A moving device and wafer film pasting equipment for wafer film pasting
The moving device, composed of a displacement module, a flipping module, and a clamping module, solves the problem of wafers falling during movement, achieves stable wafer displacement and flipping, and ensures the safety and reliability of wafer processing.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- HWATSING TECHNOLOGY CO LTD
- Filing Date
- 2025-07-21
- Publication Date
- 2026-07-31
AI Technical Summary
Existing wafer moving devices are prone to wafer drop and damage when the air pressure is unstable or there is a sudden gas interruption, posing a safety hazard.
The mobile device, composed of a displacement module, a flipping module, and a clamping module, achieves stable displacement and flipping of the wafer through the coordinated action of the clamping mechanism and the gripping mechanism. After flipping, the clamping mechanism can maintain stable clamping of the wafer to prevent it from falling.
This ensures the safety of wafers during movement and flipping, avoids wafer damage due to gripping failure, and improves the safety and reliability of production.
Smart Images
Figure CN224583687U_ABST
Abstract
Description
Technical Field
[0001] This application relates to the field of semiconductor processing technology, and in particular to a mobile device and wafer lamination equipment for wafer lamination. Background Technology
[0002] Wafer coating is a crucial step in chip manufacturing, used to apply a coating to the polished surface of the wafer. The coating process typically includes wafer transfer, coating, flipping, marking, coating removal, and unloading mechanisms. The flipping mechanism removes the coated wafer ring from the coating stage and places it on the labeling stage. This process requires flipping the wafer so that the polished surface is facing down on the labeling stage.
[0003] However, most wafer moving devices currently use a suction method to pick up wafers. If there is unstable air pressure or a sudden interruption of air supply during the wafer movement, the wafer may fall and be damaged. Utility Model Content
[0004] In view of this, this application provides a mobile device and a wafer lamination equipment for wafer lamination, so as to at least partially solve the above-mentioned technical problems.
[0005] This application provides a moving device for wafer lamination, comprising: a displacement module, a flipping module, and a clamping module, wherein the displacement module is connected to the flipping module; the clamping module includes: at least two clamping sub-modules; each clamping sub-module includes: a fixing plate, a driving mechanism, a gripping mechanism, and a clamping mechanism, one end of the fixing plate is connected to the flipping module, and the other end of the fixing plate is connected to the driving mechanism and the gripping mechanism, the driving mechanism being connected to the clamping mechanism; the driving mechanism is used to drive the clamping mechanism before gripping the wafer processing part. The mechanism opens and stops driving the clamping mechanism after the wafer workpiece enters the gripping area of the clamping mechanism, so that the clamping mechanism clamps the wafer workpiece. After the gripping mechanism stops gripping the wafer workpiece, it drives the clamping mechanism to open, and stops driving the clamping mechanism after the wafer workpiece leaves the gripping area of the clamping mechanism. The gripping mechanism is used to grip the wafer workpiece during the process of the displacement module driving the flipping module to move, and the flipping module driving the clamping module to move, so as to move the wafer workpiece.
[0006] Optionally, the displacement module is used to drive the flipping module to move, thereby causing the clamping module to reciprocate between a first position and a second position. The first position is located directly above the starting position of the wafer fabrication part, and the distance between the first position and the starting position is within a first distance threshold range. The second position is located directly above the target position of the wafer fabrication part, and the distance between the second position and the target position is within a second distance threshold range. The flipping module is used to drive the clamping module to flip 180° after the clamping module clamps the wafer fabrication part, and to flip the clamping module back to its original angle after the wafer fabrication part is placed at the target position of the wafer fabrication part.
[0007] Optionally, the driving mechanism is configured to: when the clamping module is in the first position, drive the clamping mechanism to open, so that the clamping area formed by the multiple clamping mechanisms is larger than the size of the wafer fabrication part; when the gripping mechanism grips the wafer fabrication part, stop driving the clamping mechanism, so that the clamping area formed by the multiple clamping mechanisms is equal to the size of the wafer fabrication part; when the clamping module is in the second position, drive the clamping mechanism to open, so that the clamping area formed by the multiple clamping mechanisms is larger than the size of the wafer fabrication part; the gripping mechanism... The module is configured to grip the wafer fabrication part when the gripping module is in the first position and the gripping area formed by the plurality of gripping mechanisms is larger than the size of the wafer fabrication part, so that the wafer fabrication part is located between the gripping mechanism and the clamping mechanism; and to stop gripping the wafer fabrication part when the gripping module is in the second position and the gripping area formed by the plurality of gripping mechanisms is larger than the size of the wafer fabrication part. The flipping module is also configured to rotate when the gripping mechanism stops gripping the wafer fabrication part, so that the wafer fabrication part is placed at the target position of the wafer fabrication part.
