Wafer boat

Abstract

This utility model discloses a wafer frame, wherein the wafer unit includes a wafer holder and multiple wafers attached to the wafer holder; the wafer frame includes a frame body and a crystal orientation angle adjustment module; the frame body has a receiving space for accommodating wafers; the crystal orientation angle adjustment module is disposed on the frame body and includes a support stage, a deflection stage and an adjustment part; the support stage is connected to the frame body, the deflection stage is slidably disposed on the support stage, the end of the wafer holder is placed on the deflection stage, and the adjustment part is configured to drive the deflection stage to rotate in the horizontal direction to adjust the crystal orientation angle.

Description

Technical Field

[0001] This utility model relates to the field of semiconductor chip technology, and in particular to a wafer frame. Background Technology

[0002] In the semiconductor wafer production process, silicon rods are first cut into wafers using a wire cutter. The wafers are then attached to the wafer holder using a resin plate. The wafer holder and the cut wafers are then placed together into a material frame, which transports them to the debonding station. A debonding machine separates the wafers from the wafers, and the wafers are then sequentially conveyed to subsequent stages such as insertion, cleaning, and drying.

[0003] In a currently disclosed wafer frame, the crystal orientation angle of the wafer cannot be adjusted after the sliced ​​whole wafer is placed into the frame, which will ultimately affect the quality of subsequent semiconductor devices.

[0004] The information disclosed in this background section is only intended to enhance the understanding of the background technology of this application, and therefore may include prior art that is not known to those skilled in the art. Summary of the Invention

[0005] In response to the problems pointed out in the background art, this utility model proposes a wafer frame that can adjust the crystal orientation angle.

[0006] To achieve the above-mentioned objectives, the present invention employs the following technical solution: In some embodiments of this application, a wafer frame is provided. The wafer unit includes a wafer holder and multiple wafers bonded to the wafer holder. The wafer frame includes a frame body and a crystal orientation adjustment module. A receiving space for accommodating wafers is formed within the frame body. The crystal orientation adjustment module is disposed on the frame body and includes a support stage, a deflection stage, and an adjustment part. The support stage is connected to the frame body, the deflection stage is slidably disposed on the support stage, the end of the wafer holder is placed on the deflection stage, and the adjustment part is configured to drive the deflection stage to rotate in the horizontal direction.

[0007] In some embodiments of this application, the adjusting part includes a gear and a rack, the gear meshing with the rack, the gear being disposed on the deflection platform, the rack being disposed on the support platform, and the rack extending along the width direction of the frame body.

[0008] In some embodiments of this application, a handle is provided on the deflection platform, and the handle is configured to drive the gear to rotate.

[0009] In some embodiments of this application, the support platform is provided with an arc-shaped guide hole, and the deflection platform is provided with an extension, the extension extending into the arc-shaped guide hole and moving along the arc-shaped guide hole.

[0010] In some embodiments of this application, a placement groove is provided on the deflection stage, and an extension is provided at the end of the crystal holder, the extension being placed in the placement groove.

[0011] In some embodiments of this application, the deflection stage is provided with an opening, and a pointer mark is provided on the side wall of the opening; An angular scale is provided on the support platform, and the angular scale protrudes from the opening.

[0012] In some embodiments of this application, the end of the support platform is provided with an elongated opening, the frame body is provided with a mounting hole, and a connector passes through the elongated opening and the mounting hole.

[0013] In some embodiments of this application, the frame body includes an upper frame and a lower frame, the upper frame and the lower frame are detachably connected, and the crystal orientation adjustment module is disposed on the upper frame.

[0014] In some embodiments of this application, the wafer frame further includes an anti-tipping portion, which includes a mounting frame and a limiting roller. The mounting frame is fixedly connected to the frame body, and the limiting roller is connected to the mounting frame. The limiting roller is located at the end of the wafer unit.

[0015] In some embodiments of this application, the crystal orientation adjustment module is provided at each of the opposite ends of the frame body along the length direction.

