Wafer cooling device

Abstract

This invention provides a wafer cooling device, relating to the field of semiconductor technology. It includes a housing and several workstations arranged parallel and equidistantly within the housing. Each workstation has symmetrically arranged supports on its surfaces near the inner walls of both sides of the housing. The supports have inclined surfaces to fix the wafer. Several position detectors, each including a transmitter and a receiver, are also included. The transmitter emits several scanning beams toward the receiver, with the beams propagating through the wafer. The receiver monitors whether the wafer is horizontally positioned by detecting the scanning beams, and then determines whether the wafer needs to be aligned, thus reducing the risk of wafer breakage during transport.

Description

Technical Field

[0001] This utility model relates to the field of semiconductor technology, and more specifically, to a wafer cooling device. Background Technology

[0002] In the manufacturing process of electronic components such as semiconductor devices, after high-temperature processing of wafers, rapid and uniform cooling of the wafers is required. This is usually achieved through inert gases (such as nitrogen) or precise temperature control systems to ensure efficient heat exchange, minimize wafer thermal stress, avoid structural deformation or performance damage, maintain a clean environment to prevent contamination, and ensure the yield of subsequent processes and the reliability of devices.

[0003] Currently, in wafer cooling devices, supports suspend the wafer by supporting its edges, which allows for uniform heat dissipation. However, this setup may cause the wafer to shift due to mechanical vibration, airflow disturbances, or human error. The shifted wafer may still be transported, posing a risk of wafer breakage. Utility Model Content

[0004] The purpose of this invention is to provide a wafer cooling device to address the shortcomings of the prior art.

[0005] To achieve the above objectives, the embodiments of this utility model are as follows: One aspect of this utility model provides a wafer cooling device for cooling wafers processed at high temperatures, comprising: a housing; a plurality of workstations arranged parallel and equidistantly within the housing, wherein each workstation has symmetrically arranged supports on the surfaces near the inner walls of both sides of the housing, the supports having inclined surfaces to fix the wafer; and a plurality of position detectors, each position detector including a transmitter and a receiver, wherein the transmitter and receiver are arranged around the support at any workstation, the transmitter being located on the inner wall of the housing surrounding one of the supports, and the receiver being located on the inner wall of the housing surrounding the symmetrically arranged support on the other side, the transmitter emitting a plurality of scanning beams toward the receiver, the propagation path of the scanning beams passing through the wafer; wherein, when the wafer is in a horizontal state, scanning beams located on the same horizontal line as the wafer are blocked by the wafer.

[0006] Optionally, the transmitter has multiple light-emitting holes arranged linearly in the vertical direction, each light-emitting hole being used to emit a scanning beam, and the receiver has a receiving hole arranged in a one-to-one correspondence with the multiple light-emitting holes.

[0007] Optionally, the corresponding light-emitting aperture and receiving aperture are located in the same horizontal plane, and the scanning beam propagates in a horizontal or approximately horizontal direction.

[0008] Optionally, the transmitter has six light-emitting holes and the receiver has six receiving holes.

[0009] Optionally, the spacing between two adjacent light-emitting holes and the spacing between two adjacent receiving holes are both less than or equal to the thickness of the wafer.

[0010] Optionally, the distance between the transmitter and the receiver is greater than or equal to the diameter of the wafer.

[0011] Optionally, the support includes support bars and support pads. Symmetrical support bars are provided on the surfaces of the workstations near the inner walls of the two sides of the housing. At least two support pads are provided above the support bars. The side walls of the support pads are inclined. The support pads located at the same workstations abut against the side walls of the wafers through the inclined surfaces to suspend the wafers.

[0012] Optionally, the number of workstations is six, and all workstations are stacked at intervals within the housing; The spacing between adjacent workstations ranges from 4.5cm to 5cm, and / or the height of the position detector along the stacking direction of the workstations ranges from 2.5cm to 3cm.

