Wafer transport system

Abstract

This invention provides a wafer transport system. The wafer transport system includes a wafer carrier (1) with through holes (11); a top wafer module (2), which includes a top wafer assembly and a lifting assembly. The lifting assembly includes a fixed part and a movable part connected by a drive. The fixed part is disposed on the wafer carrier (1) and can move with the wafer carrier (1); the movable part is connected to the top wafer assembly and can drive the top wafer assembly to extend or retract from the through holes (11); the top wafer module (2) can pass through the through holes (11) to eject the wafer from the wafer carrier (1). The wafer transport system provided by this invention can solve the problem that the top wafer module and the top wafer hole need to be aligned and calibrated each time wafers are loaded or unloaded, resulting in reduced wafer loading efficiency and high top wafer rod wear rate.

Description

Technical Field

[0001] This utility model relates to the field of semiconductor manufacturing equipment technology, and more specifically, to a wafer transport system. Background Technology

[0002] Semiconductor technology, as the cornerstone of modern information society, plays an immeasurable role in driving technological progress and promoting economic development. In the semiconductor device manufacturing process, wafer bonding is a crucial step in achieving advanced packaging technologies such as 3D integration and heterogeneous integration, while wafer inspection equipment is the core equipment for ensuring bonding accuracy and improving device performance and yield. Precise wafer alignment can effectively reduce alignment errors after bonding, thereby improving the quality and consistency of the final product.

[0003] During wafer alignment and bonding, wafer carriers are typically used to support and fix the wafers, resulting in a tight fit between the wafer and the carrier after placement. To reduce the difficulty of wafer removal, a top-ejector structure is usually used to eject the wafer from the carrier through top-ejector holes. However, existing top-ejector modules are usually located on the worktable, requiring alignment and calibration between the top-ejector module and the top-ejector holes each time wafers are loaded or unloaded. This significantly reduces wafer removal efficiency. Furthermore, misalignment between the top-ejector module and the top-ejector holes frequently leads to damage to the top-ejector rods, resulting in a high wear rate. Utility Model Content

[0004] The main objective of this invention is to provide a wafer transport system that can solve the problem of reduced wafer loading efficiency and high wafer rod wear rate caused by the need to align and calibrate the top wafer module and top wafer hole every time wafers are loaded or unloaded.

[0005] To achieve the above objectives, according to one aspect of the present invention, a wafer transport system is provided, including a wafer carrier with through holes; a top wafer module, the top wafer module including a top wafer assembly and a lifting assembly, the lifting assembly including a fixed part and a movable part connected by a drive, the fixed part being disposed on the wafer carrier and capable of moving with the wafer carrier; the movable part being connected to the top wafer assembly, the movable part being capable of driving the top wafer assembly to extend or retract from the through holes; the top wafer module being capable of ejecting the wafer from the wafer carrier through the through holes.

[0006] Furthermore, the top plate assembly includes a top plate rod and a mounting base, the mounting base being disposed on the movable part, and the top plate rod being disposed on the mounting base and extending toward the through hole.

[0007] Furthermore, at least three top plate rods are arranged circumferentially on the mounting base.

[0008] Furthermore, the fixing part includes a driving device, which is fixedly mounted on the wafer carrier and is capable of driving the top wafer assembly to rise and fall.

[0009] Furthermore, the fixed part also includes a lead screw, which is connected to the drive device for transmission; the movable part includes a slider; the slider is sleeved on the lead screw, and the slider can move up and down as the lead screw rotates, and the slider is connected to the top plate assembly.

[0010] Furthermore, the lifting assembly also includes a transmission unit, one end of which is located at the output end of the drive device, and the other end is connected to the lead screw drive. The drive device and the lead screw are located on the same side of the transmission unit.

[0011] Furthermore, the lifting assembly also includes an adapter, through which the drive unit is fixedly connected to the wafer carrier.

[0012] Furthermore, the top panel module also includes a displacement detection device, which can detect the lifting displacement of the top panel assembly.

[0013] Furthermore, the lifting assembly also includes a photoelectric detector, which includes a photoelectric switch and a sensing plate. One of the photoelectric switch and the sensing plate is fixedly connected to the adapter, and the other is fixedly connected to the moving part. The photoelectric detector can detect whether the top plate assembly has reached the preset position.