[0016] Compared with the prior art, the advantages and positive effects of this utility model are: The wafer frame disclosed in this application allows for the adjustment of the wafer orientation angle when placing a wafer cell into the frame, with the end of the wafer holder resting on a deflection stage. An adjustment unit drives the deflection stage to rotate, which in turn drives the wafer holder to rotate synchronously. The wafer frame of this application offers the following advantages: In traditional processes, the inability to adjust the crystal orientation angle of wafers can lead to a large number of wafers being scrapped in subsequent processes due to crystal orientation issues, resulting in waste of materials and upfront processing costs. The wafer frame proposed in this application effectively solves this problem, helping to reduce scrap rates and improve wafer utilization.

[0017] Traditional wafer hoppers cannot adjust the crystal orientation angle, which may require additional inspection and adjustment steps in subsequent processes, and even lead to frequent downtime to adjust equipment parameters due to crystal orientation issues, affecting production efficiency. The wafer hopper of this application enables the crystal orientation angle to be adjusted when the wafer enters the hopper, allowing subsequent processes to proceed smoothly without additional crystal orientation adjustment operations, thus helping to shorten the production cycle and improve production efficiency.

[0018] Different semiconductor device manufacturing processes have different requirements for wafer crystal orientation. The wafer frame in this application can easily adapt to diverse process requirements through its flexible crystal orientation angle adjustment function.

[0019] In semiconductor manufacturing processes, subsequent processes such as photolithography, etching, and ion implantation place extremely high demands on the crystal orientation accuracy of wafers. The wafer frame of this application can adjust the crystal orientation angle of the wafer, ensuring that the crystal orientation of the wafer precisely matches the process requirements when it enters these critical process stages.

[0020] Other features and advantages of this utility model will become clearer after reading the detailed embodiments of this utility model in conjunction with the accompanying drawings. Attached Figure Description

[0021] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0022] Figure 1 This is a structural diagram of a wafer frame according to some embodiments; Figure 2 This is a structural diagram of placing wafer cells within a wafer frame according to some embodiments; Figure 3 An exploded view of a wafer frame according to some embodiments; Figure 4 This is a structural diagram of an upper frame and a crystal orientation adjustment module according to some embodiments; Figure 5 This is yet another structural diagram of the upper frame and crystal orientation adjustment module according to some embodiments; Figure 6 This is a structural diagram of a deflection stage according to some embodiments; Figure 7 This is a structural diagram of a support platform according to some embodiments.

[0023] Figure label: 100. Wafer unit; 110. Chip holder; 120. Wafer wafer; 200. Frame body; 210. Upper frame body; 220. Lower frame body; 300. Crystal orientation angle adjustment module; 310. Support platform; 311. Arc-shaped guide hole; 312. Long strip opening; 313. Connector; 320. Deflection stage; 321. Placement slot; 322. Opening; 330. Adjustment part; 331. Gear; 332. Rack; 333. Handle; 341. Pointer indicator; 342. Angle scale; 350. Locking nut; 400. Anti-tipping part; 410. Mounting bracket; 420. Limiting roller. Detailed Implementation

[0024] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0025] In the description of this application, it should be understood that the terms "center", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this application.

[0026] The terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Therefore, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this application, unless otherwise stated, "a plurality of" means two or more.

[0027] In the description of this application, it should be noted that, unless otherwise expressly specified and limited, the terms "installation," "connection," and "linking" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection between two components. Those skilled in the art can understand the specific meaning of the above terms in this application based on the specific circumstances.

[0028] In this invention, unless otherwise explicitly specified and limited, "above" or "below" the second feature can include direct contact between the first and second features, or contact between the first and second features through another feature between them. Furthermore, "above," "over," and "on top" of the second feature includes the first feature directly above or diagonally above the second feature, or simply indicates that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature includes the first feature directly below or diagonally below the second feature, or simply indicates that the first feature is at a lower horizontal level than the second feature.

