Turnover device and processing system
By combining multiple displacement components and detection units, high-precision chip flipping of the flipping device is achieved, solving the problem of insufficient precision of existing flipping devices and improving the accuracy and reliability of chip picking and placing operations.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- SHENZHEN LIANDE SEMICON TECH CO LTD
- Filing Date
- 2025-07-16
- Publication Date
- 2026-07-31
AI Technical Summary
Existing flipping devices have poor accuracy when flipping chips, which cannot meet the requirements of high-precision interconnection.
By combining multiple displacement components and detection units, the first and second displacement components enable the chip picking unit to move along two intersecting directions, and the third displacement component is used to flip the chip, thereby improving the accuracy of chip picking and placing operations.
This improves the accuracy of chip placement and removal during the chip handling process, ensuring accurate alignment between the chip and external equipment and reducing the chance of chip damage.
Smart Images
Figure CN224583701U_ABST
Abstract
Description
Technical Field
[0001] This application relates to the field of flipping device technology, and in particular to a flipping device and processing system. Background Technology
[0002] With the development of semiconductor chips and the strong support from the government for the semiconductor industry, the market demand for semiconductor chip packaging equipment is growing. At the same time, the size of chips (LEDs) is becoming smaller or even ultra-smaller, which places higher demands on the precision, speed and reliability of the equipment.
[0003] However, current flipping devices for chip packaging typically use stepper motors or cylinders to flip the chips, resulting in poor flipping accuracy and failing to meet the requirements for high-precision interconnection. Utility Model Content
[0004] Therefore, it is necessary to provide a flipping device and processing system to address the above problems.
[0005] A flipping device, comprising:
[0006] body;
[0007] The chip picking unit is configured to perform chip picking and placing operations;
[0008] The displacement unit includes a first displacement component, a second displacement component, and a third displacement component. The first displacement component is mounted on the machine body, and the second displacement component is movably mounted on the first displacement component. The first displacement component is configured to drive the second displacement component to move along a first direction. One end of the third displacement component is connected to the crystal-taking unit, and the other end of the third displacement component is movably connected to the second displacement component, forming a rotation fulcrum. The third displacement component is configured to drive the crystal-taking unit to rotate around the rotation fulcrum. The second displacement component is also configured to drive the third displacement component and the crystal-taking unit to move along a second direction intersecting the first direction.
[0009] In one embodiment, the first displacement component includes a guide rail and a first drive member, the guide rail being coupled to the body and extending along a first direction; the second displacement component is movably coupled to the guide rail, the first drive member being drivenly connected to the second displacement component, and the first drive member being configured to drive the second displacement component to move relative to the guide rail along the first direction.
[0010] In one embodiment, the second displacement component includes a first moving member, a first mounting base, and a second driving member. The first mounting base is movably coupled to the first displacement component, and the second driving member is connected between the first moving member and the first mounting base. The crystal-taking unit is coupled to the first moving member, and the second driving member is configured to drive the first moving member to move the crystal-taking unit along a second direction.
[0011] In one embodiment, the crystal-taking unit includes a crystal-taking component, a fourth displacement component, and a mounting base. The mounting base is connected between the fourth displacement component and the third displacement component. The crystal-taking component is fitted onto the fourth displacement component, and the fourth displacement component is configured to drive the crystal-taking component to move along a second direction.
[0012] In one embodiment, the fourth displacement component includes a second moving member and a third driving member, the third driving member being coupled to the second mounting base, the second moving member being connected between the third driving member and the crystal picking member, and the third driving member being configured to drive the second moving member to move the crystal picking member along a second direction.
[0013] In one embodiment, the fourth displacement component includes a limiting member that is coupled to the mounting base and located on the path along which the moving member moves in the second direction;
[0014] When the second moving member moves to a preset position along the first direction under the drive of the third driving member, the limiting member abuts against and limits the second moving member.
