Chip bonding and transfer apparatus

Abstract

This utility model discloses a chip bonding and transfer device, belonging to the field of automation equipment technology. It includes an overall frame, a display, an alarm light, a feeding X-axis, a feeding Z-axis, a feeding Y-axis, a discharging X-axis, a discharging Z-axis, a discharging Y-axis, an angle recognition system, a chip bonding vision system, and a vacuum adsorption rotary table system. The display and alarm light are sequentially installed on the overall frame. In this utility model, the material is placed on the rotary table. Simultaneously, the rotary table opens a vacuum to hold the material. The feeding nozzle closes the vacuum, releases the material, and begins to pick up the next piece of material. The rotary table holds the material and rotates to a suitable angle. Horizontal and vertical lenses take pictures to identify the codes on the material shell and the chip, respectively. Software binds the two codes together. The discharging nozzle moves to directly above the rotary table, picks up the material, and places it sequentially into the corresponding positions of the material box in the second replaceable fixture on the discharging Y-axis.

Description

Technical Field

[0001] This utility model belongs to the field of automation equipment technology, and in particular relates to a chip bonding and transfer device. Background Technology

[0002] Chip loading and unloading is the core step in chip bonding and transfer. It mainly uses automated equipment to accurately transfer chips from carriers (such as wafers and trays) to processing stations and then sort and recycle them after completion. This process includes chip picking, vision positioning, posture adjustment, precision placement, and sorting. It is necessary to ensure high precision, no damage, and stable operation. The loading and unloading system is usually integrated into the bonding equipment or as an independent module to achieve efficient connection with packaging, testing and other processes.

[0003] Existing chip loading and unloading equipment mostly uses single-axis drive, which cannot meet the requirements of high precision, high efficiency and multi-angle recognition. Moreover, changing fixtures is inconvenient, affecting production flexibility and equipment versatility.

[0004] Based on this, the present invention designs a chip bonding and transfer device to solve the above problems. Utility Model Content

[0005] The purpose of this invention is to solve the problems that existing chip loading and unloading equipment mostly adopts single-axis drive, which cannot meet the requirements of high precision, high efficiency and multi-angle recognition, and the replacement of fixtures is inconvenient, affecting production flexibility and equipment versatility. Therefore, a chip bonding and transfer device is proposed.

[0006] To achieve the above objectives, the present invention adopts the following technical solution:

[0007] A chip bonding and transfer device includes an overall frame, a display, an alarm light, a loading X-axis, a loading Z-axis, a loading Y-axis, a unloading X-axis, an unloading Z-axis, an unloading Y-axis, an angle recognition system, a chip bonding vision system, and a vacuum adsorption rotary table system. The display and alarm light are sequentially mounted on the overall frame. The loading X-axis, loading Z-axis, and loading Y-axis are fixedly mounted on the overall frame and interconnected. The unloading X-axis, unloading Z-axis, and unloading Y-axis are also fixedly mounted on the overall frame and form a cooperative working structure with the loading axis system. The angle recognition system, the chip bonding vision system, and the vacuum adsorption rotary table system are respectively mounted on the overall frame.

[0008] As a further description of the above technical solution:

[0009] The feeding Z-axis includes a Z-axis base plate fixedly connected to the overall frame. The first stepper motor is fixedly installed on the Z-axis base plate. The first stepper motor is linked with the large linear guide rail through a gear rack and pinion, driving the suction nozzle installed on the large linear guide rail to move along the Z-axis direction. The suction nozzle is finely guided by a small linear guide rail. A light-blocking plate and a photoelectric switch are respectively installed at the feeding Z-axis position for detecting the position of the suction nozzle.

[0010] As a further description of the above technical solution:

[0011] The loading Y-axis includes a first lead screw module, a first clamp base plate, and a first replaceable clamp. The first replaceable clamp can be detachably installed on the first clamp base plate to achieve quick clamp replacement.

[0012] As a further description of the above technical solution:

[0013] The unloading Y-axis includes a second lead screw module, a second clamping base plate, a second replaceable clamp, and a transfer platform, which is used for temporary storage and transfer of chips.

[0014] As a further description of the above technical solution:

[0015] The angle recognition system includes a first light source module, a lens, and a camera, used to collect chip angle information and achieve automatic recognition and adjustment.

[0016] As a further description of the above technical solution:

[0017] The chip bonding vision system includes a second light source module, a position fine-tuning module, and a chip recognition module, used for visual detection of chip positioning and bonding status.

