Wafer thinning film application device

Abstract

This utility model relates to the field of semiconductor manufacturing equipment technology, specifically to a wafer thinning film application device. It includes a film application machine body, a flip cover rotatably connected to the machine body, a guide rail fixedly connected to the flip cover, a slide plate slidably connected to the guide rail, a cutting blade fixedly connected to the slide plate, a synchronous wheel rotatably connected to the flip cover, a rotating shaft rotatably connected to the flip cover, another synchronous wheel fixedly connected to the rotating shaft, and a synchronous belt wound around the three synchronous wheels. The slide plate and the synchronous belt are fixedly connected. A mounting shaft is fixedly connected to the rotating shaft, and two sliders slidably connected to the mounting shaft. One slider has a roller mounted on it, and the other slider has a rotary cutter mounted on it. A servo motor and two control buttons are mounted on the flip cover. This device enables rapid film cutting after application, not only shortening cutting time and improving film application efficiency but also enhancing the convenience of the cutting operation.

Description

Technical Field

[0001] This utility model relates to a wafer lamination device, specifically a wafer thinning lamination device, belonging to the field of semiconductor manufacturing equipment technology. Background Technology

[0002] In semiconductor wafer back-end manufacturing, wafer thinning is one of the key processes. Its core purpose is to reduce the wafer thickness through processes such as grinding and polishing to meet the requirements of thinner chip packaging and improve chip heat dissipation performance and electrical connection stability. Since the circuit surface (front side) of the wafer is covered with a precision integrated circuit structure, if it is directly exposed to the processing environment during the thinning process (for back side processing), it is easily corroded by polishing fluid, mechanical scratches or dust contamination, which can lead to circuit damage and reduced yield. Therefore, applying a protective film to the circuit surface of the wafer before thinning is an essential pre-processing step. The film material needs to be tightly attached to the wafer surface to form a sealed protective layer. At the same time, it is necessary to ensure that the edges of the film material are neat after application so as not to affect the clamping and processing accuracy of the subsequent thinning equipment. Currently, in small and medium-sized production scenarios in the industry, semi-automatic film application machines are mostly used to complete this process. After the film is applied, the crank handle needs to be manually turned to make the ring cutter pre-cut the excess film material around the wafer. Then, the independent handle is pushed to trigger the linear cutter to cut the connection between the film material and the raw material roller.

[0003] However, the crank-turn cutting and handle-push cutting need to be completed manually in steps, and each operation takes a certain amount of time. This not only increases the cutting time and reduces the efficiency of film application, but also makes the operation more cumbersome, resulting in poor convenience of the cutting operation. Utility Model Content

[0004] The purpose of this invention is to provide a wafer thinning film application device to solve the above-mentioned problems. It can realize rapid cutting of the film after application, which can not only shorten the cutting time and improve the efficiency of film application, but also improve the convenience of cutting operation.

[0005] This utility model achieves the above-mentioned objective through the following technical solution: a wafer thinning laminating device, comprising a laminating machine body, a flip cover rotatably connected to the laminating machine body, a cutting structure provided on the flip cover, the cutting structure including a guide rail and a sliding plate, a guide rail fixedly connected to the flip cover, a sliding plate slidably connected to the guide rail, a cutting blade fixedly connected to the sliding plate, one synchronous wheel rotatably connected to the flip cover, a rotating shaft rotatably connected to the flip cover, another synchronous wheel fixedly connected to the rotating shaft, the same synchronous belt wound around the three synchronous wheels, the sliding plate being fixedly connected to the synchronous belt, an mounting shaft fixedly connected to the rotating shaft, two sliders slidably connected to the mounting shaft, one slider having a roller mounted on it, and the other slider having a rotary cutter mounted on it, a servo motor mounted on the flip cover, the output shaft of the servo motor being fixedly connected to one of the synchronous wheels, and two control buttons mounted on the flip cover.

[0006] Preferably, the flip cover has two abutment rollers rotatably connected to it, and both abutment rollers are in contact with the timing belt.

[0007] Preferably, a knob is threaded onto the slider, and one end of the knob abuts against the mounting shaft.

[0008] Preferably, the cross-section of one end of the cutting blade is triangular, and the cross-section of the rotary cutter as a whole is circular.