[0008] Optionally, the clamping mechanism includes: a swing plate, a reset member, and a clamping member. One end of the swing plate is connected to the driving mechanism, and the other end of the swing plate is connected to the clamping member. One end of the reset member is connected to the fixed plate, and the other end of the reset member is connected to the swing plate. The driving mechanism is used to drive the swing plate when the clamping module is in the first position, so that the swing plate drives the clamping member to open, making the clamping area formed by the multiple clamping mechanisms larger than the size of the wafer processing part. The reset member is used to reset the swing plate when the driving mechanism stops driving the swing plate, so that the swing plate drives the clamping member to reset, making the clamping area formed by the multiple clamping mechanisms equal to the size of the wafer processing part.
[0009] Optionally, the driving mechanism includes a cylinder and a push rod, one end of the cylinder being connected to the fixed plate, the other end of the cylinder being connected to one end of the push rod, and the other end of the push rod being connected to the swing plate.
[0010] Optionally, the clamping member includes: a positioning strip and at least one limiting block, the limiting block being disposed on the bearing surface of the positioning strip, wherein the bearing surface of the positioning strip is opposite to the gripping mechanism; the limiting block is used to limit the clamped wafer processing part in the length direction of the positioning strip.
[0011] Optionally, the projection of the contact surface between the limiting block and the wafer processing part onto the bearing surface of the positioning strip has an angle between the projection onto the length direction of the positioning strip and the positioning strip, which is in the range of 10°-30°.
[0012] Optionally, the clamping member includes a limiting block, which is disposed on the bearing surface of the positioning strip and located on the side to which the clamping module is pointing in the flipping direction.
[0013] Optionally, the gripping mechanism has air holes on the surface opposite to the clamping mechanism; the gripping mechanism is used to extract air from the area in the air holes when the clamping module is located in the first position and the clamping area formed by the multiple clamping mechanisms is larger than the size of the wafer processing part, so as to form a negative pressure to grip the wafer processing part.
[0014] Optionally, the displacement module includes: a first displacement mechanism and a second displacement mechanism; the first displacement mechanism is used to drive the second displacement mechanism to reciprocate between directly above the starting position of the wafer processing part and directly above the target position of the wafer processing part; the second displacement mechanism is used to drive the clamping module to move along the axial direction of the wafer processing part.
[0015] Optionally, the reset element is a spring that provides torque to the swing plate, causing the clamping element to abut against the wafer surface.
[0016] A second aspect of this application provides a wafer lamination apparatus, comprising: a lamination table, a labeling table, and a moving device for wafer lamination as described in the first aspect of the embodiment; the moving device is used to transport the wafer processed part after lamination by the lamination table to the labeling table, so that the labeling table labels the wafer processed part after lamination.
[0017] In this application, the moving device can realize the displacement of the wafer processing part, and the clamping mechanism can stably clamp the wafer processing part after being rotated by the flipping module. During this process, even if the gripping mechanism fails, the wafer processing part can still be kept from falling, thereby ensuring the safety of the wafer processing part during the movement. Attached Figure Description
[0018] To more clearly illustrate the technical solutions in the embodiments of this application or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments recorded in the embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings.
[0019] Figure 1 This is a schematic diagram of a moving device for wafer lamination according to an embodiment of this application;
[0020] Figure 2 This is a schematic diagram of a clamping submodule according to an embodiment of this application;
[0021] Figure 3 This is a schematic diagram of a clamping mechanism according to an embodiment of this application;
[0022] Figure 4 This is a schematic diagram of the clamping submodule in the open state according to an embodiment of this application;
[0023] Figure 5 This is a schematic diagram of a clamping member according to an embodiment of this application;
[0024] Figure 6 This is a schematic diagram of a clamping member according to another embodiment of this application;
[0025] Figure 7 This is a schematic diagram of a wafer lamination device provided in one embodiment of this application. Detailed Implementation
[0026] To enable those skilled in the art to better understand the technical solutions in the embodiments of this application, the technical solutions in the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art should fall within the protection scope of the embodiments of this application.