[0014] Furthermore, the displacement detection device includes a grating ruler and a reading head, the lifting assembly also includes an adapter, and the top plate assembly also includes a mounting base. One of the grating ruler and the reading head is fixedly connected to the adapter, and the other is fixedly connected to the mounting base. The grating ruler and the reading head work together to detect the lifting displacement of the mounting base relative to the adapter.

[0015] Applying the technical solution of this utility model, the main function of the wafer carrier is to support and fix the wafer, ensuring its stability during processing. Through-holes are provided on it to allow the wafer assemblies of the wafer assemblies module to pass through these holes when needed, thereby achieving precise wafer lifting and significantly reducing the difficulty of wafer removal. The wafer assemblies module is designed to efficiently and non-destructively eject the wafer from the wafer carrier, facilitating subsequent processing or wafer transfer. The wafer assemblies module includes a wafer assemblies and a lifting assembly. The wafer assemblies directly contact the wafer, supporting and fixing it during the wafer lifting process to ensure its stability during lifting. The lifting assembly drives the wafer assemblies to move vertically in the Z-axis.

[0016] The lifting assembly consists of a fixed part and a movable part connected by a drive mechanism. The fixed part typically includes a drive device such as a motor, pneumatic cylinder, or hydraulic cylinder, as well as a transmission structure such as a screw. The fixed part is fixed relative to the wafer carrier and can drive the movable part and the top wafer assembly connected to the movable part to perform lifting and lowering movements. The movable part typically includes a slider or mounting base. The movable part is mainly used to connect the top wafer assembly and the fixed part, ensuring that the driving force of the fixed part can be transmitted to the top wafer assembly, thereby driving the top wafer assembly to perform lifting and lowering movements. Attached Figure Description

[0017] The accompanying drawings, which form part of this specification, are used to provide a further understanding of this utility model. The illustrative embodiments and descriptions of this utility model are used to explain this utility model and do not constitute an undue limitation thereof. In the drawings:

[0018] Figure 1 A schematic diagram of the overall structure of the wafer transport system of this utility model is shown;

[0019] Figure 2 A side view of the wafer transport system of this invention from a first angle is shown;

[0020] Figure 3 A second-angle side view of the wafer transport system of this invention is shown;

[0021] Figure 4 A top view of the wafer transport system of this invention is shown;

[0022] Figure 5 A schematic diagram of the overall structure of the top wafer module of the wafer transport system of this utility model is shown;

[0023] Figure 6 An exploded view of the top wafer module of the wafer transport system of this invention is shown;

[0024] Figure 7 A top view of the top wafer module of the wafer transport system of this invention is shown;

[0025] Figure 8 A side view of the top wafer module of the wafer carrier system of this invention is shown from a first angle.

[0026] Figure 9 This shows a second-angle side view of the top wafer module of the wafer carrier system of this invention;

[0027] Figure 10 This is a third-angle side view of the top wafer module of the wafer carrier system of this invention.

[0028] The above figures include the following reference numerals:

[0029] 1. Wafer carrier; 11. Through hole; 2. Top chip module; 211. Top chip rod; 212. Mounting base; 221. Drive device; 222. Lead screw; 223. Slider; 224. Transmission part; 23. Displacement detection device; 4. Adapter; 41. First adapter; 42. Second adapter. Detailed Implementation

[0030] It should be noted that, where there is no conflict, the embodiments and features in the embodiments of this utility model can be combined with each other. The present utility model will now be described in detail with reference to the accompanying drawings and embodiments.

[0031] See also Figures 1 to 10 As shown, this utility model provides a wafer transport system, which includes a wafer carrier 1 and a top wafer module 2. The wafer carrier 1 has a through-hole 11. The top wafer module 2 includes a top wafer assembly and a lifting assembly. The lifting assembly includes a fixed part and a movable part connected by a drive. The fixed part is disposed on the wafer carrier 1 and can move with the wafer carrier 1. The movable part is connected to the top wafer assembly and can drive the top wafer assembly to extend or retract from the through-hole 11. The top wafer module 2 can push the wafer out of the wafer carrier 1 through the through-hole 11.

