A single crystal silicon cell processing device

By designing a monocrystalline silicon solar cell processing device that includes an etching chamber and a flipper, efficient batch processing of multiple solar cells was achieved, solving the problem of low efficiency of traditional equipment, reducing resource waste and environmental pollution, and improving safety.

CN224583654UActive Publication Date: 2026-07-31ZHEJIANG FORTUNE ENERGY
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
ZHEJIANG FORTUNE ENERGY
Filing Date
2025-08-12
Publication Date
2026-07-31

AI Technical Summary

Technical Problem

Traditional wet etching equipment is inefficient in the processing of monocrystalline silicon solar cells, and the mixed reaction liquid is prone to splashing, resulting in resource waste and environmental pollution, making it difficult to effectively process the back of the solar cell.

Method used

A single-crystal silicon solar cell processing device was designed, which includes components such as an etching chamber, an etching flipper, a flipping motor, and a vacuum pump. The device enables batch processing of multiple solar cells through the flipping of the etching flipper and negative pressure adsorption. The device also prevents the reaction liquid from splashing through a sealed structure and ensures safety by combining a liquid level sensor and a strong exhaust system.

Benefits of technology

It significantly improves processing efficiency, reduces liquid waste, lowers production costs, and ensures the safety of the processing environment and the treatment effect.

✦ Generated by Eureka AI based on patent content.

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Abstract

This invention provides a single-crystal silicon solar cell processing device, including an etching chamber. One end of an etching flipper, located at the top center of the etching chamber, is fixedly connected to the output end of a rotating motor fixedly installed externally. The other end of the etching flipper is rotatably connected to a rotary joint fixedly installed externally of the etching chamber. The rotary joint is connected to a vacuum pump fixedly installed externally of the etching chamber via a pipe. A closed seat and a support frame are fixedly installed on the top of the etching chamber. The output end of an opening and closing hydraulic cylinder fixedly installed on the support frame is fixed to a closed cover. Powered exhaust ports are provided on both sides of the top of the etching chamber. The etching chamber is connected to a storage tank via a water pump. This invention uses a negative pressure to adsorb and process multiple solar cells in batches, significantly improving efficiency. The etching chamber and the adsorption support plate have an arc-shaped fit, ensuring a leak-proof seal and reducing liquid waste during immersion treatment. A liquid level sensor accurately controls the liquid level, the closed seat and cover are sealed to prevent evaporation, and the powerful exhaust pipes promptly treat waste gas.
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Description

Technical Field

[0001] This utility model belongs to the field of wet etching technology, and in particular relates to a processing device for monocrystalline silicon solar cells. Background Technology

[0002] Crystalline silicon solar cells, including monocrystalline silicon, polycrystalline silicon, and amorphous silicon solar cells, are a major component of terrestrial photovoltaic systems. Wet etching is a key process in their production. Currently, traditional wet etching equipment has significant shortcomings in application: for example, the monocrystalline silicon solar cell transmission induction water spray device described in utility model patent CN2187976U can only process two cells simultaneously, resulting in low production efficiency; the liquid spraying method it uses easily causes the mixed reaction liquid to splash in all directions, not only wasting resources but also potentially polluting the working environment; and the spraying method is inefficient for treating the back side of monocrystalline silicon solar cells.

[0003] Therefore, it is essential to invent a single-crystal silicon solar cell processing device. Utility Model Content

[0004] To address the aforementioned technical problems, this utility model provides a monocrystalline silicon solar cell processing device, comprising an etching chamber, an etching flipper, a flipping motor, a rotary joint, a vacuum pump, a sealing base, a support frame, an opening and closing hydraulic cylinder, a sealing cover, a powerful exhaust port, a water pump, and a storage tank. One end of the etching flipper, positioned at the center of the top of the etching chamber, is fixedly connected to the output end of the flipping motor, which is externally mounted. The other end of the etching flipper is rotatably connected to the rotary joint, which is externally mounted on the etching chamber. The rotary joint is connected to the vacuum pump, which is externally mounted on the etching chamber, via a pipe. A sealing base and a support frame are fixedly mounted on the top of the etching chamber. The output end of the opening and closing hydraulic cylinder, fixedly mounted on the support frame, is fixed to the sealing cover. Powerful exhaust ports are located on both sides of the top of the etching chamber. The etching chamber is connected to the storage tank via the water pump.

