A high-speed, high-precision film sorting machine
The high-speed, high-precision chip sorting machine, which operates in collaboration with multiple systems, solves the problem of low precision in traditional equipment. It enables efficient picking and angle correction of thin and irregularly shaped chips, improves the overall precision and stability of the equipment, and meets the high precision requirements of semiconductor technology.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- SHEN ZHEN SHI LIAN WEI BAN DAO TI SHE BEI YOU XIAN GONG SI
- Filing Date
- 2025-09-05
- Publication Date
- 2026-07-31
AI Technical Summary
Traditional chip sorting equipment has low precision, making it difficult to effectively pick up thin and irregularly shaped chips, and it cannot achieve chip angle correction, resulting in insufficient equipment precision and stability, which cannot meet the high precision requirements of semiconductor technology.
The high-speed, high-precision chip sorting machine employs a multi-system collaborative operation, including a loading and unloading system, a vision inspection system, and a swing arm assembly. Through vision inspection, precise positioning is achieved, and the buffer and angle correction components of the swing arm assembly enable automated, high-precision chip picking and placement. Combined with a cooling fan and status warning lights, the machine ensures stable operation.
It significantly improves chip stacking efficiency and accuracy, enabling high-precision placement and loading of ultra-thin chips below 50μm, reducing the risk of chip damage, and ensuring the stability and efficient operation of the equipment.
Smart Images
Figure CN224583661U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of film sorting machine technology, specifically a high-speed, high-precision film sorting machine. Background Technology
[0002] Traditional chip sorting equipment has a precision of >±15µm and an angle error of >±1°, resulting in low accuracy. The rotary system typically uses a servo motor of 1.5kW or higher to drive the rotational inertia, leading to high energy consumption and cost. Furthermore, traditional pick-up mechanisms usually use spring-return on the Z-axis, with a downward-pressing cam above the pick-up position, making it difficult to control the pick-up and placement force. This makes it difficult to effectively pick up thin or irregularly shaped chips, or may damage them. Traditional pick-up mechanisms cannot directly correct the chip's angle after pickup; the chip's angle and position are interrelated during chip sorting, further limiting the equipment's pick-up and placement accuracy.
[0003] As semiconductor technology evolves towards more advanced processes, chip design is increasingly trending towards miniaturization, ultra-thinning, and irregular integration, placing extreme demands on the precision and stability of chip stacking equipment. The market urgently needs high-speed, fully automated chip stacking equipment with ultra-high positioning accuracy that can adapt to the handling of ultra-thin chips below 50μm to support the mass production needs of third-generation semiconductors, advanced packaging, and other fields. To this end, we have proposed a high-speed, high-precision chip stacking machine. Utility Model Content
[0004] To address the shortcomings of existing technologies, this invention provides a high-speed, high-precision stacking machine, which solves the aforementioned problems.
[0005] To achieve the above-mentioned objectives, this utility model provides the following technical solution:
[0006] A high-speed, high-precision film sorting machine, comprising:
[0007] The system includes a working support frame, a cooling fan, a rotating protective cover, a status warning light, a control and adjustment assembly, and a working operation assembly. The cooling fan is fixedly connected to the side of the working support frame and is symmetrically distributed on the side of the working support frame. The status warning light is fixedly connected to the top surface of the working support frame. The rotating protective cover is rotatably connected to the top of the working support frame. The working operation assembly is fixedly connected to the inner side of the working support frame. The control and adjustment assembly is fixedly connected to the side of the working support frame.
[0008] The working assembly consists of a support base plate, a loading and unloading system, a vision inspection system, and a swing arm assembly. A support frame is fixedly connected to the top surface of the support base plate, and a swing arm assembly is fixedly connected to the top of the support frame.
[0009] A loading and unloading system is installed on the top surface of the supporting base plate, and the loading and unloading system is used to realize loading and unloading operations;
[0010] A vision inspection system is installed on the top surface of the support base plate, which is used to detect the position of the chip.