[0015] In one embodiment, the fourth displacement component further includes a mating member that is engaged with the limiting member;
[0016] The flipping device further includes a detection unit, which includes a first detection element that is coupled to the machine body;
[0017] Specifically, when the limiting member abuts against the moving member, the limiting member and the moving member together cover the mating member; when the die-picking member cooperates with an external device to perform chip picking and placing operations, the die-picking member, under the action of external force, causes the limiting member and the moving member to separate; the first detection member is configured to determine the positional relationship between the limiting member and the moving member by identifying the mating member during the chip picking and placing operations performed by the die-picking member and the external device.
[0018] In one embodiment, the detection unit includes a second detection element, which is coupled to the body of the machine; the second detection element is configured to detect the pressure of the contact between the limiting member and the moving member.
[0019] A processing system includes a flipping device as described in the foregoing embodiments.
[0020] In one embodiment, the device further includes a loading device and a unloading device, wherein the loading device is configured to cooperate with the chip picking unit to pick up the chip; and the unloading device is configured to cooperate with the chip picking unit to release the chip.
[0021] The aforementioned flipping device and processing system include a flipping device comprising a body, a chip picking unit, and a displacement unit. The chip picking unit is configured to perform chip picking and placing operations. The displacement unit includes a first displacement component, a second displacement component, and a third displacement component. The first displacement component is mounted on the body, and the second displacement component is movably mounted on the first displacement component. The first displacement component is configured to drive the second displacement component to move along a first direction. One end of the third displacement component is connected to the chip picking unit, and the other end of the third displacement component is movably connected to the second displacement component, forming a rotation fulcrum. The third displacement component is configured to drive the chip picking unit to rotate around the rotation fulcrum. The second displacement component is also configured to drive the third displacement component and the chip picking unit to move along a second direction intersecting the first direction. The flipping device utilizes the first and second displacement components to enable the chip picking unit to move along two intersecting directions, and then, in conjunction with the third displacement component, flips the chip picking unit, allowing the chip picking unit to align and cooperate with the external device for chip picking and placing, thereby improving the accuracy of the chip picking operation. Attached Figure Description
[0022] Figure 1 This is a schematic diagram of the flipping device in this application.
[0023] Figure 2 This is a schematic diagram of the assembly of the crystallizing unit and the displacement unit in this application.
[0024] Figure Labels
[0025] Tilting device 100;
[0026] Body 200;
[0027] Crystal extraction unit 300; displacement unit 400; detection unit 500;
[0028] First displacement component 10; guide rail 101;
[0029] Second displacement component 20; first moving component 201; first mounting base 202; second driving component 203;
[0030] Third displacement component 30;
[0031] Crystal component 40; Fourth displacement component 50;
[0032] First inspection piece 60; second inspection piece 70. Detailed Implementation
[0033] To make the above-mentioned objectives, features, and advantages of this application more apparent and understandable, the specific embodiments of this application are described in detail below with reference to the accompanying drawings. Many specific details are set forth in the following description to provide a thorough understanding of this application. However, this application can be implemented in many other ways different from those described herein, and those skilled in the art can make similar modifications without departing from the spirit of this application. Therefore, this application is not limited to the specific embodiments disclosed below.
[0034] In the description of this application, it should be understood that if terms such as "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential" appear, these terms indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application.
[0035] Furthermore, where the terms "first" and "second" appear, these terms are for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined with "first" or "second" may explicitly or implicitly include at least one of that feature. In the description of this application, where the term "multiple" appears, "multiple" means at least two, such as two, three, etc., unless otherwise explicitly specified.
[0036] In this application, unless otherwise expressly specified and limited, the terms "installation," "connection," "joining," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components, unless otherwise expressly limited. Those skilled in the art can understand the specific meaning of the above terms in this application based on the specific circumstances.
[0037] In this application, unless otherwise expressly specified and limited, the use of descriptions such as "above" or "below" the second feature indicates that the first and second features are in direct contact or indirect contact via an intermediate medium. Furthermore, "above," "on top of," and "over" the second feature can mean that the first feature is directly above or diagonally above the second feature, or simply that the first feature is at a higher horizontal level than the second feature. Similarly, "below," "below," and "under" the second feature can mean that the first feature is directly below or diagonally below the second feature, or simply that the first feature is at a lower horizontal level than the second feature.
