Wafer heating and cooling apparatus and bonding apparatus

Abstract

This application discloses a wafer heating and cooling device and bonding equipment, belonging to the field of semiconductor equipment. The device includes a base, a heating unit, and a cooling unit. Gas is supplied to and from the bellows assembly in the cooling unit through a first vent and a gas channel in the base, driving the bellows assembly to extend and retract axially, thereby moving a water-cooled plate closer to or away from the heating unit to achieve wafer heating or cooling. In this application, the bellows assembly is built-in and driven by gas, ensuring the synchronous control of the bellows assembly; the rapid gas transmission response also ensures the synchronous movement of the bellows assembly, improving heat transfer efficiency. The large contact area between the bellows assembly and the water-cooled plate ensures uniform force on the water-cooled plate when it is close to the heating unit, avoiding uneven local compression and ensuring uniform cooling effect and accurate temperature control. Furthermore, the built-in design of the driving mechanism avoids openings in the device cavity, ensuring the vacuum level of the device and improving process stability.

Description

Technical Field

[0001] This application relates to the field of semiconductor equipment, and more particularly to a wafer heating and cooling device and bonding equipment. Background Technology

[0002] In semiconductor manufacturing processes, the heating and cooling of wafers demands extremely high precision, uniformity, and efficiency in temperature control. Current technologies employ multiple independent external drive mechanisms (e.g., multi-cylinder) to collaboratively drive the water-cooled plate for lifting and lowering. However, ensuring synchronization of control and movement among these multiple drive mechanisms is difficult, leading to tilting of the water-cooled plate during lifting. This not only reduces cooling efficiency but may also cause mechanical damage due to interference with surrounding structures. Secondly, the output ends of each drive mechanism are in point contact with the water-cooled plate, making it difficult to guarantee consistent pressure at each contact point. This results in uneven pressure when the water-cooled plate approaches the heating unit, further contributing to uneven cooling and affecting temperature control accuracy. Furthermore, to accommodate the output ends of the external drive mechanisms, through-holes must be created in the device cavity. However, in applications requiring a vacuum environment, these through-holes easily become gas leakage points, compromising vacuum levels and affecting process stability. Therefore, a novel wafer heating and cooling device is urgently needed to address these technical problems. Utility Model Content

[0003] This application provides a wafer heating and cooling device and bonding equipment, in which a bellows assembly, serving as a water-cooled plate driving mechanism, is built-in and positioned between the water-cooled plate and a base. By filling or venting gas into the base, the bellows assembly is driven to axially elongate or compress, thereby causing the water-cooled plate to move axially to achieve wafer cooling or heating.

[0004] To achieve the above objectives, according to a first aspect of this application, a wafer heating and cooling apparatus is provided, comprising:

[0005] The base has a first vent on its side wall and an air passage communicating with the first vent inside the base.

[0006] The heating unit is connected to the base via a support column;

[0007] A cooling unit is located between the base and the heating unit;

[0008] The cooling unit includes a bellows assembly and a water-cooled plate. One end of the bellows assembly is connected to the base, and the other end is connected to the water-cooled plate.

[0009] The bellows assembly is inflated or deflated through the first vent and air passage, driving the bellows assembly to extend or contract along its axial direction, thereby moving the water-cooled plate closer to or away from the heating unit.

[0010] In some embodiments of this application, the corrugated pipe assembly includes a first corrugated pipe, a second corrugated pipe, and a third corrugated pipe; the first corrugated pipe, the second corrugated pipe, and the third corrugated pipe are evenly spaced around the center of the water-cooled plate.

[0011] In some embodiments of this application, the angle between the lines connecting any two of the first, second, and third corrugated pipes and the center of the water-cooled plate is 120°.

[0012] In some embodiments of this application, the bellows assembly has a hollow tubular structure; the end of the bellows assembly near the base is an open end; the end of the bellows assembly near the water-cooling plate is a closed end.

[0013] In some embodiments of this application, the wafer heating and cooling device further includes a guiding unit, which includes a guide rod; the guide rod extends axially and passes through a water-cooled plate, and the water-cooled plate and the guide rod are slidably engaged; the first end of the guide rod is fixedly connected to the base.