[0011] Preferably, the loading and unloading system includes a second loading and unloading system, a second workbench, a first workbench, a transporting swing arm, and a first loading and unloading system. The second loading and unloading system is fixedly connected to the top surface of the supporting base plate, the second workbench is fixedly connected to the top surface of the supporting base plate, the first workbench is fixedly connected to the top surface of the supporting base plate, the first loading and unloading system is fixedly connected to the top surface of the supporting base plate, and the transporting swing arm is fixedly connected to the top surface of the supporting base plate. The transporting swing arm is symmetrically distributed on the top surface of the supporting base plate.
[0012] Preferably, the visual inspection system includes a second visual system, a first visual system, a barcode reader, and a third visual system. The third visual system is fixedly connected to the center of the top surface of the supporting base plate, a support frame is fixedly connected to the top surface of the supporting base plate, the second visual system is fixedly connected to the side of the support frame, the first visual system is fixedly connected to the other side of the support frame, and a barcode reader is fixedly connected to the bottom outer side of the second visual system and the first visual system.
[0013] Preferably, a pin assembly is fixedly connected to the top surface of the support base plate, and the pin assembly is symmetrically distributed on the top surface of the support base plate.
[0014] Preferably, a swing arm assembly is fixedly connected to the top of the support frame, and symmetrically distributed swing arms are fixedly connected to the bottom of the swing arm assembly. The swing arm is composed of a swing arm component and an angle correction component. The swing arm component includes a swing arm support frame, a buffer spring, a pickup support frame, a pickup head, a spring fixing nut, and an adjustment contact component. A symmetrically distributed swing arm support frame is fixedly connected to the bottom of the swing arm assembly. A spring fixing nut is fixedly connected to the outer end of the swing arm support frame. A buffer spring is fixedly connected to the bottom surface of the spring fixing nut. A pickup support frame is fixedly connected to the bottom surface of the buffer spring. A pickup head is fixedly connected to the inner side of the pickup support frame. An adjustment contact component is fixedly connected to the side of the pickup support frame.
[0015] Preferably, the angle correction assembly includes a pickup head angle correction motor, an adjusting correction timing belt, a correction driven timing pulley, a correction driving timing pulley, mounting shims, and mounting bolts. The pickup head angle correction motor is fixedly connected to the top surface of the swing arm support frame, and mounting shims are fixedly connected to the bottom surface of the swing arm support frame. The mounting shims are distributed in a rectangular, equidistant pattern on the bottom surface of the swing arm support frame. Mounting bolts are rotatably connected to the inner side of the swing arm support frame, and mounting bolts are slidably connected to the inner side of the mounting shims. Mounting bolts are threadedly connected to the inner side of the pickup head angle correction motor. The output shaft of the pickup head angle correction motor is fixedly connected to the correction driving timing pulley. An adjusting correction timing belt is meshed with the outer side of the correction driving timing pulley. A correction driven timing pulley is fixedly connected to the outer side of the pickup head, and an adjusting correction timing belt is meshed with the outer side of the correction driven timing pulley.
[0016] Compared with the prior art, the advantages of this utility model are:
[0017] A high-speed, high-precision film sorting machine is provided, which has the following advantages:
[0018] This high-speed, high-precision chip sorting machine significantly improves chip sorting efficiency and accuracy through the coordinated operation of multiple systems: the first and second loading / unloading systems in the loading / unloading system work together with the transport arm to realize automatic chip loading / unloading and transfer between worktables, reducing manual intervention and increasing operation speed; the vision inspection system uses the first, second, and third vision systems and a barcode reader to accurately detect chip positions and identify wafer ring information, providing data support for positioning; the swing arm assembly uses a buffer spring to achieve Z-axis buffering to avoid damage to thin or irregularly shaped chips during pickup, while the angle correction component uses a motor and synchronous belt drive to correct the pickup head angle in real time, reducing angle errors; at the same time, the ejector pin assembly assists in chip stripping, the cooling fan ensures stable operation of the equipment, and the status warning light provides real-time feedback on the operating status. Attached Figure Description
[0019] Figure 1 This is a schematic diagram of the overall structure of this utility model;
[0020] Figure 2 This is a schematic diagram showing the overall structure of this utility model disassembled;
[0021] Figure 3 This is a schematic diagram of a single swing arm in part of the structure of this utility model;
[0022] Figure 4 This is a schematic diagram showing the disassembled single swing arm of part of the structure in this utility model.