[0018] As a further description of the above technical solution:

[0019] The vacuum adsorption rotary table system includes a second stepper motor, a rotating shaft, a calibration table base, and a bearing seat, and is used to realize the rotation and calibration of the chip.

[0020] As a further description of the above technical solution:

[0021] The display and alarm light are respectively connected to the control system on the overall frame to display the equipment's operating status and abnormal alarms.

[0022] In summary, due to the adoption of the above technical solution, the beneficial effects of this utility model are:

[0023] In this invention, in the initial state of the equipment, the operator manually loads a material-filled box onto the first interchangeable fixture on the Y-axis of the feeding process, and loads an empty box onto the second interchangeable fixture on the Y-axis of the unloading process. The feeding X and Y axes move, and after aligning the feeding Z-axis suction nozzle with the material, the suction nozzle descends and uses vacuum to pick up a piece of material, carrying the material to the focal length position of the angle recognition lens. It pauses briefly, and after the angle recognition camera captures and recognizes the initial angle of the material, the X-axis continues to move towards the center until it is directly above the rotary table, placing the material on the rotary table. At the same time, the rotary table opens the vacuum to hold the material, the feeding suction nozzle closes the vacuum, and the material is placed down. The system then begins to pick up the next piece of material. The rotary table holds the material and rotates to a suitable angle. The horizontal and vertical lenses capture images, recognizing the codes on the material shell and the chip, respectively. The software binds the two codes together. The unloading suction nozzle moves directly above the rotary table, picks up the material, and places the materials sequentially into the corresponding positions of the material boxes in the second interchangeable fixture on the Y-axis of the unloading process. Attached Figure Description

[0024] Figure 1 This is a three-dimensional structural diagram of a chip bonding and transfer device proposed in this utility model;

[0025] Figure 2 This is a three-dimensional structural diagram of the Z-axis of a chip bonding and transfer device proposed in this utility model;

[0026] Figure 3 This is a three-dimensional structural diagram of a chip bonding and transfer device according to the present invention, showing its Y-axis loading mechanism.

[0027] Figure 4 This is a three-dimensional structural diagram of the chip bonding and transfer device according to the present invention, showing its Y-axis unloading mechanism.

[0028] Figure 5 This is a three-dimensional structural diagram of an angle recognition system for chip bonding and transfer equipment proposed in this utility model;

[0029] Figure 6 This is a three-dimensional structural diagram of a chip bonding vision system for a chip bonding transfer device proposed in this utility model;

[0030] Figure 7 This is a three-dimensional structural diagram of a vacuum adsorption rotary table system for chip bonding and transfer equipment proposed in this utility model.

[0031] Legend:

[0032] 1. Overall frame; 2. Display; 3. Alarm light; 4. Loading X-axis; 5. Loading Z-axis; 501. First stepper motor; 502. Z-axis base plate; 503. Large linear guide; 504. Gear and rack; 505. Nozzle; 506. Small linear guide; 507. Light shield; 508. Photoelectric switch; 6. Loading Y-axis; 601. First lead screw module; 602. First fixture base plate; 603. First replaceable fixture; 7. Unloading X-axis; 8. Unloading Z-axis; 9. Unloading Y-axis; 901. Second lead screw Module; 902, Second fixture base plate; 903, Second replaceable fixture; 904, Transfer placement stage; 10, Angle recognition system; 1001, First light source module; 1002, Lens; 1003, Camera; 11, Chip bonding vision system; 1101, Second light source module; 1102, Position fine-tuning module; 1103, Chip recognition module; 12, Vacuum adsorption rotary table system; 1201, Second stepper motor; 1202, Rotary shaft; 1203, Calibration table base; 1204, Bearing seat. Detailed Implementation

[0033] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those skilled in the art without creative effort are within the protection scope of the present utility model.