[0013] Optionally, the position detector is a grating sensor. Grating sensors located at the same workstation are arranged on the same horizontal plane. The grating sensor includes a light signal transmitter and a light signal receiver. The light signal transmitter is located on the first inner wall of the housing surrounding the support member on one side, and the light signal receiver is located on the second inner wall of the housing surrounding the support member on the other side, which is symmetrically arranged. Multiple grating sensors are arranged at any workstation. The multiple grating sensors are arranged along a first straight line direction, or a portion of the grating sensors are arranged along the first straight line direction, and another portion of the grating sensors are arranged along a second straight line direction. The first straight line direction and the second straight line direction intersect.

[0014] Optionally, the wafer cooling device also includes a processor, with the position detector electrically connected to the processor, which determines the position of the wafer based on the signal provided by the position detector.

[0015] The beneficial effects of this utility model include: This invention provides a wafer cooling device, including a support for supporting the wafer and a position detector for monitoring the wafer's position. The position detector includes a transmitter and a receiver. The transmitter emits a scanning beam, and the position of the wafer is monitored by whether the receiver receives the scanning beam emitted by the transmitter. By placing the wafer on the support and monitoring whether the receiver can receive the scanning beam emitted by the transmitter, the device can detect whether the wafer is in a horizontal position, thereby further determining whether the wafer needs to be straightened, reducing the risk of wafer breakage during subsequent transport. Attached Figure Description

[0016] To more clearly illustrate the technical solutions of the embodiments of this utility model, the drawings used in the embodiments will be briefly introduced below. It should be understood that the following drawings only show some embodiments of this utility model and should not be regarded as a limitation on the scope. For those skilled in the art, other related drawings can be obtained based on these drawings without creative effort.

[0017] Figure 1 A schematic diagram of a wafer cooling device provided in an embodiment of this utility model; Figure 2 A side view of a wafer in a horizontal position, provided for an embodiment of this utility model; Figure 3 One of the side views of a wafer in an offset position provided in an embodiment of this utility model; Figure 4 A second side view of the wafer at an offset position provided for an embodiment of this utility model; Figure 5 This is a schematic diagram of the structure of a portion of a wafer cooling device according to an embodiment of the present invention; Figure 6 An exploded view of the support member provided in an embodiment of this utility model.

[0018] Icons: 100-Wafer cooling device; 110-House; 1101-Station; 1102-Pin; 120-Support; 1201-Bevel; 121-Support bar; 1211-Pin hole; 1212-Receiving hole; 122-Support pad; 1221-Connector; 130-Wafer; 140-Position detector; 141-Emitter; 1411-Light emission aperture; 142-Receiver; 1421-Receiver aperture; 143-Scanning beam; 1431-Bottom layer group; 1432-Middle layer group; 1433-Top layer group; 150-First inner wall; 160-Second inner wall. Detailed Implementation

[0019] To make the objectives, technical solutions, and advantages of the embodiments of this utility model clearer, the technical solutions of the embodiments of this utility model will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this utility model, and not all embodiments. The components of the embodiments of this utility model described and shown in the accompanying drawings can generally be arranged and designed in various different configurations.

[0020] Therefore, the following detailed description of the embodiments of the present invention provided in the accompanying drawings is not intended to limit the scope of the claimed invention, but merely to illustrate selected embodiments of the invention. It should be noted that, without conflict, the various features in the embodiments of the present invention can be combined with each other, and the combined embodiments are still within the protection scope of the present invention.

[0021] It should be noted that similar labels and letters in the following figures indicate similar items. Therefore, once an item is defined in one figure, it does not need to be further defined and explained in subsequent figures.

[0022] In the description of this utility model, it should be noted that the terms "center," "upper," "lower," "left," "right," "vertical," "horizontal," "inner," and "outer," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, or the orientation or positional relationship commonly used when the product of this utility model is in use. They are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model. In addition, the terms "first," "second," and "third," etc., are only used to distinguish descriptions and should not be construed as indicating or implying relative importance.