[0014] In some embodiments of this application, the wafer heating and cooling device includes multiple guiding units; the multiple guiding units are centrally symmetrically distributed about the center of the water-cooled plate.

[0015] In some embodiments of this application, the wafer heating and cooling device further includes a limiting unit, which includes a first limiting member and a second limiting member; the first limiting member and the second limiting member are distributed on both sides of the water cooling plate along the axial direction; wherein the first limiting member is fixedly installed on the second end of the guide rod; and the second limiting member is fixedly installed on the guide rod.

[0016] In some embodiments of this application, the wafer heating and cooling device further includes an elastic unit; one end of the elastic unit is connected to a water-cooled plate, and the other end is connected to a base.

[0017] In some embodiments of this application, the elastic unit includes an elastic element, a first connector and a second connector, with both ends of the elastic element connected to the first connector and the second connector respectively; the first connector is connected to the water-cooled plate and the second connector is connected to the base.

[0018] In some embodiments of this application, the wafer heating and cooling device further includes a plurality of elastic units; the plurality of elastic units are evenly spaced around the center of the water-cooled plate.

[0019] In some embodiments of this application, the wafer heating and cooling device includes three elastic units arranged in an equilateral triangle.

[0020] In some embodiments of this application, a suction cup is provided on the side of the heating unit away from the water-cooling plate, and the suction cup is used to adsorb the wafer; a pressure equalizing film is sandwiched between the suction cup and the wafer.

[0021] In some embodiments of this application, the heating unit includes a heating film; both sides of the heating film are covered with a graphite layer.

[0022] In some embodiments of this application, the heating film is made of polyimide.

[0023] In some embodiments of this application, the central axes of the base, heating unit, and cooling unit coincide.

[0024] According to a second aspect of this application, a bonding apparatus is also provided, the bonding apparatus comprising:

[0025] The wafer heating and cooling device described in the above technical solution.

[0026] In the wafer heating and cooling apparatus of this application embodiment, the above technical solution has at least the following beneficial effects: The bellows assembly, which serves as the water-cooled plate driving mechanism, is built-in and positioned between the water-cooled plate and the base. By filling or venting gas into the base, the bellows assembly is driven to axially elongate or compress, thereby causing the water-cooled plate to move axially to achieve wafer cooling or heating. Because a built-in bellows assembly is used and gas is employed for driving, the problem of asynchronous control between multiple external driving mechanisms can be avoided. Furthermore, the gas transmission response is relatively rapid, and the synchronous movement of the bellows assembly can be ensured when driven by gas, thereby improving heat transfer efficiency (cooling efficiency). Secondly, the contact area between the bellows assembly and the water-cooled plate is large. Combined with the gas-driven method, this ensures uniform force on the water-cooled plate when it is close to the heating unit, avoiding the risk of uneven local compression and ensuring uniform cooling effect and accurate temperature control. Furthermore, the built-in design of the driving mechanism avoids opening holes in the device cavity, ensuring the vacuum level of the device and thus improving the overall process stability.

[0027] Other features and advantages of this application will be described in detail in the following detailed description section. Attached Figure Description

[0028] To more clearly illustrate the technical solutions in the embodiments of this application, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0029] To gain a more complete understanding of this application and its beneficial effects, the following description will be provided in conjunction with the accompanying drawings, wherein the same reference numerals in the following description denote the same parts.

[0030] Figure 1 This is one of the structural schematic diagrams of the wafer heating and cooling device provided in the embodiments of this disclosure;

[0031] Figure 2 This is a cross-sectional schematic diagram of the base in the wafer heating and cooling device provided in the embodiments of this disclosure;

[0032] Figure 3 This is a second schematic diagram of the wafer heating and cooling device provided in the embodiments of this disclosure;

[0033] Figure 4 This is a schematic diagram of the structure of the cooling unit in the wafer heating and cooling apparatus provided in the embodiments of this disclosure;

[0034] Figure 5 This is the third schematic diagram of the wafer heating and cooling device provided in the embodiments of this disclosure;

[0035] Figure 6 This is a top view of the wafer heating and cooling apparatus provided in the embodiments of this disclosure;

[0036] Figure 7 This is the fourth schematic diagram of the wafer heating and cooling device provided in the embodiments of this disclosure;

[0037] Figure 8 yes Figure 7 An enlarged schematic diagram of part A in the middle;

[0038] Figure 9 This is a schematic diagram of the bonding device provided in the embodiments of this disclosure;

[0039] Figure 10 This is another schematic diagram of the cooling unit in the wafer heating and cooling apparatus provided in the embodiments of this disclosure.