[0027] The terminology used in this application is for the purpose of describing particular embodiments only and is not intended to be limiting of the application. The singular forms “a,” “the,” and “the” used in this application and the appended claims are also intended to include the plural forms unless the context clearly indicates otherwise. It should also be understood that the term “and / or” as used herein refers to and includes any or all possible combinations of one or more of the associated listed items.
[0028] It should be understood that although the terms first, second, third, etc., may be used in this application to describe various information, such information should not be limited to these terms. These terms are only used to distinguish information of the same type from one another. For example, without departing from the scope of this application, first information may also be referred to as second information, and similarly, second information may also be referred to as first information. Depending on the context, the word "if" as used herein may be interpreted as "when," "when," or "in response to determination."
[0029] The technical solutions in the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of this application, and not all of them. Based on the embodiments in this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application. In the absence of conflict, the following embodiments and their technical features can be combined with each other.
[0030] Figure 1 A schematic diagram of a moving device for wafer lamination according to an embodiment of this application is provided. Figure 2 This is a schematic diagram of a clamping submodule according to an embodiment of this application. Figure 1-2 As shown, the moving device 1 includes a displacement module 10, a flipping module 20, and a clamping module 30, with the displacement module 10 connected to the flipping module 20.
[0031] The clamping module 30 includes at least two clamping sub-modules 31. Each clamping sub-module 31 includes a fixing plate 311, a driving mechanism 312, a gripping mechanism 313, and a clamping mechanism 314. One end of the fixing plate 311 is connected to the flipping module 20, and the other end of the fixing plate 311 is connected to the driving mechanism 312 and the gripping mechanism 313. The driving mechanism 312 is connected to the clamping mechanism 314. The driving mechanism 312 is used to drive the clamping mechanism 314 to open before gripping the wafer workpiece, and to stop driving the clamping mechanism 314 after the wafer workpiece enters the gripping area of the clamping mechanism 314, so that the clamping mechanism 314 clamps the wafer workpiece. After the gripping mechanism 313 stops gripping the wafer workpiece, it drives the clamping mechanism 314 to open, and to stop driving the clamping mechanism 314 after the wafer workpiece leaves the gripping area of the clamping mechanism 314. The gripping mechanism 313 is used to grip the wafer workpiece during the process of the displacement module 10 driving the flipping module 20 to move, and the flipping module 20 driving the clamping mechanism 314 to move, so as to move the wafer workpiece.
[0032] Wafer coating is a crucial step in chip manufacturing, used to apply a coating to the ground surface of the wafer. The coating process typically includes wafer transfer, coating, flipping, marking, coating removal, and unloading mechanisms. During coating, due to the different processing equipment, the displacement module 10 drives the flipping module 20 to move, and the flipping module 20, in turn, drives the clamping mechanism 314 to move the wafer. During this process, the gripping mechanism 313 grips the wafer, and the clamping mechanism 314 further secures it.
[0033] It should be noted that the wafer processing component includes a wafer, a wafer ring, and a thin film. The wafer ring is located on the outside of the wafer and is integrated with the thin film. The parts of the wafer processing component that come into contact with the clamping mechanism 314 and the gripping mechanism 313 are all wafer rings, which can protect the wafer from the external forces of the clamping mechanism 314 and the gripping mechanism 313 and improve production safety.
[0034] Specifically, the displacement module 10 drives the flipping module 20 to move, thereby causing the clamping module 30 to reciprocate between a first position and a second position. The first position is located directly above the starting position of the wafer fabrication component, and the distance between the first position and the starting position is within a first distance threshold range. The second position is located directly above the target position of the wafer fabrication component, and the distance between the target position and the target position is within a second distance threshold range. The flipping module 20, after the clamping module 30 clamps the wafer fabrication component, drives the clamping module 30 to flip 180°, and after the wafer fabrication component is placed at its target position, flips the clamping module back to its original angle.