[0032] In the above technical solution, the main function of the wafer carrier 1 is to support and fix the wafer, ensuring its stability during processing. Through-holes 11 are provided on it to allow the wafer assembly of the wafer top module 2 to pass through these holes when needed, thereby achieving precise wafer lifting and significantly reducing the difficulty of wafer removal. The wafer top module 2 is designed to efficiently and non-destructively eject the wafer from the wafer carrier 1, facilitating subsequent processing or wafer transfer. The wafer top module 2 includes a wafer top assembly and a lifting assembly. The wafer top assembly directly contacts the wafer, supporting and fixing it during the wafer lifting process to ensure its stability during lifting. The lifting assembly drives the wafer top assembly to move vertically in the Z-axis direction.

[0033] The lifting assembly consists of a fixed part and a movable part connected by a drive mechanism. The fixed part typically includes a drive device such as a motor, pneumatic cylinder, or hydraulic cylinder, as well as a transmission structure such as a screw. The fixed part is fixed relative to the wafer carrier 1 and can drive the movable part and the top wafer assembly connected to the movable part to perform lifting and lowering movements. The movable part typically includes a slider or a mounting base. The movable part is mainly used to connect the top wafer assembly and the fixed part, ensuring that the driving force of the fixed part can be transmitted to the top wafer assembly, thereby driving the top wafer assembly to perform lifting and lowering movements.

[0034] In one embodiment of the present invention, the top plate assembly includes a top plate rod 211 and a mounting base 212. The mounting base 212 is disposed on the movable part, and the top plate rod 211 is disposed on the mounting base 212 and extends toward the through hole 11.

[0035] In the above technical solution, the top plate lever 211 is the component that directly contacts the wafer. Driven by the lifting assembly, the top plate lever 211 rises, passes through the through-hole 11, contacts the wafer, and lifts the wafer from the wafer carrier 1. The end design of the top plate lever 211 typically considers the wafer's size and material properties, for example, using a softer material such as rubber to ensure sufficient lifting force without damaging the wafer. The mounting base 212 provides a reliable mounting foundation for the top plate lever 211. Multiple top plate levers 211 can be mounted on the mounting base 212, connecting them into a single unit for lifting and lowering movement. This ensures synchronized movement of all top plate levers 211, improving their stability and consistency during the lifting process.

[0036] In one embodiment of this utility model, at least three top plate rods 211 are arranged circumferentially on the mounting base 212.

[0037] In the above technical solution, at least three top rods 211 are evenly arranged in the circumferential direction to ensure that the wafer is lifted evenly and to prevent the wafer from tilting during the lifting process. In addition, it can also ensure that the top rods 211 evenly distribute the pressure on the wafer during lifting, so as to avoid damage to the wafer due to excessive local stress.

[0038] In one embodiment of the present invention, the fixing part includes a driving device 221, which is fixedly mounted on the wafer carrier 1 and can drive the top wafer assembly to rise and fall.

[0039] In the above technical solution, the drive device 221 typically includes a screw motor, rack and pinion, or linear motor, etc. The function of the drive device 221 is to provide the driving force required for the lifting and lowering of the top wafer assembly. The drive device 221 is fixedly mounted on the wafer carrier 1 so that the drive device 221 can move together with the wafer carrier 1, thereby ensuring a stable relative position between the drive device 221 and the top wafer assembly, and thus ensuring the stability of the drive force output and transmission.

[0040] In one embodiment of this utility model, the fixing part further includes a lead screw 222, which is connected to the driving device 221. The movable part includes a slider 223. The slider 223 is sleeved on the lead screw 222 and connected to the mounting base 212. The slider 223 can move up and down with the rotation of the lead screw 222, thereby driving the mounting base 212 to move up and down together. The slider 223 is connected to the top plate assembly.

[0041] In the above technical solution, the lead screw 222 is connected to the drive device 221 to convert the rotational motion of the drive device 221 into the linear motion of the slider 223. The slider 223 is connected to the mounting base 212, thereby driving the top plate rod 211 connected to the mounting base 212 to move up and down. The lead screw structure has the characteristics of high transmission accuracy and smooth power transmission. Therefore, the transmission cooperation between the lead screw 222 and the slider 223 can significantly improve the accuracy and smoothness of the lifting motion of the top plate assembly, thereby ensuring that the wafer can be accurately ejected to the target position, while reducing the possibility of the wafer deviating and falling off during the lifting process.