[0040] Explanation of reference numerals in the attached figures:

[0041] 1-Wafer heating and cooling device;

[0042] 2-Base; 21-First vent; 22-Air passage; 23-First adapter plate; 24-First vent pipe; 25-Second vent pipe;

[0043] 3-Heating unit; 31-Support column; 32-Heating film;

[0044] 4-Cooling unit; 41-Bellwall assembly; 411-First bellows; 412-Second bellows; 413-Third bellows; 42-Water cooling plate; 421-Water inlet; 422-Water outlet; 423-First water pipe; 424-Second water pipe; 425-Second adapter plate;

[0045] 5-Elastic unit; 51-Elastic element; 52-First connector; 53-Second connector;

[0046] 6-Guide unit; 61-Guide rod; 611-First end; 612-Second end;

[0047] 7-Limiting unit; 71-First limiting component; 72-Second limiting component;

[0048] 8 - Wafer; 81 - Suction cup;

[0049] 9-Thimble. Detailed Implementation

[0050] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0051] In the description of this application, it should be understood that the terms "center", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc., indicate the orientation or positional relationship according to the accompanying drawings, and are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application.

[0052] The terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Therefore, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this application, unless otherwise stated, "a plurality of" means two or more.

[0053] In the description of this application, it should be noted that, unless otherwise expressly specified and limited, the terms "installation," "connection," and "linking" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection, a direct connection, or an indirect connection through an intermediate medium; or they can refer to the internal communication between two components. Those skilled in the art can understand the specific meaning of the above terms in this application based on the specific circumstances.

[0054] This application provides a wafer heating and cooling apparatus and a bonding device, which will be described in detail below. It should be noted that the order of description of the following embodiments is not intended to limit the preferred order of the embodiments of this application. Furthermore, in the following embodiments, the descriptions of each embodiment have their own emphasis; parts not described in detail in a certain embodiment can be referred to in the relevant descriptions of other embodiments.

[0055] like Figures 1 to 5 As shown, the wafer heating and cooling device 1 of this application includes a base 2, a heating unit 3, and a cooling unit 4. A first vent 21 is provided on the side wall of the base 2, and an air passage 22 communicating with the first vent 21 is provided inside the base 2. The heating unit 3 is connected to the base 2 via a support column 31. The cooling unit 4 is disposed between the base 2 and the heating unit 3. The cooling unit 4 includes a bellows assembly 41 and a water-cooled plate 42. One end of the bellows assembly 41 is connected to the base 2, and the other end is connected to the water-cooled plate 42. By inflating or deflating the bellows assembly 41 through the first vent 21 and the air passage 22, the bellows assembly 41 is driven to extend or contract along its axial direction, thereby causing the water-cooled plate 42 to move closer to or further away from the heating unit 3.

[0056] In this technical solution, the wafer heating and cooling device 1 is arranged sequentially from bottom to top along the Z direction, including a base 2, a cooling unit 4, and a heating unit 3. A suction cup is located above the heating unit 3, which secures the wafer via vacuum adsorption. Through the coordinated action of the heating unit 3 and the cooling unit 4, the wafer is heated and cooled. Figure 1 and Figure 3 This is a schematic diagram of a wafer in a cooled state. Figure 5 This is a schematic diagram of a wafer in a heated state.

[0057] Specifically, such as Figure 1 As shown, the support column 31 extends along its axial direction (i.e., the Z-direction), with its bottom end fixedly mounted on the base 2 and its top end abutting against and supporting the heating unit 3. It should be noted that... Figure 1 Only one support column 31 is shown schematically. Multiple support columns 31 can be provided in the wafer heating and cooling device 1 to provide stable support.