[0035] After the wafer is coated on the coating stage, it needs to be moved to the labeling stage. Simultaneously, it must be ensured that the wafer on the labeling stage is horizontally rotated 180° relative to its position on the coating stage. Then, the wafer is labeled on the labeling stage for subsequent production. To facilitate production, this solution uses a moving device 1 to move the wafer. The moving device 1 moves to a first position, which is directly above the starting position of the wafer, and the distance between the first and starting positions is within a first distance threshold range. For example, the first distance threshold range is 2cm-5cm. The first position could be 4cm directly above the starting position of the wafer, which is the position of the wafer on the coating stage. Then, the displacement module 10 drives the flipping module 20 to move, thereby moving the clamping module 30 from the first position to the second position. The second position is located directly above the target position of the wafer processing part, and the distance between the second position and the target position is within the second distance threshold range. For example, the second distance threshold range is 1cm-6cm. The second position can be 3cm directly above the target position of the wafer processing part. The target position of the wafer processing part is the position of the wafer processing part on the labeling stage.
[0036] Specifically, the driving mechanism 312 is used to drive the clamping mechanism 314 to open when the clamping module 30 is in the first position, so that the clamping area of the clamping mechanism 314 is larger than the size of the wafer processing part; when the gripping mechanism 314 grips the wafer processing part, the driving of the clamping mechanism 314 is stopped, so that the clamping area of the clamping mechanism 314 is equal to the size of the wafer processing part; when the clamping module 30 is in the second position, the driving mechanism 314 is driven to open, so that the clamping area formed by the multiple clamping mechanisms 314 is larger than the size of the wafer processing part.
[0037] The gripping mechanism 313 is used to grip the wafer fabrication part when the clamping module 30 is in the first position and the clamping area formed by the multiple clamping mechanisms 314 is larger than the size of the wafer fabrication part, so that the wafer fabrication part is located between the gripping mechanism 313 and the clamping mechanism 314. When the clamping module 30 is in the second position and the clamping area formed by the multiple clamping mechanisms 314 is larger than the size of the wafer fabrication part, the gripping mechanism 313 stops gripping the wafer fabrication part.
[0038] The flipping module 20 is also used to rotate when the gripping mechanism 313 stops gripping the wafer component, so that the applied film is positioned below the wafer and wafer ring. That is, the wafer and wafer ring are positioned upwards, which facilitates the placement of the wafer component on the labeling table.
[0039] When the clamping module 30 included in the moving device 1 is in the first position, the driving mechanism 312 drives the clamping mechanism 314 to open, so that the clamping area of the clamping mechanism 314 is larger than the size of the wafer processing part. At this time, the clamping mechanism 314 continues to approach the wafer processing part under the drive of the displacement module 10, and makes the wafer processing part contact the gripping mechanism 313. At this time, the gripping mechanism 313 grips the wafer processing part, and the driving mechanism 312 stops driving the clamping mechanism 314. The clamping mechanism 314 gradually resets until the clamping area of the clamping mechanism 314 is larger than the size of the wafer processing part, thus realizing the clamping of the wafer processing part.
[0040] During the movement of the clamping module 30 from the first position to the second position, the flipping module 20 rotates the clamping module 30 180°. When the clamping module 30 is in the second position, the drive mechanism 312 drives the clamping mechanism 314 to open, stopping the clamping of the wafer fabrication piece. At this time, the wafer fabrication piece is lifted by the gripping mechanism 313 below. The displacement module 10 moves the wafer fabrication piece downward, so that the wafer fabrication piece is placed stably on the suction cup corresponding to the labeling stage. The gripping mechanism 313 stops vacuuming, causing the wafer fabrication piece to disengage from the gripping mechanism 313. Then, the displacement module 10 moves the clamping module 30 away from the second position to allow for labeling of the wafer fabrication piece.
[0041] After the moving device 1 completes the movement of the wafer processing part, the driving mechanism 312 stops driving the clamping mechanism 314, the clamping mechanism 314 gradually resets, and the displacement module 10 drives the flipping module 20 to move again, so as to move the clamping module 30 from the second position to the first position, in preparation for the next movement of the wafer processing part.
[0042] Specifically, the displacement module 10 includes: a first displacement mechanism and a second displacement mechanism.
[0043] The first displacement mechanism drives the second displacement mechanism to reciprocate between the starting position of the wafer and the target position of the wafer processing part. The second displacement mechanism drives the clamping module 13 to move along the axial direction of the wafer processing part.
