A correction device for a cleaning tank and a cleaning apparatus

Abstract

This application provides a calibration device and cleaning equipment for a cleaning tank. The calibration device includes: a support platform with a receiving cavity inside for containing cleaning fluid; multiple outlets disposed on the top of the support platform and communicating with the receiving cavity; multiple spacers spaced apart on the support platform, forming a wafer receiving area between every two adjacent spacers, each wafer receiving area corresponding to at least one outlet; at least one flow detection device, each flow detection device disposed in the receiving cavity for monitoring the liquid flow rate at the outlet; and at least one regulating device, each regulating device disposed at the outlet and configured to regulate the liquid flow rate at the outlet. By providing multiple outlets communicating with the receiving cavity on the top of the support platform, and by installing flow detection and regulating devices within the receiving cavity for detecting and regulating the liquid flow rate at the outlet, the wafer cleaning effect is ensured, and the product yield is improved.

Description

Technical Field

[0001] This application relates to the field of semiconductor equipment technology, and more specifically to a calibration device and cleaning equipment for a cleaning tank. Background Technology

[0002] In semiconductor manufacturing, wet cleaning is a crucial step in ensuring wafer surface cleanliness, widely used to remove contaminants such as particles, organic matter, and metal ions. Tank-type cleaning equipment, a typical wet cleaning tool, usually employs an inner and outer tank structure. The inner tank holds the wafer and performs the cleaning process, while the outer tank stores and circulates the cleaning solution. A circulating pump delivers the cleaning solution from the outer tank to the inner tank, achieving continuous flow and reuse of the cleaning solution to improve cleaning efficiency. To ensure the stability of the cleaning process, flow meters are typically installed in the main pipeline to monitor the total liquid flow rate, indirectly ensuring the effectiveness of wafer cleaning.

[0003] However, due to the dense arrangement of wafers within the cleaning tank, the cleaning solution is easily affected by factors such as flow channel disturbances and uneven spraying during wafer cleaning. This leads to differences in the flow rate of the cleaning solution on different wafer surfaces. Even if the overall flow rate of the cleaning solution in the main pipeline remains stable, local areas may still experience low flow velocities or turbulent flow, resulting in inconsistent cleaning capabilities and consequently causing cleaning defects such as particle residue and uneven etching. In related technologies, the liquid flow monitoring methods for cleaning equipment are mainly concentrated at the main pipeline level. These methods can only detect the total flow rate of the cleaning solution in the main pipeline and cannot detect the local flow distribution on the wafer surface. They lack dynamic adjustment capabilities and are difficult to achieve adaptive optimization during the cleaning process, resulting in poor wafer cleaning performance.

[0004] Therefore, improvements are needed to at least partially address the aforementioned problems. Utility Model Content

[0005] The utility model description section introduces a series of simplified concepts, which will be further explained in detail in the detailed description section. This utility model description section is not intended to limit the key features and essential technical features of the claimed technical solution, nor is it intended to determine the scope of protection of the claimed technical solution.

[0006] To at least partially solve the above problems, this utility model provides a calibration device for a cleaning tank. The calibration device includes: a support platform with a receiving cavity inside for containing cleaning fluid; multiple outlets disposed on the top of the support platform and communicating with the receiving cavity; multiple spacers spaced apart on the support platform, with a wafer receiving area formed between every two adjacent spacers, wherein each wafer receiving area corresponds to at least one outlet; at least one flow detection device, each flow detection device disposed in the receiving cavity for monitoring the liquid flow rate at the outlet; and at least one adjustment device, each adjustment device disposed at the outlet and configured to adjust the liquid flow rate at the outlet.

[0007] For example, the spacer is a partition, the plurality of liquid outlets are divided into multiple groups of liquid outlets, and a group of liquid outlets is provided on both sides of each partition. Each group of liquid outlets includes a plurality of liquid outlets arranged at intervals along the length direction of the partition, and each group of liquid outlets corresponds to a flow detection device.

