A silicon wafer magazine
The combination of lifting, connecting rod and locking components enables automatic clamping and release of silicon wafer frames, solving the problem of unstable clamping caused by manual intervention in existing technologies, and improving the clamping reliability and production efficiency of silicon wafers.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- QINGDAO HOUZE JINYE TECH CO LTD
- Filing Date
- 2025-08-27
- Publication Date
- 2026-07-31
AI Technical Summary
The existing silicon wafer frame requires manual intervention when clamping the whole silicon wafer, which results in an unstable clamping and makes it easy to tip over and bump during the debinding process, causing the silicon wafer to chip at the edge.
A silicon wafer frame was designed, which adopts a combination structure of lifting part, connecting rod part and clamping part. It uses the self-weight of the silicon wafer unit to achieve automatic clamping. The connecting rod part drives the clamping part to move closer to or away from the silicon wafer to achieve automatic clamping and release. The locking part and the reset part together ensure the stability and automation of clamping.
It enables automatic clamping and release of silicon wafers without manual intervention, improving the reliability and automation of clamping, avoiding tipping and bumping of silicon wafers during transportation, and improving production efficiency and safety.
Smart Images
Figure CN224583679U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of photovoltaic technology, and in particular to a silicon wafer frame. Background Technology
[0002] In the silicon wafer production process, silicon rods are first cut into silicon wafers using a wire cutter. The silicon wafers are then attached to the wafer holders using resin plates. The wafer holders and the cut silicon wafers are then placed together into a material frame, which transports them to the debonding station. A debonding machine separates the wafer holders from the silicon wafers. The silicon wafers are then sequentially conveyed to subsequent insertion, cleaning, and drying stations.
[0003] In a currently disclosed silicon wafer holder, placing the sliced silicon wafer into the holder requires manual intervention. The sponge rollers on both sides need to be manually opened, and after the wafer is placed in the holder, the rollers are manually returned to their clamping position to hold the silicon ingot. This process requires manual intervention and cannot be automated. Because the clamping position is fixed, the silicon wafer often tilts and bumps during the debinding process due to insecure clamping, resulting in edge chipping.
[0004] The information disclosed in this background section is only intended to enhance the understanding of the background technology of this application, and therefore may include prior art that is not known to those skilled in the art. Summary of the Invention
[0005] In response to the problems mentioned in the background art, this utility model proposes a silicon wafer frame that enables automatic clamping of the entire silicon wafer when it is placed into the frame, without the need for manual intervention, thereby improving clamping reliability.
[0006] To achieve the above-mentioned objectives, the present invention employs the following technical solution: In some embodiments of this application, a silicon wafer frame is provided. The silicon wafer unit includes a crystal holder and multiple silicon wafers bonded to the crystal holder. The silicon wafer frame includes: The frame body has a receiving space formed within it for accommodating the silicon wafer; A lifting part is disposed on the frame body and is configured to move downward under the gravity of the silicon wafer unit; The connecting rod is connected at one end to the lifting part and at the other end to the frame body. A clamping part, which is connected to the connecting rod part; The connecting rod is configured to drive the clamping part to move toward the silicon wafer when the lifting part moves downward, so as to clamp the silicon wafer; The linkage is also configured to drive the clamping part to move away from the silicon wafer when the lifting part moves upward, so as to release the silicon wafer.
[0007] In some embodiments of this application, the lifting part includes a crystal tray support part, a guide rod is fixedly provided on the frame body, the crystal tray support part is slidably connected to the guide rod, the crystal tray support part moves up and down along the guide rod, and the crystal tray acts on the crystal tray support part.
[0008] In some embodiments of this application, a reset member is sleeved on the guide rod, and the reset member is configured to retract when the crystal support portion moves downward.
[0009] In some embodiments of this application, the crystal support portion includes a support part and a support part, wherein the support part is slidably connected to the guide rod, and the support part is fixedly connected to the support part; The frame body has a notch, and guide portions are provided on opposite sides of the notch. The upper part of the bearing portion extends upward from the notch, and the crystal support acts on the bearing portion.
[0010] In some embodiments of this application, the connecting rod includes a first connecting rod, a second connecting rod, and a connecting rod. The first end of the second connecting rod is rotatably connected to the first connecting rod, the second end of the second connecting rod is rotatably connected to the connecting rod, the first connecting rod is rotatably connected to the lifting part, the connecting rod is fixedly connected to the frame body, and the clamping part is connected to the first end of the second connecting rod.
