A fixing mechanism for wafer processing

Abstract

This utility model belongs to the field of wafer processing technology and discloses a fixing mechanism for wafer processing, including a processing table. Two threaded limit frames are slidably connected inside the processing table. Each threaded limit frame has a mounting groove inside. A sliding rheostat is fixedly connected to one side of the inner wall of the mounting groove. A connecting plate is fixedly connected to one side of the slider inside the sliding rheostat. Compared with the prior art, the beneficial effects of this utility model are as follows: By setting up a sliding rheostat, a connecting plate, and a cylinder, this utility model can adjust the fixing height according to wafers of different thicknesses. Furthermore, according to the wafer thickness, the connecting plate drives the slider inside the sliding rheostat to move upwards. The sliding rheostat is connected to the cylinder through wires, so that the cylinder's fixing pressure is greater when the wafer is thicker, and the fixing force is reduced for thinner wafers.

Description

Technical Field

[0001] This utility model belongs to the field of wafer processing technology, specifically a fixing mechanism for wafer processing. Background Technology

[0002] A wafer is a silicon wafer used to make silicon semiconductor circuits. Its raw material is silicon. High-purity polycrystalline silicon is dissolved and mixed with silicon crystal seed crystals. Then it is slowly pulled out to form a cylindrical single crystal silicon. After grinding, polishing and slicing, the silicon crystal rod is formed into a silicon wafer, which is a wafer.

[0003] In the wafer fabrication process, a fixing mechanism is needed to fix the wafer in position to ensure stability during processing. However, wafers come in different thicknesses. For thinner wafers, it is necessary to reduce the fixing force while ensuring the fixing effect to prevent damage to the wafer due to excessive fixing force. For thicker wafers, some processing areas are subjected to excessive force, and the fixing force needs to be increased to prevent poor fixing effect. However, the fixing force used by the existing fixing mechanism is not easy to adaptively adjust when fixing the wafer. Utility Model Content

[0004] To address the problems mentioned in the background art, this utility model provides a fixing mechanism for wafer processing.

[0005] To achieve the above objectives, this utility model provides the following technical solution: a fixing mechanism for wafer processing, comprising a processing table, wherein two threaded limiting frames are slidably connected inside the processing table, and each of the two threaded limiting frames has a mounting groove inside. A sliding rheostat is fixedly connected to one side of the inner wall of the mounting groove, and a connecting plate is fixedly connected to one side of the sliding plate inside the sliding rheostat. A cylinder is fixedly connected to the top of the threaded limiting frame, and an upper fixing block is fixedly connected to the output end of the cylinder. A lower fixing block is fixedly connected to the bottom of the upper fixing block, and a first ring plate is fixedly connected to the top of the lower fixing block. A second ring plate is slidably connected inside the first ring plate, and a third ring plate is slidably connected inside the second ring plate. A magnet is fixedly connected to the top of the third ring plate, and an electromagnet is fixedly connected to the bottom of the upper fixing block.

[0006] Preferably, an inner ring plate is fixedly connected to the bottom of the third ring plate, a middle ring plate is fixedly connected to the bottom of the second ring plate, and an outer ring plate is fixedly connected to the bottom of the first ring plate. The bottoms of the inner ring plate, the middle ring plate, and the outer ring plate are all fixedly connected with multiple fixed feet at equal intervals around the circumference.

[0007] Preferably, the fixing pad is made of silicone.

[0008] Preferably, the bottom of the third ring plate is located inside the second ring plate and is fixedly connected to a second spring, the bottom of the second spring being fixedly connected to the bottom of the inner side of the second ring plate. The bottom of the second ring plate is located inside the first ring plate and is fixedly connected to a first spring, the bottom of the first spring being fixedly connected to the bottom of the inner side of the first ring plate.

[0009] Preferably, the bottom of the electromagnet and the top of the magnet have the same magnetic poles on opposite sides.

[0010] Preferably, a fixed box is fixedly connected to the bottom of the processing table, a second motor is fixedly connected to the bottom inside the fixed box, a worm gear is fixedly connected to the output end of the second motor, a worm wheel is meshed with one side of the worm gear, a bidirectional lead screw is fixedly connected inside the worm wheel, and the outer side of the bidirectional lead screw is threadedly connected to the threaded limit frame.