[0008] For example, the number of flow detection devices is equal to the number of liquid outlets, with each liquid outlet corresponding to one flow detection device, and each flow detection device is disposed below the liquid outlet.

[0009] For example, each of the regulating devices includes a drive device and at least one control valve, the control valve being connected to the drive device, the drive device being configured to drive the opening degree of the control valve.

[0010] For example, each of the control valves is disposed below the liquid outlet, and each group of liquid outlets corresponds to at least one of the control valves.

[0011] The driving device is servo motor, and the control valve is rotary control valve.

[0012] For example, the calibration device further includes at least one liquid inlet, each of the liquid inlets being disposed on the side of the support platform and communicating with the receiving cavity, wherein each of the liquid inlets corresponds to one of the adjustment devices.

[0013] For example, the calibration device further includes a control device electrically connected to the flow detection device and the regulating device, configured to control the regulating device to regulate the liquid flow at the outlet based on the liquid flow detected by the flow detection device.

[0014] For example, the flow detection device is a flow meter.

[0015] According to another aspect of the present invention, a cleaning device is provided, the cleaning device including a cleaning tank, the cleaning tank including the aforementioned calibration device.

[0016] According to the present invention, a calibration device and cleaning equipment for a cleaning tank are provided. By setting a receiving cavity inside the support platform and setting multiple liquid outlets communicating with the receiving cavity at its top, and combining the spacers set at intervals to form a wafer receiving area corresponding to the wafer position, the cleaning liquid can flow evenly upward from the liquid outlets to effectively wash the wafer surface. Furthermore, a flow detection device and a regulating device are set in the receiving cavity to detect and regulate the liquid flow rate at the liquid outlets, avoiding problems such as poor wafer cleaning effect caused by uneven liquid flow distribution. This effectively ensures the stability and consistency of the wafer cleaning effect, and improves product yield and reliability. Attached Figure Description

[0017] The following drawings, which are incorporated herein by reference as part of this invention, are provided for understanding the invention. The drawings illustrate embodiments of the invention and their descriptions, serving to explain the principles of the invention.

[0018] In the attached image:

[0019] Figure 1 A schematic diagram of the structure of a correction device according to a specific embodiment of the present invention is shown;

[0020] Figure 2 A top view of a correction device according to a specific embodiment of the present invention is shown;

[0021] Figure 3 A cross-sectional view of the support platform according to another specific embodiment of the present invention is shown;

[0022] Figure 4 A schematic diagram of the structure of the adjusting device according to a specific embodiment of the present invention is shown;

[0023] Figure 5 A schematic diagram of the structure of the adjusting device located inside the support platform according to a specific embodiment of the present invention is shown;

[0024] Figure 6 The diagram shows the flow of cleaning fluid in the calibration device according to a specific embodiment of the present invention. Detailed Implementation

[0025] In the following description, numerous specific details are set forth in order to provide a more thorough understanding of the present invention. However, it will be apparent to those skilled in the art that the present invention can be practiced without one or more of these details. In other instances, certain technical features well-known in the art have not been described in order to avoid confusion with the present invention.

[0026] It should be understood that this invention can be embodied in various forms and should not be construed as being limited to the embodiments set forth herein. Rather, providing these embodiments will make the disclosure thorough and complete, and will fully convey the scope of this invention to those skilled in the art. In the drawings, for clarity, the dimensions of layers and regions, as well as their relative dimensions, may be exaggerated. The same reference numerals denote the same elements throughout.

[0027] It should be understood that when an element or layer is referred to as "on," "adjacent to," "connected to," or "coupled to" other elements or layers, it may be directly on, adjacent to, connected to, or coupled to other elements or layers, or there may be intervening elements or layers. Conversely, when an element is referred to as "directly on," "directly adjacent to," "directly connected to," or "directly coupled to" other elements or layers, there are no intervening elements or layers. It should be understood that although the terms first, second, third, etc., may be used to describe various elements, components, areas, layers, and / or portions, these elements, components, areas, layers, and / or portions should not be limited by these terms. These terms are only used to distinguish one element, component, area, layer, or portion from another element, component, area, layer, or portion. Therefore, without departing from the teachings of this utility model, the first element, component, area, layer, or portion discussed below may be referred to as a second element, component, area, layer, or portion.

