Wafer transfer system and its control device
By connecting the sensor and controller directly via signal lines, the operational amplifier is eliminated, solving the problem of high failure rate in wafer transfer systems and achieving higher transfer success rate and stability.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- BAODING DRY CORE INTEGRATED CIRCUIT (HANGZHOU) CO LTD
- Filing Date
- 2025-06-20
- Publication Date
- 2026-07-31
AI Technical Summary
Existing wafer transfer systems have a high failure rate, which affects processing progress.
By connecting the sensor and controller via a signal line, the operational amplifier is eliminated, and the sensed signal is directly transmitted to the controller, ensuring signal stability.
It improves the success rate of wafer transfer, reduces connection complexity, and avoids transfer failures caused by operational amplifier connection instability.
Smart Images
Figure CN224583682U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of semiconductor technology, specifically to a wafer transfer system and its control device. Background Technology
[0002] Thin film deposition is a process used to deposit materials layer by layer onto a substrate in the form of thin films, and it is widely used in the semiconductor field.
[0003] In practical applications, before performing the thin film deposition process, the wafer needs to be placed in a cassette within the transfer chamber. A robotic arm then transfers the wafer from the cassette to the deposition chamber where the thin film deposition process is performed. After processing is complete, the robotic arm returns the cassette from the deposition chamber back to the cassette in the transfer chamber.
[0004] However, the current wafer transfer failure rate is high, affecting the wafer processing schedule. Utility Model Content
[0005] The problem this invention aims to solve is: how to improve the success rate of wafer transfer in order to improve wafer processing progress.
[0006] To address the aforementioned problems, this utility model provides a control device for a wafer transfer system, the control device comprising:
[0007] The sensor, located in the conveying chamber, is used to sense whether a flower basket exists at the set position and whether the wafer gripping device has reached the initial gripping position corresponding to the flower basket.
[0008] A first signal line is located inside the transmission chamber and has a first connection end and a second connection end; the first connection end of the first signal line is connected to the sensor.
[0009] The second signal line is located outside the transmission chamber and has a third connection end and a fourth connection end; the third connection end of the second signal line is connected to the second connection end of the first signal line.
[0010] The controller is located outside the transmission chamber and is connected to the fourth connection terminal of the second signal line.
[0011] In one possible embodiment, the second connection end of the first signal line has a first signal output pin and a second signal output pin; the third connection end of the second signal line has a first signal input pin and a second signal input pin; the first signal output pin of the second connection end of the first signal line is connected to the first signal input pin of the third connection end of the second signal line; and the second signal output pin of the second connection end of the first signal line is connected to the second signal input pin of the third connection end of the second signal line.
[0012] In one possible embodiment, the fourth connection terminal of the second signal line includes: a first signal output pin; the first signal output pin of the fourth connection terminal of the second signal line is connected to the first signal input pin of the third connection terminal of the second signal line in a one-to-one correspondence.
[0013] In one possible embodiment, the fourth connection terminal of the second signal line includes a second signal output pin; the second signal output pin of the fourth connection terminal of the second signal line is connected to the same second signal input pin of the third connection terminal of the second signal line.
[0014] In one possible embodiment, the first signal output pin is used to output a first sensing signal to detect whether a basket for holding wafers exists at a set position; the second signal output pin is used to output a second sensing signal to detect whether the wafer gripping device has reached the corresponding initial gripping position.
[0015] In one possible embodiment, the number of sensors is three, and the three sensors share the first signal line and the second signal line.
[0016] In one possible embodiment, the transmission chamber includes: a housing, on which a first socket is provided for connection to the second connection end; and a third connection end of the second signal line is directly connected to the first connection end of the first signal line through the first socket.
[0017] In one possible embodiment, the control device further includes: a first circuit board, on which at least one connection module is disposed, the connection module corresponding one-to-one with the sensor; each connection module has an input pin and an output pin, the input pin of the connection module being directly connected to the sensor; the output pin of the connection module being directly connected to the first connection end of the first signal line.
[0018] This utility model embodiment also provides a wafer transfer system, which includes the control device for the wafer transfer system described above, and a wafer gripping device.
