Automatic leveling device for semiconductor substrate processing apparatus

Abstract

An automatic leveling device for semiconductor substrate processing equipment includes a substrate holder disposed inside a process chamber with its upper surface used for loading substrates; a support rod vertically disposed below the substrate holder; a substrate through which the support rod passes in a central region; a horizontal adjustment plate disposed on the upper part of the substrate and maintaining a certain distance from the substrate; a vertical lifting part vertically coupled to the rear of the substrate and adjusting the height of the substrate holder by raising and lowering the support rod; and a pair of horizontal adjustment parts disposed on both sides between the horizontal adjustment plate and the substrate, which keep the substrate holder horizontal relative to a spray head at the top of the process chamber by adjusting the inclination of the horizontal adjustment plate. This automatic leveling device, by employing a pair of horizontal adjustment parts equipped with dual worm gears, can finely adjust the inclination of the substrate holder. Furthermore, by minimizing the backlash of the dual worm gears, higher precision horizontal adjustment can be achieved.

Description

Technical Field

[0001] This utility model relates to an automatic leveling device, and more specifically, to an automatic leveling device for a substrate processing apparatus that utilizes a worm gear to achieve higher precision leveling. Background Technology

[0002] Generally, devices used to process substrates such as semiconductor wafers can be broadly classified into thin film deposition devices for forming thin films and etching devices for micro-etching the formed thin films on the substrate to form circuits.

[0003] Thin film deposition apparatuses can be categorized into chemical methods that synthesize thin films or particles from gaseous raw materials through chemical reactions, and physical methods that deposit particles onto a substrate through physical methods.

[0004] Chemical vapor deposition (CVD), as a chemical method, involves placing a substrate in a process chamber isolated from the outside, injecting gaseous raw materials through a spray head, and using heat provided by a heating unit to induce thermal decomposition, thereby forming a thin film without altering the properties of the substrate. It is widely used in substrate processing equipment for semiconductor wafers and flat panel display TFT (thin film transistor) formation.

[0005] The process chamber of this type of substrate processing apparatus is equipped with a substrate susceptor for placing the substrate, which has a built-in heater to heat the substrate during the process.

[0006] However, in traditional substrate processing, if the flatness of the substrate on the substrate stage deviates, the uneven distance between the spray head and the substrate will lead to uneven thickness of the deposited film, thus causing defects.

[0007] Therefore, traditional substrate processing equipment needs to check the flatness of the substrate before the process. If a deviation is found, the process is paused, and the substrate is adjusted and leveled before vacuum is re-established.

[0008] In recent years, automatic leveling devices have been developed that use sensors to detect the flatness of substrates and automatically adjust the level of the substrate platform based on the detection results.

[0009] An example of an automatic leveling device is disclosed in Korean Patent Publication No. 1020240003924, entitled "Automatic Leveling Device for Substrate Processing Apparatus Including Inclined Structure". This device adjusts the levelness using three servo motor assemblies arranged along the circumference of the substrate stage. Each assembly achieves adjustment by rotating a ball screw on a vertical guide rail in both directions. However, the prior art suffers from insufficient precision due to the use of ball screws for leveling. Utility Model Content

[0010] The purpose of this invention is to solve the above problems and provide an automatic leveling device that uses double worm gears to achieve high-precision horizontal adjustment.

[0011] Another objective is to prevent reverse rotation through the worm gear self-locking function, thereby improving the safety of the device.

[0012] Another objective is to reduce the clearance between the worm gear and the worm to decrease backlash.

[0013] The objective of this invention can be achieved through an automatic leveling device for a substrate processing apparatus. The automatic leveling device for a substrate processing apparatus of this invention includes: a substrate holder disposed inside a process chamber with its upper surface used for loading substrates; a support rod vertically disposed below the substrate holder; a substrate through which the support rod passes in a central region; a horizontal adjustment plate disposed on the upper part of the substrate and maintaining a certain distance from the substrate; a vertical lifting part vertically coupled to the rear of the substrate and adjusting the height of the substrate holder by raising and lowering the support rod; and a pair of horizontal adjustment parts disposed on both sides between the horizontal adjustment plate and the substrate, which adjust the inclination of the horizontal adjustment plate to keep the substrate holder horizontal relative to a spray head at the top of the process chamber.