[0038] It should be noted that if an element is referred to as being "fixed to" or "set on" another element, it can be directly on the other element or there may be an intervening element. If an element is considered to be "connected to" another element, it can be directly connected to the other element or there may be an intervening element. If so, the terms "vertical," "horizontal," "upper," "lower," "left," "right," and similar expressions used in this application are for illustrative purposes only and do not represent the only possible implementation.
[0039] With the development of semiconductor chips and the strong support from the government for the semiconductor industry, the market demand for semiconductor chip packaging equipment is growing. At the same time, the size of chips (LEDs) is becoming smaller or even ultra-smaller, which places higher demands on the precision, speed and reliability of the equipment.
[0040] However, current chip flipping devices 100 on the market typically use stepper motors or cylinders to drive the flipping operation, resulting in poor flipping accuracy and failing to meet the requirements of high-precision interconnection.
[0041] Based on the above considerations, in order to solve the aforementioned problems, one or more embodiments of this application provide a processing system, which includes a flipping device 100. The flipping device 100 utilizes a first displacement component 10 and a second displacement component 20 to move the chip-grabbing unit 300 along two intersecting directions, and then cooperates with a third displacement component 30 to flip the chip-grabbing unit 300, so that the chip-grabbing unit 300 can be aligned and cooperated with the external device for picking and placing chips, thereby improving the accuracy of the chip during the picking and placing process.
[0042] The processing system also includes a loading device and a unloading device. The loading device is configured to work with the chip picking unit 300 to pick up the chip. The unloading device is configured to work with the chip picking unit 300 to release the chip.
[0043] Please see Figure 1 and Figure 2In this application, the flipping device 100 includes a body 200, a chip picking unit 300, and a displacement unit 400. The chip picking unit 300 is configured to perform chip picking and placing operations. The displacement unit 400 includes a first displacement component 10, a second displacement component 20, and a third displacement component 30. The first displacement component 10 is mounted on the body 200, and the second displacement component 20 is movably mounted on the first displacement component 10. The first displacement component 10 is configured to drive the second displacement component 20 to move along a first direction. One end of the third displacement component 30 is connected to the chip picking unit 300, and the other end of the third displacement component 30 is movably connected to the second displacement component 20, forming a rotation fulcrum. The third displacement component 30 is configured to drive the chip picking unit 300 to rotate around the rotation fulcrum. The second displacement component 20 is also configured to drive the third displacement component 30 and the chip picking unit 300 to move along a second direction intersecting the first direction.
[0044] For easier understanding, please refer to Figure 1 In this application, the first direction is defined as the horizontal direction and the second direction as the direction of gravity. The process of the first displacement component 10 driving the second displacement component 20 to move along the first direction is defined as a forward and backward movement process, and the process of the second displacement component 20 driving the third displacement component 30 and the crystal extraction unit 300 to move along the second direction is defined as a vertical movement process.
[0045] Thus, in the actual operation of the flipping device 100 picking up the chip, the second displacement component 20 first controls the third displacement component 30 and the chip picking unit 300 to move up and down along the second direction until the chip picking unit 300 is at the same height as the corresponding external device; then the first displacement component 10 controls the second displacement component 20 to move back and forth along the first direction, and the second displacement component 20 will drive the third displacement component 30 and the chip picking unit 300 to move synchronously along the first direction until the chip picking unit 300 is aligned with the feeding device, thereby effectively improving the accuracy of chip picking.
[0046] Furthermore, after the flipping device 100 completes the chip picking, the third displacement component 30 drives the chip picking unit 300 to rotate around the rotation fulcrum, and cooperates with the first displacement component 10 to control the second displacement component 20 to drive the third displacement component 30 and the chip picking unit 300 to move back and forth along the first direction, so that the chip picking unit 300 is aligned with the unloading device, so as to complete the chip release.