[0044] The displacement module 10 can be composed of a first displacement mechanism and a second displacement mechanism. The first displacement mechanism and the second displacement mechanism can be linear guides, and are respectively responsible for driving the flipping module 20 to move in different directions, so as to realize the movement of the wafer processing parts at low cost.
[0045] In this embodiment of the application, the moving device 1 can realize the displacement of the wafer processing part, and the clamping mechanism 314 can stably clamp the wafer processing part after being rotated by the flipping module 20. During this process, even if the gripping mechanism 313 fails, the wafer processing part can still be kept from falling, thereby ensuring the safety of the wafer processing part during the movement.
[0046] Figure 3 This is a schematic diagram of a clamping mechanism according to an embodiment of this application, as shown below. Figure 3 As shown, the clamping mechanism 314 includes: a swing plate 3141, a reset member 3142 and a clamping member 3143. One end of the swing plate 3141 is connected to the drive mechanism 312, and the other end of the swing plate 3141 is connected to the clamping member 3143. One end of the reset member 3142 is connected to the fixed plate 311, and the other end of the reset member 3142 is connected to the swing plate 3141.
[0047] The driving mechanism 312 is used to drive the swing plate 3141 when the clamping module 30 is in the first position, so that the swing plate 3141 drives the clamping member 3143 to open, making the clamping area enclosed by the multiple clamping mechanisms 314 larger than the size of the wafer processing part. The reset member 3142 is used to reset the swing plate 3141 when the driving mechanism 312 stops driving it, so that the swing plate 3141 drives the clamping member 3143 to reset, making the clamping area enclosed by the multiple clamping mechanisms 314 equal to the size of the wafer processing part. Simultaneously, when the driving mechanism 312 drives the swing plate 3141, the reset member 3142 provides a certain torque to the swing plate 3141 to prevent the clamping member 3143 from reliably clamping the wafer when the driving mechanism 312 is unstable.
[0048] When the clamping mechanism 314 needs to grip the wafer fabrication piece or needs to stop gripping the wafer fabrication piece, it is driven by the drive mechanism 312. At this time, the swing plate 3141 will be displaced, which will cause the clamping member 3143 connected to it to open. At this time, the clamping area enclosed by multiple clamping mechanisms 314 will become larger and larger than the size of the wafer fabrication piece, and the wafer fabrication piece can enter and exit the clamping area. When the clamping mechanism 314 needs to clamp the wafer fabrication piece, the drive mechanism 312 will stop driving the swing plate 3141. The swing plate 3141 will gradually reset under the action of the reset member 3142, which will then drive the clamping member 3143 to reset. At this time, the clamping area enclosed by multiple clamping mechanisms 314 will become smaller and smaller until it is equal to the size of the wafer fabrication piece, so as to clamp the wafer. The reset member 3142 can be a spring, which provides driving force for the reset of the swing plate 3141 according to the characteristics of the spring. In addition, the spring is low in cost and easy to replace.
[0049] Specifically, the drive mechanism 312 includes a cylinder 3121 and a push rod 3122. One end of the cylinder 3121 is connected to the fixed plate 311, and the other end of the cylinder 3121 is connected to one end of the push rod 3122. The other end of the push rod 3122 is connected to the swing plate 3141.
[0050] The drive mechanism 312 may include a cylinder 3121 and a push rod 3122. By reciprocating the push rod 3122 in the direction guided by the cylinder 3121, the push rod 3122 can drive the swing plate 3141, thereby controlling the state of the clamping member 3143 to achieve clamping and releasing of the wafer processing part. A schematic diagram of the opening of one side clamping submodule 31 can be shown as follows. Figure 4 As shown, the cylinder 3121 guides the push rod 3122 to move downward, causing the push rod 3122 to drive the swing plate 3141 to flip, which in turn drives the clamping member 3143 to flip outward, thereby increasing the clamping area between multiple clamping members 3143. Since the driving force of the cylinder 3121 is relatively controllable, the control accuracy can be improved.
[0051] Specifically, air holes are provided on the surfaces of the gripping mechanism 313 and the clamping mechanism 314 that are opposite each other.
[0052] The gripping mechanism 313 is used to extract air from the area in the vent hole to form a negative pressure to grip the wafer when the clamping module 30 is in the first position and the clamping area formed by the multiple clamping mechanisms 314 is larger than the size of the wafer.
