A precision softening mechanism for large-size wafer substrate

Abstract

This utility model discloses a precision softening mechanism for large-size wafer adhesive, comprising: a support plate mounted on a machine platform; a first cylinder fixed above the support plate; a base film to which several wafers are attached is placed on top of the first cylinder; a heat source plate located below the first cylinder; a through hole in the center of the heat source plate; and an output port group above the heat source plate, through which hot air is output upwards. This utility model achieves precise softening through the synergistic effect of hot air and ultraviolet light. The output port group of the heat source plate adopts a differentiated design, with the outer ring air outlets providing a stable impact force vertically upwards to ensure the edge area of ​​the base film is firmly fixed; the pusher mechanism ensures that the wafers are safely separated at the optimal time, completely eliminating collision, residue, or breakage problems caused by uneven adhesive dissolution, and achieving perfect synergy between adhesive softening and mechanical separation.

Description

Technical Field

[0001] This invention relates to a precision softening mechanism for the substrate of large-size wafers, belonging to the field of wafer auxiliary processing technology. Background Technology

[0002] In the field of advanced semiconductor manufacturing, the widespread use of large-format wafers places higher demands on back-end packaging processes. Wafer separation, as a critical process, requires the safe removal and separation of multiple wafers attached to the substrate to avoid damage to the micron-level structure.

[0003] Traditional debonding techniques rely solely on hot air or ultraviolet light, which is insufficient to meet the high precision requirements of large-size wafers (debonding uniformity must be <5μm standard deviation). There is an urgent need for a precision softening system that integrates hot air-UV coordinated control and dynamic pushing to ensure real-time matching between the debonding process and the wafer state.

[0004] As wafer size increases and thickness decreases, the spacing between adjacent wafers shrinks to the sub-millimeter level, making them highly susceptible to collisions, residues, or breakage during separation. Undercoat softening is a crucial step in separation, requiring precise control of the adhesive's weakening level: excessive debonding causes wafer warping, while insufficient debonding results in adhesive residue. Utility Model Content

[0005] In view of the shortcomings of the existing technology, the purpose of this utility model is to provide a precision softening mechanism for large-size wafer substrates, so as to solve the problems of the existing technology.

[0006] To achieve the above objectives, this utility model is implemented through the following technical solution:

[0007] A precision softening mechanism for large-size wafer substrate includes: a support plate mounted on a machine platform, a first cylinder that is installed and fixed above the support plate, and a substrate film on which a plurality of wafers are attached is placed on top of the first cylinder.

[0008] A heat source plate is located below the first cylinder, a through hole is provided in the middle of the heat source plate, and an output port group is provided above the heat source plate to output hot air upward through the output port group;

[0009] An adhesive-removing lamp assembly is provided above the outside of the through hole; a pin mechanism is provided in the middle of the through hole; and a first drive assembly is provided to drive the pin mechanism to move up and down. The adhesive-removing lamp assembly outputs ultraviolet light toward the bottom film. A control module is provided, which is electrically connected to the adhesive-removing lamp assembly and the first drive assembly. The control module controls the on / off state of the adhesive-removing lamp assembly and adjusts the intensity of the ultraviolet light. The control module cooperates with the first drive assembly to control the pin mechanism to push the bottom film from bottom to top.

[0010] As a further improvement, the adhesive removal lamp assembly includes an inner ring, an outer ring, and a plurality of lamp beads fixedly installed in the middle of the heat source plate, wherein the inner ring is close to the through hole, the outer ring is far from the through hole, and the inner ring and the outer ring are coaxially arranged.

[0011] As a further improvement, the debonding lamp assembly also includes an annular cover plate disposed above the lamp beads, the annular cover plate being embedded between the inner ring and the outer ring.

[0012] As a further improvement, it also includes a set of support frames mounted on the machine base, with a heat source plate fixedly supported above the two support frames, and a support portion extending outward from the side of the support frame away from the heat source plate, the support portion being fixedly connected to the machine base by bolts.

[0013] As a further improvement, the ejector mechanism includes a movable platform located between two support frames, a rod installed in the middle of the movable platform, a plurality of top holes provided at the top center of the rod, and a ejector rod inserted into the top holes.

[0014] As a further improvement, it also includes a hot air input pipe located on the lower side of the rod and several hot air output holes located at the top of the rod. The hot air output holes are connected to the hot air input pipe. The hot air input pipe is equipped with a solenoid valve, which is electrically connected to the control module. The control module controls the opening and closing of the solenoid valve to adjust and control the hot air input state.

[0015] As a further improvement, the first drive assembly includes two sets of guide rods fixedly installed on the lower sides of the active platform, with the two guide rods in the same set fixed below by limiting strips;

[0016] A telescopic control mechanism is installed on the machine base. The output end of the telescopic control mechanism is fixedly connected to the middle part of the lower part of the movable platform. The telescopic control mechanism is electrically connected to the control module. Through the cooperation of the control module and the telescopic control mechanism, the movable platform is raised and lowered, shortening / increasing the distance between the ejector pin mechanism and the bottom membrane.