[0023] Furthermore, terms such as "horizontal" and "vertical" do not imply that components must be absolutely horizontal or suspended, but rather that they can be slightly tilted. For example, "horizontal" simply means that its direction is more horizontal than "vertical," and does not mean that the structure must be completely horizontal, but can be slightly tilted.

[0024] In the description of this utility model, it should also be noted that, unless otherwise explicitly specified and limited, the terms "set," "install," "connect," and "link" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model based on the specific circumstances.

[0025] like Figure 1As shown, this embodiment of the present invention provides a wafer cooling device 100 for cooling a wafer 130 that has undergone a high-temperature process. The device includes: a housing 110 and several workstations 1101 arranged parallel and equidistantly within the housing 110. Each workstation 1101 has symmetrically arranged support members 120 on the surfaces near the inner walls of both sides of the housing 110. The support members 120 have inclined surfaces 1201, which are used to fix the wafer 130. The device also includes several position detectors 140, each including a transmitter 141 and a receiver 142. A transmitter 141 and a receiver 142 are arranged around the support member 120 on one workstation 1101. The transmitter 141 is located on the inner wall of the housing 110 surrounding the support member 120 on one side, and the receiver 142 is located on the inner wall of the housing 110 surrounding the support member 120 on the other side, which is symmetrically arranged. The transmitter 141 is used to emit a plurality of scanning beams 143 toward the receiver 142. The propagation path of the scanning beams 143 passes through the wafer 130. When the wafer 130 is in a horizontal state, the scanning beams 143 that are on the same horizontal line as the wafer 130 are blocked by the wafer 130.

[0026] This invention includes a position detector 140 positioned beside the workstation 1101 where the wafer 130 is placed. The position detector 140 monitors whether the wafer 130 is horizontally positioned by receiving a scanning beam 143 emitted by the transmitter 141 through a receiver 142. When the wafer 130 is horizontally positioned, it blocks part of the scanning beam 143 emitted by the transmitter 141 from being received by the receiver 142, while allowing another part of the scanning beam 143 to be received by the receiver 142. When the wafer 130 shifts position, the other part of the scanning beam 143 that could originally be received by the receiver 142 is blocked by the wafer 130, preventing the receiver 142 from receiving it. Thus, by monitoring the scanning beam 143 that the receiver 142 can receive, the invention monitors whether the wafer 130 is horizontally positioned, thereby further determining whether the wafer 130 needs to be straightened, reducing the risk of the wafer 130 breaking during subsequent transport.

[0027] Specifically, the wafer cooling apparatus 100 includes a housing 110, within which are arranged a plurality of workstations 1101 for placing wafers 130. It should be noted that "a plurality of workstations 1101" refers to two or more workstations. The workstations 1101 are arranged parallel to each other and at equal intervals within the housing 110, and are located in different compartments within the housing 110. Each workstation 1101 has a support member 120 positioned opposite each other, located on opposite sides near the inner wall of the housing 110. An inclined surface 1201 is provided on the support member 120. It should be noted that the inclined surface 1201 can be an inclined plane, an arc surface, or a curved surface on the support member 120. For example, by setting the support member 120 as a frustum or cone, its side surface can be used as an inclined surface 1201 with an arc shape. The edge of the wafer 130 is supported by a ramp 1201, which refers to the ramp 1201 on the opposite support member 120, i.e., the ramp 1201 facing the center of the housing 110. This arrangement reduces the possibility of the wafer 130 being scratched due to direct contact between the wafer 130 and the support member 120. A position detector 140 is arranged around the workstation 1101. The position detector 140 includes a transmitter 141 and a receiver 142 arranged opposite to each other. The transmitter 141 is used to emit a scanning beam 143, and the receiver 142 is used to receive the scanning beam 143 emitted by the transmitter 141. The transmitter 141 and the receiver 142 are located on opposite sides of the workstation 1101 and on the inner wall of the housing 110 outside the support member 120. This allows the scanning beam 143 emitted by the transmitter 141 to be incident on the wafer 130 placement area within the workstation 1101, so as to realize subsequent monitoring of the wafer 130 position. For example, when the wafer 130 is supported by the inclined surfaces 1201 on at least four rectangularly arranged supports 120, a portion of the wafer 130 will protrude outward at the midpoint between two supports 120. This protruding portion can be located between the transmitter 141 and the receiver 142 for position monitoring. When the wafer 130 is horizontal, the scanning beam 143, which is on the same horizontal line as the wafer 130, is blocked by the wafer 130. When the wafer 130 shifts, the scanning beam 143 that was originally blocked by the wafer 130 can be received by the receiver 142, and the scanning beam 143 that was originally not blocked by the wafer 130 becomes blocked by the wafer 130. The status of the scanning beam 143 that the receiver 142 can receive is used to monitor whether the wafer 130 is in a horizontal position.