[0058] A water-cooled plate 42 is disposed between the heating unit 3 and the base 2, and several through holes are formed on the plate surface for the support columns 31 to pass through. The diameters of the through holes and the support columns 31 are all uniform. The diameter of the through holes in the water-cooled plate 42 is larger than the diameter of the support columns 31, thus creating a gap to prevent the water-cooled plate 42 from getting stuck during movement. A bellows assembly 41 connects the base 2 and the water-cooled plate 42, with one end fixedly connected to the base 2 and the other end connected to the water-cooled plate 42. The bellows assembly 41 can extend and retract along its axial direction (i.e., the Z-direction) to drive the water-cooled plate 42 to move along the Z-direction.

[0059] like Figure 2 As shown, the side wall of the base 2 has a first vent 21, and an air passage 22 communicating with the first vent 21 is provided inside. The first vent 21 is externally connected to a first vent pipe 24 for communicating with an external air source. Through the first vent pipe 24, the first vent 21, and the air passage 22, the bellows assembly 41 can be charged and depressurized. When air is charged into the bellows assembly 41, the bellows assembly 41 extends along its axial direction, pushing the water-cooled plate 42 closer to the heating unit 3, thereby cooling the wafer; when air is extracted (depressurized) from the bellows assembly 41, the bellows assembly 41 contracts along its axial direction, moving the water-cooled plate 42 away from the heating unit 3, thereby heating the wafer.

[0060] In existing technologies, multiple external drive mechanisms (such as multiple cylinders) are used to collaboratively drive the water-cooled plate for lifting and lowering. However, it is difficult to ensure the synchronization of control and movement among multiple drive mechanisms, causing the water-cooled plate to tilt during the lifting and lowering process. This not only reduces cooling efficiency but may also cause mechanical damage due to interference with surrounding structures. Secondly, the output ends of each drive mechanism are in point contact with the water-cooled plate, making it difficult to ensure that the clamping force at each contact point is consistent. This results in uneven local clamping when the water-cooled plate is close to the heating unit, which in turn causes uneven cooling effect and affects the temperature control accuracy. In addition, to accommodate the output ends of the external drive mechanisms, through holes need to be opened in the device cavity. However, under the condition that the internal environment of the device needs to be maintained as a vacuum environment, these through holes are very likely to become gas leakage points, destroying the vacuum and affecting the stability of the process.

[0061] Compared to existing technologies, this application integrates the bellows assembly 41, which serves as the driving mechanism for the water-cooled plate, and positions it between the water-cooled plate 42 and the base 2. By filling or expelling gas into the base 2, the bellows assembly 41 is driven to extend or compress axially, thereby causing the water-cooled plate 42 to move axially to achieve wafer cooling or heating. Because the bellows assembly 41 is integrated and driven by gas, the problem of asynchronous control between multiple external driving mechanisms is avoided. Furthermore, the gas transmission response is relatively rapid, ensuring the synchronous movement of the bellows assembly 41 and improving heat transfer efficiency (cooling efficiency). Secondly, the large contact area between the bellows assembly 41 and the water-cooled plate 42, combined with gas driving, ensures uniform force on the water-cooled plate 42 when it is close to the heating unit 3, avoiding the risk of uneven local compression and ensuring uniform cooling effect and accurate temperature control. Thirdly, the integrated design of the driving mechanism avoids opening holes in the device cavity, ensuring the vacuum level of the device and improving the overall process stability.

[0062] It is understandable that the corrugated pipe assembly 41 is positioned between the base 2 and the water-cooled plate 42, and its arrangement avoids the support column 31 in order to prevent interference with the support column 31 during the expansion and contraction process.

[0063] In some embodiments, such as Figures 3 to 4 As shown, the corrugated pipe assembly 41 includes a first corrugated pipe 411, a second corrugated pipe 412, and a third corrugated pipe 413. The first corrugated pipe 411, the second corrugated pipe 412, and the third corrugated pipe 413 are evenly spaced around the center O of the water-cooled plate 42.