[0023] In the diagram: 1. Working support frame; 2. Cooling fan; 3. Rotating protective cover; 4. Status warning light; 5. Control and adjustment assembly; 6. Working operation assembly; 7. Support base plate; 8. Second loading and unloading system; 9. Second worktable; 10. Swing arm assembly; 11. Second vision system; 12. Support frame; 13. First vision system; 14. Code reader; 15. First worktable; 16. Transport swing arm; 17. First loading and unloading system; 18. Ejector pin assembly; 19. Third vision system; 20. Swing arm support frame; 21. Pickup head angle correction motor; 22. Adjustment and correction synchronous belt; 23. Buffer spring; 24. Correction driven synchronous pulley; 25. Pickup support frame; 26. Pickup head; 27. Spring fixing nut; 28. Adjustment contact assembly; 29. Correction driving synchronous pulley; 30. Mounting shim; 31. Mounting bolt. Detailed Implementation
[0024] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.
[0025] Please see Figure 1-4 This utility model provides a technical solution:
[0026] A high-speed, high-precision film sorting machine, comprising:
[0027] The work support frame 1, cooling fan 2, rotating protective cover 3, status warning light 4, control and adjustment assembly 5, and working operation assembly 6 are provided. The cooling fan 2 is fixedly connected to the side of the work support frame 1. The cooling fan 2 is symmetrically distributed on the side of the work support frame 1. The status warning light 4 is fixedly connected to the top surface of the work support frame 1. The rotating protective cover 3 is rotatably connected to the top of the work support frame 1. The working operation assembly 6 is fixedly connected to the inner side of the work support frame 1. The control and adjustment assembly 5 is fixedly connected to the side of the work support frame 1.
[0028] The working operation assembly 6 consists of a support base plate 7, a loading and unloading system, a vision inspection system, and a swing arm assembly 10. A support frame 12 is fixedly connected to the top surface of the support base plate 7, and a swing arm assembly 10 is fixedly connected to the top of the support frame 12.
[0029] The loading and unloading system is installed on the top surface of the supporting base plate 7. The loading and unloading system is used to realize the loading and unloading operation.
[0030] A vision inspection system is installed on the top surface of the support base plate 7. The vision inspection system is used to detect the position of the chip.
[0031] Furthermore, the loading and unloading system includes a second loading and unloading system 8, a second workbench 9, a first workbench 15, a transporting arm 16, and a first loading and unloading system 17. The second loading and unloading system 8 is fixedly connected to the top surface of the supporting base plate 7, the second workbench 9 is fixedly connected to the top surface of the supporting base plate 7, the first workbench 15 is fixedly connected to the top surface of the supporting base plate 7, the first loading and unloading system 17 is fixedly connected to the top surface of the supporting base plate 7, and the transporting arm 16 is fixedly connected to the top surface of the supporting base plate 7. The transporting arm 16 is symmetrically distributed on the top surface of the supporting base plate 7. Through the action of the loading and unloading system, automatic loading and unloading is achieved. The first worktable 15 consists of an X-axis drive mechanism, a Y-axis drive mechanism, a wafer ring rotation drive mechanism, and a wafer ring carrier platform. The wafer ring carrier platform uses torsion springs to clamp the wafer ring with claws. The wafer ring rotation drive mechanism drives the wafer ring carrier platform to rotate around the wafer ring axis. Claw release cylinders are set at specific circumferential positions to press the claws and release the wafer ring from its clamping state. The wafer ring carrier platform is driven by the X-axis drive mechanism and the Y-axis drive mechanism, which can drive the wafer ring to perform chip positioning and can move to the loading and unloading position for loading and unloading operations. At the same time, the wafer ring carrier platform is provided with a cavity to avoid the ejector pin assembly.