[0005] Preferably, an etching flapper is installed at the slot through the middle of the upper part of the etching chamber, and the inner walls on both sides of the slot are arc-shaped curved surfaces. Liquid level sensors are installed at the upper and middle positions inside the etching chamber to detect the water level of the mixed reaction liquid inside the etching chamber.

[0006] Preferably, the etching flipper includes an adsorption support plate, a negative pressure port, an embedding groove, a negative pressure hole, and a sealing ring. One end of the adsorption support plate is fixed to the output end of a flipping motor fixedly installed outside the etching chamber, and the negative pressure port at the other end of the adsorption support plate is rotatably connected to a rotary joint fixedly installed outside the etching chamber. Several embedding grooves are arranged on the surface of the adsorption support plate, and several negative pressure holes are arranged at the bottom of each embedding groove, with the sealing ring embedded in its inner wall.

[0007] Preferably, the adsorption support plate is a hollow rectangular structure, and the outer arc surface of the adsorption support plate corresponds to the inner arc surface of the groove provided in the etching box. The adsorption support plate can rotate within the groove provided in the etching box.

[0008] Preferably, a rectangular sealing seat is installed around the groove of the etching chamber, the sealing seat is located directly below the sealing cover, and the sealing cover and the sealing seat can seal the groove of the etching chamber.

[0009] Preferably, the high-pressure exhaust ports located on both sides of the upper part of the etching chamber are located on both sides of the middle slot, and each high-pressure exhaust port is equipped with a high-pressure exhaust fan and is connected to the exhaust gas collection system through a pipe.

[0010] Compared with the prior art, the present invention has the following beneficial effects: This novel etching flipper uses negative pressure holes and a sealing ring structure on the surface of the adsorption support plate to stably adsorb multiple monocrystalline silicon solar cells. With the help of a flipping motor to drive the flipper to flip, the solar cells are immersed in the mixed reaction solution of the etching chamber in batches. Compared with the limitation of traditional equipment that can only process two cells at a time, this significantly improves the processing efficiency.

[0011] Furthermore, the arc-shaped curved surface of the etched box groove of this utility model is precisely matched with the outer arc surface of the adsorption support plate, which can achieve a tight sealing contact, prevent the leakage and exposure of the mixed reaction liquid. At the same time, the immersion treatment can greatly improve the treatment effect compared with the existing spraying treatment, and there will be no splashing of the mixed reaction liquid, reducing liquid waste and lowering production costs.

[0012] The liquid level sensor inside the etching chamber of this invention can monitor the water level of the mixed reaction liquid in real time, ensuring that the liquid is in full contact with the back of the battery cell during the etching process while preventing overflow; the combination design of the sealing seat and the sealing cover forms a sealed structure, further preventing liquid evaporation and exhaust gas leakage, and ensuring the safety of the processing environment. Attached Figure Description

[0013] Figure 1 This is a schematic diagram of the overall structure of this utility model.

[0014] Figure 2 This is a schematic diagram of the structure of the closed cover of this utility model after it is opened.

[0015] Figure 3 This is a schematic diagram of the etching flipper of this utility model.

[0016] Figure 4 This is a utility model Figure 3 A magnified schematic diagram of the structure at point A.

[0017] In the picture: 1. Etching chamber; 2. Etching flipper; 21. Adsorption support plate; 22. Negative pressure port; 23. Embedding groove; 24. Negative pressure hole; 25. Sealing ring; 3. Flipping motor; 4. Rotary joint; 5. Vacuum pump; 6. Sealing seat; 7. Support frame; 8. Opening and closing hydraulic cylinder; 9. Sealing cover; 10. Strong exhaust pipe port; 11. Water pump; 12. Storage tank. Detailed Implementation

[0018] To enable those skilled in the art to better understand the present invention, the technical solutions in the embodiments of the present invention will be clearly and completely described below. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort should fall within the protection scope of the present invention.