[0028] Optionally, the number of workstations 1101 is six, and all workstations 1101 are arranged in a staggered manner within the housing 110. Specifically, Figure 5The diagram shows three of the six workstations 1101. It should be understood that the remaining three workstations 1101 are further stacked on top of this, forming a layered structure. Each workstation 1101 provides a place for the wafer 130 to be placed, facilitating related process handling. For example... Figure 5 As shown, L represents the spacing between adjacent workstations 1101. To facilitate the placement of wafers 130 and the related processing of wafers 130, L can satisfy: 4.5cm≤L≤5cm. In other words, the height of each workstation 1101 is between 4.5cm and 5cm. Figure 5 The value H represents the height of the position detector 140 along the stacking direction of station 1101. Each station 1101 has a corresponding position detector 140. To avoid interference from the position detector 140 with the normal operation of the wafer 130, and to ensure that the position detector 140 monitors the placement status of the wafer 130, H can be set to: 2.5cm ≤ H ≤ 3cm. It should be understood that the stacking direction of station 1101 can be vertical. Those skilled in the art can set the number of stations 1101 according to specific circumstances; no limitation is made here.

[0029] The following will explain the principle by which position detector 140 monitors the position of wafer 130: like Figure 1As shown, when the wafer 130 is placed in the station 1101, the wafer 130 will be supported by the support member 120 on the periphery of the station 1101. At this time, the side wall of the wafer 130 abuts against the inclined surface 1201 on the support member 120. Here, the inclined surface 1201 refers to the inclined surface 1201 on the support member 120 that is arranged opposite to it, that is, the inclined surface 1201 facing the center of the housing 110. At the middle position of the relatively arranged support member 120, a portion of the wafer 130 will protrude outward. At this time, the protruding portion can be located between the transmitter 141 and the receiver 142. The transmitter 141 in the position detector 140 emits several scanning beams 143 toward the receiver 142. The propagation paths of the several scanning beams 143 in space are different. The propagation path of some scanning beams 143 passes through the wafer 130 in a horizontal state, while the propagation path of other scanning beams 143 does not pass through the wafer 130 in a horizontal state. When the wafer 130 is in a non-horizontal state, the propagation path of the other part of the scanning beams 143 just passes through the wafer 130. Therefore, when the wafer 130 placed in station 1101 is in a horizontal position, part of the scanning beam 143 emitted by the transmitter 141 is blocked by the wafer 130. That is, the scanning beam 143 on the same horizontal line as the wafer 130 is blocked by the wafer 130 and cannot be received by the receiver 142. At the same time, another part of the scanning beam 143 that is not on the same horizontal line as the wafer 130 is received by the receiver 142. When the other part of the scanning beam 143 that is not on the same horizontal line as the wafer 130 is blocked by the wafer 130 and is difficult for the receiver 142 to receive, it can be determined that the position of the wafer 130 is tilted relative to the horizontal state. Therefore, the receiver 142 converts the received scanning beam 143 into an electrical signal output. The electrical signal contains information about which of the scanning beams 143 were not received by the receiver 142 and which were received by the receiver 142. Thus, it can be determined whether the wafer 130 is in a horizontal state.