[0047] In other words, the flipping device 100 provided in this application embodiment can realize the movement of the crystal picking unit 300 along two intersecting directions by using the first displacement component 10 and the second displacement component 20, and then cooperate with the third displacement component 30 to flip the crystal picking unit 300 so that the crystal picking unit 300 can be aligned and cooperated with the external device for picking and placing chips, thereby improving the accuracy of the chip in the picking and placing process.
[0048] In some embodiments, see Figure 1 and Figure 2 The crystal-taking unit 300 includes a crystal-taking component 40, a fourth displacement component 50, and a second mounting base. The mounting base is connected between the fourth displacement component 50 and the third displacement component 30. The crystal-taking component 40 is fitted onto the fourth displacement component 50. The fourth displacement component 50 is configured to drive the crystal-taking component 40 to move along a second direction.
[0049] Understandably, during the actual chip picking process of the flipping device 100, the second displacement component 20 first controls the third displacement component 30 and the chip picking unit 300 to move up and down along the second direction until the chip picking unit 300 is at the same height as the corresponding external device; then the first displacement component 10 controls the second displacement component 20 to move back and forth along the first direction, and the second displacement component 20 will drive the third displacement component 30 and the chip picking unit 300 to move synchronously along the first direction until the chip picking unit 300 is aligned with the loading device; at the same time, the fourth displacement component 50 applies a constant force to the chip picking component 40 so that it moves along the second direction so that the chip picking component 40 contacts the chip on the loading device, and the chip picking operation is achieved under the action of the fourth displacement component 50.
[0050] Furthermore, after the flipping device 100 completes chip picking, the third displacement component 30 drives the chip picking unit 300 to rotate around the pivot point. In conjunction with the first displacement component 10, the second displacement component 20 controls the third displacement component 30 and the chip picking unit 300 to move back and forth along the first direction, aligning the chip picking unit 300 with the unloading device. Simultaneously, the fourth displacement component 50 applies a constant force to the chip picking component 40, causing it to move along the second direction, bringing the chip picked up by the chip picking component 40 into contact with the unloading device. Under the action of the fourth displacement component 50, the chip is released.
[0051] In some embodiments, see Figure 1 and Figure 2 The fourth displacement component 50 includes a second moving member and a third driving member. The third driving member is coupled to the second mounting base, and the second moving member is connected between the third driving member and the crystal picking member 40. The driving member is configured to drive the moving member to move the crystal picking member 40 along the first direction.
[0052] Understandably, during the actual chip-grabbing operation of the flipping device 100, the second displacement component 20 first controls the third displacement component 30 and the chip-grabbing unit 300 to move up and down along the second direction until the chip-grabbing unit 300 is at the same height as the corresponding external device; then, the first displacement component 10 controls the second displacement component 20 to move back and forth along the first direction, and the second displacement component 20 will drive the third displacement component 30 and the chip-grabbing unit 300 to move synchronously along the first direction until the chip-grabbing unit 300 is aligned with the loading device; at the same time, the third driving component applies a constant force to the second moving component so that the second moving component drives the chip-grabbing component 40 to move along the second direction so that the chip-grabbing component 40 contacts the chip on the loading device, and the chip-grabbing operation is realized under the action of the fourth displacement component 50.
[0053] Furthermore, after the flipping device 100 completes chip picking, the third displacement component 30 drives the chip picking unit 300 to rotate around the pivot point, and in conjunction with the first displacement component 10, controls the second displacement component 20 to move the third displacement component 30 and the chip picking unit 300 back and forth along the first direction, so that the chip picking unit 300 is aligned with the unloading device. At the same time, the third driving component applies a constant force to the second moving component, so that the second moving component drives the chip picking component 40 to move along the second direction, so that the chip picked up on the chip picking component 40 contacts the unloading device, and the chip is released under the action of the fourth displacement component 50.