[0034] Please see Figures 1-7 ,

[0035] First embodiment:

[0036] This utility model provides a technical solution: a chip bonding and transfer device, including an overall frame 1, a display 2, an alarm light 3, a feeding X-axis 4, a feeding Z-axis 5, a feeding Y-axis 6, a discharging X-axis 7, a discharging Z-axis 8, a discharging Y-axis 9, an angle recognition system 10, a chip bonding vision system 11, and a vacuum adsorption rotary table system 12. The display 2 and the alarm light 3 are sequentially installed on the overall frame 1. The feeding X-axis 4, feeding Z-axis 5, and feeding Y-axis 6 are fixedly installed on the overall frame 1 and connected to each other. The discharging X-axis 7, discharging Z-axis 8, and discharging Y-axis 9 are also fixedly installed on the overall frame 1 and form a cooperative working structure with the feeding axis system. The angle recognition system 10, the chip bonding vision system 11, and the vacuum adsorption rotary table system 12 are respectively installed on the overall frame 1.

[0037] Specifically, such as Figure 2-7As shown, the feeding Z-axis 5 includes a Z-axis base plate 502 fixedly connected to the overall frame 1. A first stepper motor 501 is fixedly mounted on the Z-axis base plate 502. The first stepper motor 501 is linked to a large linear guide rail 503 via a gear and rack 504, driving the suction nozzle 505 mounted on the large linear guide rail 503 to move along the Z-axis direction. The suction nozzle 505 is precisely guided by a small linear guide rail 506. A light-blocking plate 507 and a photoelectric switch 508 are respectively installed at the feeding Z-axis 5 position to detect the position of the suction nozzle 505. The light-blocking plate 507 and the photoelectric switch 508 work together to achieve real-time detection of the suction nozzle 505's position. When the suction nozzle 505 moves to a predetermined position, the light-blocking plate 507 blocks the light path, triggering a signal from the photoelectric switch 508, ensuring that the control system can accurately obtain the state of the suction nozzle 505, thereby adjusting the motion control in a timely manner and improving the safety and response speed of the action.

[0038] The loading Y-axis 6 includes a first lead screw module 601, a first clamping base plate 602, and a first replaceable clamp 603. The first replaceable clamp 603 is detachably mounted on the first clamping base plate 602 for quick clamp replacement. The unloading Y-axis 9 includes a second lead screw module 901, a second clamping base plate 902, a second replaceable clamp 903, and a transfer platform 904. The transfer platform 904 is used for temporary storage and transfer of chips. The angle recognition system 10 includes a first light source module 1001, a lens 1002, and a camera 1003 for collecting chip angle information and achieving automatic recognition and adjustment. The angle recognition system 10 uses commercially available industrial vision components, such as a Basler ace series industrial camera 1003 paired with a Schneider Kreuznach fixed-focus lens 1002, and a high-brightness LED light source module (such as Cree). The XLamp series LED array module enables precise shooting and recognition of chip angles. This combination is widely used in the field of automated inspection, featuring high resolution, high frame rate and stable illumination, which can meet the real-time and accuracy requirements of this device for angle recognition.

[0039] The chip bonding vision system 11 includes a second light source module 1101, a position fine-tuning module 1102, and a chip recognition module 1103. It is used for visual detection of chip positioning and bonding status. The vision detection equipment used in the chip bonding vision system 11 employs mature vision sensors and light source devices, such as Keyence's optical sensors combined with a white ring LED supplementary lighting module, and is equipped with a mechanical fine-tuning stage (such as the Thorlabs XYZ fine-tuning platform) with fine-tuning function to achieve precise chip positioning and supplementary lighting effect, ensuring accurate detection of the bonding status. This combination is widely used in the electronics manufacturing industry, is technologically mature, and has high stability.

[0040] The vacuum adsorption rotary table system 12 includes a second stepper motor 1201, a rotating shaft 1202, a calibration table base 1203, and a bearing seat 1204, used to realize the rotation and calibration of the chip. The display 2 and the alarm light 3 are respectively connected to the control system on the overall frame 1 to display the operating status of the equipment and abnormal alarms. The vacuum adsorption rotary table system 12 uses a high-performance stepper motor (such as an Oriental Motor PKP series stepper motor) to drive the high-precision rotating shaft 1202. The rotating shaft 1202 achieves stable support and smooth rotation through brand bearing seats 1204 (such as NSK or SKF precision bearing seats 1204). The calibration table base 1203 is made of high-rigidity aluminum alloy material to ensure the stability of the rotation process. The above modules are widely used in the fields of precision assembly and electronic component processing, with mature and reliable performance, meeting the high-precision requirements of the present invention for chip rotation and calibration.