[0017] As a further improvement, the adhesive removal lamp assembly also includes a plurality of first adjustment plates disposed above the outer ring, a first flexible plate connecting adjacent first adjustment plates, and a second drive assembly for controlling the angle adjustment of the first adjustment plates. The second drive assembly is electrically connected to the control module. Through the cooperation of the control module and the second drive assembly, the first adjustment plates are controlled to rotate toward the side away from the lamp beads, thereby increasing the irradiation range of the lamp beads on the outer edge of the bottom film.

[0018] By controlling the first adjusting plate to rotate toward the lamp bead, the irradiation range of the lamp bead on the outer edge of the base film is reduced.

[0019] As a further improvement, the adhesive removal lamp assembly also includes a plurality of second adjustment plates disposed above the inner ring, a second flexible plate connecting adjacent second adjustment plates, and a sixth driving component for controlling the angle adjustment of the second adjustment plates. The sixth driving component is electrically connected to the control module. Through the cooperation of the control module and the sixth driving component, the second adjustment plates are controlled to rotate toward the side away from the lamp beads, thereby increasing the irradiation range of the lamp beads on the central area of ​​the bottom film.

[0020] By controlling the second adjustment plate to rotate toward the lamp bead, the irradiation range of the lamp bead on the central area of ​​the base film is reduced.

[0021] Beneficial effects:

[0022] This invention utilizes the precise softening effect of synergistic action of hot air and ultraviolet light. The heat source plate output port assembly adopts a differentiated design, with the outer ring air outlet providing a stable impact force vertically upwards, ensuring a firm fixation of the bottom membrane edge area;

[0023] The inner air outlet is angled towards the center, creating an optimized airflow path that ensures even coverage of the wafer attachment area with hot air. The debonding lamp assembly employs a double-ring layout, with the inner ring closer to the through-hole and the outer ring further away. The lamps are regularly distributed to effectively compensate for the natural attenuation of UV intensity with distance. Combined with the ejector pin mechanism, it pushes upwards from the center, assisting in the mid-section stretching of the base film and aiding in wafer separation.

[0024] The heat source plate's differentiated air outlet design ensures that the edge area is stably fixed and the center area is uniformly debonded simultaneously. The debonding lamp group adopts a double-ring layout structure to automatically adapt to the wafer distribution density. In areas with too small a spacing, the radiation intensity is reduced to prevent excessive debonding and warping. In areas with too large a spacing, the radiation is enhanced to ensure sufficient softening and avoid adhesion residue.

[0025] The pusher mechanism ensures that the wafer is safely separated at the optimal time, completely eliminating collision, residue or cracking problems caused by uneven descaling, and achieving perfect synergy between base adhesive softening and mechanical separation. Attached Figure Description

[0026] To more clearly illustrate the technical solutions of the embodiments of this utility model, the drawings used in the embodiments will be briefly introduced below. It should be understood that the following drawings only show some embodiments of this utility model and should not be regarded as a limitation of the scope. For those skilled in the art, other related drawings can be obtained from these drawings without creative effort.

[0027] Figure 1 This is a side view cross-sectional diagram of a large-size wafer substrate precision softening mechanism according to this utility model.

[0028] Figure 2 This is a schematic diagram of the installation state structure of a large-size wafer substrate adhesive precision softening mechanism according to this utility model.

[0029] Figure 3 This is a partially enlarged schematic diagram of the ejector mechanism of a precision softening mechanism for large-size wafer substrates according to this utility model.

[0030] Figure 4 This is a partially enlarged structural diagram of the descaling lamp assembly of a large-size wafer substrate adhesive precision softening mechanism according to this utility model.

[0031] Figure 5 This is a partially enlarged structural schematic diagram of another embodiment of the descaling lamp assembly of a large-size wafer substrate adhesive precision softening mechanism according to this utility model.

[0032] Figure 6 This is a schematic diagram of the connection of a precision softening mechanism module for large-size wafer substrate adhesive according to this utility model.

[0033] 1. Support plate; 11. Machine base; 2. First cylinder; 3. Wafer; 4. Bottom film; 5. Heat source plate; 6. Control module; 61. Through hole; 7. Output port assembly; 8. Debonding lamp assembly; 9. Ejector pin mechanism; 81. Inner ring; 82. Outer ring; 83. Lamp bead; 84. Annular cover; 12. Support frame; 121. Support part; 91. Movable platform; 92. Rod; 93. Top hole; 94. Top rod; 9 5. Hot air inlet pipe; 96. Hot air outlet; 97. Solenoid valve; 98. Guide rod; 99. Limiting plate; 910. Telescopic control mechanism; 821. First adjusting plate; 822. First flexible plate; 811. Second adjusting plate; 812. Second flexible plate; 823. First airbag; 824. First air pump; 825. Torsion spring; 826. Rotating shaft; 813. Second airbag; 814. Second air pump. Detailed Implementation

[0034] To make the objectives, technical solutions, and advantages of the embodiments of this utility model clearer, the technical solutions of the embodiments of this utility model will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of this utility model, not all of them. Based on the embodiments of this utility model, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this utility model. Therefore, the following detailed description of the embodiments of this utility model provided in the accompanying drawings is not intended to limit the scope of the claimed utility model, but merely represents selected embodiments of this utility model. Based on the embodiments of this utility model, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this utility model.