[0011] In some embodiments of this application, the silicon wafer frame further includes a locking part disposed on the frame body, and the locking part is configured to restrict the upward movement of the lifting part after the lifting part moves downward.
[0012] In some embodiments of this application, the locking part is a spring pin, and the lifting part includes an extension tongue, wherein the spring pin cooperates with the extension tongue to lock the lifting part.
[0013] Compared with the prior art, the advantages and positive effects of this utility model are: The silicon wafer frame disclosed in this application allows the silicon wafer unit to be automatically lowered by its weight when placed into the frame. A connecting rod connects to both the lifting rod and the frame body. As the lifting rod moves downwards, the connecting rod drives the clamping part to move closer to the silicon wafer, thus automatically clamping it. This process requires no manual intervention; the pressure on the lifting part comes from the weight of the silicon wafer unit itself, and no additional power source is needed. Therefore, it can automatically clamp the silicon wafer, improving the automation level of wafer clamping and contributing to increased production efficiency. During subsequent transfer, the clamping part remains in the position that clamps the silicon wafer, preventing it from tipping over.
[0014] Other features and advantages of this utility model will become clearer after reading the detailed embodiments of this utility model in conjunction with the accompanying drawings. Attached Figure Description
[0015] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.
[0016] Figure 1 This is a structural diagram of a silicon wafer frame according to some embodiments; Figure 2 This is a structural diagram of placing a silicon wafer unit within a silicon wafer frame according to some embodiments; Figure 3 This is a partial structural diagram of a silicon wafer frame according to some embodiments; Figure 4 This is a partial structural diagram of the lifting part, connecting rod part, and clamping part according to some embodiments; Figure 5 This is a structural diagram of a locking part according to some embodiments; Figure 6 This is a structural diagram of a silicon wafer unit according to some embodiments.
[0017] Figure label: 100. Silicon wafer unit; 110. Crystal holder; 111. Extension; 120. Silicon wafer; 200, frame body; 210, notch; 220, guide section; 300. Lifting unit; 310. Crystal tray support unit; 311. Support unit 1; 312. Support unit 2; 313. Slider; 314. Extension tongue; 320. Reset component; 330. Guide rod; 400. Linkage section; 410. First link; 420. Second link; 430. Connecting rod; 500. Clamping part; 600. Locking part; 610. Spring pin; 611. Roller. Detailed Implementation
[0018] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.
[0019] In the description of this application, it should be understood that the terms "center", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this application.
[0020] The terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Therefore, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this application, unless otherwise stated, "a plurality of" means two or more.
[0021] In the description of this application, it should be noted that, unless otherwise expressly specified and limited, the terms "installation," "connection," and "linking" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection between two components. Those skilled in the art can understand the specific meaning of the above terms in this application based on the specific circumstances.
[0022] In this invention, unless otherwise explicitly specified and limited, "above" or "below" the second feature can include direct contact between the first and second features, or contact between the first and second features through another feature between them. Furthermore, "above," "over," and "on top" of the second feature includes the first feature directly above or diagonally above the second feature, or simply indicates that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature includes the first feature directly below or diagonally below the second feature, or simply indicates that the first feature is at a lower horizontal level than the second feature.
[0023] The following disclosure provides many different embodiments or examples for implementing various structures of this invention. To simplify the disclosure, specific examples of components and arrangements are described below. These are merely examples and are not intended to limit the scope of the invention. Furthermore, reference numerals and / or letters may be repeated in different examples; such repetition is for simplification and clarity and does not in itself indicate a relationship between the various embodiments and / or arrangements discussed. In addition, examples of various specific processes and materials are provided in this invention, but those skilled in the art will recognize the application of other processes and / or the use of other materials.
[0024] During silicon wafer production and processing, the silicon rod is first cut into silicon wafers 120 using slicing equipment (such as a wire cutter). At this time, the silicon wafers 120 are attached to the crystal tray 110 by a resin plate. After cutting, the crystal tray 110 and the silicon wafers 120 are loaded into a material frame. The material frame transports the silicon wafer unit 100 to the debonding station to separate the crystal tray 110 from the silicon wafers 120. The separated silicon wafers 120 then undergo subsequent processes such as slitting and loading. The silicon wafers 120 are loaded to the insertion station for insertion. After insertion, the silicon wafers 120 are cleaned and dried.