[0011] Preferably, a support platform is fixedly connected to the bottom of the processing table, a base is rotatably connected to the bottom of the support platform, a first motor is fixedly connected inside the base, and the output end of the first motor is fixedly connected to the bottom of the support platform.

[0012] Preferably, the threaded limiting bracket has a limiting groove inside that mates with the connecting plate.

[0013] Compared with the prior art, the beneficial effects of this utility model are as follows: This invention, by incorporating a sliding rheostat, a connecting plate, and a cylinder, allows for adjustment of the fixing height based on the thickness of the wafer. The connecting plate moves the slider within the rheostat upwards, and the rheostat is connected to the cylinder via wires. This allows for greater cylinder fixing pressure for thicker wafers and reduced fixing force for thinner wafers. The invention also includes a fixing block, a lower fixing block, a first ring plate, a second ring plate, a third ring plate, a magnet, and an electromagnet. The electromagnet is connected to the rheostat via wires. This design allows for a smaller magnet size and less repulsive force on the magnet when the wafer is thicker, resulting in a smaller fixing contact area. Conversely, a larger magnetic force and a larger fixing contact area are achieved when the wafer is thinner. This ensures more even force distribution when fixing thinner wafers, and the simultaneous application of force at multiple contact points effectively reduces localized stress concentration on the wafer. Attached Figure Description

[0014] Figure 1 This is a three-dimensional structural diagram of the present invention; Figure 2 This is a schematic diagram of the internal structure of the present invention; Figure 3 This is a schematic diagram of the internal structure of the processing table and the fixing box of this utility model; Figure 4 This is a schematic diagram of the internal structure of the threaded limit frame of this utility model; Figure 5 This is a schematic diagram of the internal structure of the first ring plate, the second ring plate, and the third ring plate of this utility model; Figure 6 This utility model Figure 5 A magnified structural diagram at point A in the diagram.

[0015] In the diagram: 1. Base; 2. First motor; 3. Support platform; 4. Machining table; 5. Fixing box; 6. Second motor; 7. Worm gear; 8. Worm wheel; 9. Double-acting lead screw; 10. Threaded limit bracket; 11. Sliding rheostat; 12. Cylinder; 13. Connecting plate; 14. Upper fixing block; 15. Lower fixing block; 16. First ring plate; 17. Second ring plate; 18. First spring; 19. Second spring; 20. Third ring plate; 21. Magnet; 22. Electromagnet; 23. Limiting slot; 24. Installation slot; 25. Inner ring plate; 26. Middle ring plate; 27. Outer ring plate; 28. Fixing foot pad. Detailed Implementation

[0016] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0017] like Figures 1 to 6 As shown, this utility model provides a fixing mechanism for wafer processing, including a processing table 4. Two threaded limit frames 10 are slidably connected inside the processing table 4. Each of the two threaded limit frames 10 has a mounting groove 24. A sliding rheostat 11 is fixedly connected to one side of the inner wall of the mounting groove 24. A connecting plate 13 is fixedly connected to one side of the sliding plate inside the sliding rheostat 11. A cylinder 12 is fixedly connected to the top of the threaded limit frame 10. An upper fixing block 14 is fixedly connected to the output end of the cylinder 12. A lower fixing block 15 is fixedly connected to the bottom of the upper fixing block 14. A first ring plate 16 is fixedly connected to the top of the lower fixing block 15. A second ring plate 17 is slidably connected inside the first ring plate 16. A third ring plate 20 is slidably connected inside the second ring plate 17. A magnet 21 is fixedly connected to the top of the third ring plate 20. An electromagnet 22 is fixedly connected to the bottom of the upper fixing block 14.

[0018] like Figure 5As shown, the bottom of the third ring plate 20 is fixedly connected to the inner ring plate 25, the bottom of the second ring plate 17 is fixedly connected to the middle ring plate 26, and the bottom of the first ring plate 16 is fixedly connected to the outer ring plate 27. The bottoms of the inner ring plate 25, the middle ring plate 26, and the outer ring plate 27 are all fixedly connected with multiple fixed feet 28 at equal intervals around the circumference.

[0019] The above solution can fix wafers of different thicknesses by using fixing feet 28 at the bottom of the inner ring plate 25, the middle ring plate 26 and the outer ring plate 27. By setting multiple fixing feet 28, the contact surface with the wafer can be increased, thereby reducing fixing stress.