[0029] The following disclosure provides many different embodiments or examples for implementing various structures of this invention. To simplify the disclosure, specific examples of components and arrangements are described below. These are merely examples and are not intended to limit the scope of the invention. Furthermore, reference numerals and / or letters may be repeated in different examples; such repetition is for simplification and clarity and does not in itself indicate a relationship between the various embodiments and / or arrangements discussed. In addition, examples of various specific processes and materials are provided in this invention, but those skilled in the art will recognize the application of other processes and / or the use of other materials.

[0030] During wafer manufacturing, silicon rods are first cut into wafers 120 using slicing equipment (such as wire cutting machines). At this time, wafers 120 are attached to wafer holders 110 via resin plates. After cutting, wafer holders 110 and wafers 120 are loaded into a material frame, which then transports wafer units 100 to the debonding station to separate wafer holders 110 from wafers 120. After separation, wafers 120 undergo subsequent slitting, loading, and other processes. Wafers 120 are then loaded to the insertion station for insertion. After insertion, wafers 120 are cleaned and dried.

[0031] The wafer unit 100 includes a wafer holder 110 and multiple wafers 120 attached to the wafer holder 110. After the silicon ingot is cut, it is loaded into the feed frame in units of wafer units 100.

[0032] This application provides a wafer frame that, through structural improvements, enables adjustment of the crystal orientation angle of the wafer 120. Figure 1 This is a structural diagram of a wafer frame. Figure 2 This is a structural diagram showing a wafer unit 100 placed within a wafer frame. Figure 3 This is an exploded view of a wafer frame.

[0033] The wafer frame includes a frame body 200. The frame body 200 has a receiving space formed within it for accommodating wafers 120. The top of the frame body 200 is open to allow wafer cells 100 to be inserted or removed.

[0034] A wafer frame crystal orientation angle adjustment module 300 is provided. The crystal orientation angle adjustment module 300 is disposed on the frame body 200. The crystal orientation angle adjustment module 300 is located at the end of the wafer unit 100. The crystal orientation angle adjustment module 300 includes a support stage 310, a deflection stage 320, and an adjustment part 330.

[0035] The support platform 310 is connected to the frame body 200. The deflection stage 320 is slidably mounted on the support platform 310, and the end of the crystal holder 110 is placed on the deflection stage 320. The adjustment unit 330 is configured to drive the deflection stage 320 to rotate in the horizontal direction.

[0036] The wafer unit 100 is placed in the feed frame, and the end of the wafer holder 110 is placed on the deflection stage 320. The deflection stage 320 is driven to rotate by the adjustment unit 330, and the deflection stage 320 drives the wafer holder 110 to rotate synchronously, thereby realizing the adjustment of the crystal orientation angle of the wafer 120.

[0037] In traditional processes, the inability to adjust the crystal orientation angle of wafer 120 can lead to a large number of wafers being scrapped in subsequent processes due to crystal orientation issues, resulting in waste of materials and upfront processing costs. The wafer frame of this application effectively solves this problem, helping to reduce scrap rates and improve the utilization rate of wafers 120.

[0038] Traditional wafer hoppers cannot adjust the crystal orientation angle, which may require additional inspection and adjustment steps in subsequent processes, and may even lead to frequent downtime to adjust equipment parameters due to crystal orientation issues, affecting production efficiency. The wafer hopper of this application enables the crystal orientation angle of the wafer 120 to be adjusted when it enters the hopper, allowing subsequent processes to proceed smoothly without additional crystal orientation adjustment operations, thus helping to shorten the production cycle and improve production efficiency.

[0039] Different semiconductor device manufacturing processes have varying requirements for the 120° crystal orientation of wafers. The wafer frame in this application can easily adapt to diverse process requirements through its flexible crystal orientation angle adjustment function.