[0064] In this technical solution, the first corrugated pipe 411, the second corrugated pipe 412 and the third corrugated pipe 413 are arranged evenly around the center O of the water-cooled plate 42. This uniform layout allows the corrugated pipe assembly 41 to maintain a force balance when it expands and contracts due to inflation and deflation, thereby acting more evenly on the water-cooled plate 42, ensuring that the water-cooled plate 42 remains stable during movement, preventing it from tilting, and ensuring heat transfer efficiency (cooling efficiency).

[0065] It is understandable that, in order to ensure drive synchronization (consistency), the structure and material of each bellows in the bellows assembly 41 are kept consistent.

[0066] Preferably, in the first corrugated pipe 411, the second corrugated pipe 412, and the third corrugated pipe 413, the angle between the line connecting any two corrugated pipes and the center O of the water-cooled plate 42 is 120°. That is, as shown in the figure... Figure 4 As shown, the angle between two adjacent dashed lines is 120°, causing the first corrugated pipe 411, the second corrugated pipe 412, and the third corrugated pipe 413 to be distributed in an equilateral triangle. Gas generated by an external gas source sequentially enters the interiors of the first corrugated pipe 411, the second corrugated pipe 412, and the third corrugated pipe 413 through the first vent pipe 24, the first vent 21, and the air passage 22, respectively. Due to the rapid gas transmission response, the first corrugated pipe 411, the second corrugated pipe 412, and the third corrugated pipe 413 can extend synchronously and uniformly, thus smoothly pushing the water-cooled plate 42 upwards along the Z-direction until the water-cooled plate 42 is tightly attached to the heating unit 3, thereby efficiently cooling the heated wafer. Similarly, due to the rapid gas transmission response, during the exhaust process, the first corrugated pipe 411, the second corrugated pipe 412, and the third corrugated pipe 413 can also achieve synchronous and uniform contraction.

[0067] In some embodiments, the bellows assembly 41 has a hollow tubular structure. The end of the bellows assembly 41 near the base 2 is an open end, and the end of the bellows assembly 41 near the water-cooling plate 42 is a closed end.

[0068] In this technical solution, as described above, the structure and materials of each bellows in the bellows assembly 41 are consistent. The following description only uses the structure of the first bellows 411 as an example. The interior of the first bellows 411 is hollow. Its end near the base 2 (i.e., the bottom) is set as an opening to communicate with the air passage 22 of the base 2 to realize the filling and discharging of gas; while its end near the water-cooling plate 42 (i.e., the top) is set as a closed end (sealing) to prevent gas from leaking into the device cavity, thereby ensuring the vacuum degree and process quality inside the device.

[0069] In some embodiments, such as Figure 6 As shown, the cooling unit 4 employs water cooling, with an inlet 421 and an outlet 422 respectively located on the side wall of the water-cooled plate 42. The inlet 421 is connected to the first water pipe 423 for supplying cooling medium into the water-cooled plate 42; the outlet 422 is connected to the second water pipe 424 for discharging the cooling medium from the water-cooled plate 42. Furthermore, the wafer heating and cooling device 1 also includes a second vent pipe 25, which is connected to a through-hole on the lower surface of the chuck for introducing or removing gas from the chuck to control its adsorption and release of the wafer.

[0070] In some embodiments, such as Figure 1 , Figure 7 and Figure 8 As shown, the wafer heating and cooling device 1 also includes a guide unit 6, which includes a guide rod 61. The guide rod 61 extends along its axial direction and passes through the water-cooled plate 42, and the water-cooled plate 42 is slidably engaged with the guide rod 61. The first end 611 of the guide rod 61 is fixedly connected to the base 2.

[0071] In this technical solution, the guide rod 61 extends along the Z-direction and passes through the water-cooled plate 42. Its bottom along the axial direction (Z-direction) is the first end 611, and its top along the axial direction (Z-direction) is the second end 612. Driven by the bellows assembly 41, the water-cooled plate 42 moves up and down along the guide rod 61. The guide rod 61 provides precise guidance, improving the stability and accuracy of the water-cooled plate 42's movement, ensuring that the entire surface of the water-cooled plate 42 is synchronously and tightly attached to the heating unit 3, thereby ensuring the uniformity of the cooling effect and improving the accuracy of wafer temperature control.