[0025] Figure 6 This is a structural diagram of a silicon wafer unit 100, which includes a crystal holder 110 and multiple silicon wafers 120 bonded to the crystal holder 110. After the silicon rod is cut, it is loaded into a feed frame in units of silicon wafer units 100.
[0026] In some embodiments of this application, a silicon wafer frame is provided to improve the clamping structure of the silicon wafer 120, thereby achieving automatic and reliable clamping of the silicon wafer 120 after it is placed in the frame, preventing the silicon wafer 120 from tipping over during subsequent transfer, and eliminating the need for manual intervention in the loading process of the silicon wafer 120.
[0027] Figure 1 This is a structural diagram of a silicon wafer frame. Figure 2 This is a structural diagram showing a silicon wafer unit 100 placed within a silicon wafer frame. Figure 3 This is a partial structural diagram of a silicon wafer frame. Figure 4 This is a partial structural diagram of the lifting part 300, the connecting rod part 400, and the clamping part 500.
[0028] The silicon wafer frame structure includes a frame body 200. The frame body 200 is a frame structure. A receiving space for accommodating the silicon wafer 120 is formed within the frame body 200. The top of the frame body 200 is open to allow the silicon wafer unit 100 to be loaded or unloaded.
[0029] The silicon wafer frame structure also includes a lifting section 300. The lifting section 300 is disposed on the frame body 200. The lifting section 300 is configured to move downward under the gravity of the silicon wafer unit 100.
[0030] Lifting parts 300 are respectively provided at opposite ends of the frame body 200 along its length. When the silicon wafer unit 100 is placed into the material frame, the two ends of the silicon wafer unit 100 contact the lifting parts 300 on the corresponding sides respectively, and the gravity of the silicon wafer unit 100 acts on the lifting parts 300, causing the lifting parts 300 to move downward.
[0031] The silicon wafer frame structure also includes a connecting rod portion 400. One end of the connecting rod portion 400 is connected to the lifting portion 300, and the other end is connected to the frame body 200. The silicon wafer frame structure also includes a clamping portion 500. The clamping portion 500 is connected to the connecting rod portion 400. For example, the clamping portion 500 is a long strip-shaped sponge roller.
[0032] The clamping part 500 has two parts. The two sides of the silicon wafer unit 100 are respectively provided with clamping parts 500. The two clamping parts 500 move together toward the silicon wafer 120 to clamp the silicon wafer 120.
[0033] Each lifting section 300 is provided with two clamping sections 500, that is, the silicon wafer frame is provided with a total of four connecting sections 400. A clamping section 500 is provided between every two connecting sections 400 that are arranged opposite each other along the length of the frame.
[0034] The linkage 400 is configured to move the clamping part 500 toward the silicon wafer 120 when the lifting part 300 moves downward, so as to clamp the silicon wafer 120; the linkage 400 is also configured to move the clamping part 500 away from the silicon wafer 120 when the lifting part 300 moves upward, so as to release the silicon wafer 120.
[0035] The silicon wafer frame disclosed in this application allows the silicon wafer unit 100 to automatically move downwards when placed into the frame due to the weight of the unit. A connecting rod 400 connects to both the lifting unit 300 and the frame body 200. As the lifting unit 300 moves downwards, the connecting rod 400 drives the clamping unit 500 to move closer to the silicon wafer 120, thus automatically clamping the silicon wafer 120. This process requires no manual intervention; the pressure on the lifting unit 300 comes from the weight of the silicon wafer unit 100 itself, and no additional power source is needed. Therefore, it can automatically clamp the silicon wafer 120, improving the automation level of silicon wafer clamping and contributing to increased production efficiency.
[0036] During subsequent transfer, the clamping part 500 remains in the position of clamping the silicon wafer 120 to prevent the silicon wafer 120 from tipping over.
[0037] In some embodiments of this application, reference is made to Figure 3 and Figure 4 The lifting part 300 includes a crystal tray support part 310. A guide rod 330 is fixedly provided on the frame body 200. The crystal tray support part 310 is slidably connected to the guide rod 330. The crystal tray support part 310 moves up and down along the guide rod 330. The crystal tray 110 acts on the crystal tray support part 310.
[0038] Specifically, the silicon wafer frame is equipped with a total of four guide rods 330, and a crystal tray support portion 310 is provided on two guide rods 330 located at the same end of the frame. The crystal tray support portion 310 includes a slider 313, which is slidably connected to the guide rods 330.