[0019] In one possible embodiment, the wafer gripping device is a robotic arm.
[0020] Compared with the prior art, the technical solution of this utility model embodiment has the following advantages:
[0021] By applying the solution of this utility model, the sensor is connected to the controller through the first signal line and the second signal line, thereby eliminating the need for an operational amplifier and avoiding the impact of poor operational amplifier connection stability on signal processing stability, thus improving the success rate of wafer transfer. Attached Figure Description
[0022] Figure 1 This is a schematic diagram of the structure of a control device for a wafer transfer system;
[0023] Figure 2 This is a control device for a wafer transfer system in one embodiment of the present invention;
[0024] Figure 3 This is a schematic diagram of the pin connections of a wafer transfer system control device according to an embodiment of this utility model. Detailed Implementation
[0025] In practical applications, before performing the thin film deposition process, the wafer needs to be placed in a cassette within the transfer chamber. A robotic arm then transfers the wafer from the cassette to the deposition chamber where the thin film deposition process is performed. After processing is complete, the robotic arm returns the cassette from the deposition chamber back to the cassette in the transfer chamber.
[0026] Figure 1 This is a schematic diagram of the structure of a control device for a wafer transfer system. (Refer to...) Figure 1 Specifically, a sensor 11 is typically installed in the transfer chamber. This sensor 11 can be used to sense whether a wafer-holding basket exists at a set position. When a wafer-holding basket exists at the set position, the sensor 11 sends a first sensing signal to the controller 13 of the robotic arm. Upon receiving the first sensing signal, the controller 13 controls the robotic arm to move to the initial position, thereby successfully grasping the wafer from the basket. The sensor 11 can also sense whether the robotic arm has reached the corresponding initial position. Once the robotic arm reaches the corresponding initial position, the sensor sends a second sensing signal to the controller 13 of the robotic arm. Upon receiving the second sensing signal, the controller 13 controls the robotic arm to perform the grasping action and to transfer the grasped wafer to the deposition chamber.
[0027] In practical applications, the sensor output signal is typically amplified by operational amplifier 12 before being transmitted to controller 13. Operational amplifier 12 is connected to the circuit board via a plug-in connection and then to controller 13 via a signal line connected to the circuit board. This plug-in connection of operational amplifier 12 results in poor connection stability, leading to poor signal processing stability and consequently, controller 13's inability to properly receive the sensor signal, thus causing transmission failure.
[0028] To address this issue, this invention provides a control device for a wafer transfer system. Within the control device, the sensor is connected to the controller via a first signal line and a second signal line, without placing an operational amplifier between the controller and the sensor. This avoids wafer transfer failures caused by poor operational amplifier connection stability, thereby improving the success rate of wafer transfer.
[0029] To make the above-mentioned objectives, features and advantages of this utility model more apparent and understandable, the specific embodiments of this utility model will be described in detail below with reference to the accompanying drawings.
[0030] Reference Figure 2 This utility model embodiment provides a control device 20 for a wafer transfer system. The control device 20 may include: a sensor 21, a first signal line L1, a second signal line L2, and a controller 22. Wherein:
[0031] The sensor 21 is located in the conveying chamber and is used to sense whether there is a flower basket at the set position and whether the wafer gripping device has reached the initial gripping position corresponding to the flower basket.
[0032] The first signal line L1 is located in the transmission chamber and has a first connection end and a second connection end; the first connection end of the first signal line is connected to the sensor 21.
[0033] The second signal line L2 is located outside the transmission chamber and has a third connection end and a fourth connection end; the third connection end of the second signal line L2 is connected to the second connection end of the first signal line L1.
[0034] The controller 22 is located outside the transmission chamber and is connected to the fourth connection terminal of the second signal line L2.
[0035] By eliminating the operational amplifier, wafer transfer failures caused by the operational amplifier can be reduced, thereby improving wafer transfer efficiency.
[0036] In a specific implementation, sensor 21 can be a photoelectric sensor, which can receive light signals within the transmission chamber and convert the received light signals into electrical signals. Specifically, sensor 21 can be placed around the designated location of the flower basket within the transmission chamber, for example, above or below the designated location of the flower basket. When a flower basket is present at the designated location, the photoelectric sensor will sense that the light at the designated location is blocked, thereby causing a change in the intensity of the received light signal, and thus outputting a first sensing signal indicating whether a flower basket exists at the designated location.