[0054] Further, please see Figure 1 and Figure 2 The fourth displacement component 50 includes a limiting member, which is fitted onto the mounting base and located on the path along which the moving member moves in the first direction. When the second moving member moves to a preset position along the first direction under the drive of the third driving member, the limiting member abuts against the second moving member and is limited.
[0055] Understandably, during the process where the third driving component applies a constant force to the second moving component, causing the second moving component to move the chip-fetching component 40 along the second direction, the second moving component will move to a preset position where it abuts against the limiting component. Simultaneously, the third driving component will continuously apply force to the second moving component, ensuring that the chip-fetching component 40 is in close contact with the chip on the loading device to achieve chip pickup, and preventing the chip-fetching component 40 from exerting excessive pressure on the chip, thus reducing the probability of chip damage. Similarly, the cooperation of the third driving component, the second moving component, and the limiting component ensures that the chip on the chip-fetching component 40 is in close contact with the unloading device to achieve chip release, and also prevents the chip-fetching component 40 from exerting excessive pressure on the chip, reducing the probability of chip damage.
[0056] In some embodiments, see Figure 1 and Figure 2The fourth displacement component 50 also includes a mating part, which is fitted onto the limiting part. The flipping device 100 also includes a detection unit 500, which includes a first detection element 60, which is fitted onto the body 200.
[0057] When the limiting member and the moving member abut against the limiting position, the limiting member and the moving member together cover the mating member. When the die-picking member 40 cooperates with an external device to perform chip picking and placing operations, the external device applies external force to the die-picking member 40, causing the die-picking member 40 to separate the limiting member and the moving member. The first detection member 60 is configured to determine the positional relationship between the limiting member and the moving member by identifying the mating member during the chip picking and placing operations performed by the die-picking member 40 and the external device.
[0058] Understandably, during the chip picking process between the chip picking component 40 and the loading device, the third driving component drives the second moving component to abut against the limiting component and continuously applies force to the second moving component to ensure that the chip picking component 40 is in close contact with the chip on the loading device.
[0059] Furthermore, the feeding device applies an appropriate force opposite to that of the third driving member to the chip-grabbing component 40, causing the second moving component to move in the opposite direction and separate from the limiting member. The mating component then becomes exposed between the second moving component and the limiting member. The first detection component 60 then identifies the mating component to confirm that the second moving component and the limiting member are in a separated state. This further confirms that the chip-grabbing component 40 has completed chip removal, facilitating the control of the flipping device 100 for the next operation and improving operational efficiency.
[0060] Similarly, during the chip release process between the chip picker 40 and the loading device, the third driving member drives the second moving member to abut against the limiting member and continuously applies force to the second moving member to ensure that the chip on the chip picker 40 is in close contact with the unloading device.
[0061] Furthermore, the unloading device applies an appropriate force opposite to that of the third driving member to the die-grabbing component 40, causing the second moving component to move in the opposite direction and separate from the limiting member. The mating component then becomes exposed between the second moving component and the limiting member. The first detection component 60 then identifies the mating component to confirm that the second moving component and the limiting member are in a separated state. This further confirms that the die-grabbing component 40 has completed the chip release.
[0062] In some embodiments, see Figure 1 and Figure 2 The detection unit 500 includes a second detection element 70, which is coupled to the body 200. The second detection element 70 is configured to detect the pressure between the limiting member and the moving member.
[0063] Understandably, during the actual chip-grabbing operation of the flipping device 100, the second displacement component 20 first controls the third displacement component 30 and the chip-grabbing unit 300 to move up and down along the second direction until the chip-grabbing unit 300 is at the same height as the corresponding external device. Then, the first displacement component 10 controls the second displacement component 20 to move back and forth along the first direction, and the second displacement component 20 drives the third displacement component 30 and the chip-grabbing unit 300 to move synchronously along the first direction until the chip-grabbing unit 300 is aligned with the loading device. Simultaneously, the third driving component applies a constant force to the second moving component, causing the second moving component to move the chip-grabbing component 40 along the second direction to a preset position where it abuts against the limiting component. Subsequently, the third driving component continues to apply force to the second moving component, so that the chip-grabbing component 40 is in close contact with the chip on the loading device to achieve chip retrieval.