[0042] In one embodiment of the present invention, the lifting assembly further includes a transmission part 224. One end of the transmission part 224 is disposed at the output end of the drive device 221, and the other end is connected to the lead screw 222 for transmission. The drive device 221 and the lead screw 222 are disposed on the same side of the transmission part 224.

[0043] In the above technical solution, the transmission unit 224 can be a coupling, belt, chain, or gear transmission structure. One end of the transmission unit 224 is located at the output end of the drive device 221, and the other end is connected to the lead screw 222, thereby transmitting the output motion of the drive device 221 to the lead screw 222. By placing the drive device 221 and the lead screw 222 on the same side of the transmission unit 224 to form a reverse lead screw structure, the space occupied in the Z-axis direction can be effectively reduced, the space utilization rate can be improved, and the overall structure of the wafer transport system can be made more compact.

[0044] In one embodiment of this utility model, the transmission part 224 consists of two parts, wherein the first part is a coupling, and the second part can be a belt or chain, or a gear structure that meshes with each other, etc. One end of the first part (coupling) is connected to the output end of the drive device 221, and the other end is connected to the input end of the second part (transmission structure). The output end of the second part (transmission structure) is connected to the lead screw 222.

[0045] In the above technical solution, the coupling is used to connect the input end of the transmission structure and the output end of the drive device, ensuring that the driving force of the drive device can be transmitted to the transmission structure. The output end of the second part (transmission structure) is connected to the lead screw 222, so that the driving force output by the drive device can be transmitted to the lead screw through the transmission structure. By setting the transmission part 224, which includes the first part (coupling) and the second part (transmission structure), the adaptability of the transmission part 224 to accurately transmit power in different scenarios can be improved. Especially in the scenario where the drive device 221 and the lead screw 222 are set on the same side of the transmission part 224 to form a reverse lead screw structure, the transmission part 224 using the above solution can ensure smooth and accurate power transmission while minimizing vertical space occupation, making the overall structure of the wafer transport system more compact and improving space utilization.

[0046] In one embodiment of the present invention, the lifting assembly further includes an adapter 4, and the driving device 221 is fixedly connected to the wafer carrier 1 through the adapter 4.

[0047] In the above technical solution, the adapter 4 is used to connect the drive device 221 of the fixing part and the wafer carrier 1, so that the drive device 221 is fixed relative to the wafer carrier 1 and can move together with the wafer carrier 1. At the same time, the adapter 4 can also carry other components, such as displacement detection devices or photodetectors, to ensure that they can be reliably installed and fixed and can perform their functions.

[0048] In one embodiment of the present invention, the top panel module 2 further includes a displacement detection device 23, which can detect the lifting displacement of the top panel assembly.

[0049] In the above technical solution, the displacement detection device 23 is mainly used to detect the lifting displacement of the top panel assembly. The displacement detection device 23 typically includes a grating ruler and a reading head system. When the top panel assembly rises or falls, the reading head slides along the grating ruler, and the displacement is calculated by reading the scale lines on the grating ruler. Alternatively, it may include a magnetic ruler and a magnetic head system. The installation method of the magnetic ruler and magnetic head is similar to that of the grating ruler and reading head, but the displacement is detected by the change of magnetic field. The magnetic head moves along the magnetic ruler, and the lifting displacement of the top panel assembly is calculated based on the sensed magnetic field change information.

[0050] In one embodiment of this utility model, the displacement detection device 23 includes a grating ruler and a reading head. The top plate assembly also includes a mounting base 212. One of the grating ruler and the reading head is fixed relative to the adapter 4, and the other is fixed relative to the mounting base 212. The grating ruler and the reading head work together to detect the lifting displacement of the mounting base 212 relative to the adapter 4.

[0051] In the above technical solution, one of the grating ruler and the reader is fixed to the adapter 4, or mounted on another component fixed relative to the adapter 4, while the other of the grating ruler and the reader is fixed to the mounting base 212, or mounted on another component fixed relative to the mounting base 212. This ensures that the other of the grating ruler and the reader can move together with the lifting and lowering of the top panel assembly. The grating ruler is mainly used to provide a reference standard for displacement detection of the reader. The reader is the detection unit in the grating ruler system. Through the cooperation of the reader and the grating ruler, the effect of detecting the magnitude of the lifting and lowering displacement of the top panel assembly is achieved.