[0030] Optionally, such as Figure 1 and Figure 2 As shown, the transmitter 141 has a plurality of light-emitting holes 1411 arranged linearly along the vertical direction. Each light-emitting hole 1411 is used to emit a scanning beam 143. The receiver 142 has a receiving hole 1421 that corresponds one-to-one with the plurality of light-emitting holes 1411.

[0031] Specifically, the transmitter 141 has multiple light-emitting holes 1411, which can emit multiple scanning beams 143. The receiver 142 has multiple receiving holes 1421, which are arranged one-to-one with the multiple light-emitting holes 1411 and are used to receive the scanning beams 143 emitted by the corresponding light-emitting holes 1411. Some of the light-emitting holes 1411 and some of the receiving holes 1421 are located on the same horizontal line as the wafer 130. It should be noted that the vertical direction refers to the thickness direction when the wafer 130 is placed horizontally. Considering that the possible offset of the wafer 130 when it is placed in the workstation 1101 is mainly angular deviation, and its general position will not change significantly, the positional changes of the wafer 130 in horizontal and non-horizontal states are more reflected in local vertical changes. Therefore, when the multiple light-emitting holes and multiple receiving holes 1421 are each arranged linearly in the vertical direction, the horizontal and non-horizontal states of the wafer 130 can be monitored more accurately based on the aforementioned monitoring principle.

[0032] Optionally, such as Figure 2 As shown, the corresponding light-emitting aperture 1411 and receiving aperture 1421 are located in the same horizontal plane, and the scanning beam 143 propagates in the horizontal or approximately horizontal direction.

[0033] Specifically, the light-emitting aperture 1411 emits a scanning beam 143, and the corresponding receiving aperture 1421 receives the scanning beam 143. Since it is necessary to monitor whether the wafer 130 is in a horizontal position, the corresponding light-emitting aperture 1411 and receiving aperture 1421 are located in the same horizontal plane, so that the scanning beam 143 emitted by the light-emitting aperture 1411 propagates in a horizontal or approximately horizontal direction, thus enabling precise monitoring of whether the wafer 130 is in a horizontal position.

[0034] Optionally, such as Figures 2 to 4 As shown, the transmitter 141 has six light-emitting holes 1411, and the receiver 142 has six receiving holes 1421.

[0035] Specifically, six light-emitting holes 1411 emit six scanning beams 143, and receiving holes 1421 receive the scanning beams 143 emitted by the corresponding light-emitting holes 1411. The light-emitting holes 1411 and their corresponding receiving holes 1421 are considered as a pair of holes, and the multiple pairs of holes are vertically divided into three groups: bottom group 1431, middle group 1432, and top group 1433. The light-emitting holes 1411 and receiving holes 1421 of the middle group 1432 are located on the same horizontal line as the wafer 130. Specifically: when wafer 130 is in a horizontal position, wafer 130 is located in the optical path of the middle layer group 1432, and is not located in the optical paths of the bottom layer group 1431 and the top layer group 1433; when wafer 130 is in a non-horizontal position, wafer 130 is located in the optical path of the bottom layer group 1431 or the top layer group 1433, and is not located in the optical path of the middle layer group 1432, or wafer 130 is located in all the optical paths of the bottom layer group 1431, the middle layer group 1432 and the top layer group 1433.

[0036] For example, such as Figure 2 As shown, wafer 130 is in the optical path of the middle layer group 1432. At this time, the optical path of the middle layer group 1432 is blocked, while the optical paths of the bottom layer group 1431 and the top layer group 1433 are not blocked. It can be determined that wafer 130 is in a horizontal position.

[0037] For example, such as Figure 3 As shown, point A is the front side and point B is the rear side. The front side of wafer 130 is in the optical path of the top layer group 1433. At this time, the optical path of the top layer group 1433 is blocked by the front side of wafer 130, while the optical paths of the bottom layer group 1431 and the middle layer group 1432 are not blocked. The rear side of wafer 130 is in the optical path of the bottom layer group 1431. The optical path of the bottom layer group 1431 is blocked by the rear side of wafer 130, while the optical paths of the top layer group 1433 and the middle layer group 1432 are not blocked. At this time, it can be determined that wafer 130 has shifted and is in a position where the front is higher than the back.