[0019] In the description of the embodiments, it should be noted that the terms "upper," "lower," "inner," "outer," "front end," "rear end," "both ends," "one end," and "the other end," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are used only for the convenience of describing the present invention and for simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on the present invention. Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance. In the description of the utility model, it should be noted that unless otherwise explicitly specified and limited, the terms "installed," "equipped with," "connected," etc., should be interpreted broadly. For example, "connection" can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium; it can be a connection within two components. Those skilled in the art can understand the specific meaning of the above terms in the present utility model based on the specific circumstances.

[0020] As attached Figure 1 To be continued Figure 4 As shown: This utility model provides a single-crystal silicon solar cell processing device, including an etching chamber 1, an etching flipper 2, a flipping motor 3, a rotary joint 4, a vacuum pump 5, a sealing seat 6, a support frame 7, an opening and closing hydraulic cylinder 8, a sealing cover 9, a powerful exhaust port 10, a water pump 11, and a storage tank 12. One end of the etching flipper 2, which is located in the middle of the top of the etching chamber 1, is fixed to the output end of the flipping motor 3, which is fixedly installed externally. The other end of the etching flipper 2 is rotatably connected to the rotary joint 4, which is fixedly installed externally to the etching chamber 1. The rotary joint 4 is connected to the vacuum pump 5, which is fixedly installed externally to the etching chamber 1, through a pipe. The sealing seat 6 and the support frame 7 are fixedly installed on the top of the etching chamber 1. The output end of the opening and closing hydraulic cylinder 8, which is fixedly installed on the support frame 7, is fixed to the sealing cover 9. Powerful exhaust ports 10 are provided on both sides of the top of the etching chamber 1. The etching chamber 1 is connected to the storage tank 12 through the water pump 11.

[0021] Furthermore, a rectangular slot is opened through the upper middle position of the etching chamber 1. The inner walls on both sides of the slot are machined with arc-shaped curved surfaces (the curvature matches that of the adsorption support plate 21). Ultrasonic liquid level sensors of model JYB-KO-L200 are horizontally installed on the upper side and in the middle position (at 1 / 2 of the height of the chamber) inside the etching chamber 1. Their detection ends face downwards and are fixed to the inner wall of the chamber 1 through an M12 threaded interface. The sensor signal line is led out through a waterproof connector and is used to monitor the water level of the mixed reaction liquid in real time, and outputs a 4-20mA signal to the PLC control system.

[0022] Furthermore, the adsorption support plate 21 of the etching flipper 2 is made of 316L stainless steel and has a hollow rectangular cavity structure inside. The outer arc surface of the adsorption support plate 21 is in clearance fit with the arc-shaped curved surface of the inner wall of the groove of the etching chamber 1. One end of the adsorption support plate 21 is rigidly connected to the output shaft of the flipping motor 3 (model: Y132M-4) through a coupling, and the negative pressure port 22 at the other end is a DN50 flange interface, which is connected to the suction port of the vacuum pump 5 (model: 2XZ-4) through a rotary joint 4 (model: QZX-50). The stationary ring end of the rotary joint 4 is fixed to the outside of the etching chamber 1 by a bracket.

[0023] Furthermore, the upper surface of the adsorption support plate 21 is evenly distributed with multiple rectangular mounting grooves 23, with a groove spacing of 20mm. Each mounting groove 23 has multiple negative pressure holes 24 evenly distributed at its bottom, with a hole spacing of 25mm. All negative pressure holes 24 communicate with the internal cavity of the adsorption support plate 21. A rectangular sealing groove is formed on the inner wall of the mounting groove 23, into which a rectangular fluororubber sealing ring 25 is embedded to form a seal with the edge of the monocrystalline silicon solar cell. After installation, the back of the monocrystalline silicon solar cell protrudes outwards.

[0024] Furthermore, the adsorption support plate 21 is driven by the flipping motor 3, allowing it to rotate 180° within the groove of the etching chamber 1. When the adsorption support plate 21 is in its initial position (horizontally upward), its outer arc surface corresponds to the arc-shaped curved surface of the groove; when flipped to 90°, and then to 180°, the adsorption support plate 21 is horizontally downward, at which point the back of the solar cell is completely immersed in the mixed reaction solution within the etching chamber 1. During the flipping process, the rotary joint 4 ensures that the negative pressure pipeline remains connected, and the vacuum pump 5 continuously provides a negative pressure of -0.08MPa to ensure the solar cell is firmly adsorbed.