[0035] In the description of this utility model, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this utility model, "a plurality of" means two or more, unless otherwise explicitly specified.

[0036] Example 1

[0037] Reference Figure 1-4 As shown in Figure 6, a large-size wafer substrate adhesive precision softening mechanism includes: a support plate 1 installed on a machine base 11, a first cylinder 2 installed and fixed above the support plate 1, and a substrate film 4 on which several wafers 3 are attached is covered on the first cylinder 2.

[0038] A heat source plate 5 is located below the first cylinder 2. A through hole 61 is provided in the middle of the heat source plate 5. An output port group 7 is provided above the heat source plate 5, through which hot air is output upward.

[0039] A glue-removing lamp group 8, a pin mechanism 9 located in the middle of the through hole 61, and a first drive assembly for driving the pin mechanism 9 to rise and fall are provided above the outside of the through hole 61. The glue-removing lamp group 8 outputs ultraviolet light toward the bottom film 4.

[0040] The control module 6 is electrically connected to the adhesive removal lamp group 8 and the first driving component. The control module 6 controls the on / off state of the adhesive removal lamp group 8 and adjusts the intensity of ultraviolet light. The control module 6 cooperates with the first driving component to control the ejector pin mechanism 9 to push the bottom film 4 from bottom to top.

[0041] The heat source plate 5 and the output port group 7 employ a differentiated design, with the outer ring air outlets providing a stable impact force vertically upwards to ensure the edge area of ​​the bottom membrane 4 is firmly fixed.

[0042] The inner air outlet is tilted towards the center to form an optimized airflow path, ensuring that hot air energy evenly covers the wafer 3 attachment area. The debonding lamp group 8 adopts a double-ring layout structure, with the inner ring 81 close to the through hole 61 and the outer ring 82 away from the through hole 61. The lamp beads 83 are regularly distributed to effectively compensate for the natural attenuation of ultraviolet light intensity with distance. Together with the ejector pin mechanism 9, it pushes upward from the middle to assist the bottom film 4 in middle stretching and assist the separation of the wafer 3.

[0043] The heat source plate 5 and the output port group 7 adopt a differentiated design, providing a pressure of 0.8–1.2 kPa to fix the edge area at the outer ring vertical air outlet, and an inner ring 45° inclined air outlet with a top width to bottom width ratio of 1:1.5 to compensate for long-path energy loss and ensure heat flux uniformity of ±3% in the central area.

[0044] The debonding lamp assembly 8 employs a double-ring design: the inner ring 81 has a diameter of 80–100 mm, and the outer ring 82 has a diameter of 180–220 mm. The LED beads 83 are non-uniformly arranged according to the radiation attenuation curve. The density in the outer ring 82 area is increased by 40%, with a spacing of 4–5 mm, while the density in the inner ring 81 area is reduced by 30%, with a spacing of 8–10 mm, compensating for the natural attenuation of UV intensity with distance. The control module 6 dynamically adjusts the hot air temperature (80–150℃), UV intensity (200–500 mW / cm²), and pushing parameters based on real-time data from temperature sensors and a high-resolution camera, compressing the standard deviation of debonding uniformity to within 5 μm and completely eliminating the process mismatch problem caused by a single debonding method.

[0045] By using a combination of hot air and UV control and a dynamic jacking mechanism, the core bottlenecks of single debonding method, rigid radiation distribution, and jacking mismatch have been solved.

[0046] During operation, control module 6 executes a precise softening sequence:

[0047] During the preheating stage, the heat source plate 5 is started, and the output port group 7 preheats the system with 80℃ hot air. The temperature detection module provides real-time feedback data, and the control module 6 adjusts the hot air unit to ensure temperature uniformity (standard deviation < ±3℃).

[0048] During the radiation matching stage, a high-resolution camera scans the wafer 3 distribution on the substrate 4, and the control module 6 identifies areas with abnormal spacing (<0.6mm or >1.0mm). It dynamically adjusts the output intensity of the debonding lamp group 8 and the angle between it and the annular cover plate 84. In areas with excessively small spacing, the UV intensity is suppressed to 300–350mW / cm². 2 In areas with excessively large spacing, the power output is increased to 450–500 mW / cm².2 ;

[0049] During the synergistic softening stage, hot air and UV work simultaneously. The outer ring of vertical hot air strengthens the edge fixation, while the inner ring of inclined hot air and optimized UV radiation work together in the central area. The control module 6 collects debonding progress data every 10ms.

[0050] During the pre-assessment phase, when a local adhesion strength of <0.2MPa is detected, the UV intensity of the area is automatically reduced to prevent excessive debonding; at the same time, hot air is sprayed at 80–120℃ into the area with insufficient debonding for pretreatment (action time 100–300ms).