[0014] The horizontal adjustment unit includes: a first worm gear part vertically coupled to the front side of the horizontal adjustment plate and equipped with a horizontal adjustment motor and a first worm gear driven by the motor in forward and reverse rotation; a second worm gear disposed inside the horizontal adjustment plate; a second worm gear part consisting of the first worm gear and the second worm gear meshing and rotating with the first worm gear, which are horizontally disposed on the horizontal adjustment plate; and a fixed screw shaft vertically fixed to the base plate and threadedly engaged with the inside of the second worm gear, which causes the second worm gear and the horizontal adjustment plate to move up and down through the forward and reverse rotation linkage of the second worm gear.

[0015] According to one embodiment, the gear ratio of the first worm gear is 30:1, and the gear ratio of the second worm gear is 20:1.

[0016] According to one embodiment, the first worm gear portion is housed within an outer housing and includes: a first worm gear support pin horizontally inserted from the outer wall of the outer housing to press the first worm gear against the first worm to eliminate backlash; and a second worm gear support pin horizontally inserted from the side wall of a horizontal adjustment plate to press the second worm gear against the second worm to eliminate backlash.

[0017] Compared with the prior art, the present invention has the following advantages: The automatic leveling device of the present invention can finely adjust the inclination of the base plate by using a pair of horizontal adjustment parts equipped with double worm gears.

[0018] Furthermore, by minimizing the backlash of the twin worm gears, higher precision leveling can be achieved. Attached Figure Description

[0019] Figure 1 This is a three-dimensional structural diagram of the automatic leveling device of this utility model; Figure 2 This is a side view of the automatic leveling device of this utility model; Figure 3 A three-dimensional projection diagram of the horizontal adjustment mechanism in its combined state; Figure 4 A three-dimensional structural diagram of the horizontal adjustment section; Figure 5 for Figure 1 Schematic diagram of the cross section of line AA; Figure 6 for Figure 1 Schematic diagram of the cross section of the middle BB line; Figure 7 for Figure 1 A schematic diagram of the cross-section of the CC line, wherein the height of the horizontal adjustment part can be adjusted synchronously to h1; Figure 8 for Figure 7 Enlarged view of point D; Figure 9 for Figure 1 A schematic diagram of the cross-section of the CC line, showing the height differences of the horizontal adjustment section; Figure 10 for Figure 9 Enlarged diagram of point E in the middle.

[0020] 100: Automatic leveling device; 110: Base plate holder 120: Support rod; 121: Lower lifting block 121a: Guide rail connecting block; 130: Base plate 131: Connecting pin; 140: Horizontal adjustment plate 150: Vertical lifting section; 151: Lifting guide rail 153: Lifting motor 160, 160a: Horizontal adjustment unit 161: First worm gear part; 161a: Outer casing 161b: Horizontal adjustment motor; 161c: Coupling 161d: First worm gear; 161e: Worm gear cover 163: Second worm gear section; 163a: First worm. 163b: Second worm gear; 163c: Second worm. 165a: Fixed screw shaft; 165b: Bearing 165c: Support block; 166: First worm gear support pin 167: Second worm gear support pin; 168: Cover plate Detailed Implementation

[0021] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0022] In the description of this utility model, it should be understood that the terms "upper", "lower", "front", "rear", "left", "right", "top", "bottom", "inner", "outer", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model.

[0023] like Figure 1 , Figure 2 As shown, the automatic leveling device 100 of the semiconductor substrate processing equipment of this utility model includes: a substrate holder 110 for loading substrates; a support rod 120 for vertically supporting the substrate holder 110; a horizontally arranged substrate 130, through which the support rod 120 passes; a horizontal adjustment plate 140 disposed on the upper part of the substrate 130 to adjust the levelness of the substrate holder; a vertical lifting part 150 disposed behind the substrate 130 and adjusting the height of the substrate holder 110 by the lifting support rod 120; and a pair of horizontal adjustment parts 160, 160a, which adjust the left and right heights of the horizontal adjustment plate 140 to achieve horizontal alignment of the substrate holder 110.