[0032] Furthermore, the vision inspection system includes a second vision system 11, a first vision system 13, a barcode reader 14, and a third vision system 19. The third vision system 19 is fixedly connected to the center of the top surface of the support base plate 7, and a support frame 12 is fixedly connected to the top surface of the support base plate 7. The second vision system 11 is fixedly connected to the side of the support frame 12, and the first vision system 13 is fixedly connected to the other side of the support frame 12. The barcode reader 14 is fixedly connected to the bottom outer side of the second vision system 11 and the first vision system 13. Through the action of the vision inspection system, the X and Y axes are adjusted to calibrate the vision center to the center of the preset crystal picking position of the pickup head. The Z axis can be finely adjusted for focusing. At the same time, the encoder 14 is used to identify the barcode or QR code on the wafer ring. The wafer ring rotation drive mechanism drives the wafer ring to rotate until the barcode or QR code enters the field of view of the barcode reader 14.
[0033] Furthermore, a pin assembly 18 is fixedly connected to the top surface of the support base plate 7. The pin assemblies 18 are symmetrically distributed on the top surface of the support base plate 7. The pin assemblies 18 are used to peel the chip off the wafer ring.
[0034] Furthermore, a swing arm assembly 10 is fixedly connected to the top of the support frame 12, and symmetrically distributed swing arms are fixedly connected to the bottom of the swing arm assembly 10. The swing arms consist of a swing arm component and an angle correction component. The swing arm component includes a swing arm support frame 20, a buffer spring 23, a pickup support frame 25, a pickup head 26, a spring fixing nut 27, and an adjustment contact assembly 28. Symmetrically distributed swing arm support frames 20 are fixedly connected to the bottom of the swing arm assembly 10, and spring fixing nuts 27 are fixedly connected to the outer ends of the swing arm support frames 20. A buffer spring 23 is fixedly connected to the bottom surface of the fixing nut 27. A pickup support frame 25 is fixedly connected to the bottom surface of the buffer spring 23. A pickup head 26 is fixedly connected to the inner side of the pickup support frame 25. An adjustment contact assembly 28 is fixedly connected to the side of the pickup support frame 25. Through the action of the buffer spring 23, Z-axis buffering is achieved. The collision time is extended by elastic deformation, thereby reducing the instantaneous impact force. The adjustment contact assembly 28 is used in the debugging stage. After contacting the chip, the disconnection signal of the contact can be used to measure the chip height.
[0035] Furthermore, the angle correction assembly includes a pickup head angle correction motor 21, an adjusting correction timing belt 22, a correction driven timing pulley 24, a correction driving timing pulley 29, mounting shims 30, and mounting bolts 31. The pickup head angle correction motor 21 is fixedly connected to the top surface of the swing arm support frame 20, and the mounting shims 30 are fixedly connected to the bottom surface of the swing arm support frame 20. The mounting shims 30 are distributed in a rectangular, equidistant pattern on the bottom surface of the swing arm support frame 20. The mounting bolts 31 are rotatably connected to the inner side of the swing arm support frame 20. The side sliding connection is provided with mounting bolt 31. The inner thread of the pickup head angle correction motor 21 is connected with mounting bolt 31. The output shaft of the pickup head angle correction motor 21 is fixedly connected with a correction driving synchronous pulley 29. The outer side of the correction driving synchronous pulley 29 is meshed with an adjusting correction synchronous belt 22. The outer side of the pickup head 26 is fixedly connected with a correction driven synchronous pulley 24. The outer side of the correction driven synchronous pulley 24 is meshed with an adjusting correction synchronous belt 22. Through the action of the angle correction component, the angle of the pickup head 26 is corrected.