[0051] The gradient push stage control module 6 instructs the first drive component to first activate the outer ring push rod 94 (force value 0.5–0.8N) to separate the edge wafer 3, and activate the inner ring push rod 94 (force value 1.0–1.5N) 100ms later. The push force is dynamically compensated according to the debonding progress to ensure that the standard deviation of the contact pressure is <0.4MPa.

[0052] Existing adhesive softening technology suffers from multiple problems due to design flaws. The single adhesive removal method results in both insufficient edge fixing force (<0.5N) and excessive adhesive removal in the center (carbonization rate >12%). The fixed lamp assembly cannot adapt to the wafer 3-pitch variation, resulting in adhesive removal strength deviation >45%. The ejector pin is forcibly separated under fixed parameters, resulting in a breakage rate of >7% in the insufficient adhesive removal area and a scratch depth of >0.2μm in the fully adhesive removal area.

[0053] In the separation process of large-size wafers, the UV debonding stage faces core defects such as unbalanced radiation intensity gradient and thermal interference: traditional single-ring lamps cause UV overexposure in the inner ring area (intensity > 600mW / cm2), leading to colloid carbonization, while the outer ring area receives insufficient radiation (< 200mW / cm2). 2 This causes adhesion residue; at the same time, the thermal deformation of the heat source plate 5 (displacement > 30 μm) causes fluctuations in the distance between the lamp bead 83 and the bottom film 4, exacerbating uneven debonding. The ejector mechanism 9, due to insufficient structural rigidity, leads to an unbalanced distribution of the ejector force (pressure standard deviation > 1.5 MPa), causing the wafer 3 to crack (breakage rate > 7%).

[0054] The adhesive removal lamp assembly 8 includes an inner ring 81, an outer ring 82, and a plurality of lamp beads 83 fixedly installed in the middle of the heat source plate 5. The inner ring 81 is close to the through hole 61, the outer ring 82 is away from the through hole 61, and the inner ring 81 and the outer ring 82 are coaxially arranged.

[0055] The debonding lamp assembly 8 also includes an annular cover 84 disposed above the lamp bead 83, the annular cover 84 being embedded between the inner ring 81 and the outer ring 82.

[0056] It also includes a set of support frames 12 installed on the machine base 11. The heat source plate 5 is fixedly supported above the two support frames 12. A support part 121 extends outward from the side of the support frame 12 away from the heat source plate 5. The support part 121 is fixedly connected to the machine base 11 by bolts.

[0057] The ejector mechanism 9 includes a movable platform 91 located between two support frames 12, a rod 92 installed in the middle of the movable platform 91, a plurality of top holes 93 provided at the top center of the rod 92, and a ejector rod 94 inserted into the top holes 93.

[0058] By using zoned radiation and 12 independent support frames, a breakthrough was achieved in both degumming accuracy and jacking safety.

[0059] With the inner ring 81 and outer ring 82 arranged in a coaxial nested layout (inner ring 81 diameter 80–100mm, outer ring 82 diameter 180–220mm), the LED beads 83 are non-uniformly arranged according to the radiation attenuation curve: the density of LED beads 83 is reduced by 30% in the area near the inner ring 81 (spacing 8–10mm), and the density is increased by 40% in the area near the outer ring 82 (spacing 4–5mm), compensating for the natural attenuation of UV intensity with distance (following the inverse square law).

[0060] An annular cover plate 84 (quartz material, 92% light transmittance) is embedded between the inner and outer rings 82, and its surface is coated with an anti-reflective film (reflectivity <1.5%) to eliminate stray light interference generated by the heat radiation (>150℃) from the heat source plate 5. During operation, the control module 6 dynamically adjusts the settings according to the distribution of the wafer 3.

[0061] When the inner ring spacing is too small (<0.6mm) after the bottom membrane 4 is stretched, the output intensity of the inner ring 81 is reduced (200–300mW / cm2) to avoid colloid carbonization.

[0062] When the outer ring spacing is large (>1.0mm), the outer ring 82 radiation is enhanced (400–500mW / cm2) to ensure that the adhesive is sufficiently weakened;

[0063] The annular cover plate 84 maintains the purity of the optical path and compresses UV intensity fluctuations to within ±5%.

[0064] It directly solves the problem of radiation gradient imbalance: the inner / outer ring debonding strength deviation is reduced from 48% to 6%, the carbonization rate is reduced from 10.2% to 0.5%, and the adhesion residue rate is reduced from 8.7% to 0.3%.

[0065] The support frame 12 extends to the support section 121 (length ≥ 60 mm), which is rigidly connected to the machine base 11 by bolts, guiding the thermal deformation stress (expansion ≈ 50 μm at a temperature difference of 80℃) of the heat source plate 5 to the equipment foundation frame. The two support frames 12 are symmetrically arranged (spacing ≥ 250 mm), increasing the bending stiffness to 450 N / μm, thus suppressing the working displacement of the heat source plate 5 within ±10 μm.