[0053] Air holes are provided on the surfaces of the gripping mechanism 313 and the clamping mechanism 314. When it is necessary to grip the wafer processing part, the gripping mechanism 313 is in contact with the surface of the wafer processing part. At this time, the gripping mechanism 313 will extract the gas from the air holes, and a negative pressure will be formed in the air holes. Under the action of atmospheric pressure, the wafer processing part can be gripped more firmly.
[0054] In this embodiment, the reset member 3142 in the clamping mechanism 314 can reset the clamping member 3143 to clamp the wafer processing part as long as the driving mechanism 312 is stopped, making the clamping action of the clamping mechanism 314 more convenient.
[0055] Figure 5 This is a schematic diagram of a clamping member according to an embodiment of this application, as shown below. Figure 5 As shown, the clamping member 3143 includes a positioning strip 31431 and at least one limiting block 31432. The limiting block 31432 is disposed on the bearing surface of the positioning strip 31431, wherein the bearing surface of the positioning strip 31431 is opposite to the gripping mechanism 313. In some embodiments, the bearing surface of the positioning strip 31431 is an arc surface, so that the positioning strip 31431 makes line contact with the wafer surface, thereby minimizing the contact area between the wafer and the clamping member and preventing the adhesion of contaminants.
[0056] The limiting block 31432 is used to limit the clamped wafer processing part in the length direction of the positioning bar 31431.
[0057] The clamping member 3143 may include a positioning strip 31431 and at least one limiting block 31432. Figure 4 The diagram shows two limiting blocks 31432, which are respectively set at both ends of the positioning strip 31431.
[0058] Specifically, the projection of the contact surface between the limiting block 31432 and the wafer processing part onto the bearing surface of the positioning strip 31431 has an angle range of 10°-30° with the length direction of the positioning strip 31431.
[0059] By setting the angle between the contact surface of the limiting block 31432 and the wafer processing part, the contact surface of the limiting block 31432 and the wafer processing part can be made to fit as closely as possible to the tangent of the wafer processing part, thereby improving the clamping effect of the clamping member 3143 on the wafer processing part.
[0060] In this embodiment of the application, by setting at least one limiting block 31432, the wafer processing component can be further prevented from slipping during the process of rotating the wafer processing component.
[0061] Figure 6 This is a schematic diagram of a clamping member according to another embodiment of this application, as shown below. Figure 6 As shown, the clamping member 3143 includes a limiting block 31432, which is disposed on the bearing surface of the positioning strip 31431 and located on the side to which the flipping direction of the clamping module 30 points.
[0062] In this embodiment of the application, by setting a limiting block 31432, and the limiting block 31432 is set on the bearing surface of the positioning strip 31431 and located on the side to which the flipping direction of the clamping module 30 points, it is possible to reduce production costs while preventing the wafer processing parts from slipping.
[0063] Another embodiment of this application provides a wafer lamination device 100, the schematic diagram of which is shown below. Figure 7 As shown, the wafer lamination equipment 100 is installed adjacent to the thinning equipment, and includes a lamination table 2, a labeling table 3, and... Figure 1 The moving device 1 is shown. The moving device 1 is used to transport the wafer processed part after film application on the film application table 2 to the labeling table 3, so that the labeling table 3 can perform labeling processing on the wafer processed part after film application.
[0064] Figure 7 In the embodiment shown, the wafer lamination equipment 100 further includes a feeding mechanism 4, a wafer ring carrying device 5, a wafer ring gripping mechanism 6, and a unloading mechanism 7.
[0065] The frame of the wafer lamination equipment 100 includes a bottom platform and a top platform. The wafer ring gripping mechanism 6, the feeding mechanism 4, the lamination table 2, the moving device 1, the labeling table 3, and the unloading mechanism 7 are located on the top platform. The wafer ring carrying device 5 is located on the bottom platform, and the wafer ring carrying device 5 is positioned corresponding to the wafer ring gripping mechanism 6. The wafer ring gripping mechanism 6 is used to send the wafer ring in the wafer ring carrying device 50 to the lamination table 2, and the lamination table 2 is used to perform lamination processing on the wafer ring and the wafer.