[0024] The horizontal adjustment unit 160, 160a of this utility model is driven by a double worm gear, which can achieve more precise horizontal control compared with the traditional ball screw adjustment method.

[0025] The worm gear has a self-locking function to prevent reverse rotation and ensure operational stability.

[0026] The substrate holder 110 is used to support the substrate in the process chamber for process processing, and a heater (not shown) can be integrated inside it.

[0027] The support rod 120 is vertically positioned below the center of the base plate 110, and a lower lifting block 121 is attached to its bottom. For example... Figure 2 As shown, a guide rail connecting block 121a is integrally formed behind the lower lifting block 121.

[0028] The guide rail connecting block 121a is disposed on the lifting guide rail 151 of the vertical lifting part 150 and moves up and down through the vertical lifting part 150. Therefore, the vertical lifting part 150 can adjust the height of the base plate 110 up and down.

[0029] The base plate 130 passes through the support rod 120 and is horizontally arranged, and is connected to the lower part of the support rod 120 through the vertical lifting part 150. The horizontal adjustment plate 140 is arranged on the upper part of the base plate 130, and a pair of horizontal adjustment parts 160, 160a are connected to its front side, so as to achieve horizontal adjustment by adjusting the left and right height.

[0030] The substrate 130 and the horizontal adjustment plate 140 are jointly combined in the horizontal adjustment section 160, 160a. The height adjustment result of the horizontal adjustment section 160, 160a on the horizontal adjustment plate 140 is transmitted to the substrate base 110 through the support rod 120.

[0031] like Figure 2 As shown, the substrate 130 is connected to the leveling adjustment 140 via a connecting pin 131. When the leveling adjustment units 160, 160a adjust according to... Figure 7-10 When adjusting the left and right height of the horizontal adjustment plate 140, the base plate 130 and its support rod 120 connected by the connecting pin 131 will tilt synchronously with the horizontal adjustment plate 140, thereby adjusting the levelness of the base plate seat 110.

[0032] like Figure 1 and Figure 2 As shown, the vertical lifting part 150 is vertically disposed behind the substrate 130 and is used to adjust the height of the substrate base 110. The vertical lifting part 150 is provided with a vertical lifting guide rail 151, which is combined with the guide rail connecting block 121a. The guide rail connecting block 121a is integrally formed with the lower lifting block 121 of the support rod 120.

[0033] The vertical lifting unit 150 is driven by the lifting motor 153 at the bottom, which causes the guide rail connecting block 121a to move up and down in the manner of LM guide rail, thereby adjusting the height of the support rod 120 and the base plate seat 110 fixed on its top.

[0034] A pair of leveling units 160, 160a are disposed on both sides in front of the leveling plate 140 and the substrate 130 for automatically adjusting the level of the substrate holder 110. A level sensor (not shown) is provided in the process chamber (not shown) to detect the level status of the substrate holder 110. The controller (not shown) drives the leveling units 160, 160a according to the sensor signal to ensure that the substrate holder 110 and the spray head (not shown) remain horizontally aligned.

[0035] Figure 3 This is a three-dimensional projection diagram of the horizontal adjustment parts 160, 160a of the present invention on the horizontal adjustment plate 140. Figure 4 A three-dimensional structural diagram of the horizontal adjustment parts 160 and 160a; Figure 5 for Figure 1 Schematic diagram of the cross section of line AA; Figure 6 for Figure 1 Schematic diagram of the cross section of the middle BB line; Figure 7 and Figure 9 for Figure 1 A schematic diagram of the cross-section of the CC line.

[0036] The horizontal adjustment part 160, 160a of this utility model includes: a first worm gear part 161 disposed on the front side of the horizontal adjustment plate 140, a second worm gear part 163 horizontally disposed inside the horizontal adjustment plate 140, and a fixed screw shaft 165a vertically fixed to the base plate 130 and coupled to the second worm 163.