[0020] like Figure 5 As shown, the fixed foot pad 28 is made of silicone.

[0021] The above solution can provide protection when the moving fixing foot 28 is used to fix the wafer, preventing damage.

[0022] like Figure 5 As shown, the bottom of the third ring plate 20 is located inside the second ring plate 17 and is fixedly connected to the second spring 19. The bottom of the second spring 19 is fixedly connected to the bottom of the inner side of the second ring plate 17. The bottom of the second ring plate 17 is located inside the first ring plate 16 and is fixedly connected to the first spring 18. The bottom of the first spring 18 is fixedly connected to the bottom of the inner side of the first ring plate 16.

[0023] The above scheme allows the second ring plate 17 to be moved down to compress the first spring 18, and the third ring plate 20 to be moved down to compress the second spring 19, so as to provide a successive displacement function through the first spring 18 and the second spring 19 with different elasticity. When the fixing work is released, the second ring plate 17 and the third ring plate 20 can be reset by the compressed first spring 18 and the second spring 19 respectively.

[0024] like Figure 5 As shown, the bottom of electromagnet 22 and the top of magnet 21 have the same magnetic poles on opposite sides.

[0025] Using the above scheme, the electromagnet 22 can generate a repulsive force on the magnet 21, thereby adjusting and fixing the contact surface.

[0026] like Figures 2 to 3 As shown, a fixed box 5 is fixedly connected to the bottom of the processing table 4. A second motor 6 is fixedly connected to the bottom inside the fixed box 5. A worm 7 is fixedly connected to the output end of the second motor 6. A worm wheel 8 is meshed with one side of the worm 7. A bidirectional lead screw 9 is fixedly connected inside the worm wheel 8. The outer side of the bidirectional lead screw 9 is threadedly connected to the threaded limit frame 10.

[0027] Using the above solution, the fixed position can be adjusted according to wafers of different sizes.

[0028] like Figure 2 As shown, a support platform 3 is fixedly connected to the bottom of the processing table 4, and a base 1 is rotatably connected to the bottom of the support platform 3. A first motor 2 is fixedly connected inside the base 1, and the output end of the first motor 2 is fixedly connected to the bottom of the support platform 3.

[0029] The above solution allows the wafer to be installed in a suitable position via the base 1, ensuring stability during processing. Furthermore, the first motor 2 enables the wafer to be rotated, facilitating processing of wafers in different positions.

[0030] like Figure 6 As shown, the threaded limit bracket 10 has a limit groove 23 inside that mates with the connecting plate 13.

[0031] Using the above solution, the moving connecting plate 13 can be guided and limited.

[0032] Working principle and usage process of this utility model: The wafer is placed on the processing table 4. Depending on the size and thickness of the wafer, the second motor 6 is operated to rotate the worm gear 7, causing the worm gear 7 to drive the worm wheel 8. When the worm wheel 8 rotates, it drives the bidirectional lead screw 9. The rotating bidirectional lead screw 9 causes two threaded limit brackets 10 to slide closer together within the processing table 4. This allows for adjustment of the fixed spacing according to the size of the wafer being processed. After the threaded limit brackets 10 are moved to the appropriate position with the wafer, the cylinder 12 is controlled to push the upper fixing block 14. The connecting plate 13 is then fixedly connected to the outer side of the output end of the cylinder 12, allowing... When the output end of cylinder 12 moves, it can drive the connecting plate 13. The moving connecting plate 13 slides within the limiting slot 23, and through the connecting plate 13, it can drive the slider position of the sliding rheostat 11. At the same time, the bottom first ring plate 16 approaches the wafer and contacts the wafer through the fixing feet 28 on the bottom outer ring plate 27. The fixing feet 28 made of silicone material can provide protection when fixing the wafer. Cylinder 12 and electromagnet 22 are connected to the sliding rheostat 11 respectively through wires. Depending on the thickness of the wafer, the fixing position of cylinder 12 can be controlled by the sliding rheostat 11. Regarding the force applied to a thinner wafer, the sliding rheostat 11 controls the cylinder 12 to reduce the fixing force. For a thicker wafer, the sliding rheostat 11 controls the cylinder 12 to increase the fixing force. When fixing a thinner wafer, the sliding rheostat 11 controls the electromagnet 22 to increase its magnetic strength, thereby causing the electromagnet 22 to generate a repulsive force on the magnet 21. When installing the first spring 18 and the second spring 19, the elastic strength of the second spring 19 is greater than that of the first spring 18, thus allowing the downward-moving third ring plate 20 to pass through the second ring plate 17. The first ring plate 16 slides downwards, which in turn causes the second ring plate 17 to compress the first spring 18. This causes the bottom of the second ring plate 17 to contact the wafer for fixation. The thinner the wafer, the stronger the magnetic force of the electromagnet 22, which pushes the third ring plate 20 to contact the wafer. When the second ring plate 17 and the third ring plate 20 approach the wafer, they can respectively drive the silicone fixing pads 28 at the bottom of the bottom middle ring plate 26 and the inner ring plate 25 to contact and fix the wafer. This allows the contact surface to be larger when the wafer is thinner, thereby reducing the fixing stress.