[0072] Preferably, the wafer heating and cooling device 1 includes a plurality of guiding units 6. The plurality of guiding units 6 are centrally symmetrically distributed about the center O of the water-cooled plate 42. For example, the wafer heating and cooling device 1 includes two guiding units 6, that is, it has two guide rods, and the angle between the line connecting the two guide rods and the center O of the water-cooled plate 42 is 180°. By adopting this symmetrical design, the guiding stability and guiding accuracy of the guiding units 6 can be improved.

[0073] In some embodiments, such as Figure 7and Figure 8 As shown, the wafer heating and cooling device 1 also includes a limiting unit 7, which includes a first limiting member 71 and a second limiting member 72. The first limiting member 71 and the second limiting member 72 are distributed on both sides of the water cooling plate 42 along the axial direction. The first limiting member 71 is fixedly installed on the second end 612 of the guide rod 61, and the second limiting member 72 is fixedly installed on the guide rod 61.

[0074] In this technical solution, the water-cooled plate 42, as a movable component, has its movement stroke limited by the internal layout of the device. Therefore, an additional limiting unit 7 is required to precisely control and ensure that the water-cooled plate 42 moves within a preset stroke range. Specifically, the first limiting member 71, as the upper limit, is fixedly installed at the second end 612 of the guide rod 61 (i.e., located on the side of the water-cooled plate 42 near the heating unit 3) to limit the extreme position of upward movement; the second limiting member 72, as the lower limit, is fixedly locked to the guide rod 61 (i.e., located on the side of the water-cooled plate 42 near the base 2) to limit the extreme position of downward movement. Through the above upper and lower limiting design, the movement range of the water-cooled plate 42 can be limited, preventing it from colliding with other components due to excessive movement, thereby avoiding damage to the equipment. It can be understood that a certain gap is reserved between the second limiting member 72 and the base 2.

[0075] In some embodiments, such as Figure 1 , Figure 7 and Figure 8 As shown, the wafer heating and cooling device 1 also includes an elastic unit 5. One end of the elastic unit 5 is connected to the water-cooling plate 42, and the other end is connected to the base 2. Specifically, the elastic unit 5 includes an elastic element 51, a first connecting element 52, and a second connecting element 53. The two ends of the elastic element 51 are connected to the first connecting element 52 and the second connecting element 53, respectively. The first connecting element 52 is connected to the water-cooling plate 42, and the second connecting element 53 is connected to the base 2.

[0076] In this technical solution, by filling or venting gas into the bellows assembly 41, the bellows assembly 41 is driven to axially elongate or contract, thereby causing the water-cooled plate 42 to move closer to or further away from the heating unit 3. With the elastic element 5 provided, when gas is filled into the bellows assembly 41, the bellows assembly 41 gradually elongates, pushing the water-cooled plate 42 upward along the Z-axis. At this time, the elastic element 51 is gradually stretched from its original state. When gas is extracted from the bellows assembly 41, the bellows assembly 41 gradually contracts. At this time, in addition to relying on the extraction action to drive the water-cooled plate 42 downward along the Z-axis, the elastic element 51 itself also returns from its stretched state to its original state, and the resulting restoring force assists the water-cooled plate 42 in moving downward along the Z-axis. This bidirectional mechanism can improve the movement response speed of the water-cooled plate 42, thereby improving temperature control accuracy and overall process yield.

[0077] Specifically, the side wall of the base 2 is provided with a first adapter plate 23, and the side wall of the water-cooling plate 42 is provided with a second adapter plate 425. The first connector 52 in the elastic unit 5 is connected to the second adapter plate 425, and the second connector 53 is connected to the first adapter plate 23. Since the base 2 and the first adapter plate 23 are in a fixed state, the elastic element 51 will undergo corresponding tensile or compressive deformation as the water-cooling plate 42 and the second adapter plate 425 move up and down along the Z direction.

