Bonding fixtures for power devices

Abstract

This utility model discloses a bonding fixture for power devices, comprising: two strip blocks extending along the width direction of the substrate, each strip block being movably mounted on the substrate and movable along the length direction of the substrate; each strip block having at least two support frames spaced apart along its length; a horizontal portion of each support frame, whose vertical portion is connected to a strip block, extending towards another strip block; a cylinder mounted on the upper surface of the horizontal portion of the support frame; a holding block mounted on the piston rod of the cylinder and located below the horizontal portion; and each strip block being connected to a driving assembly mounted on the substrate for driving the strip block to reciprocate along the length direction of the substrate. This utility model's bonding fixture for power devices automatically adjusts the distance between the holding blocks according to the product's specifications, thereby adapting to products of different sizes without changing the fixture, improving the efficiency of processing different batches of products.

Description

Technical Field

[0001] This utility model relates to the field of semiconductor device packaging, specifically a bonding fixture for power devices. Background Technology

[0002] Chip bonding refers to the process of cleaning two chips and then bonding them together under certain conditions to form a single unit. In the prior art, patent document CN116110839A discloses a bonding alignment device for a flip chip bonding machine. This device includes a mounting frame with a transfer mechanism on it. An array of bonding mechanisms is fixedly mounted on the side of the transfer mechanism away from the mounting frame. The bonding mechanisms have an alignment mechanism within their inner cavity. The transfer mechanism allows for intermittent 90-degree rotation of a cross-shaped transfer plate, which in turn causes the bonding mechanisms, corresponding bonding bases, and bonding grooves to rotate intermittently. This enables simultaneous alignment and loading of the lower chip, alignment and bonding of the upper chip, and heating and filling of the upper and lower chips, effectively improving processing efficiency. The bonding mechanisms also facilitate convenient movement of the upper and lower chips, providing convenience for the alignment and loading of the lower chip and the alignment and bonding of the upper chip. However, the existing bonding device's fixtures cannot be adapted to products of different sizes during use, resulting in low processing efficiency. Utility Model Content

[0003] The purpose of this invention is to provide a bonding fixture for power devices. This bonding fixture can automatically adjust the distance between the holding blocks according to the specifications and dimensions of the product, thereby adapting to products of different specifications and dimensions without changing the fixture, and improving the efficiency of processing different batches of products.

[0004] To achieve the above objectives, the technical solution adopted by this utility model is as follows: a bonding fixture for a power device, comprising: a substrate and a plurality of holding blocks disposed above the substrate. Two strip blocks, each extending along the width direction of the substrate, are disposed above the substrate. The strip blocks, movably mounted on the substrate, can move along the length direction of the substrate. Each strip block is equipped with at least two support frames spaced apart along its length direction. The horizontal portion of the support frame, whose vertical portion is connected to the strip block, extends towards another strip block. A cylinder is mounted on the upper surface of the horizontal portion of the support frame. The holding blocks are mounted on the piston rod of the cylinder and located below the horizontal portion. Each strip block is connected to a driving assembly mounted on the substrate for driving the strip block to reciprocate along the length direction of the substrate.

[0005] The following are further improvements to the above technical solution: 1. In the above scheme, each of the strip blocks is equipped with three support frames at equal intervals.

[0006] 2. In the above scheme, at least two guide grooves extending along the length direction of the substrate are spaced apart on the upper surface of the substrate, and the strip block is connected to at least two guide blocks slidably disposed in the guide grooves.

[0007] 3. In the above scheme, a lifting plate is provided between the pressing block and the horizontal part of the support frame. The surface of the lifting plate opposite to the pressing block is connected to the piston rod of the cylinder. The other surface of the lifting plate is connected to the upper surface of the pressing block by at least two elastic members.

[0008] 4. In the above scheme, all three elastic elements are springs.