[0052] In one embodiment of this utility model, the lifting assembly further includes a photoelectric detector, which includes a photoelectric switch and a sensing plate. One of the photoelectric switch and the sensing plate is fixed relative to the adapter 4, and the other is fixed relative to the movable part. The photoelectric detector can detect whether the top plate assembly has reached the preset position.

[0053] In the above technical solution, the first of the photoelectric switch and the sensing element is fixed to the adapter 4, or mounted on other components fixed relative to the adapter 4. The second of the photoelectric switch and the sensing element is fixed to the movable part, or mounted on other components fixed relative to the movable part. The first of the photoelectric switch and the sensing element is fixed at a preset position. When the second of the photoelectric switch and the sensing element moves to this preset position, the system operates according to the detection signal. In particular, when the first is fixed at the travel limit position, the lifting range of the movable part can be limited, ensuring that the movable part moves within a safe range. When the second moves to this travel limit position, a signal is triggered. The photoelectric detector feeds this signal back to the system. The system then issues an overtravel alarm based on the signal and controls the movable part to stop or retract, thereby preventing structural damage caused by overtravel of the movable part. This effectively protects the lifting assembly and improves its safety and reliability.

[0054] In addition, the preset position can also be the position when the top wafer module 2 lifts the wafer into place, or the position when the top wafer module 2 lowers and drives the wafer into place. By fixing the first of the photoelectric switch and the sensor in this preset position, the second of the photoelectric switch and the sensor can trigger a signal when the top wafer module 2 lifts or lowers the wafer into place. The photoelectric detector feeds the signal back to the system, and the system provides a wafer placement reminder based on the signal and controls the moving part to stop or revert to other actions. This ensures that the system can automatically and accurately control the top wafer module 2 to transport the wafer to the target position, improving the automation level of the system and the safety and accuracy of wafer lifting and lowering.

[0055] In one embodiment of the present invention, the adapter 4 includes a first adapter portion 41 and a second adapter portion 42, wherein the first adapter portion 41 is fixed on the wafer carrier 1, and a protrusion extending toward the through hole 11 is provided on the first adapter portion 41, so that the first adapter portion 41 is T-shaped in whole, the second adapter portion 42 is disposed on the protrusion and extends downward, and the top plate module is disposed on the second adapter portion 42.

[0056] In the above technical solution, the first adapter 41 is used to connect the second adapter 42 and the wafer carrier 1. The first adapter 41 is designed in a T-shape, so that the protrusion on the first adapter 41 extends towards the through hole 11, ensuring that the second adapter 42 and the top wafer module 2, which are provided on the protrusion, can maintain a certain safe distance from the wafer carrier 1, avoiding interference between the lifting components in the top wafer module 2 and the wafer carrier 1 when they are raised or lowered. The second adapter 42 is used to support the top wafer module 2. The second adapter 42 is provided on the protrusion and extends downward, providing a larger installation area for the top wafer module 2 in the vertical plane, thereby improving the reliability and stability of the top wafer module 2. At the same time, other expansion components such as photodetectors and displacement detection devices 23 can also be installed on the second adapter 42 as needed, improving the scalability of the transport system.

[0057] From the above description, it can be seen that the above embodiments of this utility model achieve the following technical effects: The main function of the wafer carrier 1 is to support and fix the wafer, ensuring that the wafer remains stable during processing. Through holes 11 are provided on it to allow the top wafer assembly of the top wafer module 2 to pass through these through holes when needed, thereby achieving precise wafer lifting and significantly reducing the difficulty of wafer removal. The top wafer module 2 is designed to efficiently and non-destructively eject the wafer from the wafer carrier 1, facilitating subsequent processing or wafer transfer. The top wafer module 2 includes a top wafer assembly and a lifting assembly. The top wafer assembly directly contacts the wafer, supporting and fixing it during the wafer lifting process to ensure the stability of the wafer during lifting. The lifting assembly drives the top wafer assembly to move vertically in the Z-direction.