[0039] When the silicon wafer unit 100 is placed into the material frame and acts on the crystal tray support part 310, the crystal tray support part 310 can move stably up and down along the guide rod 330 through the sliding cooperation of the slider 313 and the guide rod 330. This avoids the crystal tray support part 310 from deviating or shaking during the movement, ensuring the accuracy of the movement of the lifting part 300. In turn, it ensures that the connecting rod part 400 can drive the clamping part 500 to move according to the preset trajectory, making the clamping action of the clamping part 500 on the silicon wafer 120 more reliable.
[0040] Because the wafer holder support 310 can move smoothly up and down along the guide rod 330, regardless of how the size of the silicon wafer unit 100 changes within a certain range, as long as its weight can cause the wafer holder support 310 to move downwards, the clamping part 500 can be driven by the connecting rod 400 to reliably clamp the silicon wafer 120. This allows the silicon wafer frame to adapt to silicon wafer units 100 of different specifications, improving the frame's versatility, reducing the need to replace the frame due to changes in the specifications of the silicon wafer 120, and lowering production costs.
[0041] In some embodiments of this application, a reset member 320 is sleeved on the guide rod 330, and the reset member 320 is configured to retract when the crystal carrier portion 310 moves downward. For example, the reset member 320 is a spring.
[0042] When the silicon wafer unit 100 is removed from the feed frame, the pressure on the wafer holder 310 disappears. At this time, the reset member 320, which was originally in a contracted state, will extend due to its own elastic restoring force, thereby pushing the wafer holder 310 upward along the guide rod 330 and returning it to its initial position. This automatic reset process requires no manual operation, ensuring that the feed frame can quickly prepare for the next loading of silicon wafer units 100, further improving the automation and continuity of the entire production process, and effectively avoiding production stoppages caused by untimely manual reset.
[0043] When the silicon wafer unit 100 is placed into the frame and acts on the wafer holder support 310, the wafer holder support 310 will move downward under the action of gravity. At this time, the reset member 320 retracts accordingly. The retraction process of the reset member 320 can generate a certain buffering force on the downward movement of the wafer holder support 310, slowing down its movement speed and preventing the wafer holder support 310 from violently colliding with the frame body 200 or other components due to excessive instantaneous force.
[0044] During the loading of the silicon wafer unit 100, as the crystal tray support portion 310 moves downward, the reset member 320 gradually contracts and accumulates elastic potential energy. The elastic force of the reset member 320 reacts on the crystal tray support portion 310, making the support of the crystal tray support portion 310 for the silicon wafer unit 100 more stable. At the same time, this elastic force, transmitted through the crystal tray support portion 310 and the connecting rod portion 400, makes the clamping force of the clamping portion 500 on the silicon wafer 120 more stable. Even if slight bumps or vibrations are encountered during the material frame transfer, the elastic effect of the reset member 320 can, to a certain extent, offset the influence of these external forces, maintain the stability of the clamping force between the clamping portion 500 and the silicon wafer 120, prevent the silicon wafer 120 from loosening or tipping over, and further ensure the safety of the silicon wafer 120 during the transfer process.
[0045] Furthermore, the reset member 320 can accommodate silicon wafer units 100 of different weights. For silicon wafer units 100 of different weights, the downward movement distance of the crystal support portion 310 will vary, and the degree of contraction of the reset member 320 will also differ accordingly. The reset member 320 automatically adjusts the amount of contraction according to the weight of the silicon wafer unit 100, thereby generating a matching elastic force, ensuring that the clamping portion 500 can reliably clamp the silicon wafer 120 under different weight conditions, thus improving the adaptability of the material frame to silicon wafer units 100 of different specifications and the versatility of clamping.
[0046] In some embodiments of this application, the crystal carrier 310 includes a carrier part 311 and a carrier part 312, with the carrier part 311 and the carrier part 312 fixedly connected. The carrier part 311 is slidably connected to the guide rod 330. For example, a slider 313 is fixedly provided on the carrier part 311, and the slider 313 is slidably connected to the guide rod 330.
[0047] The frame body 200 is provided with a notch 210, and guide portions 220 are provided on opposite sides of the notch 210. The upper part of the bearing portion 312 extends upward from the notch 210, and the crystal holder 110 acts on the bearing portion 312.