[0009] Due to the application of the above technical solution, this utility model has the following advantages compared with the prior art: This utility model relates to a bonding fixture for power devices. Two strip blocks, each extending along the width of the substrate, are disposed above the substrate. These strip blocks are movably mounted on the substrate and can move along its length. Each strip block has at least two support frames spaced apart along its length. The horizontal portion of each support frame, connected vertically to a strip block, extends towards another strip block. A cylinder is mounted on the upper surface of the horizontal portion of the support frame. A holding block is mounted on the piston rod of the cylinder and located below the horizontal portion. Each strip block is connected to a drive assembly mounted on the substrate, which drives the strip block to reciprocate along the length of the substrate. In addition to holding and positioning the product to be processed, the distance between the holding blocks can be automatically adjusted according to the product's dimensions, thus adapting to products of different sizes without changing the fixture, improving the efficiency of processing different batches of products. Attached Figure Description

[0010] Appendix Figure 1 This is a schematic diagram of the bonding fixture for the power device of this utility model; Appendix Figure 2 For the appendix Figure 1 Enlarged view of point A in the structural schematic diagram shown; Appendix Figure 3 For the appendix Figure 1 Enlarged view of point B in the structural schematic diagram shown.

[0011] In the above attached figures: 1. Base plate; 2. Holding block; 3. Strip block; 4. Support frame; 41. Vertical part; 42. Horizontal part; 5. Cylinder; 61. Guide groove; 62. Guide block; 7. Lifting plate; 8. Elastic element; 91. Two-way lead screw; 92. Servo motor; 93. Drive block. Detailed Implementation

[0012] The present patent can be further understood through the specific embodiments given below, but they are not intended to limit the present patent.

[0013] Example 1: A bonding fixture for a power device includes: a substrate 1 and a plurality of holding blocks 2 disposed above the substrate 1. Two strip blocks 3, each extending along the width direction of the substrate 1, are disposed above the substrate 1. The strip blocks 3, movably mounted on the substrate 1, can move along the length direction of the substrate 1. Each strip block 3 is equipped with at least two support frames 4 spaced apart along its length direction. The horizontal portion 42 of the support frame 4, which is connected to the vertical portion 41 of the strip block 3, extends towards the other strip block 3. A cylinder 5 is mounted on the upper surface of the horizontal portion 42 of the support frame 4. The holding blocks 2 are mounted on the piston rod of the cylinder 5 and located below the horizontal portion 42. Each strip block 3 is connected to a driving assembly mounted on the substrate 1 for driving the strip block 3 to reciprocate along the length direction of the substrate 1.

[0014] Each of the above-mentioned strip blocks 3 is equipped with 3 support frames 4 at equal intervals.

[0015] A lifting plate 7 is provided between the aforementioned pressing block 2 and the horizontal part 42 of the support frame 4. The surface of the lifting plate 7 opposite to the pressing block 2 is connected to the piston rod of the cylinder 5. The other surface of the lifting plate 7 is connected to the upper surface of the pressing block 2 by at least two elastic members 8. This can achieve elastic pressing of the substrate of the device to be processed, which can compensate for the tolerance in the vertical direction and avoid product damage caused by instantaneous force.

[0016] All three of the above-mentioned elastic components 8 are springs.

[0017] Example 2: A bonding fixture for a power device includes: a substrate 1 and a plurality of holding blocks 2 disposed above the substrate 1. Two strip blocks 3, each extending along the width direction of the substrate 1, are disposed above the substrate 1. The strip blocks 3, movably mounted on the substrate 1, can move along the length direction of the substrate 1. Each strip block 3 is equipped with at least two support frames 4 spaced apart along its length direction. The horizontal portion 42 of the support frame 4, which is connected to the vertical portion 41 of the strip block 3, extends towards the other strip block 3. A cylinder 5 is mounted on the upper surface of the horizontal portion 42 of the support frame 4. The holding blocks 2 are mounted on the piston rod of the cylinder 5 and located below the horizontal portion 42. Each strip block 3 is connected to a driving assembly mounted on the substrate 1 for driving the strip block 3 to reciprocate along the length direction of the substrate 1.