[0025] Furthermore, a rectangular sealing seat 6 is fixedly installed around the groove of the etched housing 1 using M12 stainless steel bolts. The sealing seat 6 is made of nitrile rubber, and its upper surface is machined with a rectangular sealing groove, in which a rectangular sealing ring is embedded. The sealing cover 9 is made of 304 stainless steel, and its lower surface is machined with a rectangular boss corresponding to the sealing groove. The sealing cover 9 is driven by an opening and closing hydraulic cylinder 8 (model: MOB-FA), and the cylinder body of the hydraulic cylinder 8 is fixed to the top of the support frame 7. When the piston rod of the hydraulic cylinder 8 extends, the sealing cover 9 presses down and fits against the sealing seat 6, achieving a seal at the groove through the rectangular sealing ring.

[0026] Furthermore, two symmetrical exhaust ports 10 are arranged on both sides of the upper part of the etching chamber 1. The ports are DN100 circular interfaces, and each exhaust port 10 is equipped with a centrifugal exhaust fan of model 4-72-6C. The outlet of the exhaust port 10 is connected to a waste gas collection system (not shown) via a pipeline. An electric regulating valve (model: ZAZP-16K) is installed on the pipeline to regulate the exhaust volume. When waste gas is generated during the etching process, the exhaust fan transports the waste gas through the pipeline to the waste gas treatment system. After treatment to meet the standards, the waste gas is discharged, ensuring a safe working environment.

[0027] The working principle is as follows: First, the opening and closing hydraulic cylinder 8 drives the sealing cover 9 to rise linearly, and the sealing cover 9 disengages from the sealing seat 6, opening the groove of the etching chamber 1. The operator places the front side (i.e., the side that needs to be protected) of the monocrystalline silicon solar cell into the mounting groove 23 of the etching flipper 2. The edge of the solar cell is tightly fitted with the fluororubber sealing ring 25, while the back side (i.e., the side that needs to be etched) protrudes outward.

[0028] Next, the vacuum pump 5 is started, creating a negative pressure environment through the rotary joint 4, the internal cavity of the adsorption support plate 21, and the negative pressure hole 24, which firmly adsorbs the monocrystalline silicon solar cell into the mounting groove 23. At this time, the liquid level sensor detects the water level of the mixed reaction liquid in the etching chamber 1 to ensure that it is at a low level (the water level height that does not contact the adsorption support plate 21).

[0029] Then, the flipping motor 3 starts, driving the adsorption support plate 21 to rotate 180° around the rotation axis, so that the back of the battery cell faces down and enters the etching chamber 1. During this process, the rotary joint 4 ensures that the negative pressure pipeline is continuously connected to prevent the battery cell from falling off. In addition, the opening and closing hydraulic cylinder 8 drives the sealing cover 9 to descend and fit tightly against the sealing seat 6, forming a sealed environment through the rectangular sealing ring to prevent residual exhaust gas from leaking.

[0030] Subsequently, water pump 11 pumps the mixed reaction solution (a mixture of hydrofluoric acid and nitric acid) from storage tank 12 into etching tank 1, and a level sensor monitors the liquid level in real time. When the liquid level reaches the set etching height, water pump 11 stops working, the mixed reaction solution comes into full contact with the back of the battery cell, and the wet etching reaction begins.

[0031] During the etching process, the exhaust fan in the exhaust port 10 is started simultaneously, and the fluorine-containing waste gas generated during etching is transported to the waste gas treatment system (such as an alkaline spray tower) through the pipeline. The electric regulating valve automatically adjusts the exhaust volume according to the waste gas concentration to ensure that the waste gas meets the emission standards.

[0032] After etching is completed, the water pump 11 reverses its operation, drawing the mixed reaction liquid in the etching chamber 1 back to the storage tank 12. The liquid level drops to the initial position, and the mixture is left to stand for a period of time to allow the adhering mixed reaction liquid to drip off. After standing, the opening and closing hydraulic cylinder 8 drives the sealing cover 9 to rise linearly again, disengaging the sealing cover 9 from the sealing seat 6. The flipping motor 3 drives the adsorption support plate 21 to rotate 180° in the opposite direction, returning it to the initial horizontal position.

