A debonding device
By using an inclined guide surface and a raised structure in the debonding device, the wafer debonding problem in the prior art is solved, achieving efficient and stable wafer stripping, reducing the risk of wafer breakage, and improving the stability and versatility of the system.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- HUBEI XINGCHEN TECH CO LTD
- Filing Date
- 2025-09-16
- Publication Date
- 2026-07-31
AI Technical Summary
In 2.5D or 3D semiconductor manufacturing, the existing technology makes it difficult to effectively peel off the wafer clamping components during debonding, resulting in a high probability of wafer breakage.
A debonding device with an inclined guide surface is used. Through the cooperation of the guide surface and the connector, the wafer is gradually pulled and peeled along the peeling direction. The inclined angle of the guide surface and the raised structure reduce the difference in pulling force and reduce the risk of wafer breakage.
It improves the success rate of bond bonding, reduces the probability of fragmentation, enhances system stability and versatility, and reduces the frequency of component replacement and debugging.
Smart Images
Figure CN224583665U_ABST
Abstract
Description
Technical Field
[0001] This application relates to the field of semiconductor process technology, and in particular to a debonding device. Background Technology
[0002] In 2.5D or 3D semiconductor manufacturing, two wafers bonded by molecular forces may need to be debonded due to low bonding precision or defects in the bonding layer. Current technologies use wafer clamping devices for debonding, which makes it difficult to separate the two wafers along the peeling direction during the peeling process, resulting in a higher probability of wafer breakage. Utility Model Content
[0003] In view of this, embodiments of this application aim to provide a debonding device that can reduce the probability of fragmentation.
[0004] To achieve the above objectives, the technical solution of this application embodiment is implemented as follows:
[0005] This application discloses a debonding device, comprising:
[0006] A fixed mounting component, the mounting component having a guide surface inclined to the peeling direction;
[0007] A first connector and a second connector, wherein a portion of the first connector passes through the mounting member along a first direction for connection to one of the wafers to be debonded, and the second connector is disposed opposite to the first connector along the first direction for connection to another wafer to be debonded, the second connector being configured to drive the first connector to move along the first direction to abut against the guide surface, wherein the peeling direction intersects the first direction.
[0008] In one embodiment, the angle between the guide surface and the peeling direction is between 0.5° and 2°.
[0009] In one embodiment, the guide surface includes a starting portion, a transition portion, and a peeling portion along the peeling direction. The peeling portion is close to the second connector relative to the starting portion along the first direction. The transition portion connects the starting portion and the peeling portion. The peeling portion has a protrusion at its edge away from the starting portion along the peeling direction.
[0010] In one embodiment, the size of the protrusion along the peeling direction is between 5 mm and 10 mm; and / or, the size of the protrusion along the first direction gradually increases from near the starting portion toward the peeling portion along the peeling direction.
[0011] In one embodiment, the maximum size of the protrusion along the first direction is between 0.2 mm and 0.5 mm.
[0012] In one embodiment, the minimum dimension between the mounting member and one of the wafers to be debonded along the first direction is not less than 5 mm.
[0013] In one embodiment, the mounting member has a through-hole extending along the first direction, and the first connector has a first vacuum chamber and a suction nozzle communicating with the first vacuum chamber. The suction nozzle is movably disposed through the through-hole for adsorbing one of the wafers to be debonded.
[0014] In one embodiment, the first connector includes a cover and a vacuum body. The vacuum body has a vacuum groove, a suction hole, and an opening. The vacuum groove connects the opening and the suction hole. The cover covers the opening to define the first vacuum cavity. The suction nozzle connects to the suction hole. The side of the vacuum body with the suction nozzle is provided to abut against the guide surface.
[0015] In one embodiment, the vacuum body is made of a flexible material; and / or, the cover is made of a rigid material.
[0016] In one embodiment, the second connector has a second vacuum chamber and a suction port communicating with the second vacuum chamber, the suction port being used to adsorb the other wafer to be debonded.