[0078] In some embodiments, the wafer heating and cooling device 1 includes a plurality of elastic units 5, which are evenly spaced around the center O of the water cooling plate 42.

[0079] In this technical solution, the uniform layout of the elastic units 5 is beneficial to maintaining the motion stability and force balance of the water-cooled plate 42. It can be understood that the structure and material of each elastic unit 5 are consistent to ensure that each elastic element 51 has the same elastic coefficient, thereby ensuring the consistency of the reset elastic force.

[0080] Preferably, the wafer heating and cooling device 1 includes three elastic units 5, which are arranged in an equilateral triangle.

[0081] In some embodiments, such as Figure 9 As shown, a suction cup 81 is provided on the side of the heating unit 3 away from the water-cooling plate 42. The suction cup 81 is used to adsorb the wafer 8. A pressure equalizing film is sandwiched between the suction cup 81 and the wafer 8.

[0082] In this technical solution, a suction cup 81 is positioned above the heating unit 3 in the Z direction. The suction cup 81 has internal air channels for fixing the wafer 8 via vacuum adsorption. A flexible, uniformly pressure-equalizing film is laid flat between the wafer 8 and the suction cup 81. In actual operating conditions, the surface of the wafer 8 may be warped or have uneven thickness. By using this uniformly pressure-equalizing film, the problem of uneven bonding caused by wafer surface deviations and thickness differences can be effectively improved, thereby enhancing process quality and yield.

[0083] In some embodiments, such as Figure 9 As shown, the heating unit 3 includes a heating film 32, both sides of which are covered with a graphite layer. The material of the heating film 32 is polyimide.

[0084] In this technical solution, the heating film 32 generates high temperatures during operation to heat the wafer 8. To improve thermal conductivity, graphite layers are provided on both the upper and lower surfaces of the heating film 32. It can be understood that the upper and lower graphite layers maintain the same structure and material.

[0085] In some embodiments, the central axes of the base 2, heating unit 3, and cooling unit 4 coincide. In other words, in this application, the wafer 8, suction cup 81, heating unit 3, cooling unit 4, and base 2 are coaxial. By adopting a coaxial arrangement, it can be ensured that the heat generated by the heating unit 3 and the cold energy dissipated by the cooling unit 4 are uniformly distributed circumferentially with respect to the center of the wafer 8. This axisymmetric thermal field distribution eliminates the radial temperature gradient caused by component eccentricity, improves the temperature uniformity of the wafer 8 surface, reduces thermal stress and warpage caused by uneven heating of the wafer 8, and thus improves the yield and reliability of semiconductor processes.

[0086] In some embodiments, such as Figure 10 As shown, the bellows assembly 41 may consist of only a single bellows. The figure shows a cross-sectional view of the bellows and the water-cooling plate 42, where the dashed lines represent the channels for gas flow inside the bellows. Furthermore, the end of the bellows assembly 41 near the base 2 is an open end, and the end of the bellows assembly 41 near the water-cooling plate 42 is a closed end.

[0087] In some embodiments of this application, a bonding apparatus is also provided, which includes a wafer heating and cooling device as described in any of the above technical solutions. Since the wafer heating and cooling device in this bonding apparatus has the same technical features as the aforementioned wafer heating and cooling devices, both can solve the same technical problems and achieve the same technical effects.

[0088] In some embodiments, the bonding apparatus further includes a push pin 9 configured to drive the wafer 8 to move vertically upwards and downwards to perform wafer placement before bonding and wafer removal after bonding. It should be noted that this application does not specifically limit the driving mechanism of the push pin 9, and it can be selected according to actual working conditions. For example, the driving mechanism includes, but is not limited to, a motor, a cylinder, or a hydraulic cylinder.

[0089] In the description of this specification, specific features, structures, materials, or characteristics may be combined in any suitable manner in one or more embodiments or examples.

[0090] The above description is merely a specific embodiment of this application, but the scope of protection of this application is not limited thereto. Any variations or substitutions that can be easily conceived by those skilled in the art within the technical scope disclosed in this application should be included within the scope of protection of this application. Therefore, the scope of protection of this application should be determined by the scope of protection of the claims. Furthermore, specific examples have been used in the specification to illustrate the principles and implementation methods of this application. The description of the above embodiments is only for the purpose of helping to understand the method and core ideas of this application, and the content of this specification should not be construed as a limitation of this application.