[0040] In the semiconductor manufacturing process, subsequent processes such as photolithography, etching, and ion implantation place extremely high demands on the crystal orientation accuracy of the wafer 120. The wafer frame of this application can adjust the crystal orientation angle of the wafer 120, so that the crystal orientation of the wafer 120 can accurately match the process requirements when entering these critical process stages.

[0041] In some embodiments of this application, the crystal orientation adjustment module 300 is respectively provided at both ends of the frame body 200 along the length direction.

[0042] After the wafer cell 100 is placed into the receiving space of the frame body 200, the two opposite ends of the wafer holder 110 along the length direction will be placed on the deflection stages 320 of the two crystal orientation adjustment modules 300 respectively. This two-end support method can provide stable support for the wafer holder 110 and prevent the wafer holder 110 from tilting or shaking due to unilateral force.

[0043] During crystal orientation adjustment, the adjustment units 330 of the two crystal orientation adjustment modules 300 will work together to drive their respective deflection stages 320 to rotate. Since the two deflection stages 320 act on the two ends of the crystal holder 110 respectively, their synchronous rotation can drive the crystal holder 110 to rotate smoothly in the horizontal direction, ensuring the consistency and stability of the rotation process of the crystal holder 110 and the wafer 120.

[0044] In some embodiments of this application, reference is made to Figure 5 , Figure 5 for Figure 4 The diagram shows a structural design viewed from the bottom. The adjusting unit 330 includes a gear 331 and a rack 332, with the gear 331 meshing with the rack 332. The gear 331 is mounted on the deflection table 320, and the rack 332 is mounted on the support platform 310, extending along the width direction of the frame body 200. When the gear 331 rotates, it moves along the rack 332, thereby causing the deflection table 320 to rotate.

[0045] The meshing transmission between gear 331 and rack 332 has a fixed transmission ratio, enabling precise displacement transmission. When the drive gear 331 rotates at a specific angle, the distance the gear 331 moves along rack 332 is fixed and predictable, thus allowing precise control over the rotation angle of the deflection stage 320. This means that the operator can control the rotation of gear 331 to rotate the deflection stage 320, driving the crystal holder 110 and the wafer 120 to a precise target angle according to the adjustment requirements of the crystal orientation angle of the wafer 120, effectively avoiding angle deviations during the adjustment process.

[0046] The meshing of gear 331 and rack 332 is a rigid contact, which prevents slippage during transmission and ensures the continuity and stability of power transmission. When gear 331 moves along rack 332, the deflection table 320 can smoothly follow the rotation without any sudden shaking or jumping.

[0047] In some embodiments of this application, the deflection stage 320 is provided with a handle 333, which is configured to drive the gear 331 to rotate. The handle 333 facilitates user operation.

[0048] In some embodiments of this application, reference is made to Figure 7 The support platform 310 is provided with an arc-shaped guide hole 311. (Refer to...) Figure 5 The deflection stage 320 is provided with an extension (not shown), for example, the extension is a downwardly extending column, the extension extends into the arc-shaped guide hole 311 and moves along the arc-shaped guide hole 311.

[0049] When the deflection stage 320 rotates under the drive of the adjustment unit 330, the extension on the deflection stage 320 moves synchronously along the arc-shaped guide hole 311 on the support platform 310. The trajectory of the arc-shaped guide hole 311 matches the preset rotation path of the deflection stage 320, which can strictly constrain the movement direction of the deflection stage 320 and prevent the deflection stage 320 from deviating, tilting or shaking during rotation.

[0050] The arc-shaped guide hole 311 can also limit the rotation range of the deflection stage 320. The two ends of the arc-shaped guide hole 311 can be used as the extreme positions of the rotation of the deflection stage 320. When the extension moves to the end of the arc-shaped guide hole 311, it will be blocked and unable to continue moving, thereby limiting the maximum rotation angle of the deflection stage 320.

[0051] In some embodiments of this application, a locking nut 350 is provided at the bottom of the extension. When the deflection table 320 rotates to the position, the locking nut 350 is tightened to fix the position of the deflection table 320.