[0017] This application discloses a debonding device. A second connector can drive a first connector to move along a first direction via one wafer to be debonded and another wafer. When the first connector contacts the guide surface, due to the fixed setting of the mounting component and the inclined setting of the guide surface, various points on the guide surface along the peeling direction will successively abut against the first connector to prevent further movement. That is, the force points change along the peeling direction, thereby allowing the first connector to gradually pull one wafer to be debonded along the peeling direction. Then, in conjunction with the second connector, the wafer to be debonded can be gradually peeled off along the peeling direction. The wafer and the other wafer to be debonded are separated in this way. On the one hand, due to the inclined setting of the guide surface, it can be ensured that one wafer to be debonded and the other wafer to be debonded are separated along the peeling direction. At the same time, it can also reduce the breakage caused by large differences in tensile force to a certain extent, thereby improving the success rate of debonding and reducing the probability of breakage. On the other hand, by using the inclined setting of the guide surface, and with the first connector and the second connector respectively connecting one wafer to be debonded and the other wafer to be debonded for peeling, the structure is relatively simple, which can improve the system stability and versatility, and reduce the frequency of component replacement and debugging. Attached Figure Description
[0018] Figure 1 This is a cross-sectional schematic diagram of a debonding device provided in an embodiment of this application, wherein one wafer to be debonded and the other wafer to be debonded are not separated.
[0019] Figure 2 This is a cross-sectional schematic diagram of a debonding device provided in another embodiment of the present application, wherein one wafer to be debonded and the other wafer to be debonded have been peeled off but not removed;
[0020] Figure 3 A partial schematic diagram of a first connector provided in yet another embodiment of this application;
[0021] Figure 4 This is a schematic diagram of the structure of an installation component provided in yet another embodiment of this application;
[0022] Figure 5 for Figure 4 A cross-sectional diagram;
[0023] Figure 6 This is a schematic diagram of the structure of a third connector provided in yet another embodiment of this application.
[0024] Explanation of reference numerals in the attached figures
[0025] 100. Debonding device; 1. Mounting component; 1a. Guide surface; 1a1. Starting part; 1a2. Transition part; 1a3. Peeling part; 1b. Protrusion; 1c. Through-hole; 2. First connector; 2a. First vacuum chamber; 2b. Suction nozzle; 21. Cover; 21a. Vacuum hole; 22. Vacuum body; 22a. Suction hole; 3. Second connector; 3a. Suction port; A. One wafer to be debonded; B. Another wafer to be debonded; C. Movable hole. Detailed Implementation
[0026] It should be noted that, unless otherwise specified, the embodiments and technical features in the embodiments of this application can be combined with each other, and the detailed descriptions in the specific implementation should be understood as explanations of the purpose of this application and should not be regarded as undue limitations on this application.
[0027] The present application will now be described in further detail with reference to the accompanying drawings and specific embodiments. The terms "first," "second," etc., used in the embodiments of this application are for descriptive purposes only and should not be construed as indicating or implying their relative importance or implicitly including at least one feature. In the description of the embodiments of this application, "multiple" means at least two, such as two, three, etc., unless otherwise explicitly specified.
[0028] This application provides a debonding device 100. Please refer to [link to relevant documentation]. Figures 1 to 6The debonding device 100 includes a mounting member 1, a first connector 2, and a second connector 3. The mounting member 1 is fixedly disposed. The mounting member 1 has a guide surface 1a inclined to the peeling direction. A portion of the first connector 2 passes through the mounting member 1 along a first direction for connecting to one of the wafers A to be debonded. The second connector 3 is disposed opposite to the first connector 2 along the first direction for connecting to another wafer B to be debonded. The second connector 3 is configured to drive the first connector 2 to move along the first direction to abut against the guide surface 1a, wherein the peeling direction intersects with the first direction.
[0029] The wafer can be a silicon wafer or other types of wafers.
[0030] Mounting component 1 refers to the component used to fix and support the first connecting component 2.
[0031] Mounting component 1 can be made of ceramic, which has high hardness and good load-bearing capacity. Mounting component 1 can be fixed to the tooling by means of screws or other methods.
[0032] Mounting component 1 can be circular or other shapes.
[0033] The first connector 2 and the second connector 3 are components used to connect the wafers to be debonded. The wafers can be connected by vacuum adsorption, bonding, etc.