[0066] During operation, the distance between the debonding lamp group 8 and the base film 4 is constant (fluctuation <5μm), eliminating UV focusing failure caused by thermal drift;

[0067] The movable platform 91 of the ejector mechanism 9 is independent of the heat source plate 5, which avoids the transmission of thermal deformation to the push system;

[0068] The extended design of the support section 121 increases the natural frequency of the heat source plate 5 to 130Hz, effectively isolating the impact vibration of the ejector pin (attenuation rate >75%).

[0069] In actual testing on a 300mm wafer with continuous debonding, the radiation angle deviation of the 83 LEDs was reduced from 2.5° to 0.3°, and the standard deviation of debonding uniformity was improved by 41%.

[0070] The movable platform 91 of the ejector mechanism 9 is independently mounted between the support frames 12 via high-precision linear guides (positioning accuracy ±1μm), completely decoupled from the heat source plate 5. A polyimide-coated ejector rod 94 (friction coefficient <0.03) is inserted into the top hole 93 (diameter 0.8–1.2mm) in the middle of the rod 92, with a top curvature radius of 0.1mm to fit the edge of the wafer 3.

[0071] It also includes a hot air input pipe 95 located on the lower side of the rod 92, and a plurality of hot air output holes 96 located on the top of the rod 92. The hot air output holes 96 are connected to the hot air input pipe 95. The hot air input pipe 95 is equipped with a solenoid valve 97. The solenoid valve 97 is electrically connected to the control module 6. The control module 6 controls the opening and closing of the solenoid valve 97 to adjust and control the hot air input state.

[0072] During the separation of large-size wafers, the core defects of the push pin push link are the imbalance of adhesive force distribution and mechanical impact: the insufficient local debonding area of ​​the bottom film 4 (adhesion strength > 1.2MPa) leads to a sudden increase in push resistance (peak force > 3N), causing wafer 3 to break (breakage rate > 6%).

[0073] Meanwhile, traditional purely mechanical pushing cannot dynamically match the debonding progress, resulting in scratches on the film surface in areas of excessive pushing (depth > 0.2μm) or pushing failure in areas of sufficient debonding. The ejector pin hot air auxiliary system weakens the local adhesion force before pushing by precisely spraying hot air.

[0074] The hot air inlet pipe 95 is integrated on the lower side of the rod 92 and connected to the control module 6 via a solenoid valve 97 (response time <20ms). Hot air outlet holes 96 (0.3–0.5mm in diameter, 10–20 in number) are arranged in a ring at the top of the rod 92. During operation:

[0075] Based on temperature detection data, control module 6 identifies areas of insufficient adhesive release in the bottom film 4 (temperature <110℃);

[0076] 50ms before the ejector pin rises, the solenoid valve 97 is opened, and hot air (80–120℃) is vertically sprayed into the target area through the output hole (action time 100–300ms), which weakens the adhesive (adhesion strength decreases by 35–50%).

[0077] The ejector mechanism 9 rises synchronously, reducing the thrust requirement by 40% (from 2.8N to 1.7N) to avoid sudden changes in local stress; the hot air jet stops at the moment of contact with the ejector to prevent the film surface from collapsing due to excessive debonding.

[0078] It directly solves the problem of mismatch between push force and film state, reducing the peak push resistance in the insufficient debonding area from 3.5N to 1.9N, reducing the wafer breakage rate from 6.3% to 0.6%, and controlling the scratch depth of push rod 94 to within 0.08μm.

[0079] The first drive assembly includes two sets of guide rods 98 fixedly installed on both sides below the active platform 91, with the two guide rods 98 in the same set fixed below by limiting strips;

[0080] A telescopic control mechanism 910 is installed on the machine base 11. The output end of the telescopic control mechanism 910 is fixedly connected to the lower center of the movable platform 91. The telescopic control mechanism 910 is electrically connected to the control module 6. Through the cooperation of the control module 6 and the telescopic control mechanism 910, the movable platform 91 is controlled to rise and fall, thereby shortening / increasing the distance between the ejector pin mechanism 9 and the bottom membrane 4.

[0081] In this embodiment, the telescopic control mechanism 910 is an electric guide rod. The telescopic control mechanism 910 can also be a pneumatic telescopic structure that achieves telescopic movement through the cooperation of a cylinder and a piston, or a hydraulic telescopic structure that achieves telescopic movement through the cooperation of a hydraulic pump and a hydraulic cylinder.

[0082] Example 2

[0083] Reference Figure 5As shown, it is basically the same as in Embodiment 1, except that the adhesive removal lamp group 8 is further provided to include a plurality of first adjusting pieces 821 rotatably mounted on the inner side above the outer ring 82, a first flexible piece 822 connecting adjacent first adjusting pieces 821, and a second driving component for controlling the angle adjustment of the first adjusting pieces 821. The second driving component is electrically connected to the control module 6. Through the cooperation of the control module 6 and the second driving component, the first adjusting pieces 821 are controlled to rotate toward the side away from the lamp beads 83, thereby increasing the irradiation range of the lamp beads 83 on the outer edge of the bottom film 4.

[0084] By controlling the first adjusting piece 821 to rotate toward the lamp bead 83, the irradiation range of the lamp bead 83 on the outer edge of the bottom film 4 is reduced.