[0052] When the operator drives the gear 331 to rotate via handle 333, or the deflection stage 320 is adjusted to the target angle via an automated device, the crystal orientation angle of the wafer 120 has met the process requirements. At this point, if the deflection stage 320 is not secured, it may rotate unexpectedly due to external forces such as vibration or collision during wafer frame transfer, causing the crystal orientation angle to deviate from the preset value and affecting the accuracy of subsequent processes. This problem is solved by using a locking nut 350. Tightening the locking nut 350 tightly secures the extension to the support platform 310, thereby restricting the movement of the extension along the arc-shaped guide hole 311, ultimately locking the position of the deflection stage 320 firmly and ensuring that the crystal orientation angle remains stable during transfer and subsequent operations.

[0053] In some embodiments of this application, reference is made to Figure 6 The deflection stage 320 is provided with a placement groove 321, and the end of the crystal holder 110 is provided with an extension, which is placed in the placement groove 321.

[0054] The engagement between the placement slot 321 and the extension of the crystal tray 110 provides a rigid constraint on their relative positions. When the extension at the end of the crystal tray 110 is placed into the placement slot 321 of the deflection stage 320, the sidewall of the placement slot 321 will limit the extension, preventing the crystal tray 110 from sliding or shifting on the deflection stage 320. This ensures that the relative position between the crystal tray 110 and the deflection stage 320 is fixed, so that when the deflection stage 320 rotates, the crystal tray 110 can rotate synchronously and accurately, thereby ensuring the crystal orientation angle adjustment accuracy of the wafer 120.

[0055] The placement slot 321 provides intuitive positioning guidance for the placement of the wafer tray 110. When placing the wafer tray 110 into the feed frame, the operator does not need to repeatedly align the position of the wafer tray 110 with the deflection stage 320. The operator only needs to align the extension of the wafer tray 110 with the placement slot 321 and place it in to complete the initial positioning, which simplifies the operation process and shortens the loading time of the wafer cell 100.

[0056] In some embodiments of this application, reference is made to Figure 6 The deflection stage 320 has an opening 322, and a pointer indicator 341 is provided on the side wall of the opening 322. (Refer to...) Figure 7 The support platform 310 is provided with an angle scale 342, which is exposed from the opening 322.

[0057] The combination of pointer mark 341 and angle scale 342 enables the visualization and quantification of crystal orientation angle adjustment. When the operator drives the deflection stage 320 to rotate via handle 333, pointer mark 341 on the deflection stage 320 moves synchronously with the deflection stage 320, while angle scale 342 on the support stage 310 is exposed from the opening 322. The scale value pointed to by the pointer directly reflects the current rotation angle of the deflection stage 320, that is, the amount of crystal orientation angle adjustment of the wafer 120.

[0058] In some embodiments of this application, reference is made to Figure 7 The end of the support platform 310 is provided with an elongated opening 312, which extends along the length of the frame body 200. The frame body 200 is provided with mounting holes, and a connector 313, such as a bolt, passes through the elongated opening 312 and the mounting holes.

[0059] When it is necessary to adapt to wafer trays 110 or wafer cells 100 of different lengths, the operator can loosen the connector 313 and push the carrier stage 310 along the extension direction of the elongated opening 312 until the carrier stage 310 reaches the position that matches the current wafer cell 100. Then tighten the connector 313 to fix the carrier stage 310, so that the wafer frame can be compatible with wafer trays 110 of various lengths and improve the versatility of the frame.

[0060] In some embodiments of this application, reference is made to Figure 3 The frame body 200 includes an upper frame 210 and a lower frame 220, the upper frame 210 and the lower frame 220 are detachably connected, and the crystal orientation angle adjustment module 300 is disposed on the upper frame 210.