[0033] Finally, vacuum pump 5 stops working, releasing the negative pressure adsorption state, and the operator removes the etched monocrystalline silicon solar cell, completing one work cycle.

[0034] Throughout the process, the PLC control system precisely controls the coordinated operation of water pump 11, flip motor 3, vacuum pump 5 and forced exhaust fan based on the feedback signal from the liquid level sensor, so as to achieve efficient and safe etching of monocrystalline silicon solar cells.

[0035] Any technical solution that achieves the above-mentioned technical effects by utilizing the technical solution described in this utility model, or by designing a similar technical solution inspired by the technical solution described in this utility model, falls within the protection scope of this utility model.

Claims

1. A single-crystal silicon solar cell processing apparatus, characterized in that, The system includes an etching chamber (1), an etching flipper (2), a flipping motor (3), a rotary joint (4), a vacuum pump (5), a sealing seat (6), a support frame (7), an opening and closing hydraulic cylinder (8), a sealing cover (9), a forced exhaust port (10), a water pump (11), and a storage tank (12). One end of the etching flipper (2), which is located in the middle of the top of the etching chamber (1), is fixed to the output end of the flipping motor (3) which is fixed to the outside of the etching chamber (1). The other end of the etching flipper (2) is fixed to the outside of the etching chamber (1). The installed rotary joint (4) is rotatably connected, and the rotary joint (4) is connected to the vacuum pump (5) fixedly installed outside the etching chamber (1) through a pipe; a closed seat (6) and a support frame (7) are fixedly installed on the top of the etching chamber (1), and the output end of the opening and closing hydraulic cylinder (8) fixedly installed on the support frame (7) is fixed to the closed cover (9); a strong exhaust port (10) is provided on both sides of the top of the etching chamber (1), and the etching chamber (1) is connected to the storage tank (12) through a water pump (11).

2. A single crystal silicon wafer processing apparatus as set forth in claim 1, characterized by: An etching flapper (2) is installed at the slot through the middle of the upper part of the etching chamber (1). The inner walls on both sides of the slot are arc-shaped curved surfaces. Liquid level sensors are installed at the upper and middle positions inside the etching chamber (1) to detect the water level of the mixed reaction liquid inside the etching chamber (1).

3. A single crystal silicon wafer processing apparatus as set forth in claim 2, characterized by: The etching flipper (2) includes an adsorption support plate (21), a negative pressure port (22), an embedding groove (23), a negative pressure hole (24), and a sealing ring (25). One end of the adsorption support plate (21) is fixed to the output end of the flipping motor (3) fixedly installed outside the etching box (1). The negative pressure port (22) provided at the other end of the adsorption support plate (21) is rotatably connected to the rotary joint (4) fixedly installed outside the etching box (1). Several embedding grooves (23) are arranged on the surface of the adsorption support plate (21). Several negative pressure holes (24) are arranged at the bottom of each embedding groove (23), and the sealing ring (25) is embedded in its inner wall.

4. A single crystal silicon wafer processing apparatus as set forth in claim 3, characterized by: The adsorption support plate (21) is a hollow rectangular structure. The outer arc surface of the adsorption support plate (21) corresponds to the inner arc surface of the groove in the etching box (1). The adsorption support plate (21) can rotate within the groove in the etching box (1).

5. A single crystal silicon wafer processing apparatus as set forth in claim 4, characterized by: A rectangular sealing seat (6) is installed around the groove of the etching box (1). The sealing seat (6) is located directly below the sealing cover (9). The sealing cover (9) and the sealing seat (6) can seal the groove of the etching box (1).

6. A single crystal silicon wafer processing apparatus as set forth in claim 5, characterized by: The strong exhaust pipe ports (10) set on both sides of the upper part of the etching box (1) are located on both sides of the middle slot. Each of the strong exhaust pipe ports (10) is equipped with a strong exhaust fan and is connected to the exhaust gas collection system through a pipe.