[0048] Reference Figure 6The end of the crystal holder 110 is provided with an extension 111. When the silicon wafer unit 100 is placed into the silicon wafer frame, the two guides 220 play a positioning and guiding role for the extension 111. The extension 111 is directly opposite the notch 210. When the silicon wafer unit 100 falls downward, the extension 111 can act downward on the part of the support part 312 exposed from the notch 210.
[0049] Because the guide section 220 guides the extension section 111, operators or automated equipment do not need to perform high-precision manual alignment when placing the silicon wafer unit 100, reducing the difficulty of operation. At the same time, the extension section 111 falls smoothly under the guidance of the guide section 220 and acts on the support section 312, avoiding damage to the crystal holder 110, silicon wafer 120 and material frame components caused by collisions or offsets during placement, and reducing the risk of edge chipping of silicon wafer 120 and equipment wear.
[0050] The first support part 311 mainly functions as a sliding connection with the guide rod 330. By fixing a slider 313 on the first support part 311, the slider 313 and the guide rod 330 form a stable sliding engagement, allowing the entire crystal tray support part 310 to move smoothly up and down along the guide rod 330, providing a stable motion basis for the gravity transmission of the silicon wafer unit 100 and the subsequent movement of the clamping part 500. The second support part 312 is specifically used to contact the crystal tray 110 and bear its pressure. Its upper part extends upward from the notch 210 of the frame body 200, directly bearing the force of the crystal tray 110.
[0051] In some embodiments of this application, reference is made to Figure 3 and Figure 4 The connecting rod includes a first connecting rod 410, a second connecting rod 420, and a connecting rod 430. The first end of the second connecting rod 420 is rotatably connected to the first connecting rod 410, and the second end of the second connecting rod 420 is rotatably connected to the connecting rod 430. The first connecting rod 410 is rotatably connected to the lifting part 300, specifically, the first connecting rod 410 is rotatably connected to the bearing part 311. The connecting rod 430 is fixedly connected to the frame body 200, and the clamping part 500 is connected to the first end of the second connecting rod 420.
[0052] When the silicon wafer unit 100 is placed on the crystal tray support part 310, the crystal tray support part 310 moves downward along the guide rod 330 under the action of gravity. Through the rotational cooperation of the multi-link, the linear downward movement of the crystal tray support part 310 is converted into the arc movement of the first end of the second link 420, which ultimately drives the clamping part 500 connected to the first end of the second link 420 to move closer to the silicon wafer 120, thereby clamping the silicon wafer 120.
[0053] During the removal of silicon wafer 120, as silicon wafer unit 100 is removed, the crystal support 310 moves upward under the action of reset member 320, and drives the second link 420 to rotate in the opposite direction through linkage transmission, so that the clamping part 500 moves away from silicon wafer 120, thereby achieving automatic release.
[0054] In some embodiments of this application, the silicon wafer frame further includes a locking part 600, which is disposed on the frame body 200. The locking part 600 is configured to restrict the upward movement of the lifting part 300 after the lifting part 300 moves downward. Automatic locking is achieved under the action of the locking part 600, and the entire clamping process is fully automated.
[0055] After the silicon wafer unit 100 is placed in the material frame, the lifting part 300 moves downward under the gravity of the silicon wafer unit 100, driving the connecting rod part 400 to clamp the silicon wafer 120 with the clamping part 500. At this time, the locking part 600 restricts the upward movement of the lifting part 300, which can prevent the lifting part 300 from moving upward unexpectedly due to external forces such as vibration and bumps during the material frame transfer. If the lifting part 300 moves upward unexpectedly, it will cause the connecting rod part 400 to drive the clamping part 500 to move away from the silicon wafer 120, resulting in a weakening or even loss of clamping force, which may lead to problems such as the silicon wafer 120 tipping over or being bumped. The limiting effect of the locking part 600 ensures that the lifting part 300 always remains in the position where the clamping part 500 clamps the silicon wafer 120, maintaining a stable clamping force, and fundamentally ensuring the stability and safety of the silicon wafer 120 during the transfer process.
[0056] The locking part 600 operates without manual intervention, completely synchronized with the movement of the lifting part 300. When the lifting part 300 reaches its downward position, the locking part 600 automatically triggers and locks it. When the silicon wafer 120 needs to be removed, simply releasing the locking part 600 allows the lifting part 300 to move upward under the action of the reset member 320, causing the clamping part 500 to release the silicon wafer 120. This automatic locking mechanism further enhances the automation level of the silicon wafer frame, and together with the previous automatic clamping and automatic reset structures, forms a complete automated operation process, reducing manual operation steps and improving production efficiency.