[0028] Spatial relation terms such as “below,” “under,” “below,” “under,” “above,” “above,” etc., are used herein for convenience of description to describe the relationship between one element or feature shown in the figure and other elements or features. It should be understood that, in addition to the orientation shown in the figure, spatial relation terms are intended to also include different orientations of the device in use and operation. For example, if the device in the figure is flipped, then the element or feature described as “below” or “under” the other element or feature will be oriented “above” the other element or feature. Therefore, the exemplary terms “below” and “under” can include both upper and lower orientations. The device may be otherwise oriented (rotated 90 degrees or otherwise) and the spatial descriptive terms used herein will be interpreted accordingly.

[0029] The terminology used herein is for the purpose of describing particular embodiments only and is not intended to limit the scope of the invention. When used herein, the singular forms “a,” “an,” and “the” are also intended to include the plural forms, unless the context clearly indicates otherwise.

[0030] Because wafers are densely packed within the cleaning tank, the cleaning solution is easily affected by flow channel disturbances and uneven spraying when cleaning the gaps between wafers, resulting in differences in the flow rate of the cleaning solution on different wafer surfaces. Even if the overall flow rate of the cleaning solution in the main pipeline remains stable, there may still be local areas with lower flow velocities or turbulent flow, causing inconsistent cleaning capabilities and leading to cleaning defects such as particle residue and uneven etching. In related technologies, the liquid flow monitoring methods of cleaning equipment are mainly focused on the main pipeline level. These methods can only detect the total flow rate of the cleaning solution in the main pipeline and cannot detect the local flow distribution on the wafer surface. They lack dynamic adjustment capabilities and are difficult to achieve adaptive optimization during the cleaning process, resulting in poor wafer cleaning effects.

[0031] To address at least one of the aforementioned technical problems, this application provides a calibration device for a cleaning tank, comprising:

[0032] The support platform has an internal cavity for holding the cleaning fluid.

[0033] Multiple liquid outlets are located on the top of the support platform and communicate with the receiving cavity;

[0034] Multiple spacers are spaced apart on the support platform, and a wafer accommodating area is formed between every two adjacent spacers. Each wafer accommodating area has at least one liquid outlet.

[0035] At least one flow detection device, each flow detection device being disposed in the receiving cavity, is used to monitor the liquid flow rate at the outlet;

[0036] At least one regulating device, each regulating device being disposed at the liquid outlet and configured to regulate the liquid flow rate at the liquid outlet.

[0037] According to the calibration device for the cleaning tank of this application, a receiving cavity is set inside the support platform, and multiple liquid outlets communicating with the receiving cavity are set at its top. Combined with spacers set at intervals, a wafer receiving area corresponding to the wafer position is formed, so that the cleaning liquid can flow evenly upward from the liquid outlets to effectively wash the wafer surface. Furthermore, a flow detection device and a regulating device are set in the receiving cavity to detect and regulate the liquid flow rate at the liquid outlets, avoiding problems such as poor wafer cleaning effect caused by uneven liquid flow distribution. This effectively ensures the stability and consistency of the wafer cleaning effect and improves product yield and reliability.

[0038] To fully understand this application, a detailed structure will be presented in the following description to illustrate the technical solutions proposed in this application. Preferred embodiments of this application are described in detail below; however, in addition to these detailed descriptions, this application may have other implementation methods.

[0039] The following is for reference. Figure 1The present application describes a calibration device for a cleaning tank according to one embodiment. The calibration device includes a support platform 10 with a receiving cavity inside for containing cleaning fluid; a plurality of liquid outlets 11 disposed on the top of the support platform 10 and communicating with the receiving cavity; a plurality of spacers 12 spaced apart on the support platform 10, with a wafer receiving area formed between every two adjacent spacers 12, wherein each wafer receiving area corresponds to at least one liquid outlet 11; at least one flow detection device, each flow detection device disposed in the receiving cavity, for monitoring the liquid flow rate of the liquid outlet 11; and at least one regulating device 14, each regulating device 14 disposed at the liquid outlet 11 and configured to regulate the liquid flow rate of the liquid outlet 11.