[0061] The upper frame 210 needs to integrate the crystal orientation angle adjustment module 300, while the lower frame 220 mainly serves as the basic support for the space. The two can be separated and processed separately. During the assembly stage, the pre-assembly and debugging of the upper frame 210 and the crystal orientation angle adjustment module 300 can be completed first, and then the upper frame 210 and the lower frame 220 can be docked and fixed.

[0062] In some embodiments of this application, reference is made to Figure 3 The wafer frame further includes an anti-tipping part 400, which is disposed on the lower frame 220. The anti-tipping part 400 includes a mounting frame 410 and a limiting roller 420. The mounting frame 410 is fixedly connected to the frame body 200, and the limiting roller 420 is connected to the mounting frame 410. The limiting roller 420 is located at the end of the wafer unit 100.

[0063] The wafer cell 100 is placed vertically in the housing space of the material frame. If it is supported only by the crystal orientation adjustment modules 300 at both ends, it is prone to tilting to the side due to the shift of the center of gravity when the material frame is tilted, vibrated, or subjected to external impact. By setting up an anti-tilting part, when the wafer cell 100 shows a tendency to tilt, the limiting roller 420 will contact the surface of the wafer cell 100 and apply a reverse supporting force to prevent it from tilting further.

[0064] In the description of the above embodiments, specific features, structures, materials, or characteristics may be combined in any suitable manner in one or more embodiments or examples.

[0065] The above are merely specific embodiments of this utility model, but the protection scope of this utility model is not limited thereto. Any variations or substitutions that can be easily conceived by those skilled in the art within the technical scope disclosed in this utility model should be included within the protection scope of this utility model. Therefore, the protection scope of this utility model should be determined by the scope of the claims.

Claims

1. A wafer boat, a wafer unit comprising a wafer holder and a plurality of wafer pieces adhered to said wafer holder, characterized in that, The wafer frame includes: The frame body has a receiving space formed within it for accommodating the wafer. A crystal orientation angle adjustment module, disposed on the frame body, includes: A support platform, which is connected to the frame body; A deflection stage is slidably disposed on the support platform, and the end of the crystal holder is placed on the deflection stage; An adjustment unit is configured to drive the deflection table to rotate in the horizontal direction.

2. The wafer frame according to claim 1, characterized in that, The adjusting part includes a gear and a rack, the gear meshing with the rack, the gear being disposed on the deflection platform, and the rack being disposed on the bearing platform, the rack extending along the width direction of the frame body.

3. The wafer frame according to claim 2, characterized in that, A handle is provided on the deflection platform, and the handle is configured to drive the gear to rotate.

4. The wafer frame according to claim 1, characterized in that, The support platform is provided with an arc-shaped guide hole, and the deflection platform is provided with an extension, which extends into the arc-shaped guide hole and moves along the arc-shaped guide hole.

5. The wafer frame according to claim 1, characterized in that, The deflection stage is provided with a placement groove, and the end of the crystal holder is provided with an extension, which is placed in the placement groove.

6. The wafer frame according to claim 1, characterized in that, An opening is provided on the deflection stage, and a pointer mark is provided on the side wall of the opening; An angular scale is provided on the support platform, and the angular scale protrudes from the opening.

7. The wafer frame according to claim 1, characterized in that, The end of the support platform is provided with an elongated opening, and the frame body is provided with a mounting hole. A connector passes through the elongated opening and the mounting hole.

8. The wafer frame according to any one of claims 1 to 7, characterized in that, The frame body includes an upper frame and a lower frame, the upper frame and the lower frame are detachably connected, and the crystal orientation adjustment module is disposed on the upper frame.

9. The wafer frame according to any one of claims 1 to 7, characterized in that, The wafer frame also includes an anti-tipping part, which includes a mounting frame and a limiting roller. The mounting frame is fixedly connected to the frame body, and the limiting roller is connected to the mounting frame. The limiting roller is located at the end of the wafer unit.

10. The wafer frame according to any one of claims 1 to 7, characterized in that, The crystal orientation adjustment module is provided at each of the opposite ends of the frame body along its length.

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