[0057] In some embodiments of this application, reference is made to Figure 3 and Figure 5 The locking part 600 is a spring pin 610, and a roller 611 is provided at the front end of the spring pin 610. The lifting part 300 includes an extension tongue 314, and the spring pin 610 cooperates with the extension tongue 314 to lock the lifting part 300.
[0058] When the lifting part 300 moves downward to a certain position, the spring pin 610 moves above the extension tongue 314 under its own elastic force, automatically locking the extension tongue 314, thereby preventing the lifting part 300 from rising, and thus ensuring that the clamping part 500 maintains sufficient clamping force. Throughout the entire transportation and debinding process of the silicon wafer frame, the clamping part 500 firmly clamps the silicon wafer 120, preventing the silicon wafer 120 from tipping over.
[0059] When it is necessary to remove the silicon wafer unit 100 from the material frame, the spring pin 610 is manually or automatically stretched, the roller 611 above the extension tongue 314 retracts, the lifting part 300 automatically moves back to its original position under the action of the reset part 320, and the clamping part 500 that clamps the silicon wafer 120 automatically opens.
[0060] In some embodiments of this application, the silicon wafer frame also includes a read / write chip, which can record and trace information such as materials, processing time, and process steps in all stages, including slicing machine unloading, debinding machine loading and unloading, and wafer insertion machine loading. It can also upload MES information to realize digital production information management and control.
[0061] In the description of the above embodiments, specific features, structures, materials, or characteristics may be combined in any suitable manner in one or more embodiments or examples.
[0062] The above are merely specific embodiments of this utility model, but the protection scope of this utility model is not limited thereto. Any variations or substitutions that can be easily conceived by those skilled in the art within the technical scope disclosed in this utility model should be included within the protection scope of this utility model. Therefore, the protection scope of this utility model should be determined by the scope of the claims.
Claims
1. A silicon wafer magazine, a wafer unit comprising a wafer boat and a plurality of silicon wafers attached to said wafer boat, characterized in that, The silicon wafer frame includes: The frame body has a receiving space formed within it for accommodating the silicon wafer; A lifting part is disposed on the frame body and is configured to move downward under the gravity of the silicon wafer unit; The connecting rod is connected at one end to the lifting part and at the other end to the frame body. A clamping part, which is connected to the connecting rod part; The connecting rod is configured to drive the clamping part to move toward the silicon wafer when the lifting part moves downward, so as to clamp the silicon wafer; The linkage is also configured to drive the clamping part to move away from the silicon wafer when the lifting part moves upward, so as to release the silicon wafer.
2. The silicon wafer frame according to claim 1, characterized in that, The lifting unit includes a crystal tray support unit. A guide rod is fixedly provided on the frame body. The crystal tray support unit is slidably connected to the guide rod. The crystal tray support unit moves up and down along the guide rod. The crystal tray acts on the crystal tray support unit.
3. The silicon wafer frame according to claim 2, characterized in that, A reset member is sleeved on the guide rod, and the reset member is configured to retract when the crystal support portion moves downward.
4. The silicon wafer frame according to claim 2, characterized in that, The crystal support portion includes a support part one and a support part two. The support part one is slidably connected to the guide rod, and the support part two is fixedly connected to the support part one. The frame body has a notch, and guide portions are provided on opposite sides of the notch. The upper part of the bearing portion extends upward from the notch, and the crystal support acts on the bearing portion.
5. The silicon wafer frame according to claim 1, characterized in that, The linkage includes a first linkage, a second linkage, and a connecting rod. The first end of the second linkage is rotatably connected to the first linkage, and the second end of the second linkage is rotatably connected to the connecting rod. The first linkage is rotatably connected to the lifting part, and the connecting rod is fixedly connected to the frame body. The clamping part is connected to the first end of the second linkage.
6. The silicon wafer frame according to any one of claims 1 to 5, characterized in that, The silicon wafer frame also includes a locking part, which is disposed on the frame body and is configured to restrict the upward movement of the lifting part after the lifting part moves downward.
7. The silicon wafer frame according to claim 6, characterized in that, The locking part is a spring pin, and the lifting part includes an extension tongue. The spring pin and the extension tongue cooperate to lock the lifting part.