[0058] The lifting assembly consists of a fixed part and a movable part connected by a drive mechanism. The fixed part typically includes a drive device such as a motor, pneumatic cylinder, or hydraulic cylinder, as well as a transmission structure such as a screw. The fixed part is fixed relative to the wafer carrier 1 and can drive the movable part and the top wafer assembly connected to the movable part to perform lifting and lowering movements. The movable part typically includes a slider or a mounting base. The movable part is mainly used to connect the top wafer assembly and the fixed part, ensuring that the driving force of the fixed part can be transmitted to the top wafer assembly, thereby driving the top wafer assembly to perform lifting and lowering movements.

[0059] Obviously, the embodiments described above are only some embodiments of this utility model, and not all embodiments. Based on the embodiments of this utility model, all other embodiments obtained by those skilled in the art without creative effort should fall within the protection scope of this utility model.

[0060] It should be noted that the terminology used herein is for the purpose of describing particular embodiments only and is not intended to limit the exemplary embodiments according to this application. As used herein, the singular form is intended to include the plural form as well, unless the context clearly indicates otherwise. Furthermore, it should be understood that when the terms "comprising" and / or "including" are used in this specification, they indicate the presence of features, steps, operations, devices, components, and / or combinations thereof.

[0061] The above description is merely a preferred embodiment of this utility model and is not intended to limit the utility model. Various modifications and variations can be made to this utility model by those skilled in the art. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this utility model should be included within the protection scope of this utility model.

Claims

1. A wafer transport system, characterized in that, include: A wafer carrier (1) is provided with through holes (11); a top plate module (2) is provided with a top plate assembly and a lifting assembly. The lifting assembly includes a fixed part and a movable part that are driven to be connected. The fixed part is provided on the wafer carrier (1) and can move with the wafer carrier (1). The movable part is connected to the top plate assembly, and the movable part can drive the top plate assembly to extend or retract from the through hole (11); The top plate module (2) can push the wafer out of the wafer carrier (1) through the through hole (11).

2. The wafer transport system according to claim 1, characterized in that, The top plate assembly includes a top plate rod (211) and a mounting base (212), the mounting base (212) being disposed on the movable part, and the top plate rod (211) being disposed on the mounting base (212) and extending toward the through hole (11).

3. The wafer transport system according to claim 2, characterized in that, At least three of the top plate rods (211) are arranged circumferentially on the mounting base (212).

4. The wafer transport system according to claim 1, characterized in that, The fixing part includes a driving device (221), which is fixedly mounted on the wafer carrier (1) and can drive the top wafer assembly to rise and fall.

5. The wafer transport system according to claim 4, characterized in that, The fixing part also includes a lead screw (222), which is connected to the driving device (221) in a transmission manner; The movable part includes: a slider (223); the slider (223) is sleeved on the lead screw (222), the slider (223) can move up and down as the lead screw (222) rotates, and the slider (223) is connected to the top plate assembly.

6. The wafer transport system according to claim 5, characterized in that, The lifting assembly also includes a transmission part (224), one end of which is disposed at the output end of the drive device (221), and the other end is connected to the lead screw (222). The drive device (221) and the lead screw (222) are disposed on the same side of the transmission part (224).

7. The wafer transport system according to claim 6, characterized in that, The lifting assembly also includes an adapter (4), and the drive device (221) is fixedly connected to the wafer carrier (1) through the adapter (4).

8. The wafer transport system according to claim 6, characterized in that, The top panel module (2) also includes a displacement detection device (23), which can detect the lifting displacement of the top panel assembly.

9. The wafer transport system according to claim 7, characterized in that, The lifting assembly also includes a photoelectric detector, which includes a photoelectric switch and a sensing plate. One of the photoelectric switch and the sensing plate is fixedly connected to the adapter (4), and the other is fixedly connected to the movable part. The photoelectric detector can detect whether the top plate assembly has reached a preset position.

10. The wafer transport system according to claim 8, characterized in that, The displacement detection device (23) includes a grating ruler and a reading head. The top plate assembly also includes a mounting base (212). The lifting assembly also includes an adapter (4). One of the grating ruler and the reading head is fixedly connected to the adapter (4), and the other is fixedly connected to the mounting base (212). The grating ruler and the reading head cooperate to detect the lifting displacement of the mounting base (212) relative to the adapter (4).

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