[0037] In some embodiments, the sensor 21 may be selected as a photoelectric sensor capable of amplifying photocurrent, such as a phototransistor, thereby improving the sensitivity of photoelectric sensing and thus improving the efficiency of wafer transfer.
[0038] In practice, once the basket is placed in the designated position, the wafer gripping device moves to the initial gripping position, thereby gripping the wafer from the basket. When the wafer gripping device moves to the initial gripping position, it further blocks the light illuminating the photoelectric sensor, which in turn affects the intensity of the light signal received by the photoelectric sensor. The photoelectric sensor can then output a second sensing signal indicating whether the wafer gripping device has reached the initial gripping position corresponding to the basket.
[0039] In practice, multiple locations for placing flower baskets can be set in the same conveying chamber. Accordingly, the control device 20 can include multiple sensors, with each sensor corresponding to a flower basket placement location.
[0040] Figure 3 This is a schematic diagram of the pin connections of a wafer transfer system control device according to an embodiment of this utility model. (Refer to...) Figure 3 For example, three locations for placing flower baskets can be set in the same transfer chamber. Accordingly, the control device 20 can include three sensors: a first sensor 211, a second sensor 212, and a third sensor 213. Each sensor is used to sense whether a flower basket exists at the corresponding location and to sense whether the wafer gripping device has reached the initial gripping position corresponding to the flower basket.
[0041] In a specific implementation, the sensor's output terminal can be connected to the first connection terminal of the first signal line L1 via a circuit board. In this case, the control device may further include a first circuit board. The sensor's output terminal can be connected to the first connection terminal of the first signal line via the first circuit board. The first circuit board is provided with at least one connection module, each corresponding to a sensor; each connection module has an input pin and an output pin, the input pin of which is directly connected to the sensor; the output pin of which is directly connected to the first connection terminal of the first signal line.
[0042] Specifically, refer to Figure 3The first circuit board PM can be equipped with three connection modules: a first connection module P1, a second connection module P2, and a third connection module P3. The output terminals of the first sensor 211, the second sensor 212, and the third sensor 213 each include eight pins. Each connection module in the first connection module P1, the second connection module P2, and the third connection module P3 also includes eight input pins and eight output pins. The first sensor 211 is connected to the first signal line L1 through the first connection module P1. The second sensor 212 is connected to the first signal line L1 through the second connection module P2. The third sensor 213 is connected to the first signal line L1 through the third connection module P3.
[0043] Furthermore, taking the first sensor 211 as an example, its fourth and eighth pins are ground pins, its second and sixth pins are voltage pins, its first pin is a second sensing signal output pin, its third and seventh pins are signal common pins, and its fifth pin is a first sensing signal output pin. The first sensing signal is a result signal indicating whether a wafer-holding basket exists at a set position; the second sensing signal is a result signal indicating whether the wafer gripping device has reached the corresponding initial gripping position.
[0044] The pins of each sensor are connected to the input pins of the corresponding connection modules on the first circuit board PM, and then connected to the first connection terminal L1a of the first signal line L1 via the output pins of the corresponding connection modules on the first circuit board PM.
[0045] In practical implementation, both the first connection terminal L1a and the second connection terminal L2a of the first signal line L1 can be plugs with multiple pins. The number of pins on the first connection terminal L1a and the second connection terminal L1b is the same, and pins with the same function are connected accordingly.
[0046] Specifically, the first connection terminal L1a of the first signal line L1 has a voltage pin (pin A), a first signal input pin (pins C, J, and R), a second signal input pin (pins B, H, and P), a signal common pin (pins E, D, L, K, T, and S), and a ground pin (pins V, W, and F). The second connection terminal L1b of the first signal line has a voltage pin (pin 1), a first signal output pin (pins 2, 5, and 8), a second signal output pin (pins 14, 17, and 20), a signal common pin (pins 3, 15, 6, 18, 23, and 21), and a ground pin (pins 22, 19, and 18).