[0085] In the large-size wafer 3 separation process, the core defect of UV de-adhesive removal is the failure of radiation adaptation in the outer edge area: the spacing between the outer wafer 3 varies dynamically after the bottom film 4 is stretched (typically ranging from 0.4 to 1.2 mm). Traditional fixed lamp sets cannot match the spacing changes, resulting in UV overexposure (intensity > 550 mW / cm²) when the spacing is too small. 2 The problem was exacerbated by thermal deformation (displacement > 20 μm) of the heat source plate 5, resulting in a standard deviation of degumming uniformity as high as 25 μm. Example 4 utilizes an adjustable reflective structure to achieve real-time compensation of the outer edge radiation intensity. (Note: The text also mentions carbonization rate > 9% and insufficient irradiation when the spacing is too large (intensity < 220 mW / cm², adhesion residue > 8%).)

[0086] The first adjusting piece 821 (thickness 0.5–1.0 mm, surface coated with a high-reflectivity film) is rotatably mounted on the inner side of the outer ring 82. A first flexible piece 822 (made of silicone, with an elongation rate ≥30%) connects adjacent first adjusting pieces 821 to form a continuous reflective surface. The second drive assembly receives commands from the control module 6 to execute the rotation.

[0087] In scenarios with excessively small spacing (<0.6mm): the control module 6 instructs the second drive component to rotate the first adjustment plate 821 toward the lamp bead 83 (tilt angle 0°–15°), the reflective surface focuses the light, reduces the irradiation range (diameter shrinks by 15–20%), and precisely suppresses the radiation intensity to 300–350mW / cm2 to avoid colloid carbonization.

[0088] For scenes with excessively large spacing (>1.0mm): Instruct the adjustment plate to rotate towards the side away from LED 83 (tilt angle 15°–30°), the reflective surface diffuses the light, expands the illumination range (diameter expansion 20–25%), and increases the radiation intensity to 450–500mW / cm2, ensuring that the adhesive is sufficiently weakened;

[0089] During the dynamic compensation process, the first flexible sheet 822 deforms synchronously with the adjustment sheet, eliminating the reflection gap (light leakage rate <0.5%) and maintaining the continuity of the light field.

[0090] Directly solves the problem of radiation mismatch at the outer edge: the deviation in debonding strength caused by spacing fluctuation is reduced from 52% to 7%, the carbonization rate is reduced from 9.5% to 0.4%, and the adhesion residue rate is reduced from 8.3% to 0.3%.

[0091] The second drive assembly includes a first airbag 823 embedded in an outer ring 82 and a first air pump 824 for controlling the inflation and deflation of the first airbag 823. The first air pump 824 is mounted on the machine base 11 and connected to the first airbag 823 via an air supply pipe.

[0092] The sixth drive assembly includes a second airbag 813 embedded in the inner ring 81, and a second air pump 814 that controls the inflation and deflation of the second airbag 813. The second air pump 814 is mounted on the machine base 11 and connected to the second airbag 813 through an air supply pipe.

[0093] The first adjusting piece 821 is mounted on the outer ring 82 via a rotating shaft 826 with a torsion spring 825, and the second adjusting piece 811 is mounted on the inner ring 81 via a rotating shaft 826 with a torsion spring 825. When the first airbag 823 is inflated, it pushes the first adjusting piece 821 to rotate toward the inner ring 81, thereby pulling the first flexible piece 822 embedded on the side of the first adjusting piece 821 to unfold.

[0094] Inflating the second airbag 813 pushes the second adjusting plate 811 to rotate toward the outer ring 82, pulling the second flexible plate 812 embedded in the side of the second adjusting plate 811 to unfold.

[0095] Both the first flexible sheet 822 and the second flexible sheet 812 are light-shielding plastic sheets.

[0096] The adhesive removal lamp group 8 also includes a plurality of second adjustment plates 811 disposed on the outer side of the inner ring 81, a second flexible plate 812 connecting adjacent second adjustment plates 811, and a sixth driving component for controlling the angle adjustment of the second adjustment plates 811. The sixth driving component is electrically connected to the control module 6. Through the cooperation of the control module 6 and the sixth driving component, the second adjustment plate 811 is controlled to rotate toward the side away from the lamp bead 83, thereby increasing the irradiation range of the lamp bead 83 on the central area of ​​the bottom film 4.

[0097] By controlling the second adjusting plate 811 to rotate toward the lamp bead 83, the irradiation range of the lamp bead 83 on the central region of the base film 4 is reduced.

[0098] In the large-size wafer 3 separation process, the core defect in the UV de-adhesion stage is the failure of radiation adaptation between the inner and outer regions: after the bottom film 4 is stretched, the spacing between the outer edge wafer 3 fluctuates (0.4–1.2 mm) and is unevenly distributed in the central region. Traditional fixed lamp groups cause UV overexposure (intensity > 550 mW / cm) when the spacing is too small. 2 The carbonization rate is >9%, and insufficient irradiation occurs when the spacing is too large (intensity <220mW / cm2, adhesion residue rate >8%). This problem is further aggravated by the thermal deformation (displacement >20μm) of the heat source disk 5, resulting in a standard deviation of degumming uniformity as high as 25μm. The airbag-driven adjustment mechanism achieves dynamic compensation of radiation intensity through millisecond-level light field reconstruction.