[0064] Furthermore, the second detection element 70 can detect the pressure between the chip picker 40 and the chip on the feeding device in real time after the second moving element and the limiting element abut against each other and the chip picker 40 is in close contact with the chip on the feeding device. This allows the user to be reminded to adjust the third driving element in time when the pressure is too high, thereby avoiding chip damage caused by excessive pressure exerted by the chip picker 40 on the chip.
[0065] Similarly, the third driving component, the second moving component, and the limiting component work together to ensure that the chip on the chip picker 40 is tightly attached to the unloading device, thus releasing the chip. Correspondingly, the second detection component 70 can detect the pressure between the chip on the chip picker 40 and the unloading device in real time after the second moving component and the limiting component abut against each other and the chip on the chip picker 40 is tightly attached to the unloading device. This allows the user to be reminded to adjust the third driving component in time when the pressure is too high, thereby avoiding chip damage caused by excessive pressure exerted by the chip picker 40 on the chip.
[0066] In some embodiments, see Figure 1 and Figure 2 The first displacement component 10 includes a guide rail 101 and a first driving member. The guide rail 101 is fitted onto the body 200 and extends along a first direction. The second displacement component 20 is movably fitted with the guide rail 101. The first driving member is drivenly connected to the second displacement component 20. The first driving member is configured to drive the second displacement component 20 to move relative to the guide rail 101 along the first direction.
[0067] Understandably, during the actual chip picking process of the flipping device 100, the second displacement component 20 first controls the third displacement component 30 and the chip picking unit 300 to move up and down along the second direction until the chip picking unit 300 is at the same height as the corresponding external device. Then, the first driving component drives the second displacement component 20 to move back and forth relative to the guide rail 101 along the first direction, and the second displacement component 20 will drive the third displacement component 30 and the chip picking unit 300 to move synchronously along the first direction until the chip picking unit 300 is aligned with the loading device, thereby effectively improving the chip picking accuracy. The guide rail 101 guides the second displacement component 20, allowing it to move smoothly and preventing it from deviating, thus ensuring the accuracy of its movement.
[0068] Furthermore, after the flipping device 100 completes the chip picking, the third displacement component 30 drives the chip picking unit 300 to rotate around the rotation fulcrum, and in conjunction with the first driving component, drives the second displacement component 20 to move back and forth relative to the guide rail 101 in the first direction. The second displacement component 20 will drive the third displacement component 30 and the chip picking unit 300 to move synchronously, so that the chip picking unit 300 is aligned with the unloading device, so as to complete the chip release.
[0069] In some embodiments, see Figure 1 and Figure 2 The second displacement component 20 includes a first moving member 201, a second mounting base, and a second driving member 203. The second mounting base is movably coupled to the first displacement component 10. The second driving member 203 is connected between the first moving member 201 and the second mounting base. The crystal picking unit 300 is coupled to the first moving member 201, and the second driving member 203 is configured to drive the first moving member 201 to move the crystal picking unit 300 along a second direction.
[0070] Understandably, during the actual chip picking process of the flipping device 100, the first moving component 201 is first driven to move up and down along the second direction by the second driving component 203. The first moving component 201 will drive the third displacement component 30 and the chip picking unit 300 to move synchronously along the second direction until the chip picking unit 300 is at the same height as the corresponding external device. Then, the second displacement component 20 is driven to move back and forth relative to the guide rail 101 along the first direction by the first driving component. The second displacement component 20 will drive the third displacement component 30 and the chip picking unit 300 to move synchronously along the first direction until the chip picking unit 300 is aligned with the loading device, thereby effectively improving the chip picking accuracy.