[0040] In this embodiment, the calibration apparatus includes a support platform 10, which has a cavity for containing cleaning fluid. Multiple outlets 11 are located on the top of the support platform 10 and communicate with the cavity, allowing the cleaning fluid to flow upwards from the cavity through the outlets 11, effectively rinsing the wafer surface. Multiple spacers 12 are spaced apart on the support platform 10, forming a wafer accommodating area between every two adjacent spacers 12. Each wafer accommodating area corresponds to at least one outlet 11, achieving regional matching between the cleaning fluid output and the wafer position, improving the uniformity of the flow field distribution. The calibration apparatus also includes at least one flow detection device and at least one adjustment device 14, located in the cavity, for real-time detection and adjustment of the liquid flow rate at the outlets 11. This allows for obtaining the flow rate of the cleaning fluid corresponding to wafers in different areas, and adjustment based on the flow rate difference between different areas, achieving flow balance of the cleaning fluid in different areas. The correction device of this application enables precise monitoring and adaptive correction of the local flow field during the wafer cleaning process, which significantly improves the stability and uniformity of the cleaning process and enhances the cleaning effect of the wafer.

[0041] In some embodiments, such as Figure 1 and Figure 2 As shown, the calibration device includes a support platform 10, which has an internal cavity for holding cleaning fluid. Specifically, the support platform 10 has a hollow structure with a closed internal cavity for holding and temporarily storing the cleaning fluid, serving as a distribution cavity for the cleaning fluid within the inner tank. Figure 6 As shown, the cleaning fluid enters the containment cavity and is evenly distributed within the cavity under pressure. It then flows upwards through multiple outlets 11 at the top, continuously rinsing the wafer surface. For example, the support stage 10 is made of corrosion-resistant, high-purity materials, such as PTFE, suitable for wet cleaning environments involving strong acids and alkalis in semiconductors, ensuring that no metal ions or particulate contamination is introduced during the process.

[0042] In some embodiments, such as Figure 1and Figure 2 As shown, the calibration device includes multiple liquid outlets 11, which are located on the top of the support platform 10 and communicate with the receiving cavity. Specifically, the multiple liquid outlets 11 are connected to the receiving cavity and can be arranged in an array or in sections on the top of the support platform 10, allowing the cleaning fluid to be uniformly sprayed upwards from the top of the support platform 10, forming a vertical or inclined scouring flow field on the wafer surface, effectively improving the cleaning fluid's ability to remove particulate contaminants. By corresponding the multiple liquid outlets 11 to the arrangement of the wafers, regional control of the cleaning fluid output can be achieved, ensuring a consistent fluid environment in the area where each wafer is located. The number, aperture, and distribution density of the liquid outlets 11 can be designed according to process requirements and are not specifically limited thereto.

[0043] In some embodiments, such as Figure 1 and Figure 2 As shown, the calibration device includes multiple spacers 12, which are spaced apart on the support platform 10. A wafer accommodating area is formed between every two adjacent spacers 12, and each wafer accommodating area corresponds to at least one liquid outlet 11. Specifically, the spacers 12 are partitions. Multiple spacers 12 are spaced apart on the top of the support platform 10, forming a wafer accommodating area between every two adjacent spacers 12, thereby achieving stable support and orderly arrangement of multiple wafers. The spacing of the spacers 12 is designed according to the wafer thickness and process clearance to ensure that the wafers maintain a fixed position during cleaning and provide a uniform channel for the flow of cleaning fluid. Each wafer accommodating area corresponds to at least one liquid outlet 11, allowing the cleaning fluid flowing from the outlet to directly act on the surface area of ​​the corresponding wafer. Exemplarily, the spacers 12 can be partitions, etc., without specific limitation.