[0099] The second drive assembly uses a first airbag 823 (volume 5–10 mL) embedded inside the outer ring 82, and a first air pump 824 (response time <30 ms) precisely controls inflation and deflation via an air supply pipe. The first adjusting plate 821 is mounted via a torsion spring 825 and a rotating shaft 826 (preload 0.05–0.1 N·m), with a first flexible sheet 822 (polyimide material, 0.1 mm thick) embedded on its side. During operation:

[0100] In scenarios where the spacing is too small (<0.6mm), the control module 6 instructs the first air pump 824 to exhaust air, and the torsion spring 825 drives the first adjusting plate 821 to rotate toward the lamp bead 83 (tilt angle 0°–15°) with the rebound force. The first flexible plate 822 shrinks synchronously, and the reflective surface focuses the light, reducing the diameter of the irradiation range by 15–20% and precisely suppressing the radiation intensity to 300–350mW / cm2.

[0101] In scenarios with excessively large spacing (>1.0mm), the first air pump 824 is instructed to inflate, and the expansion force of the airbag pushes the first adjusting plate 821 to rotate toward the side away from the lamp bead 83 (tilt angle 15°–30°). The first flexible plate 822 unfolds to expand the reflective surface, the diameter of the irradiation range is expanded by 20–25%, and the radiation intensity is increased to 450–500mW / cm2.

[0102] The dynamic compensation process and closed-loop control of the air pump enable tilt angle adjustment accuracy of ±0.5° and response time of <40ms, eliminating radiation intensity deviation caused by spacing fluctuations (standard deviation reduced from 22% to 3%).

[0103] The carbonization rate decreased from 9.5% to 0.4%, the adhesion residue rate decreased from 8.3% to 0.3%, and the edge wafer breakage rate was reduced from 5.8% to 0.5%.

[0104] The second airbag 813 (volume 3–8 mL) is embedded inside the inner ring 81 via the sixth drive assembly, and the second air pump 814 is independently adjustable. The second adjustment plate 811 is mounted via a torsion spring 825 and a rotating shaft 826 (preload 0.03–0.08 N·m), and the second flexible plate 812 (of the same material) connects to the adjacent adjustment plate.

[0105] During operation:

[0106] In scenarios where the center-to-center spacing is too small (dense area of ​​wafer 3), the control module 6 instructs the second air pump 814 to exhaust air, the torsion spring 825 drives the second adjusting plate 811 to rotate toward the lamp bead 83 (tilt angle 0°–10°), and the second flexible plate 812 shrinks to focus the light, suppressing the radiation intensity to 250–300mW / cm2 to avoid carbonization.

[0107] In scenarios where the center-to-center spacing is too large (sparse area of ​​wafer 3), the second air pump 814 is instructed to inflate, and the airbag pushes the second adjusting plate 811 to rotate toward the outer ring 82 (tilt angle 10°–25°). The second flexible sheet 812 unfolds to diffuse light, and the radiation intensity is increased to 400–450mW / cm2 to ensure sufficient desizing.

[0108] In the coordinated control process, the inner and outer loop 82 air pumps independently respond to the control module 6 commands to achieve synchronous optimization of the center / edge radiation intensity (adjustment error < ±2%).

[0109] It solves the bottleneck of uneven debonding in the central region, reduces the standard deviation of central debonding uniformity from 20μm to 4μm, and reduces wafer warpage by 35%, adapting to the sensitive process requirements of ultra-thin wafers (<50μm).

[0110] It should be noted that the device structure and accompanying drawings of this utility model mainly describe the principle of this utility model. In terms of the technical aspects of this design principle, the setting of the power mechanism, power supply system and control system of the device is not fully described. However, under the premise that those skilled in the art understand the principle of the above utility model, the specific details of its power mechanism, power supply system and control system can be clearly understood. The control method in the application document is automatic control through a controller. The control circuit of the controller can be implemented by those skilled in the art through simple programming.

[0111] All standard parts used can be purchased from the market, and can be customized according to the instructions and drawings. The specific connection methods of each part adopt conventional methods such as bolts, rivets, and welding that are mature in the existing technology. The machinery, parts and equipment adopt conventional models in the existing technology, and the structure and principle of the components known to those skilled in the art can be known by those skilled in the art through technical manuals or conventional experimental methods.

[0112] The above description is merely a preferred embodiment of this utility model and is not intended to limit the utility model. Various modifications and variations can be made to this utility model by those skilled in the art. Any modifications, equivalent substitutions, or improvements made within the spirit and principles of this utility model should be included within the protection scope of this utility model.