[0009] Preferably, the flip cover is provided with a blocking structure, the blocking structure including a guide seat and a slide rod. Two guide seats are fixedly connected to the flip cover, and a slide rod is slidably connected to the guide seats. A baffle is fixedly connected to one end of the slide rod, and a connecting plate is fixedly connected to the other end of the slide rod. A rotating wheel is rotatably connected to the connecting plate, and a stop block is fixedly connected to the slide plate. The stop block abuts against one of the rotating wheels.

[0010] Preferably, a spring is sleeved on the outside of the slide rod, one end of the spring abutting against the guide seat, and the other end of the spring abutting against the connecting plate.

[0011] Preferably, the baffle has an L-shaped cross-section, and the abutment has a trapezoidal cross-section.

[0012] Preferably, the film applicator body is provided with a fixed suction cup, and two electric support rods are installed on the film applicator body, with the extended ends of the two electric support rods rotatably connected to the flip cover.

[0013] The beneficial effects of this invention are as follows: When the film needs to be cut, pressing one of the control buttons will cause the servo motor to rotate a specified number of times. The rotation of the servo motor's output shaft will drive one of the synchronous pulleys to rotate, which in turn will drive the synchronous belt to move. Simultaneously, the synchronous belt will drive the other two synchronous pulleys to rotate. During the movement of the synchronous belt, the slide plate will slide on the guide rail. The movement of the slide plate will drive the cutting blade to cut the film. At the same time, the rotation of the synchronous pulley on the rotating shaft will drive the rotating shaft to rotate, which in turn will drive the mounting shaft to rotate. The mounting shaft will drive two sliders to move. One slider will drive the rotating blade to cut the film around the wafer, while the other slider will drive the roller to roll. During the rolling process, the roller will press down on the cutting edge to prevent the cutting edge from lifting. When the cutting blade cuts the film, the output shaft of the servo motor will stop rotating, thus completing the film cutting. Since only pressing the control button is needed to achieve one-time film cutting, it not only improves the convenience of operation but also shortens the cutting time, thereby improving the efficiency of film application. Attached Figure Description

[0014] Figure 1 This is a schematic diagram of the overall structure of this utility model;

[0015] Figure 2 for Figure 1 The diagram shown is an enlarged view of the structure of part A.

[0016] Figure 3 for Figure 2 The diagram shown is an enlarged view of the structure of section B.

[0017] Figure 4 This is a schematic diagram of the connection structure between the synchronous belt and the synchronous pulley of this utility model;

[0018] Figure 5 This is a schematic diagram of the connection structure between the abutment wheel and the timing belt of this utility model.

[0019] In the diagram: 1. Film applicator body; 2. Flip cover; 3. Cutting structure; 301. Guide rail; 302. Slide plate; 303. Cutting blade; 304. Synchronous pulley; 305. Synchronous belt; 306. Abutment wheel; 307. Rotary shaft; 308. Mounting shaft; 309. Slider; 310. Roller; 311. Rotary cutter; 312. Knob; 313. Servo motor; 4. Abutment structure; 401. Guide seat; 402. Slide rod; 403. Connecting plate; 404. Rotary wheel; 405. Abutment block; 406. Spring; 407. Baffle; 5. Control button; 6. Fixed suction cup; 7. Electric support rod. Detailed Implementation

[0020] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0021] Please see Figures 1-5 As shown, the wafer thinning laminating device includes a laminating machine body 1, a flip cover 2 rotatably connected to the laminating machine body 1, a cutting structure 3 on the flip cover 2, the cutting structure 3 including a guide rail 301 and a sliding plate 302, the guide rail 301 fixedly connected to the flip cover 2, the sliding plate 302 slidably connected to the guide rail 301, a cutting blade 303 fixedly connected to the sliding plate 302, one synchronous wheel 304 rotatably connected to the flip cover 2, a rotating shaft 307 rotatably connected to the flip cover 2, and another synchronous wheel 304 fixedly connected to the rotating shaft 307. The same timing belt 305 is wound around three synchronous pulleys 304. The slide plate 302 is fixedly connected to the timing belt 305. The mounting shaft 308 is fixedly connected to the rotating shaft 307. Two sliders 309 are slidably connected to the mounting shaft 308. One slider 309 is equipped with a roller 310, and the other slider 309 is equipped with a rotating cutter 311. The flip cover 2 is equipped with a servo motor 313. The output shaft of the servo motor 313 is fixedly connected to one of the synchronous pulleys 304. Two control buttons 5 are installed on the flip cover 2.