[0037] First gear section 161 Figure 4 and Figure 5 As shown, it includes: an outer housing 161a, a horizontal adjustment motor 161b disposed at the lower part of the outer housing, a first worm gear 161d disposed at the upper part of the horizontal adjustment motor 161b, a coupling 161c for connecting the drive shaft of the horizontal adjustment motor 161b to the first worm gear 161d to transmit rotational power, and a worm gear cover 161e fixed to the top surface of the outer housing 161a to support the rotation of the first worm gear 161d.

[0038] The outer casing 161a is fixed to the front side of the horizontal adjustment plate 140, and its interior houses the horizontal adjustment motor 161b, the coupling 161c, and the first worm gear 161d. Figure 1 As shown, the outer shell 161a of the pair of horizontal adjustment parts 160, 160a is fixedly connected by a cover plate 168.

[0039] The leveling motor 161b is driven by a controller (not shown) based on the detection signal from a level sensor (not shown). Coupling 161c connects the rotating shaft of the leveling motor 161b to the lower end of the gear shaft of the first worm gear 161d, transmitting the motor's rotational force to the first worm gear 161d. The upper end of the gear shaft of the first worm gear 161d is as follows... Figure 5 As shown, it is rotatably attached to the inside of the worm gear cover 161e. The worm gear cover 161e is attached to the top of the outer housing 161a via a connecting member, allowing the first worm gear 161d to rotate.

[0040] The second worm gear portion 163 is horizontally positioned across the boundary region between the outer casing 161a and the horizontal adjustment plate 140. The second worm gear portion 163 includes: a first worm 163a disposed on the front outer edge of the worm shaft and meshing and rotating with the first worm wheel 161d; a second worm wheel 163b disposed on the rear outer edge of the worm shaft and rotating in conjunction with the first worm 163a; and a second worm 163c vertically disposed on the surface of the horizontal adjustment plate 140 and meshing with the second worm wheel 163b.

[0041] like Figure 7 , Figure 8 , Figure 9 , Figure 10 As shown, the worm shaft of the second worm gear portion 163 horizontally spans the surfaces of the outer casing 161a and the horizontal adjustment plate 140. When the first worm 163a meshes and rotates with the first worm wheel 161d, the worm shaft engaged with the first worm 163a and the second worm wheel 163b rotate together. The second worm wheel 163b then drives the second worm 163c to rotate.

[0042] like Figure 7 , Figure 8 As shown, the second worm gear 163c rotates horizontally in a state limited by the vertical direction of the horizontal adjustment plate 140.

[0043] The lower part of the second worm gear 163c is threaded into the fixed screw shaft 165a. For example... Figure 8 As shown in the enlarged view, the upper end of the fixed screw shaft 165a is screwed into the second worm 163c. Since the second worm 163c rotates under the restriction of the horizontal adjustment plate 140, the horizontal adjustment plate 140 that accommodates the second worm 163c moves up and down along the thread of the fixed screw shaft 165a.

[0044] Therefore, the horizontal adjustment motor 161b is driven in both forward and reverse directions via a controller (not shown), such as... Figure 8 As shown, the height of the pair of horizontal adjustment parts 160, 160a on the left and right sides can be adjusted synchronously to h1; or as shown... Figure 9 , Figure 10 As shown, the height h2 of the first horizontal adjustment section 160, 160a is differentiated from the height h1 of the second horizontal adjustment section 160, 160a.

[0045] The result of the horizontal adjustment plate 140 adjusting the left and right height is transmitted to the base plate 110 through the base plate 130.

[0046] The lower part of the fixed screw shaft 165a is fixed to the support block 165c. A bearing 165b is provided between the support block 165c and the fixed screw shaft 165a. The bearing 165b is perpendicular to the support block 165c and is located on the front side of the base plate 130.

[0047] The horizontal adjustment section 160, 160a of this utility model adopts a double worm gear structure of a first worm gear 161d and a second worm gear 163b to adjust the horizontal height. Compared with the traditional servo motor, ball screw and vertical guide rail structure, this design has fewer components and can reduce manufacturing costs.

[0048] Furthermore, the high reduction ratio of the worm gears enables precise adjustment of the height and angle of the base plate. For example, the reduction ratio of a traditional servo motor is 30:1 or 50:1, while the first worm gear 161d and the second worm gear 163b of this invention adopt reduction ratios of 30:1 and 20:1 respectively, with a total reduction ratio of up to 600:1, which theoretically allows for nanometer-level fine-tuning.