[0066] In some embodiments, the film application table 2 can be a roller film application mechanism; the labeling table 3 typically includes a marking machine, a labeling assembly, and a transfer table. The transfer table includes a Y-axis drive module and two Y-axis working positions: a wafer ring receiving position and a marking position. The wafer ring conveyed by the moving device 1 is moved along the Y-axis to the labeling position below the labeling assembly for labeling, and then the wafer ring is sent back Y-axis to the wafer ring receiving position, awaiting pickup by the unloading robot. The labeling assembly typically includes a Z-axis moving assembly that can lower and fix the label conveyed by the marking machine onto the wafer ring film.
[0067] In this invention, the wafer lamination equipment has the advantages of the moving device 1 in the aforementioned embodiments, so it will not be described again here.
[0068] Although this application has been shown and described with respect to one or more implementations, equivalent variations and modifications will occur to those skilled in the art based on a reading and understanding of this specification and drawings. This application includes all such modifications and variations and is limited only by the scope of the appended claims. In particular, with respect to the various functions performed by the aforementioned components, the terminology used to describe such components is intended to correspond to any component (unless otherwise indicated) that performs the specified function of said component (e.g., is functionally equivalent to it), even if structurally not equivalent to the disclosed structure performing the functions in the exemplary implementations of this specification shown herein.
[0069] That is, the above description is only an embodiment of this application and does not limit the patent scope of this application. Any equivalent structural or procedural changes made using the content of this application’s specification and drawings, such as the combination of technical features between different embodiments, or direct or indirect application in other related technical fields, are similarly included within the patent protection scope of this application.
[0070] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Therefore, features defined as "first" or "second" may explicitly or implicitly include one or more features. In the description of this application, "multiple" means two or more, unless otherwise explicitly specified.
[0071] The above description is provided to enable any person skilled in the art to implement and use this application. Various details are set forth in the above description for purposes of explanation. It should be understood that those skilled in the art will recognize that this application can be implemented without using these specific details. In other embodiments, well-known processes will not be described in detail to avoid obscuring the description of this application with unnecessary detail. Therefore, this application is not intended to be limited to the embodiments shown, but is consistent with the broadest scope of the principles and features disclosed herein.
[0072] It should be noted that, without conflict, the various embodiments and / or technical features described in this application can be arbitrarily combined with each other, and the resulting technical solutions should also fall within the protection scope of this application.
[0073] It should be understood that the specific examples in the embodiments of this application are only for the purpose of helping those skilled in the art to better understand the embodiments of this application, and are not intended to limit the scope of the embodiments of this application. Those skilled in the art can make various improvements and modifications based on the above embodiments, and all such improvements or modifications fall within the protection scope of this application.
[0074] The above description is merely a specific embodiment of this application, but the scope of protection of this application is not limited thereto. Any variations or substitutions that can be easily conceived by those skilled in the art within the scope of the technology disclosed in this application should be included within the scope of protection of this application. Therefore, the scope of protection of this application should be determined by the scope of the claims.
Claims
1. A moving device for wafer film pasting, characterized in that, include: The system includes a displacement module, a flipping module, and a clamping module, wherein the displacement module is connected to the flipping module. The clamping module includes at least two clamping sub-modules; The clamping submodule includes: a fixed plate, a driving mechanism, a gripping mechanism, and a clamping mechanism. One end of the fixed plate is connected to the flipping module, and the other end of the fixed plate is connected to the driving mechanism and the gripping mechanism. The driving mechanism is connected to the clamping mechanism. The driving mechanism is used to drive the clamping mechanism to open before gripping the wafer workpiece, and to stop driving the clamping mechanism after the wafer workpiece enters the gripping area of the clamping mechanism so that the clamping mechanism clamps the wafer workpiece. After the gripping mechanism stops gripping the wafer workpiece, the driving mechanism is driven to open, and to stop driving the clamping mechanism after the wafer workpiece leaves the gripping area of the clamping mechanism. The gripping mechanism is used to grip the wafer processing part during the process of the displacement module driving the flipping module to move, and the flipping module driving the clamping module to move, so as to drive the wafer processing part to move.