[0044] In some embodiments, such as Figure 1 and Figure 3 As shown, the calibration device includes at least one inlet 13, each inlet 13 being disposed on the side of the support platform 10 and communicating with the receiving cavity. Specifically, the inlet 13 is disposed on the side of the support platform 10 for introducing cleaning fluid from an external circulation pump or liquid supply system into the receiving cavity. There can be one, two, or more inlets 13. When multiple inlets 13 are provided, they are disposed on the side of the support platform 10 and spaced apart along the length of the side. In this embodiment, two inlets 13 are provided on the side of the support platform 10, allowing the cleaning fluid to enter the receiving cavity simultaneously from different positions, shortening the flow path, quickly establishing pressure balance within the cavity, and improving the uniformity of the cleaning fluid distribution within the receiving cavity.

[0045] In some embodiments, the calibration device includes at least one flow detection device, each disposed in the receiving cavity, for monitoring the liquid flow rate at the outlet 11. Specifically, one, two, three, or more flow detection devices may be provided. By directly integrating the flow detection devices into the receiving cavity, with each flow detection device positioned close to the outlet 11, the liquid flow rate at the outlet 11 can be detected, thus obtaining the liquid flow rate flowing to the wafer surface and improving the uniformity and stability of the cleaning process. Exemplarily, the flow detection device may be a flow meter or similar device, without specific limitation.

[0046] In some embodiments, the spacer 12 is a partition, and the multiple outlets 11 are divided into multiple groups of outlets. A group of outlets is provided on both sides of each partition, and each group of outlets includes multiple outlets 11 spaced apart along the length of the partition. Each group of outlets corresponds to a flow detection device. Specifically, each group of outlets corresponds to a flow detection device, enabling independent monitoring of the flow rate of the cleaning fluid in the area where each wafer is located. Each flow detection device is located inside the receiving cavity, on the fluid path between the inlet 13 and the group of outlets. This location reflects the flow rate of the cleaning fluid allocated to that group of outlets, avoiding measurement interference caused by flow channel crossing or mixing. In other examples, each flow detection device can also be located below any outlet 11 in each group of outlets; this is not specifically limited. This arrangement can detect whether there are problems such as low flow rate, blockage, or abnormal flow in a wafer receiving area.

[0047] In some embodiments, the number of flow detection devices is equal to the number of outlets 11, with one flow detection device corresponding to each outlet 11, and each flow detection device is located below the corresponding outlet 11. Specifically, a flow detection device is provided below each outlet 11, located inside the receiving cavity and close to the outlet 11, on the necessary path of the cleaning fluid flowing to the outlet 11. Since each outlet 11 corresponds to a portion of the wafer's surface area, the liquid flow rate at multiple locations on each wafer can be detected, thereby determining whether there are any abnormalities in the liquid flow rate in different surface areas of the wafer, and providing feedback signals for subsequent closed-loop control to achieve uniform cleaning of the wafer.

[0048] In some embodiments, such as Figure 4As shown, the correction device also includes at least one regulating device 14. Each regulating device 14 is located below the liquid outlet 11, and each liquid inlet 13 corresponds to one regulating device 14. The regulating device 14 is configured to regulate the liquid flow rate of the liquid outlet 11. Specifically, each liquid inlet 13 is configured with one regulating device 14, for example, two liquid inlets are configured with two regulating devices. The regulating device 14 is located below the liquid outlet 11 and closer to the liquid outlet 11 than the flow detection device, and is configured to dynamically regulate the flow rate of the cleaning fluid flowing to each liquid outlet 11. When the flow rate of a certain area of ​​the liquid outlet 11 is too low or too high, the corresponding regulating device 14 can adjust its flow area, thereby changing the flow resistance of that branch and achieving a balanced distribution of the flow rate.