[0036] Structural Description:
[0037] Work support frame 1: The main support structure of the device, with symmetrically distributed cooling fans 2 and control and adjustment assembly 5 fixed on the side, status warning light 4 fixed on the top, rotating protective cover 3 rotatably connected, and working operation assembly 6 fixed on the inside, providing installation support and a stable working environment for each component;
[0038] Cooling fan 2: Symmetrically fixed on the side of the working support frame 1, it removes heat generated inside the equipment, such as the drive mechanism and motor, through airflow circulation, so as to prevent the components from affecting the operating accuracy and lifespan due to high temperature;
[0039] Rotating protective cover 3: Rotarily connected to the top of the working support frame 1, it can be opened and closed. When closed, it protects the internal components of the working operation assembly 6 and prevents dust from entering or being accidentally touched. When open, it facilitates maintenance and loading and unloading.
[0040] Status warning light 4: Fixed on the top surface of the working support frame 1, it provides real-time feedback on the equipment's operating status through different colored lights such as green for standby, red for fault, and yellow for operation, making it convenient for operators to quickly identify;
[0041] Control and adjustment assembly 5: Fixed on the side of the working support frame 1, with a built-in control system, used to preset chip arrangement parameters such as chip size and accuracy requirements, receive visual inspection data and drive the coordinated operation of each component, which is the control core of the equipment;
[0042] Working operation assembly 6: Fixed inside the working support frame 1, it consists of a support base plate 7, loading and unloading system, vision inspection system and swing arm assembly 10, and is a functional module for realizing the core process of chip stacking.
[0043] Support base plate 7: The base bearing plate of the working operation assembly 6, with the loading and unloading system, vision inspection system, support frame 12 and ejector pin assembly 18 fixed on the top surface, providing installation benchmark and layout space for each functional component;
[0044] The second loading and unloading system 8 is fixed on the top surface of the support base plate 7 and works in conjunction with the first loading and unloading system 17 to receive the wafer rings that have been arranged and transport them to the designated area to complete the unloading of finished products.
[0045] Second worktable 9: Fixed on the top surface of support base plate 7, it consists of a bearing platform, a rotary drive mechanism and an XY drive mechanism. It carries the empty wafer ring and works with the swing arm assembly 10 to place the chip. The chip placement position can be accurately compensated by rotation and XY adjustment.
[0046] Swing arm assembly 10: Fixed to the top of the support frame 12, with symmetrically distributed swing arms connected to the bottom. Driven by a rotary mechanism, it can rotate 180° or 90°, simultaneously completing the "chip pickup - angle correction - chip placement" action, thus improving work efficiency.
[0047] Second vision system 11: Fixed to the side of support frame 12, located above the second worktable 9, used to detect the actual placement position of the chip on the second worktable 9, and feed the deviation data back to the control system to achieve dynamic compensation.
[0048] Support frame 12: Fixed to the top surface of the support base plate 7, with the top fixed to the swing arm assembly 10 and the side fixed to the first vision system 13 and the second vision system 11, providing stable support for the swing arm and vision components;
[0049] First vision system 13: Fixed on the other side of support frame 12, located above first worktable 15, can finely adjust XY axis and Z axis, accurately capture the position and angle deviation of chip on first worktable 15, and provide data for pickup positioning;
[0050] Reader 14: Fixed to the bottom outer side of the first vision system 13 and the second vision system 11, used to identify barcodes or QR codes on the wafer ring, match them with the waferMap file from the previous process, and obtain chip test information;
[0051] First worktable 15: fixed on the top surface of support base plate 7, consisting of X-axis / Y-axis drive mechanism, wafer ring rotation drive mechanism and wafer ring carrier platform, carrying wafer ring to be stacked, driving wafer ring to move to the pick-up position, and its carrier platform is provided with cavity to avoid ejector pin assembly 18.