[0047] Reference Figure 3The second connection terminal L1b of the first signal line L1 includes: a voltage pin (pin 1), a first signal output pin (pins 2, 5, 8), a second signal output pin (pins 14, 17, 20), a signal common pin (pins 3, 15, 6, 18, 23, 21), and a ground pin (pins 22, 19, 18).
[0048] The first sensing signals output by the first sensor 211, the second sensor 212, and the third sensor 213 are input from the first signal input pin of the first connection terminal L1a and output from the first signal output pin of the second connection terminal L1b. The second sensing signals output by the first sensor 211, the second sensor 212, and the third sensor 213 are input from the second signal input pin of the first connection terminal L1a and output from the second signal output pin of the second connection terminal L1b.
[0049] In a specific implementation, the second signal line L2 is located outside the transmission chamber and has a third connection terminal La2 and a fourth connection terminal L2b. Both the third connection terminal La2 and the fourth connection terminal L2b can be plugs with multiple pins.
[0050] The third connection terminal L2a of the second signal line L2 is connected to the second connection terminal L1b of the first signal line L1. In one embodiment, to reduce connection complexity, both the second connection terminal L1b and the third connection terminal L2a can be configured as plugs with multiple pins, and the number and function of the pins in the plugs are the same. Therefore, Figure 3 In order to simplify the illustration, the second connection terminal L1b and the third connection terminal L2a are shown with the same plug.
[0051] Specifically, refer to Figure 3 The third connection terminal L2a of the second signal line L2 has a voltage pin (pin 1), a first signal input pin (pins 2, 5, 8), a second signal input pin (pins 14, 17, 20), a signal common pin (pins 3, 15, 6, 18, 23, 21), and a ground pin (pins 22, 19, 18).
[0052] The voltage pin of the first signal line L1 is connected to the voltage pin of the second signal line L2; the first signal output pin of the first signal line L1 is connected to the first signal input pin of the second signal line L2; the second signal output pin of the first signal line L1 is connected to the second signal input pin of the second signal line L2; the signal common pin of the first signal line L1 is connected to the signal common pin of the second signal line L2; and the ground pin of the first signal line L1 is connected to the ground pin of the second signal line L2.
[0053] Reference Figure 3The fourth connection terminal L2b of the second signal line L2 may include: a voltage pin (pin 3), a first signal output pin (pins 2, 5, 8), a second signal output pin (12), and a signal common pin (pins 14, 16, 17, 19, 20, 22). Any one of the signal common pins (pins 14, 16, 17, 19, 20, 22) can be used as a ground pin; for example, pin 14 can be used as a ground pin.
[0054] In one embodiment of this utility model, the first signal output pin of the fourth connection terminal L2b of the second signal line L2 is connected one-to-one with the first signal input pin of the third connection terminal L2a of the second signal line L2. For example, pin 2 of the fourth connection terminal L2b of the second signal line L2 is connected to the first signal input pin 2 of the third connection terminal L2a of the second signal line L2, pin 5 of the fourth connection terminal L2b of the second signal line L2 is connected to the first signal input pin 5 of the third connection terminal L2a of the second signal line L2, and pin 8 of the fourth connection terminal L2b of the second signal line L2 is connected to the first signal input pin 8 of the third connection terminal L2a of the second signal line L2.
[0055] Using the above connection method, the first sensing signal of each sensor can be input to the controller through different pins. Thus, the controller can determine which set position has been placed based on the received sensing signal.
[0056] In one embodiment of this utility model, the second signal output pin of the fourth connection terminal L2b of the second signal line L2 is connected to the same second signal input pin of the third connection terminal L2a of the second signal line L2. For example, pin 12 of the fourth connection terminal L2b of the second signal line L2 is connected to the first signal input pins 14, 17 and 20 of the third connection terminal L2a of the second signal line L2.
[0057] Using the above connection method, the second sensing signals of all sensors can be input to the controller through the same pin. Since only one sensor outputs the second sensing signal at any given time, the controller can determine whether the wafer gripping device has moved to the initial gripping position around the corresponding basket based on the second sensing signal.