[0022] As a technical optimization of this utility model, two abutment rollers 306 are rotatably connected on the flip cover 2. Both abutment rollers 306 abut against the synchronous belt 305, thus making the cross-sectional area between the synchronous belt 305 and the three synchronous pulleys 304 larger, thereby facilitating the improvement of transmission stability.

[0023] As a technical optimization of this utility model, a knob 312 is threadedly connected to the slider 309. One end of the knob 312 abuts against the mounting shaft 308. Therefore, the slider 309 can be fixed by the abutting between the end of the knob 312 and the mounting shaft 308. At the same time, by rotating the knob 312, the position of the slider 309 can be adjusted when its end is not in contact with the mounting shaft 308. Therefore, films of different sizes can be cut, thereby improving applicability.

[0024] As a technical optimization of this utility model, the cross-section of one end of the cutting blade 303 is triangular, so when the movement of the cutting blade 303 reverses, it can also cut the film. The overall cross-section of the rotating cutter 311 is circular, so the rotating cutter 311 can rotate during the movement of the slider 309, thereby realizing the cutting of the film.

[0025] As a technical optimization of this utility model, the flip cover 2 is provided with a blocking structure 4, which includes a guide seat 401 and a slide rod 402. Two guide seats 401 are fixedly connected to the flip cover 2, so they can guide the movement of the slide rod 402. The slide rod 402 is slidably connected to the guide seat 401. A baffle 407 is fixedly connected to one end of the slide rod 402. The baffle 407 can block one of the control buttons 5, thereby preventing accidental pressing. A connecting plate 403 is fixedly connected to the other end of the slide rod 402. A rotating wheel 404 is rotatably connected to the connecting plate 403. A stop block 405 is fixedly connected to the slide plate 302. The stop block 405 abuts against one of the rotating wheels 404.

[0026] As a technical optimization of this utility model, a spring 406 is sleeved on the outside of the slide bar 402. One end of the spring 406 abuts against the guide seat 401, and the other end of the spring 406 abuts against the connecting plate 403. When the stop block 405 separates from the rotating wheel 404, the baffle 407 can prevent the control button 5 from being blocked by the spring 406.

[0027] As a technical optimization of this utility model, the baffle 407 has an L-shaped cross-section and the abutment 405 has a trapezoidal cross-section. Therefore, the abutment 405 can abut against the rotating wheel 404 during its movement, thereby allowing the slide rod 402 to slide on the guide seat 401.

[0028] As a technical optimization of this utility model, the film applicator body 1 is provided with a fixed suction cup 6, which can fix the wafer. The film applicator body 1 is equipped with two electric support rods 7, and the extended ends of the two electric support rods 7 are rotatably connected to the flip cover 2, which facilitates the opening and closing of the flip cover 2.

[0029] In use, when the film needs to be cut, the flip cover 2 can be closed by activating the two electric support rods 7. Then, by pressing one of the control buttons 5, the other control button 5 can be prevented from being pressed by the baffle 407. After one control button 5 is pressed, the servo motor 313 will rotate a specified number of times. The rotation of the output shaft of the servo motor 313 will drive one of the synchronous pulleys 304 to rotate. The rotation of the synchronous pulley 304 will drive the synchronous belt 305 to move. The timing belt 305 drives the other two timing pulleys 304 to rotate. During the movement of the timing belt 305, the sliding plate 302 slides on the guide rail 301. The movement of the sliding plate 302 drives the cutting blade 303 to cut the film. At the same time, the rotation of the timing pulley 304 on the rotating shaft 307 drives the rotating shaft 307 to rotate. The rotation of the rotating shaft 307 drives the mounting shaft 308 to rotate. The mounting shaft 308 drives the two sliders 309 to move. One of the sliders 309 drives the rotating cutter 311 to cut the film around the wafer. Another slider 309 drives the roller 310 to roll. During the rolling process, the roller 310 presses down on the cutting edge to prevent it from lifting. After the cutting blade 303 cuts the film, the output shaft of the servo motor 313 stops rotating, thus completing the film cutting. Since the film can be cut in one go simply by pressing the control button 5, it not only improves the convenience of operation but also shortens the cutting time, thereby improving the efficiency of film application. Furthermore, the movement of the sliding plate 302 drives the abutment block 405 to move. During the movement of the abutment block 405, it will abut against the rotating wheel 404. While the rotating wheel 404 rolls on the abutment block 405, the slide rod 402 will slide on the guide seat 401. The spring 406 will contract. The movement of the slide rod 402 will drive the baffle 407 to block one of the control buttons 5. When the servo motor 313 stops rotating, the baffle 407 will block one of the control buttons 5. Therefore, when the next cutting requires pressing another control button 5 to make the slide plate 302 move in the opposite direction, it can avoid pressing the wrong button, thereby improving the stability of use.