[0038] For example, such as Figure 4 As shown, point A is the front side and point B is the rear side. The front side of wafer 130 is in the optical path of the bottom layer group 1431. At this time, the optical path of the bottom layer group 1431 is blocked by the front side of wafer 130, while the optical paths of the top layer group 1433 and the middle layer group 1432 are not blocked. The rear side of wafer 130 is in the optical path of the top layer group 1433. The optical path of the top layer group 1433 is blocked by the rear side of wafer 130, while the optical paths of the bottom layer group 1431 and the middle layer group 1432 are not blocked. At this time, it can be determined that wafer 130 has shifted and is in a position where the front is lower than the rear.

[0039] For example, wafer 130 is located in the optical paths of bottom group 1431, middle group 1432 and top group 1433. At this time, the optical paths of bottom group 1431, middle group 1432 and top group 1433 are blocked. It can be determined that wafer 130 has shifted in the left and right directions.

[0040] Therefore, by analyzing the optical path signals at different heights, it can be determined whether the position of wafer 130 has shifted. The signal from position detector 140 can monitor whether wafer 130 is in a horizontal position, thereby further determining whether wafer 130 needs to be straightened, reducing the risk of wafer 130 breaking during subsequent transport.

[0041] Optionally, the spacing between two adjacent light-emitting holes 1411 and the spacing between two adjacent receiving holes 1421 are both less than or equal to the thickness of the wafer 130.

[0042] Specifically, the spacing between two adjacent scanning beams 143 is less than or equal to the thickness of the wafer 130. The two lowest-lying light-emitting holes 1411 and two receiving holes 1421 form the bottom layer group 1431, the two middle-lying light-emitting holes 1411 and two receiving holes 1421 form the middle layer group 1432, and the two highest-lying light-emitting holes 1411 and two receiving holes 1421 form the top layer group 1433. For example... Figure 2 As shown, wafer 130 can block the two scanning beams 143 in the middle position, while the other four scanning beams 143 are not blocked. At this time, wafer 130 is in a horizontal position. If wafer 130 fails to block all two scanning beams 143 in the middle position or blocks none of them, it indicates that wafer 130 has shifted. The specific shift situation is the same as described above and will not be repeated here.

[0043] Optionally, the distance between the transmitter 141 and the receiver 142 is greater than or equal to the diameter of the wafer 130.

[0044] Specifically, wafer 130 is generally placed in the middle of station 1101, and transmitter 141 and receiver 142 are positioned opposite each other on the side of wafer 130. At the same time, the distance between transmitter 141 and receiver 142 is greater than or equal to the diameter of wafer 130. This arrangement ensures that the position detector 140 does not affect or interfere with the normal operation of wafer 130, reduces the possibility of wafer 130 being interfered with by transmitter 141 or receiver 142 when it is shifted, and avoids wafer 130 breakage.

[0045] Optionally, such as Figure 6As shown, the support member 120 includes support bars 121 and support pads 122. The station 1101 is provided with symmetrical support bars 121 on the surface near the inner walls on both sides of the housing 110. At least two support pads 122 are provided above the support bars 121. The side walls of the support pads 122 are inclined surfaces 1201. The support pads 122 located on the same station 1101 abut against the side walls of the wafer 130 through the inclined surfaces 1201 so that the wafer 130 is suspended.

[0046] Specifically, support bars 121 are disposed on the inner walls of opposite sides of the housing 1101 near the workstation 1101, with two support bars 121 arranged symmetrically. At least two support pads 122 are disposed on each support bar 121; that is, three or more support pads 122 can also be disposed, with no specific limit on the number. The support pads 122 support the inclined surface 1201 of the sidewall of the wafer 130. The sidewall of the wafer 130 is supported by at least four rectangularly arranged support pads 122 and inclined surfaces 1201, thus suspending the wafer 130 in the air. This arrangement reduces the possibility of the wafer 130 being scratched due to direct contact with the support member 120.