[0058] In a practical implementation, the controller can provide power to the third connection terminal L2a of the second signal line L2 and the first connection terminal L1a of the first signal line L1 through the voltage pin 3 of the fourth connection terminal L2b of the second signal line L2. This power supply voltage can be 5V.
[0059] The control device of the wafer transfer system in this embodiment connects the sensor and controller via signal lines. No operational amplifier is installed between the sensor and controller, thus avoiding wafer transfer failures caused by operational amplifiers and improving the success rate of wafer transfer. Furthermore, connecting the sensor and controller via signal lines reduces connection complexity, makes it easier to implement, and does not affect the vacuum level of the transfer chamber.
[0060] This invention also provides a wafer transfer system, which may include the control device described above. In addition to the control device, the wafer transfer system may also include a wafer gripping device. The control device can control the wafer gripping device to grip the wafer.
[0061] In one embodiment, the wafer gripping device can be a robotic arm. After a basket is placed in the transfer chamber, the wafer is placed inside the basket. At this time, the control device can control the robotic arm to move to the initial gripping position and slowly grip the wafer.
[0062] While the present invention has been disclosed above, it is not limited thereto. Any person skilled in the art can make various modifications and alterations without departing from the spirit and scope of the present invention; therefore, the scope of protection of the present invention should be determined by the scope defined in the claims.
Claims
1. A control device of a wafer transfer system, characterized by comprising: include: The sensor, located in the conveying chamber, is used to sense whether a flower basket exists at the set position and whether the wafer gripping device has reached the initial gripping position corresponding to the flower basket. A first signal line is located inside the transmission chamber and has a first connection end and a second connection end; the first connection end of the first signal line is connected to the sensor. The second signal line is located outside the transmission chamber and has a third connection end and a fourth connection end; the third connection end of the second signal line is connected to the second connection end of the first signal line. The controller is located outside the transmission chamber and is connected to the fourth connection terminal of the second signal line.
2. The control device of a wafer transfer system according to claim 1, wherein The second connection terminal of the first signal line has a first signal output pin and a second signal output pin; the third connection terminal of the second signal line has a first signal input pin and a second signal input pin; the first signal output pin of the second connection terminal of the first signal line is connected to the first signal input pin of the third connection terminal of the second signal line; the second signal output pin of the second connection terminal of the first signal line is connected to the second signal input pin of the third connection terminal of the second signal line.
3. The control device of a wafer transfer system according to Claim 2, wherein The fourth connection terminal of the second signal line includes: a first signal output pin; the first signal output pin of the fourth connection terminal of the second signal line is connected to the first signal input pin of the third connection terminal of the second signal line in a one-to-one correspondence.
4. The control device of a wafer transfer system according to Claim 2, wherein The fourth connection terminal of the second signal line includes a second signal output pin; the second signal output pin of the fourth connection terminal of the second signal line is connected to the same second signal input pin of the third connection terminal of the second signal line.
5. The control device of a wafer transfer system according to Claim 2, wherein The first signal output pin is used to output a first sensing signal to detect whether there is a basket for holding the wafer at the set position; the second signal output pin is used to output a second sensing signal to detect whether the wafer gripping device has reached the corresponding initial gripping position.
6. The control device of a wafer transfer system according to Claim 2, wherein The number of sensors is three, and the three sensors share the first signal line and the second signal line.
7. The control device of a wafer transfer system according to Claim 5, wherein The transmission chamber includes: a housing, on which a first socket is provided for connection to the second connection end; the third connection end of the second signal line is directly connected to the first connection end of the first signal line through the first socket.
8. The control device of a wafer transfer system according to Claim 1, wherein Also includes: A first circuit board is provided with at least one connection module, each connection module corresponding to one of the sensors; each connection module has an input pin and an output pin, the input pin of the connection module is directly connected to the sensor; the output pin of the connection module is directly connected to the first connection end of the first signal line.
9. A wafer transfer system, characterized by, The system includes a control device for the wafer transfer system as described in any one of claims 1 to 8, and a wafer gripping device.
10. The wafer transfer system of claim 9, wherein, The wafer gripping device is a robotic arm.