[0041] Working principle: In the initial state of the equipment, the operator manually loads the material-filled box onto the first interchangeable fixture 603 on the loading Y-axis 6, and loads the empty box onto the second interchangeable fixture 903 on the unloading Y-axis 9. The loading X-axis 4 and Y-axis move, and after aligning the loading Z-axis suction nozzle 505 with the material, the suction nozzle 505 descends and uses vacuum to pick up a piece of material, carrying the material to the positive focal length position of the angle recognition lens 1002. It pauses briefly, and after the angle recognition camera 1003 captures and recognizes the initial angle of the material, the X-axis continues to move towards the center until rotation. The material is placed on the rotating table directly above the platform. At the same time, the rotating table opens the vacuum to hold the material, while the loading nozzle 505 closes the vacuum, releases the material, and begins to pick up the next piece of material. The rotating table holds the material and rotates to a suitable angle. The horizontal lens 1002 and the vertical lens 1002 take pictures to identify the code on the material shell and the code on the chip, respectively. The software binds the two codes together. The unloading nozzle 505 moves to the top of the rotating table, picks up the material, and places the material in the corresponding position of the material box of the second interchangeable fixture 903 on the unloading Y-axis 9.

[0042] The above description is only a preferred embodiment of the present utility model, but the protection scope of the present utility model is not limited thereto. Any equivalent substitutions or changes made by those skilled in the art within the technical scope disclosed in the present utility model, based on the technical solution and the inventive concept of the present utility model, should be included within the protection scope of the present utility model.

Claims

1. A chip bonding and transfer device, comprising an overall frame (1), a display (2), an alarm light (3), a loading X-axis (4), a loading Z-axis (5), a loading Y-axis (6), a unloading X-axis (7), an unloading Z-axis (8), an unloading Y-axis (9), an angle recognition system (10), a chip bonding vision system (11), and a vacuum adsorption rotary table system (12), characterized in that, The display (2) and alarm light (3) are installed sequentially on the overall frame (1). The feeding X-axis (4), feeding Z-axis (5), and feeding Y-axis (6) are fixedly installed on the overall frame (1) and connected to each other. The unloading X-axis (7), unloading Z-axis (8), and unloading Y-axis (9) are also fixedly installed on the overall frame (1) and form a cooperative working structure with the feeding axis system. The angle recognition system (10), chip bonding vision system (11), and vacuum adsorption rotary table system (12) are respectively installed on the overall frame (1).

2. The chip bonding and transfer apparatus according to claim 1, wherein It also includes a first stepper motor (501). The feeding Z-axis (5) includes a Z-axis base plate (502) fixedly connected to the overall frame (1). The first stepper motor (501) is fixedly installed on the Z-axis base plate (502). The first stepper motor (501) is linked with the large linear guide rail (503) through a gear rack (504) to drive the suction nozzle (505) installed on the large linear guide rail (503) to move along the Z-axis direction. The suction nozzle (505) is finely guided by the small linear guide rail (506). The light shield (507) and photoelectric switch (508) are respectively installed at the feeding Z-axis (5) position to detect the position of the suction nozzle.

3. The chip bonding and transfer apparatus according to claim 1, wherein The loading Y-axis (6) includes a first lead screw module (601), a first clamp base plate (602) and a first replaceable clamp (603). The first replaceable clamp (603) can be detachably installed on the first clamp base plate (602) to achieve quick clamp replacement.

4. The chip bonding and transfer apparatus according to claim 1, wherein The unloading Y-axis (9) includes a second lead screw module (901), a second clamp base plate (902), a second replaceable clamp (903), and a transfer platform (904), which is used for temporary storage and transfer of chips.

5. The chip bonding and transfer apparatus according to claim 1, wherein The angle recognition system (10) includes a first light source module (1001), a lens (1002) and a camera (1003), used to collect chip angle information and realize automatic recognition and adjustment.

6. The chip bonding and transfer apparatus according to claim 1, wherein The chip bonding vision system (11) includes a second light source module (1101), a position fine-tuning module (1102), and a chip recognition module (1103), which are used for visual detection of chip positioning and bonding status.

7. The chip bonding and transfer apparatus according to claim 1, wherein The vacuum adsorption rotary table system (12) includes a second stepper motor (1201), a rotating shaft (1202), a calibration table base (1203), and a bearing seat (1204), which are used to realize the rotation and calibration of the chip.

8. The chip bonding and transfer apparatus according to claim 1, wherein The display (2) and the alarm light (3) are respectively connected to the control system on the overall frame (1) to display the operating status of the equipment and abnormal alarms.

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