[0047] In some embodiments, a pin hole 1211 is provided at the bottom of the support bar 121, and a pin 1102 is provided at the bottom of the housing 110. The pin hole 1211 and the pin 1102 are inserted and engaged, so that the support bar 121 is fixedly connected to the housing 110.

[0048] In some embodiments, a receiving hole 1212 is provided at the top of the support bar 121, and a connecting part 1221 is provided on the support pad 122. The connecting part 1221 is inserted into the receiving hole 1212 to fix the support bar 121 and the support pad 122.

[0049] In some embodiments, the connection method between the support bar 121 and the housing 110 and the connection method between the support bar 121 and the support pad 122 can be screw connection, glue connection or riveting, etc., and there is no specific limitation.

[0050] Optionally, such as Figure 1 As shown, the position detector 140 is a grating sensor. The grating sensors located at the same workstation 1101 are arranged on the same horizontal plane. The grating sensor includes a light signal transmitter 141 and a light signal receiver 142. The light signal transmitter 141 is located on the first inner wall 150 of the housing 110 surrounding the support member 120 on one side, and the light signal receiver 142 is located on the second inner wall 160 of the housing 110 surrounding the support member 120 on the other side, which is symmetrically arranged. Multiple grating sensors are arranged at any workstation 1101. The multiple grating sensors are arranged along a first straight line direction, or a portion of the grating sensors are arranged along the first straight line direction and another portion of the grating sensors are arranged along a second straight line direction. The first straight line direction and the second straight line direction intersect.

[0051] Specifically, the grating sensor includes a light signal transmitter 141 and a light signal receiver 142. The light signal transmitter 141 emits a scanning beam 143, and the light signal receiver 142 receives the scanning beam 143 emitted by the light signal transmitter 141. The light signal transmitter 141 is located on the first inner wall 150, and the light signal receiver 142 is located on the second inner wall 160. The first inner wall 150 and the second inner wall 160 are arranged on opposite sides of the housing 110 and are parallel to each other. The workstation 1101 is located between the first inner wall 150 and the second inner wall 160, ensuring that the wafer 130 remains within the workstation 1101 even if it shifts. Furthermore, by fixing the transmitter 141 and the receiver 142 to the first inner wall 150 and the second inner wall 160 respectively, it is beneficial for the scanning beam 143 emitted by the light signal transmitter 141 to be received by the correspondingly positioned light signal receiver 142, and it also facilitates the installation of the light signal transmitter 141 and the light signal receiver 142.

[0052] The wafer cooling device 100 may be equipped with multiple grating sensors located on the same horizontal plane. It should be noted that multiple grating sensors refer to two or more.

[0053] In this embodiment, as Figure 1 As shown, point A is the front side, point B is the rear side, and multiple grating sensors are arranged along the front-to-back direction. Point C is the left side, and point D is the right side, with some grating sensors arranged along the front-to-back direction and others arranged along the left-to-right direction.

[0054] In some embodiments, the transmitter 141 and receiver 142 can be fixed by screw connection, glue connection or riveting, and the specific connection method is not limited.

[0055] Optionally, the wafer cooling device 100 also includes a processor (not shown), and a position detector 140 is electrically connected to the processor. The processor is used to determine the position of the wafer 130 based on the signal provided by the position detector 140.

[0056] Specifically, the processor is electrically connected to the receiver 142 in the position detector 140. The processor can be integrated on the outer surface of the wafer cooling device 100. It converts the signal from the receiver 142 of the position detector 140 into a digital signal and displays the digital signal on a display, making it easy to see whether the wafer 130 has shifted. Thus, by using the signal generated by the scanning beam 143 emitted by the position detector 140 being blocked by the wafer 130 and the signal received by the processor converted into a digital signal, the processor monitors whether the wafer 130 is in a horizontal position, thereby further determining whether the wafer 130 needs to be straightened, reducing the risk of the wafer 130 breaking during subsequent transport.