[0052] Handling arm 16: Symmetrically fixed on the top surface of the support base plate 7, used to transfer the wafer ring between the first loading and unloading system 17, the second loading and unloading system 8 and the worktable, so as to realize the automation of loading and unloading;
[0053] First loading and unloading system 17: fixed on the top surface of support base plate 7, used to transport the wafer ring to be arranged to the first worktable 15, and cooperate with the chuck clamping mechanism to complete the wafer ring positioning;
[0054] Ejector assembly 18: Symmetrically fixed on the top surface of the support base plate 7 and below the first worktable 15, it consists of a lifting drive device and a lifting device. It can rise to the peeling position and gently push the chip with the ejector pin to peel it off from the wafer ring blue film, making it easy for the pick-up head 26 to adsorb it.
[0055] Third vision system 19: Fixed in the middle of the top surface of the support base plate 7, located at 90° of the swing arm rotation path, used to capture the positional error of the chip on the pickup head 26, and to assist the angle correction component in accurately correcting the chip angle.
[0056] The swing arm support frame 20 is symmetrically fixed at the bottom of the swing arm assembly 10, with a spring fixing nut 27 fixed at the outer end and a pickup head angle correction motor 21 fixed on the top surface, providing installation support for the swing arm assembly and the angle correction assembly;
[0057] Pick-up head angle correction motor 21: fixed on the top surface of the swing arm support frame 20, the output shaft is connected to the correction active synchronous wheel 29, and drives the pickup head 26 to rotate through the synchronous belt drive to realize chip angle correction;
[0058] Adjusting the timing belt 22: It is engaged with the outer side of the correcting active timing pulley 29 and the correcting driven timing pulley 24, and transmits the driving force of the pickup head angle correction motor 21 to ensure precise and synchronized angle adjustment;
[0059] Buffer spring 23: Fixed between the bottom surface of spring fixing nut 27 and pickup support frame 25, it provides Z-axis elastic buffer to prevent excessive impact force when pickup head 26 contacts chip, thus avoiding damage.
[0060] Correction driven synchronous pulley 24: fixed on the outside of the pickup head 26, meshing with the adjustment and correction synchronous belt 22, receiving the motor driving force and driving the pickup head 26 to rotate, thereby achieving angle correction;
[0061] Pickup support frame 25: fixed to the bottom surface of buffer spring 23, with pickup head 26 fixed on the inner side and adjustment contact assembly 28 fixed on the side, providing installation and buffer support for pickup head 26;
[0062] Pick-up head 26: Fixed inside the pickup support frame 25, with built-in vacuum air passage for adsorbing chips, and a through hole at its rotation center for calibration of the first vision system 13 and the ejector pin assembly 18;
[0063] Spring fixing nut 27: Fixed to the outer end of the swing arm support frame 20, with a buffer spring 23 connected to the bottom surface, used to fix the spring position and adjust the spring preload;
[0064] Debugging contact assembly 28: Fixed to the side of pickup support 25, it triggers a disconnect signal after contacting the chip during the debugging phase, and is used to measure the chip height and assist in calibrating the pickup position.
[0065] Correction active synchronous pulley 29: fixed on the output shaft of pickup head angle correction motor 21, meshing with adjustment correction synchronous belt 22, converting motor torque into synchronous belt drive power;
[0066] Mounting shims 30: Rectangularly and equidistantly fixed to the bottom surface of the swing arm support frame 20, with mounting bolts 31 slidably connected to the inner side, used to adjust the pickup head angle and correct the installation height of the motor 21 to ensure the accuracy of the synchronous belt drive;
[0067] Mounting bolt 31: Rotatably connected to the inner side of the swing arm support frame 20, slides through the mounting pad 30 and is threadedly connected to the pickup head angle correction motor 21, used to fix the motor position and ensure installation stability;