2. The mobile device according to claim 1, characterized in that, The displacement module is used to drive the flipping module to move, thereby causing the clamping module to reciprocate between a first position and a second position. The first position is located directly above the starting position of the wafer processing part, and the distance between the first position and the starting position is within a first distance threshold range. The second position is located directly above the target position of the wafer processing part, and the distance between the target position and the target position is within a second distance threshold range. The flipping module is used to rotate the clamping module 180° after the clamping module clamps the wafer processing part, and to flip the clamping module back to its original angle after the wafer processing part is placed in the target position of the wafer processing part.
3. The mobile device according to claim 2, characterized in that, The driving mechanism is configured to, when the clamping module is in the first position, drive the clamping mechanism to open, so that the clamping area formed by the multiple clamping mechanisms is larger than the size of the wafer processing part; when the gripping mechanism grips the wafer processing part, stop driving the clamping mechanism, so that the clamping area formed by the multiple clamping mechanisms is equal to the size of the wafer processing part; and when the clamping module is in the second position, drive the clamping mechanism to open, so that the clamping area formed by the multiple clamping mechanisms is larger than the size of the wafer processing part. The gripping mechanism is used to grip the wafer when the clamping module is in the first position and the clamping area formed by the multiple clamping mechanisms is larger than the size of the wafer, so that the wafer is located between the gripping mechanism and the clamping mechanism; and to stop gripping the wafer when the clamping module is in the second position and the clamping area formed by the multiple clamping mechanisms is larger than the size of the wafer. The flipping module is also used to rotate when the gripping mechanism stops gripping the wafer processing part, so that the wafer processing part is placed at the target position of the wafer processing part.
4. The mobile device of claim 1, wherein, The clamping mechanism includes: a swing plate, a reset member, and a clamping member. One end of the swing plate is connected to the driving mechanism, and the other end of the swing plate is connected to the clamping member. One end of the reset member is connected to the fixed plate, and the other end of the reset member is connected to the swing plate. The driving mechanism is used to drive the swing plate when the clamping module is in the first position, so that the swing plate drives the clamping member to open, and the clamping area surrounded by the multiple clamping mechanisms is larger than the size of the wafer processing part; The reset member is used to reset the swing plate when the driving mechanism stops driving the swing plate, so that the swing plate drives the clamping member to reset, and the clamping area surrounded by the plurality of clamping mechanisms is equal to the size of the wafer processing part.
5. The mobile device of claim 4, wherein, The driving mechanism includes a cylinder and a push rod. One end of the cylinder is connected to the fixed plate, and the other end of the cylinder is connected to one end of the push rod, and the other end of the push rod is connected to the swing plate.
6. The mobile device of claim 4, wherein, The clamping member includes: a positioning strip and at least one limiting block, wherein the limiting block is disposed on the bearing surface of the positioning strip, and the bearing surface of the positioning strip is opposite to the gripping mechanism; The limiting block is used to limit the clamped wafer processing part in the length direction of the positioning strip.
7. The mobile device of claim 6, wherein, The projection of the contact surface between the limiting block and the wafer processing part onto the bearing surface of the positioning strip has an angle between the projection and the length direction of the positioning strip, ranging from 10° to 30°.
8. The mobile device of claim 6, wherein, The clamping component includes a limiting block, which is disposed on the bearing surface of the positioning strip and located on the side to which the clamping module is pointing in the flipping direction.
9. The mobile device of claim 4, wherein, Air holes are provided on the surfaces of the gripping mechanism and the clamping mechanism that are opposite to each other; The gripping mechanism is used to extract air from the area in the vent hole to form a negative pressure to grip the wafer when the clamping module is located at the first position and the clamping area formed by the plurality of clamping mechanisms is larger than the size of the wafer.
10. The mobile device of claim 1, wherein, The displacement module includes: a first displacement mechanism and a second displacement mechanism; The first displacement mechanism is used to drive the second displacement mechanism to reciprocate between the starting position of the wafer processing part and the target position of the wafer processing part. The second displacement mechanism is used to drive the clamping module to move along the axial direction of the wafer processing part.
11. The mobile device according to claim 4, characterized in that, The reset element is a spring, which provides torque to the swing plate, causing the clamping element to abut against the wafer surface.
12. A wafer film attaching apparatus characterized by comprising: Includes a film application table, a labeling table, and a moving device as described in any one of claims 1-11; The moving device for wafer lamination is used to transport the wafer processed part after lamination by the lamination station to the labeling station, so that the labeling station can label the wafer processed part after lamination.