[0034] The peeling direction can be perpendicular to the first direction or at other angles.
[0035] It should be noted that during the peeling process, due to the brittleness of the wafer, the debonding process needs to be very slow, and the force on all parts of the wafer needs to be as uniform as possible. The peeling process needs to start from one point and diffuse the force, requiring the stress point to change along the peeling direction.
[0036] The mounting component 1 has a guide surface 1a that is inclined to the peeling direction, meaning that the guide surface 1a has an angle with the peeling direction.
[0037] The debonding device 100 provided in this embodiment allows the second connector 3 to move the first connector 2 along a first direction via one wafer A to be debonded and another wafer. When the first connector 2 contacts the guide surface 1a, due to the fixed arrangement of the mounting member 1 and the inclined arrangement of the guide surface 1a, various points on the guide surface 1a along the peeling direction will successively abut against the first connector 2 to prevent further movement. That is, the force points change along the peeling direction, thereby allowing the first connector 2 to gradually pull the one wafer A to be debonded along the peeling direction. Then, in conjunction with the second connector 3, the wafers to be debonded can be gradually peeled off along the peeling direction. One wafer A and the other wafer B to be debonded are arranged in a manner that, on the one hand, due to the inclined setting of the guide surface 1a, it can be ensured that the wafer A to be debonded and the other wafer B to be debonded are peeled off along the peeling direction. At the same time, it can also reduce the breakage situation caused by large differences in tensile force to a certain extent, thereby improving the success rate of debonding and reducing the probability of breakage. On the other hand, by using the inclined setting of the guide surface 1a, and with the first connector 2 and the second connector 3 respectively connecting the wafer A to be debonded and the other wafer B to be debonded for peeling, the structure is relatively simple, which can improve the stability and versatility of the system, and reduce the frequency of component replacement and debugging.
[0038] In one exemplary embodiment, Figure 5 R1 can be the stripping direction, and R2 can be the first direction.
[0039] In one exemplary embodiment, the second connector 3 may be configured to be driven by a high-precision and high-resolution motor.
[0040] In one embodiment, the angle between the guide surface 1a and the peeling direction is between 0.5° and 2°.
[0041] For example, the angle between the guide surface 1a and the peeling direction can be 0.5°, 0.6°, 0.7°, 0.8°, 0.9°, 1°, 1.1°, 1.2°, 1.3°, 1.4°, 1.5°, 1.6°, 1.7°, 1.8°, 1.9° or 2°, etc.
[0042] The angle between the guide surface 1a and the peeling direction can be the slope of the mounting part 1. For example, the dimension of the mounting part 1 along the peeling direction can be 300mm, and the dimension of the mounting part 1 along the first direction can be 3mm, 4mm, 5mm, 6mm or 7mm, etc.
[0043] Here, by setting an appropriate angle value, the peeling process can be made smoother, which can reduce the force difference on the wafers to be debonded along the peeling direction and further improve the success rate of debonding.
[0044] In one embodiment, please refer to Figure 4 and Figure 5 The guide surface 1a includes a starting part 1a1, a transition part 1a2 and a peeling part 1a3 along the peeling direction. The peeling part 1a3 is close to the second connector 3 relative to the starting part 1a1 along the first direction. The transition part 1a2 connects the starting part 1a1 and the peeling part 1a3. The edge of the peeling part 1a3 away from the starting part 1a1 along the peeling direction is provided with a protrusion 1b.
[0045] In other words, when the second connector 3 drives the first connector 2 to move along the first direction, the first connector 2 first contacts and abuts against the starting part 1a1. Thus, the first connector first pulls the end of the wafer A to be debonded along the first direction corresponding to the starting part 1a1. Then, in conjunction with the second connector 3, it begins to peel off that end. As the second connector 3 continues to move along the first direction, it can sequentially peel off the portion corresponding to the transition part 1a2 along the peeling direction. Here, as the wafer A to be debonded and the other wafer B to be debonded are gradually peeled apart, the angle between them also gradually... The peeling process begins to increase until it reaches the peeling portion 1a3, which is the end of the wafer. At this position, the angle between the two wafers reaches its maximum. If peeling continues, this will cause the edges of one wafer A to be debonded to come into contact with the edges of the other wafer B to be debonded, resulting in edge breakage. This application provides a protrusion 1b on the peeling portion 1a3, which can abut against the first connecting portion when peeling reaches this position. This allows the edge of one wafer A to be debonded to be slightly raised in the first direction away from the other wafer B to be debonded during the final peeling, thus deviating from the edge position that is prone to edge breakage. This reduces the probability of wafer breakage.