[0068] Working Principle: When this utility model is needed, after the equipment is started, the preset wafer arrangement parameters are controlled by the adjustment assembly 5. The status warning light 4 lights up green to indicate standby readiness. The protective cover 3 is closed, and the loading and unloading system is started: The first loading and unloading system 17 transports the wafer rings to be arranged to the first worktable 15. The wafer ring carrier automatically clamps the wafer rings through the torsion spring driven claws. At the same time, the wafer ring rotation drive mechanism drives the wafer rings to rotate until the barcode reader 14 recognizes the barcode / QR code on the wafer ring, matches it with the waferMap file generated in the previous process, and determines the test information of each chip. The transport arm 16 simultaneously transports the empty wafer rings to the second worktable 9, completing the carrier preparation before wafer arrangement. The X-axis and Y-axis drive mechanisms of the first worktable 15 are based on... According to the wafer map file, the target chip is moved to the preset pickup position. At this time, the first vision system 13 is activated, and the vision center is aligned with the pickup position by fine-tuning the XY axis, accurately capturing the real-time position and angle deviation of the chip, and feeding the data back to the control system. Simultaneously, the ejector pin assembly 18 under the first worktable 15 is activated, and the lifting drive device drives the ejector pin to rise to the avoidance position. Then, the lifting device drives the ejector pin to gently push the chip, peeling the chip off from the blue film on the wafer ring, preparing for the pickup head 26 to pick up and replace it, avoiding blue film adhesion that could damage the chip. The swing arm assembly 10, driven by the rotary mechanism, drives the symmetrically distributed pickup heads 26 to rotate synchronously. When the pickup head 26 moves to the pickup position on the first worktable 15, the chip is aligned using the pickup head 26. The chip is adsorbed. When the pick-up head 26 adsorbs the chip, the vacuum flow drops sharply, and the system determines that the adsorption is successful. Torque control is used to avoid excessive clamping force that could damage the chip. After picking up the chip, the swing arm assembly 10 drives the pick-up head 26 to rotate 90°, passing through the detection area of the third vision system 19. The third vision system 19 captures the chip position and further corrects the deviation data. If there is an angle error, the pick-up head angle correction motor 21 is activated. Through the correction active synchronous wheel 29 and the adjustment of the correction synchronous belt 22, the correction driven synchronous wheel 24 is driven to rotate, driving the pick-up head 26 to precisely adjust the angle. At the same time, the buffer spring 23 provides Z-axis buffering to prevent chip displacement during rotation. After the angle correction is completed, the swing arm assembly 10 continues to rotate 90°, transporting the chip to the second process. Above worktable 9, the second worktable 9 adjusts the attitude of the empty wafer ring through the XY axis and rotary drive mechanism according to the wafer placement position pre-detected by the second vision system 11 to ensure accurate wafer placement. The pick-up head 26 descends under the drive of the Z-axis voice coil motor, releases the vacuum and places the chip in the target position. After wafer placement, the second vision system 11 captures the actual placement position of the chip in real time and feeds the deviation data back to the control system to dynamically correct the wafer placement compensation parameters of subsequent chips. At the same time, the cooling fan 2 runs continuously to cool the internal drive mechanism and motor of the equipment, ensuring stable operation for a long time. After the wafer placement of a single chip is completed, the first worktable 15 and the second worktable 9 synchronously switch to the pick-up and placement position of the next chip, and the swing arm assembly 10 repeats the "pick-up-correction-layout" action.
[0069] Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the appended claims and their equivalents.
Claims
1. A high-speed high-precision sheet arranging machine characterized by comprising: include: The work support frame (1), cooling fan (2), rotating protective cover (3), status warning light (4), control and adjustment assembly (5) and work operation assembly (6) are provided. The cooling fan (2) is fixedly connected to the side of the work support frame (1). The cooling fan (2) is symmetrically distributed on the side of the work support frame (1). The status warning light (4) is fixedly connected to the top surface of the work support frame (1). The rotating protective cover (3) is rotatably connected to the top of the work support frame (1). The work operation assembly (6) is fixedly connected to the inner side of the work support frame (1). The control and adjustment assembly (5) is fixedly connected to the side of the work support frame (1). The working assembly (6) consists of a support base plate (7), a loading and unloading system, a vision inspection system and a swing arm assembly (10). A support frame (12) is fixedly connected to the top surface of the support base plate (7), and a swing arm assembly (10) is fixedly connected to the top of the support frame (12). A loading and unloading system is installed on the top surface of the supporting base plate (7), the loading and unloading system being used to realize loading and unloading operations; A vision inspection system is installed on the top surface of the support base plate (7), which is used to detect the position of the chip.