[0049] In some embodiments, such as Figure 4 As shown, each regulating device 14 includes a drive device 140 and at least one control valve 141. The control valve 141 is connected to the drive device 140, and the drive device 140 is configured to drive the opening degree of the control valve 141. For example, when there are multiple sets of outlets, the regulating device 14 includes a drive device 140 and multiple control valves 141, the number of control valves 141 being equal to the number of outlets in each set. Each control valve 141 is located below the outlet 11 of each set of outlets. Specifically, the control valve 141 is located below the outlet 11 and closer to the outlet 11 than the flow detection device. The control valve 141 is located in the fluid passage within the receiving cavity and is used to regulate the flow rate of the cleaning fluid flowing to the outlet 11. The drive device 140 is connected to the control valve 141 and configured to drive the opening degree of the control valve 141, thereby changing the flow area of ​​the control valve 141 and achieving regulation of the flow rate of the cleaning fluid flowing to the outlet 11.

[0050] For example, such as Figure 5As shown, each set of outlets corresponds to at least one control valve 141, enabling independent control of the cleaning fluid flow rate in the area where each wafer is located. Specifically, the number of control valves 141 corresponding to each set of outlets is matched with the number of inlets 13. For example, when the support platform 10 has one inlet 13, each set of outlets corresponds to one control valve 141; when the support platform 10 has two inlets 13, each set of outlets corresponds to two control valves 141; and when the support platform 10 has multiple inlets 13, each set of outlets corresponds to multiple control valves 141. Exemplarily, the drive device 140 can be a servo motor or an electromagnetic driver, etc., and the control valve 141 can be a rotary control valve, etc., without specific limitations. The flow data collected by the flow detection device can be uploaded to the control device. After comparing the flow deviation of each area, the control device outputs the adjustment command to control the drive device 140 to act and dynamically adjust the opening and closing degree of each control valve. This enables real-time monitoring and adaptive adjustment of the flow of the cleaning fluid during the cleaning process, significantly improving the cleaning uniformity and process stability.

[0051] In some embodiments, the calibration device further includes a control device electrically connected to the flow detection device and the regulating device 14, configured to control the regulating device 14 to adjust the liquid flow rate at the outlet 11 based on the liquid flow rate detected by the flow detection device. Exemplarily, the control device can be a programmable logic controller (PLC), an industrial computer, a microcontroller, or an embedded control system, possessing data acquisition, logic operation, and output control functions. During operation, each flow detection device uploads the detected cleaning fluid flow rate at the outlet 11 to the control device. The control device compares and analyzes the cleaning fluid flow rates in multiple areas, generates adjustment commands, and sends them to the corresponding drive device 140. The drive device 140 drives the control valve 141 to adjust its opening degree, thereby achieving dynamic adjustment of the cleaning fluid flow rate in each area to achieve uniform distribution. This control device enables the cleaning process to possess intelligent capabilities of self-sensing, self-decision-making, and self-regulation, significantly improving the stability, uniformity, and yield of the cleaning process.

[0052] In summary, the calibration device for the cleaning tank according to the embodiments of this application, by setting a receiving cavity inside the support platform and setting multiple liquid outlets communicating with the receiving cavity at its top, and combining the spacers set at intervals to form a wafer receiving area corresponding to the wafer position, allows the cleaning liquid to flow evenly upward from the liquid outlets, effectively rinsing the wafer surface. Furthermore, a flow detection device and a regulating device are set in the receiving cavity to detect and regulate the liquid flow rate at the liquid outlets, avoiding problems such as poor wafer cleaning effect caused by uneven liquid flow distribution, effectively ensuring the stability and consistency of the wafer cleaning effect, and improving product yield and reliability.

[0053] This application also provides a cleaning device, which includes a cleaning tank and the aforementioned calibration device. Specifically, the cleaning device has a cleaning tank, which typically adopts an inner and outer tank structure design. The inner tank is used to hold the wafer and perform the cleaning process, while the outer tank is used to store and circulate the cleaning solution. A circulation pump transports the cleaning solution from the outer tank to the inner tank, achieving continuous flow and reuse of the cleaning solution. Using the calibration device in the cleaning tank effectively ensures the stability and consistency of the wafer cleaning effect, improving product yield and reliability.