[0057] The specific types of process equipment that can be applied to the wafer cooling device 100 in this utility model are not limited here, such as semiconductor heat treatment equipment.

[0058] The above description is merely a preferred embodiment of this utility model and is not intended to limit the utility model. Various modifications and variations can be made to this utility model by those skilled in the art. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this utility model should be included within the protection scope of this utility model.

Claims

1. A wafer cooling device, characterized in that, Used for cooling wafers that have undergone high-temperature processes, including: case; Several workstations are arranged in parallel and equidistantly within the housing. Each workstation has symmetrical support members arranged opposite each other on the surface near the inner walls of the two sides of the housing. The support members are provided with inclined surfaces, and the wafer is fixed by the inclined surfaces on the oppositely arranged support members. A plurality of position detectors, each position detector including a transmitter and a receiver, are disposed around the periphery of a support member at any of the workstations. The transmitter is located on the inner wall of the housing surrounding one side of the support member, and the receiver is located on the inner wall of the housing surrounding the other symmetrically disposed support member. The transmitter is used to emit a plurality of scanning beams toward the receiver, the propagation path of the scanning beams passing through the wafer; wherein, when the wafer is in a horizontal state, the scanning beams located on the same horizontal line as the wafer are blocked by the wafer.

2. The wafer cooling apparatus as described in claim 1, characterized in that, The transmitter has a plurality of light-emitting holes arranged linearly along the vertical direction. Each light-emitting hole is used to emit a scanning beam. The receiver has a receiving hole that corresponds one-to-one with the plurality of light-emitting holes. Some of the light-emitting holes and some of the receiving holes are located on the same horizontal line as the wafer.

3. The wafer cooling apparatus as described in claim 2, characterized in that, The corresponding light-emitting aperture and receiving aperture are located in the same horizontal plane, and the scanning beam propagates in a horizontal or approximately horizontal direction.

4. The wafer cooling apparatus as described in claim 3, characterized in that, The transmitter has six light-emitting holes, and the receiver has six receiving holes.

5. The wafer cooling apparatus as described in claim 4, characterized in that, The spacing between two adjacent light-emitting holes and the spacing between two adjacent receiving holes are both less than or equal to the thickness of the wafer.

6. The wafer cooling apparatus as described in claim 1, characterized in that, The distance between the transmitter and the receiver is greater than or equal to the diameter of the wafer.

7. The wafer cooling apparatus as described in claim 1, characterized in that, The support includes support bars and support pads. The workstation has symmetrical support bars on the surface near the inner walls of both sides of the housing. At least two support pads are provided above the support bars. The side walls of the support pads are inclined. The support pads located at the same workstation abut against the side walls of the wafer through the inclined surfaces to suspend the wafer.

8. The wafer cooling apparatus as described in claim 1, characterized in that, The number of workstations is six, and all the workstations are stacked at intervals within the housing. The spacing between adjacent workstations ranges from 4.5cm to 5cm, and / or the height of the position detector along the stacking direction of the workstations ranges from 2.5cm to 3cm.

9. The wafer cooling apparatus according to any one of claims 1 to 8, characterized in that, The position detector is a grating sensor. The grating sensors located at the same workstation are arranged on the same horizontal plane. The grating sensor includes a light signal transmitter and a light signal receiver. The light signal transmitter is located on the first inner wall of the housing on the periphery of one of the support members, and the light signal receiver is located on the second inner wall of the housing on the periphery of the support member on the other side, which is symmetrically arranged. In this configuration, multiple grating sensors are provided at any of the workstations, and the multiple grating sensors are arranged along a first straight line direction, or a portion of the grating sensors are arranged along the first straight line direction and another portion of the grating sensors are arranged along a second straight line direction, wherein the first straight line direction and the second straight line direction intersect.

10. The wafer cooling apparatus according to any one of claims 1 to 8, characterized in that, The wafer cooling apparatus further includes a processor, and the position detector is electrically connected to the processor. The processor is used to determine the position of the wafer based on the signal provided by the position detector.

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