[0049] The worm gear's unique self-locking function prevents reverse motion caused by external loads. Traditional ball screws require an additional braking mechanism, while the worm gear itself can suppress reverse rotation, ensuring operational stability.

[0050] In addition, such as Figure 5 and Figure 6 As shown, the horizontal adjustment parts 160 and 160a of this invention minimize the worm gear backlash. That is, as Figure 5 As shown, the first worm gear support pin 166 is inserted into the side wall of the outer casing 161a, pressing the first worm gear 161d against the first worm 163a. ​​Due to the pressure applied by the first worm gear support pin 166, the first worm gear 161d and the first worm 163a are tightly fitted without any clearance, minimizing backlash.

[0051] Similarly, Figure 5 As shown, the second worm gear support pin 167 is inserted into the side wall of the leveling plate 140, pressing the second worm gear 163b against the second worm 163c. Due to the pressure applied by the second worm gear support pin 167, the second worm gear 163b and the second worm 163c are tightly fitted without any clearance, minimizing backlash. This backlash-minimizing design of the dual worm gears helps to achieve precise leveling.

[0052] In summary, the automatic leveling device of this utility model achieves high-precision horizontal fine-tuning of the base plate seat through a pair of horizontal adjustment parts with a double worm gear structure.

[0053] Furthermore, by minimizing the backlash of the twin worm gears through design, more precise leveling can be achieved.

[0054] The above description is only a preferred embodiment of the present utility model. It should be noted that those skilled in the art can make several changes and improvements without departing from the overall concept of the present utility model, and these should also be considered within the protection scope of the present utility model.

Claims

1. An automatic leveling device for semiconductor substrate processing equipment, characterized in that: include: A substrate holder (110) is disposed inside the process chamber and whose upper surface is used to load the substrate. A support rod (120) is vertically disposed at the lower part of the substrate base (110). The base plate (130) through which the support rod (120) is provided is located in the central region. A horizontal adjustment plate (140) is disposed on the upper part of the substrate (130) and maintains a certain distance from the substrate (130). A vertical lifting part (150) is vertically attached to the rear of the substrate (130) and adjusts the height of the substrate base (110) by raising and lowering the support rod (120). A pair of horizontal adjustment parts (160, 160a) are disposed on both sides between the horizontal adjustment plate (140) and the substrate (130) to keep the substrate seat (110) horizontal relative to the spray head at the top of the process chamber by adjusting the tilt of the horizontal adjustment plate (140). The leveling adjustment unit (160, 160a) includes: A first worm gear part (161) is vertically coupled to the front side of the horizontal adjustment plate (140) and equipped with a horizontal adjustment motor (161b) and a first worm gear (161d) driven by the motor in forward and reverse rotation. The second worm gear (163c) is located inside the horizontal adjustment plate (140). The second worm gear section (163) consists of a first worm (163a) that is horizontally disposed on the horizontal adjustment plate (140) and meshes with the first worm gear (161d) and rotates, and a second worm gear (163b) that meshes with the second worm (163c) and rotates. A fixed screw shaft (165a) is vertically fixed to the base plate (130) and threadedly connected to the inside of the second worm (163c). The second worm (163c) and the horizontal adjustment plate (140) are raised and lowered by the forward and reverse rotation linkage of the second worm (163c).

2. The automatic leveling device of a semiconductor substrate processing apparatus according to claim 1, characterized by: The first worm gear (161d) has a gear ratio of 30:1, and the second worm gear (163b) has a gear ratio of 20:

1.

3. The automatic leveling device of a semiconductor substrate processing apparatus according to claim 1, characterized by: The first worm gear portion (161) is housed within the outer casing (161a) and includes: A first worm gear support pin (166) is inserted horizontally from the outer wall of the outer casing (161a) to press the first worm gear (161d) against the first worm (163a) to eliminate backlash. A second worm gear support pin (167) is inserted horizontally from the side wall of the horizontal adjustment plate (140) to press the second worm gear (163b) against the second worm (163c) to eliminate backlash.

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