[0054] Although exemplary embodiments have been described herein with reference to the accompanying drawings, it should be understood that the above exemplary embodiments are merely illustrative and are not intended to limit the scope of this application. Various changes and modifications can be made therein by those skilled in the art without departing from the scope and spirit of this application. All such changes and modifications are intended to be included within the scope of this application as claimed in the appended claims.

[0055] Similarly, it should be understood that, in order to simplify this application and aid in understanding one or more aspects of the application, various features of this application may sometimes be grouped together in a single embodiment, figure, or description thereof in the description of exemplary embodiments of this application. However, this approach should not be construed as reflecting an intention that the claimed application requires more features than are expressly recited in each claim. Rather, as reflected in the corresponding claims, the point of application is that the corresponding technical problem can be solved with fewer features than all of a single disclosed embodiment. Therefore, the claims following the detailed description are hereby expressly incorporated into that detailed description, wherein each claim itself is a separate embodiment of this application.

[0056] Furthermore, those skilled in the art will understand that although some embodiments described herein include certain features but not others included in other embodiments, combinations of features from different embodiments are intended to be within the scope of this application and form different embodiments. For example, in the claims, any one of the claimed embodiments can be used in any combination.

[0057] It should be noted that the above embodiments are illustrative of this application and not limiting of it, and that those skilled in the art can devise alternative embodiments without departing from the scope of the appended claims. In the claims, any reference signs placed between parentheses should not be construed as limiting the claims. The use of the words first, second, and third, etc., does not indicate any order. These words can be interpreted as names.

Claims

1. A correction device for a cleaning tank, characterized in that The correction device includes: A support platform, the inside of which is provided with a receiving cavity for holding cleaning fluid; Multiple liquid outlets are provided on the top of the support platform and communicate with the receiving cavity; Multiple spacers are spaced apart on the support platform, and a wafer accommodating area is formed between every two adjacent spacers, wherein each wafer accommodating area corresponds to at least one liquid outlet. At least one flow detection device, each of which is disposed in the receiving cavity, is used to monitor the liquid flow rate at the outlet; At least one regulating device, each of the regulating devices being disposed at the liquid outlet and configured to regulate the liquid flow rate of the liquid outlet.

2. The correction device of claim 1, wherein The spacer is a partition, and the multiple liquid outlets are divided into multiple groups of liquid outlets. A group of liquid outlets is provided on both sides of each partition. Each group of liquid outlets includes multiple liquid outlets arranged at intervals along the length of the partition. Each group of liquid outlets corresponds to a flow detection device.

3. The correction device of claim 1, wherein The number of flow detection devices is equal to the number of liquid outlets, with each liquid outlet corresponding to one flow detection device, and each flow detection device is located below the liquid outlet.

4. The correction device of claim 2, wherein Each of the regulating devices includes a drive device and at least one control valve, the control valve being connected to the drive device, the drive device being configured to drive the opening degree of the control valve.

5. The correction device of claim 4, wherein, Each of the control valves is located below the liquid outlet, and each group of liquid outlets corresponds to at least one of the control valves.

6. The correction device of claim 4, wherein, The driving device is a servo motor, and the control valve is a rotary control valve.

7. The correction device of claim 1, wherein The calibration device further includes at least one liquid inlet, each of which is disposed on the side of the support platform and communicates with the receiving cavity, wherein each of the liquid inlets corresponds to one of the adjustment devices.

8. The correction device of claim 1, wherein, The calibration device further includes a control device electrically connected to the flow detection device and the regulating device, configured to control the regulating device to regulate the liquid flow at the outlet based on the liquid flow detected by the flow detection device.

9. The correction device of claim 1, wherein, The flow detection device is a flow meter.

10. A cleaning apparatus characterized by, The cleaning equipment includes a cleaning tank, and the cleaning tank includes a calibration device as described in any one of claims 1-9.

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