[0046] In one embodiment, the size of the protrusion 1b along the peeling direction is between 5 mm and 10 mm.
[0047] For example, the dimensions of the protrusion 1b along the peeling direction can be 5mm, 6mm, 7mm, 8mm, 9mm, or 10mm, etc.
[0048] Here, by setting the length, the possibility of excessively long lifting length of one of the wafers A to be unbonded along the peeling direction, which could lead to breakage, can be reduced, thereby further reducing the probability of breakage.
[0049] In one embodiment, please refer to Figure 5 The size of the protrusion 1b along the first direction gradually increases from near the starting part 1a1 toward the peeling part 1a3 along the peeling direction.
[0050] In this way, the protrusion 1b can form a slope-like structure, so that the edge of the wafer A to be debonded will slowly rise, reducing the possibility of breakage caused by sudden stress changes.
[0051] In one embodiment, the maximum dimension of the protrusion 1b along the first direction is between 0.2 mm and 0.5 mm.
[0052] For example, the maximum dimension of the protrusion 1b along the first direction can be 0.2mm, 0.25mm, 0.3mm, 0.35mm, 0.4mm, 0.45mm or 0.5mm, etc.
[0053] Here, by setting an appropriate size, the excessive warping height of one of the wafers A to be unbonded along the first direction can be reduced, thereby further reducing the probability of wafer breakage.
[0054] In one embodiment, the minimum dimension between the mounting member 1 and one of the wafers A to be debonded along the first direction is not less than 5 mm.
[0055] This reduces the likelihood of contact between the wafer A to be debonded and the mounting component 1 during the stripping process, thereby minimizing damage to the wafer A to be debonded.
[0056] In one embodiment, please refer to Figure 4 and Figure 5 The mounting component 1 has a through-hole 1c extending along a first direction, and the first connector 2 has a first vacuum chamber 2a and a suction nozzle 2b communicating with the first vacuum chamber 2a. The suction nozzle 2b is movably inserted through the through-hole 1c for adsorbing one of the wafers A to be debonded.
[0057] For example, the first connector 2 can be a suction cup.
[0058] In other words, the suction nozzle 2b on the first connector 2 can move along the first direction through the through-hole 1c.
[0059] Here, the suction nozzle 2b can adsorb and grasp one of the wafers A to be debonded through the first vacuum chamber 2a. This not only reduces damage to the wafer A to be debonded, but also avoids fatigue deformation damage caused by mechanical clamping, further reducing the probability of wafer breakage.
[0060] For example, in one embodiment, the nozzle 2b may be made of plastic.
[0061] In one embodiment, please refer to Figure 3 The first connecting member 2 includes a cover 21 and a vacuum body 22. The vacuum body 22 has a vacuum groove, a suction hole 22a and an opening. The vacuum groove connects the opening and the suction hole 22a. The cover 21 covers the opening to define the first vacuum chamber 2a. The suction nozzle 2b connects to the suction hole 22a. The side of the vacuum body 22 with the suction nozzle 2b is used to abut against the guide surface 1a.
[0062] For example, the opening and suction hole 22a can be arranged along the first direction, and the cover 21 can be fixed to the opening by means of screwing or bonding to seal the vacuum groove and improve the sealing performance of the vacuum chamber.
[0063] In this way, the first connector 2 adopts a split design, which facilitates replacement and maintenance, and makes it easy to set up structures such as suction hole 22a.
[0064] As an example, in one embodiment, please refer to Figure 3 The cover 21 has a vacuum hole 21a, which is connected to the vacuum chamber. The vacuum chamber can be evacuated by connecting a floating cylinder.