Claims

1. A precision softening mechanism for the substrate of a large-size wafer, characterized in that, include: A support plate (1) is installed on the machine base (11), and a first cylinder (2) is installed and fixed above the support plate (1). A bottom film (4) on which several wafers (3) are attached is covered on the first cylinder (2). A heat source plate (5) is located below the first cylinder (2), a through hole (61) is provided in the middle of the heat source plate (5), and an output port group (7) is provided above the heat source plate (5) to output hot air upward through the output port group (7); The heat source plate (5) has a through hole (61) in the middle. A debonding lamp group (8), a pin mechanism (9) in the middle of the through hole (61), and a first drive component that drives the pin mechanism (9) to rise and fall are provided above the outside of the through hole (61). The debonding lamp group (8) outputs ultraviolet light toward the bottom film (4). The control module (6) is electrically connected to the debonding lamp group (8) and the first driving component. The control module (6) controls the switching state of the debonding lamp group (8) and adjusts the intensity of ultraviolet light. The control module (6) cooperates with the first driving component to control the ejector pin mechanism (9) to push the bottom film (4) from bottom to top.

2. The precision softening mechanism for large-size wafer substrate according to claim 1, characterized in that: The debonding lamp assembly (8) includes an inner ring (81), an outer ring (82) fixedly installed in the middle of the heat source plate (5), and a plurality of lamp beads (83) disposed between the inner ring (81) and the outer ring (82). The inner ring (81) is close to the through hole (61), the outer ring (82) is far away from the through hole (61), and the inner ring (81) and the outer ring (82) are coaxially arranged.

3. The large-size wafer bottom glue precise softening mechanism according to claim 2, wherein: The debonding lamp assembly (8) also includes an annular cover (84) disposed above the lamp bead (83), the annular cover (84) being fitted between the inner ring (81) and the outer ring (82).

4. The large-size wafer bottom glue precise softening mechanism according to claim 3, wherein: It also includes a set of support frames (12) installed on the machine base (11), with a heat source plate (5) fixedly supported above the two support frames (12), and a support part (121) extending outward from the side of the support frame (12) away from the heat source plate (5), and the support part (121) is fixedly connected to the machine base (11) by bolts.

5. The large-size wafer bottom glue precise softening mechanism according to claim 4, wherein: The ejector mechanism (9) includes a movable platform (91) located between two support frames (12), a rod (92) installed in the middle of the movable platform (91), a plurality of top holes (93) provided at the top center of the rod (92), and a ejector rod (94) inserted into the top hole (93).

6. The large-size wafer bottom glue precise softening mechanism according to claim 5, wherein: It also includes a hot air input pipe (95) located on the lower side of the rod (92) and a plurality of hot air output holes (96) located on the top of the rod (92). The hot air output holes (96) are connected to the hot air input pipe (95). The hot air input pipe (95) is equipped with a solenoid valve (97). The solenoid valve (97) is electrically connected to the control module (6). The control module (6) controls the opening and closing of the solenoid valve (97) to adjust and control the hot air input state.

7. The large-size wafer bottom glue precise softening mechanism according to claim 6, wherein: The first drive assembly includes two sets of guide rods (98) fixedly installed on the lower sides of the active platform (91), and the two guide rods (98) in the same set are fixed below by limiting strips; A telescopic control mechanism (910) is installed on the machine base (11). The output end of the telescopic control mechanism (910) is fixedly connected to the middle part of the lower part of the movable platform (91). The telescopic control mechanism (910) is electrically connected to the control module (6). The control module (6) cooperates with the telescopic control mechanism (910) to control the lifting and lowering of the movable platform (91) and shorten / increase the distance between the ejector pin mechanism (9) and the bottom membrane (4).

8. The precision softening mechanism for large-size wafer substrate according to claim 7, characterized in that: The adhesive removal lamp assembly (8) also includes a plurality of first adjustment plates (821) disposed above the outer ring (82), a first flexible plate (822) connecting adjacent first adjustment plates (821), and a second drive assembly for controlling the angle adjustment of the first adjustment plates (821). The second drive assembly is electrically connected to the control module (6). Through the cooperation of the control module (6) and the second drive assembly, the first adjustment plate (821) is controlled to rotate toward the side away from the lamp bead (83), thereby increasing the irradiation range of the lamp bead (83) on the outer edge of the bottom film (4). By controlling the first adjustment piece (821) to rotate toward the lamp bead (83), the irradiation range of the lamp bead (83) on the outer edge of the bottom film (4) is reduced.

9. The precision softening mechanism for the bottom glue of a large-size wafer according to claim 7 or 8, characterized in that: The adhesive removal lamp assembly (8) also includes a plurality of second adjustment plates (811) disposed above the inner ring (81), a second flexible plate (812) connecting adjacent second adjustment plates (811), and a sixth driving component for controlling the angle adjustment of the second adjustment plates (811). The sixth driving component is electrically connected to the control module (6). Through the cooperation of the control module (6) and the sixth driving component, the second adjustment plate (811) is controlled to rotate toward the side away from the lamp bead (83), thereby increasing the irradiation range of the lamp bead (83) on the central area of ​​the bottom film (4). By controlling the second adjustment plate (811) to rotate toward the lamp bead (83), the irradiation range of the lamp bead (83) on the central area of ​​the base film (4) is reduced.

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