[0030] It will be apparent to those skilled in the art that this invention is not limited to the details of the exemplary embodiments described above, and that it can be implemented in other specific forms without departing from the spirit or essential characteristics of this invention. Therefore, the embodiments should be considered illustrative and non-limiting in all respects, and the scope of this invention is defined by the appended claims rather than the foregoing description. Thus, it is intended that all variations falling within the meaning and scope of equivalents of the claims be included within this invention. No reference numerals in the claims should be construed as limiting the scope of the claims.

[0031] Furthermore, it should be understood that although this specification describes embodiments, not every embodiment contains only one independent technical solution. This narrative style is merely for clarity. Those skilled in the art should consider the specification as a whole, and the technical solutions in each embodiment can also be appropriately combined to form other embodiments that can be understood by those skilled in the art.

Claims

1. A wafer thinning lamination apparatus, comprising a laminator body (1), characterized in that: The film applicator body (1) is rotatably connected to a flip cover (2). The flip cover (2) is provided with a cutting structure (3). The cutting structure (3) includes a guide rail (301) and a sliding plate (302). The guide rail (301) is fixedly connected to the flip cover (2). The sliding plate (302) is slidably connected to the guide rail (301). The cutting blade (303) is fixedly connected to the sliding plate (302). One of the synchronous pulleys (304) is rotatably connected to the flip cover (2). A rotating shaft (307) is rotatably connected to the flip cover (2). Another synchronous pulley (304) is fixedly connected to the rotating shaft (307). The three synchronous pulleys (304) are rotatably connected to the rotating shaft (307). 4) The same synchronous belt (305) is wound around it. The slide plate (302) is fixedly connected to the synchronous belt (305). The rotating shaft (307) is fixedly connected to the mounting shaft (308). Two sliders (309) are slidably connected to the mounting shaft (308). One of the sliders (309) is equipped with a roller (310), and the other slider (309) is equipped with a rotating cutter (311). The flip cover (2) is equipped with a servo motor (313). The output shaft of the servo motor (313) is fixedly connected to one of the synchronous pulleys (304). The flip cover (2) is equipped with two control buttons (5).

2. The wafer thinning lamination apparatus according to claim 1, characterized in that: The flip cover (2) is rotatably connected to two abutment rollers (306), both of which abut against the timing belt (305).

3. The wafer thinning film application device according to claim 1, characterized in that: A knob (312) is threaded onto the slider (309), and one end of the knob (312) abuts against the mounting shaft (308).

4. The wafer thinning lamination apparatus according to claim 1, characterized in that: The cross-section of one end of the cutting blade (303) is triangular, and the cross-section of the rotary cutter (311) as a whole is circular.

5. The wafer thinning film application device according to claim 1, characterized in that: The flip cover (2) is provided with a blocking structure (4), the blocking structure (4) includes a guide seat (401) and a slide rod (402). Two guide seats (401) are fixedly connected to the flip cover (2). A slide rod (402) is slidably connected to the guide seat (401). A baffle (407) is fixedly connected to one end of the slide rod (402). A connecting plate (403) is fixedly connected to the other end of the slide rod (402). A rotating wheel (404) is rotatably connected to the connecting plate (403). A stop block (405) is fixedly connected to the slide plate (302). The stop block (405) abuts against one of the rotating wheels (404).

6. The wafer thinning film application apparatus according to claim 5, characterized in that: A spring (406) is sleeved on the outside of the slide rod (402). One end of the spring (406) abuts against the guide seat (401), and the other end of the spring (406) abuts against the connecting plate (403).

7. The wafer thinning lamination apparatus according to claim 5, characterized in that: The baffle (407) has an L-shaped cross-section, and the block (405) has a trapezoidal cross-section.

8. The wafer thinning lamination apparatus according to claim 1, characterized in that: The film applicator body (1) is provided with a fixed suction cup (6), and two electric support rods (7) are installed on the film applicator body (1). The extended ends of the two electric support rods (7) are rotatably connected to the flip cover (2).

Images