[0065] In one embodiment, the vacuum body 22 is made of a flexible material.
[0066] In this way, the vacuum body 22 can make flexible contact with the guide surface 1a, thereby reducing the stress abrupt change of the nozzle 2b on one of the wafers A to be debonded, so as to slowly peel it off.
[0067] In one embodiment, the cover 21 is made of a rigid material.
[0068] In this way, when the vacuum body 22 is pulled along the first direction and comes into contact with the guide surface 1a, the cover 21 can provide rigid support and rigid sealing, resulting in good working stability.
[0069] In one embodiment, please refer to Figure 6 The second connector 3 has a second vacuum chamber and a suction port 3a communicating with the second vacuum chamber. The suction port 3a is used to adsorb another wafer B to be debonded.
[0070] For example, the second connector 3 can be a suction cup.
[0071] In other words, the second connector 3 can use the vacuum of the second vacuum chamber to adsorb and grab the other wafer B to be debonded through the suction port 3a. This not only reduces the damage to the other wafer B to be debonded, but also avoids fatigue deformation damage caused by mechanical clamping, further reducing the probability of wafer breakage.
[0072] As an example, in one embodiment, please refer to Figures 3 to 6 The mounting component 1, the first connecting component 2, and the second connecting component 3 all have movable holes C, which are reserved for the movement of the vacuum rod for loading and unloading.
[0073] For example, the number of movable holes C can be three, and the three movable holes C can be set at 120° intervals.
[0074] The above description is merely a preferred embodiment of this application and is not intended to limit the application. Various modifications and variations can be made to this application by those skilled in the art. All modifications, equivalent substitutions, improvements, etc., within the spirit and principles of this application are included within the scope of protection of this application.
Claims
1. A debonding apparatus, characterized by, include: A fixed mounting component, the mounting component having a guide surface inclined to the peeling direction; A first connector and a second connector, wherein a portion of the first connector passes through the mounting member along a first direction for connection to one of the wafers to be debonded, and the second connector is disposed opposite to the first connector along the first direction for connection to another wafer to be debonded, the second connector being configured to drive the first connector to move along the first direction to abut against the guide surface, wherein the peeling direction intersects the first direction.
2. The debonding apparatus of claim 1, wherein, The angle between the guide surface and the peeling direction is between 0.5° and 2°.
3. The debonding apparatus of claim 2, wherein, The guide surface includes a starting portion, a transition portion, and a peeling portion along the peeling direction. The peeling portion is close to the second connector relative to the starting portion along the first direction. The transition portion connects the starting portion and the peeling portion. The peeling portion has a protrusion at its edge away from the starting portion along the peeling direction.
4. The debonding apparatus of claim 3, wherein The size of the protrusion along the peeling direction is between 5 mm and 10 mm; and / or, the size of the protrusion along the first direction gradually increases from near the starting portion toward the peeling portion along the peeling direction.
5. The debonding device according to claim 4, characterized in that, The maximum size of the protrusion along the first direction is between 0.2 mm and 0.5 mm.
6. The debonding apparatus of claim 1, wherein, The minimum dimension between the mounting component and one of the wafers to be debonded along the first direction is not less than 5 mm.
7. The debonding apparatus of claim 1, wherein The mounting member has a through-hole extending along the first direction, and the first connector has a first vacuum chamber and a suction nozzle communicating with the first vacuum chamber. The suction nozzle is movably inserted through the through-hole for adsorbing one of the wafers to be debonded.
8. The debonding apparatus of claim 7, wherein, The first connector includes a cover and a vacuum body. The vacuum body has a vacuum groove, a suction hole, and an opening. The vacuum groove connects the opening and the suction hole. The cover covers the opening to define the first vacuum cavity. The suction nozzle connects to the suction hole. The vacuum body has a side of the suction nozzle for abutting the guide surface.
9. The debonding apparatus of claim 8, wherein, The vacuum body is made of a flexible material; and / or the cover is made of a rigid material.
10. The debonding apparatus of claim 1, wherein, The second connector has a second vacuum chamber and a suction port communicating with the second vacuum chamber. The suction port is used to adsorb the other wafer to be debonded.