[0071] Furthermore, after the flipping device 100 completes the chip picking, the third displacement component 30 drives the chip picking unit 300 to rotate around the rotation fulcrum, and in conjunction with the first driving component, drives the second displacement component 20 to move back and forth relative to the guide rail 101 in the first direction. The second displacement component 20 will drive the third displacement component 30 and the chip picking unit 300 to move synchronously, so that the chip picking unit 300 is aligned with the unloading device, so as to complete the chip release.
[0072] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.
[0073] The embodiments described above are merely illustrative of several implementation methods of this application, and while the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the patent application. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this application, and these all fall within the protection scope of this application. Therefore, the protection scope of this patent application should be determined by the appended claims.
Claims
1. A turnover device, characterized in that include: body; The chip picking unit is configured to perform chip picking and placing operations; The displacement unit includes a first displacement component, a second displacement component, and a third displacement component. The first displacement component is mounted on the machine body, and the second displacement component is movably mounted on the first displacement component. The first displacement component is configured to drive the second displacement component to move along a first direction. One end of the third displacement component is connected to the crystal-taking unit, and the other end of the third displacement component is movably connected to the second displacement component, forming a rotation fulcrum. The third displacement component is configured to drive the crystal-taking unit to rotate around the rotation fulcrum. The second displacement component is also configured to drive the third displacement component and the crystal-taking unit to move along a second direction intersecting the first direction.
2. The turnover device according to claim 1, characterized in that The first displacement component includes a guide rail and a first driving member. The guide rail is coupled to the machine body and extends along a first direction. The second displacement component is movably coupled to the guide rail. The first driving member is drivenly connected to the second displacement component. The first driving member is configured to drive the second displacement component to move relative to the guide rail along the first direction.
3. The turnover device according to claim 1, characterized in that The second displacement component includes a first moving member, a first mounting base, and a second driving member. The first mounting base is movably coupled to the first displacement component, and the second driving member is connected between the first moving member and the first mounting base. The crystal-taking unit is coupled to the first moving member, and the second driving member is configured to drive the first moving member to move the crystal-taking unit along a second direction.
4. The turnover device according to claim 1, characterized in that The crystal-taking unit includes a crystal-taking component, a fourth displacement component, and a mounting base. The mounting base is connected between the fourth displacement component and the third displacement component. The crystal-taking component is fitted onto the fourth displacement component. The fourth displacement component is configured to drive the crystal-taking component to move along a first direction.
5. The flipping device according to claim 4, characterized in that, The fourth displacement component includes a second moving member and a third driving member. The third driving member is coupled to the second mounting base, and the second moving member is connected between the third driving member and the crystal picking member. The third driving member is configured to drive the second moving member to move the crystal picking member along a second direction.
6. The flipping device according to claim 5, characterized in that, The fourth displacement component includes a limiting member, which is coupled to the mounting base and located on the path along which the second moving member moves in the second direction; When the second moving member moves to a preset position along the second direction under the drive of the third driving member, the limiting member abuts against and limits the second moving member.
7. The flipping device according to claim 6, characterized in that, The fourth displacement component further includes a mating component, which is engaged with the limiting component; The flipping device further includes a detection unit, which includes a first detection element that is coupled to the machine body; Specifically, when the limiting member abuts against the moving member, the limiting member and the moving member together cover the mating member; when the die-picking member cooperates with an external device to perform chip picking and placing operations, the die-picking member, under the action of external force, causes the limiting member and the moving member to separate; the first detection member is configured to determine the positional relationship between the limiting member and the moving member by identifying the mating member during the chip picking and placing operations performed by the die-picking member and the external device.
8. The flipping device according to claim 6, characterized in that, The detection unit includes a second detection element, which is coupled to the body of the machine; the second detection element is configured to detect the pressure between the limiting member and the moving member.
9. A processing system, characterized in that, Includes the flipping device as described in any one of claims 1 to 8.
10. The processing system according to claim 9, characterized in that, It also includes a loading device and a unloading device. The loading device is configured to cooperate with the chip picking unit to pick up the chip; the unloading device is configured to cooperate with the chip picking unit to release the chip.