2. The high-speed, high-precision film sorting machine according to claim 1, characterized in that, The loading and unloading system includes a second loading and unloading system (8), a second workbench (9), a first workbench (15), a transport swing arm (16), and a first loading and unloading system (17). The second loading and unloading system (8) is fixedly connected to the top surface of the support base plate (7). The second workbench (9) is fixedly connected to the top surface of the support base plate (7). The first workbench (15) is fixedly connected to the top surface of the support base plate (7). The first loading and unloading system (17) is fixedly connected to the top surface of the support base plate (7). The transport swing arm (16) is fixedly connected to the top surface of the support base plate (7). The transport swing arm (16) is symmetrically distributed on the top surface of the support base plate (7).
3. The high-speed, high-precision film sorting machine according to claim 1, characterized in that, The visual inspection system includes a second visual system (11), a first visual system (13), a barcode reader (14), and a third visual system (19). The third visual system (19) is fixedly connected to the middle of the top surface of the support base plate (7). A support frame (12) is fixedly connected to the top surface of the support base plate (7). The second visual system (11) is fixedly connected to the side of the support frame (12). The first visual system (13) is fixedly connected to the other side of the support frame (12). The barcode reader (14) is fixedly connected to the bottom outer side of the second visual system (11) and the first visual system (13).
4. The high-speed, high-precision film sorting machine according to claim 1, characterized in that, The top surface of the support base plate (7) is fixedly connected to a pin assembly (18), and the pin assembly (18) is symmetrically distributed on the top surface of the support base plate (7).
5. A high-speed, high-precision film sorting machine according to claim 1, characterized in that, The top of the support frame (12) is fixedly connected to the swing arm assembly (10), and the bottom of the swing arm assembly (10) is fixedly connected to the symmetrically distributed swing arms. The swing arms are composed of a swing arm component and an angle correction component. The swing arm component includes a swing arm support frame (20), a buffer spring (23), a pickup support frame (25), a pickup head (26), a spring fixing nut (27), and an adjustment contact component (28). The bottom of the swing arm assembly (10) is fixedly connected to the symmetrically distributed swing arm support frame (20). The outer end of the swing arm support frame (20) is fixedly connected to the spring fixing nut (27). The bottom surface of the spring fixing nut (27) is fixedly connected to the buffer spring (23). The bottom surface of the buffer spring (23) is fixedly connected to the pickup support frame (25). The inner side of the pickup support frame (25) is fixedly connected to the pickup head (26). The side of the pickup support frame (25) is fixedly connected to the adjustment contact component (28).
6. A high-speed, high-precision film sorting machine according to claim 5, characterized in that, The angle correction assembly includes a pickup head angle correction motor (21), an adjusting correction timing belt (22), a correction driven timing pulley (24), a correction driving timing pulley (29), mounting shims (30), and mounting bolts (31). The pickup head angle correction motor (21) is fixedly connected to the top surface of the swing arm support frame (20), and the mounting shims (30) are fixedly connected to the bottom surface of the swing arm support frame (20). The mounting shims (30) are distributed in a rectangular, equidistant pattern on the bottom surface of the swing arm support frame (20). The mounting bolts are rotatably connected to the inner side of the swing arm support frame (20). 31) The inner side of the mounting pad (30) is slidably connected with a mounting bolt (31), the inner side of the pickup head angle correction motor (21) is threadedly connected with a mounting bolt (31), the output shaft of the pickup head angle correction motor (21) is fixedly connected with a correction driving synchronous pulley (29), the outer side of the correction driving synchronous pulley (29) is meshed with an adjusting correction synchronous belt (22), the outer side of the pickup head (26) is fixedly connected with a correction driven synchronous pulley (24), the outer side of the correction driven synchronous pulley (24) is meshed with an adjusting correction synchronous belt (22).