[0033] It should be noted that, in this document, relational terms such as "first" and "second" are used only to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such process, method, article, or apparatus.

[0034] Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A fixing mechanism for wafer processing, comprising a processing table (4), characterized in that: The processing table (4) has two threaded limit brackets (10) slidably connected inside. Each of the two threaded limit brackets (10) has a mounting groove (24) inside. A sliding rheostat (11) is fixedly connected to one side of the inner wall of the mounting groove (24). A connecting plate (13) is fixedly connected to one side of the sliding plate inside the sliding rheostat (11). A cylinder (12) is fixedly connected to the top of the threaded limit bracket (10). An upper fixing block (14) is fixedly connected to the output end of the cylinder (12). A lower fixing block (15) is fixedly connected to the bottom of the upper fixing block (14). A first ring plate (16) is fixedly connected to the top of the lower fixing block (15). A second ring plate (17) is slidably connected inside the first ring plate (16). A third ring plate (20) is slidably connected inside the second ring plate (17). A magnet (21) is fixedly connected to the top of the third ring plate (20). An electromagnet (22) is fixedly connected to the bottom of the upper fixing block (14).

2. The wafer processing fixing mechanism according to claim 1, characterized by: The bottom of the third ring plate (20) is fixedly connected to an inner ring plate (25), the bottom of the second ring plate (17) is fixedly connected to a middle ring plate (26), and the bottom of the first ring plate (16) is fixedly connected to an outer ring plate (27). The bottoms of the inner ring plate (25), the middle ring plate (26) and the outer ring plate (27) are all fixedly connected with multiple fixed feet (28) at equal intervals around the circumference.

3. The wafer processing fixing mechanism according to claim 2, wherein: The fixed foot pad (28) is made of silicone material.

4. The wafer processing fixing mechanism according to claim 1, wherein: The bottom of the third ring plate (20) is located inside the second ring plate (17) and is fixedly connected to a second spring (19). The bottom of the second spring (19) is fixedly connected to the bottom of the inner side of the second ring plate (17). The bottom of the second ring plate (17) is located inside the first ring plate (16) and is fixedly connected to a first spring (18). The bottom of the first spring (18) is fixedly connected to the bottom of the inner side of the first ring plate (16).

5. The wafer processing fixing mechanism according to claim 1, wherein: The bottom of the electromagnet (22) and the top of the magnet (21) have the same magnetic poles on opposite sides.

6. The wafer processing fixing mechanism according to claim 1, wherein: The bottom of the processing table (4) is fixedly connected to a fixed box (5), and the bottom of the inner side of the fixed box (5) is fixedly connected to a second motor (6). The output end of the second motor (6) is fixedly connected to a worm (7). One side of the worm (7) is meshed with a worm wheel (8). The inside of the worm wheel (8) is fixedly connected to a bidirectional lead screw (9). The outer side of the bidirectional lead screw (9) is threadedly connected to a threaded limit frame (10).

7. The wafer processing fixing mechanism according to claim 1, wherein: The bottom of the processing table (4) is fixedly connected to a support platform (3), and the bottom of the support platform (3) is rotatably connected to a base (1). The base (1) is fixedly connected to a first motor (2), and the output end of the first motor (2) is fixedly connected to the bottom of the support platform (3).

8. The wafer processing fixing mechanism according to claim 1, wherein: The threaded limiting bracket (10) has a limiting slot (23) inside that matches the connecting plate (13).

Images