Claims

1. A wafer heating and cooling device, characterized in that, include: A base, wherein a first vent is provided on the side wall of the base, and an air passage communicating with the first vent is provided inside the base; The heating unit is connected to the base via a support column; A cooling unit is disposed between the base and the heating unit; The cooling unit includes a bellows assembly and a water-cooled plate. One end of the bellows assembly is connected to the base, and the other end is connected to the water-cooled plate. The bellows assembly is inflated or deflated through the first vent and the air passage, driving the bellows assembly to extend or contract along its axial direction, thereby moving the water-cooled plate closer to or away from the heating unit.

2. The wafer heating and cooling apparatus according to claim 1, characterized in that, The bellows assembly includes a first bellows, a second bellows, and a third bellows; The first corrugated pipe, the second corrugated pipe, and the third corrugated pipe are evenly spaced around the center of the water-cooled plate.

3. The wafer heating and cooling apparatus according to claim 2, characterized in that, In the first corrugated pipe, the second corrugated pipe, and the third corrugated pipe, the angle between the line connecting any two corrugated pipes and the center of the water-cooled plate is 120°.

4. The wafer heating and cooling apparatus according to claim 1, characterized in that, The bellows assembly has a hollow tubular structure; The end of the bellows assembly near the base is an open end; The end of the corrugated pipe assembly closest to the water-cooling plate is a closed end.

5. The wafer heating and cooling apparatus according to claim 1, characterized in that, The wafer heating and cooling device further includes a guiding unit, which includes a guide rod; The guide rod extends axially and passes through the water-cooling plate, and the water-cooling plate is slidably engaged with the guide rod; The first end of the guide rod is fixedly connected to the base.

6. The wafer heating and cooling apparatus according to claim 5, characterized in that, The wafer heating and cooling device includes multiple guiding units; The multiple guide units are centrally symmetrically distributed about the center of the water-cooled plate.

7. The wafer heating and cooling apparatus according to claim 5, characterized in that, The wafer heating and cooling device further includes a limiting unit, which includes a first limiting member and a second limiting member; The first limiting member and the second limiting member are distributed on both sides of the water-cooled plate along its axial direction; The first limiting member is fixedly installed at the second end of the guide rod; The second limiting member is fixedly installed on the guide rod.

8. The wafer heating and cooling apparatus according to claim 1, characterized in that, The wafer heating and cooling device also includes an elastic unit; One end of the elastic unit is connected to the water-cooled plate, and the other end is connected to the base.

9. The wafer heating and cooling apparatus according to claim 8, characterized in that, The elastic unit includes an elastic element, a first connector, and a second connector, with both ends of the elastic element connected to the first connector and the second connector, respectively. The first connector is connected to the water-cooled plate, and the second connector is connected to the base.

10. The wafer heating and cooling apparatus according to claim 8, characterized in that, The wafer heating and cooling device also includes multiple elastic units; The multiple elastic elements are evenly spaced around the center of the water-cooled plate.

11. The wafer heating and cooling apparatus according to claim 10, characterized in that, The wafer heating and cooling device includes three elastic units, which are arranged in an equilateral triangle.

12. The wafer heating and cooling apparatus according to claim 1, characterized in that, A suction cup is provided on the side of the heating unit away from the water-cooled plate, and the suction cup is used to adsorb the wafer; A pressure equalization film is sandwiched between the suction cup and the wafer.

13. The wafer heating and cooling apparatus according to claim 1, characterized in that, The heating unit includes a heating film; Both sides of the heating film are covered with a graphite layer.

14. The wafer heating and cooling apparatus according to claim 13, characterized in that, The heating film is made of polyimide.

15. The wafer heating and cooling apparatus according to claim 1, characterized in that, The central axes of the base, the heating unit, and the cooling unit coincide.

16. A bonding apparatus characterized by comprising: include: The wafer heating and cooling apparatus as described in any one of claims 1 to 15.

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