[0018] Each of the above-mentioned strip blocks 3 is equipped with 3 support frames 4 at equal intervals.

[0019] The upper surface of the substrate 1 is provided with at least two guide grooves 61 that extend along the length of the substrate 1, and the strip block 3 is connected to at least two guide blocks 62 that are slidably disposed in the guide grooves 61.

[0020] The aforementioned driving assembly includes: a bidirectional lead screw 91 disposed between two guide grooves 61 along the length direction of the substrate 1 and a servo motor 92 connected to one end of the bidirectional lead screw 91. The first threaded section and the second threaded section of the bidirectional lead screw 91, which are rotatably mounted on the substrate 1 via at least two bearing seats, are respectively connected by threads to a driving block 93. The two driving blocks 93 are correspondingly connected to two strip blocks 3. The first threaded section and the second threaded section are arranged in opposite directions, thereby driving the two strip blocks 3 to move towards each other under the action of the same servo motor 92. A strip mounting groove for embedding the bidirectional lead screw 91 is formed on the upper surface of the substrate 1, and the servo motor 92 is fixedly mounted on the end face of one end of the substrate 1.

[0021] Working principle: When in use, the substrate / lead frame of the device to be processed needs to be clamped and fixed to facilitate the subsequent bonding operation between the chip and the substrate / lead frame. In the initial state, the two strip blocks are driven to move away from each other by a servo motor, so that the distance between the two strip blocks is maximized; The substrate / lead frame of the device to be processed is manually or automatically transported to the middle area of ​​the upper surface of the substrate; Then, the servo motor drives the two strip blocks to move closer together, so that the horizontal part of the support frame that moves with the two strip blocks moves to above the substrate / lead frame of the device to be processed. Then, each independently set cylinder drives the holding block to move down until it presses and contacts the substrate / lead frame of the device to be processed. Based on the pressing and positioning of the product to be processed, the distance between the holding blocks can be automatically adjusted according to the specifications and dimensions of the product, so as to adapt to products of different specifications and sizes without changing the fixture, thereby improving the efficiency of processing different batches of products.

[0022] When using the bonding fixture for the aforementioned power devices, in addition to holding and positioning the products to be processed, it can automatically adjust the distance between the holding blocks according to the specifications and dimensions of the products, thereby adapting to products of different specifications and dimensions without changing the fixture, and improving the efficiency of processing different batches of products.

[0023] The above embodiments are only for illustrating the technical concept and features of this utility model, and are intended to enable those skilled in the art to understand the content of this utility model and implement it accordingly. They should not be construed as limiting the scope of protection of this utility model. All equivalent changes or modifications made in accordance with the spirit and essence of this utility model should be included within the scope of protection of this utility model.

Claims

1. A bonding fixture for a power device, comprising: The substrate (1) and a plurality of pressing blocks (2) disposed above the substrate (1) are characterized in that: two strip blocks (3) each extending along the width direction of the substrate (1) are disposed above the substrate (1), the strip blocks (3) movably mounted on the substrate (1) can move along the length direction of the substrate (1), each strip block (3) is mounted with at least two support frames (4) spaced apart along its length direction, the horizontal part (42) of the support frame (4) connected to the vertical part (41) and the strip block (3) extends toward the other strip block (3), a cylinder (5) is mounted on the upper surface of the horizontal part (42) of the support frame (4), the pressing block (2) is mounted on the piston rod of the cylinder (5) and located below the horizontal part (42), each strip block (3) is connected to a driving assembly mounted on the substrate (1) for driving the strip block (3) to reciprocate along the length direction of the substrate (1).

2. The bonded jig for power devices of claim 1, wherein: Each of the strip blocks (3) is equipped with three support frames (4) at equal intervals.

3. The bonded jig for power devices of claim 1, wherein: The upper surface of the substrate (1) is provided with at least two guide grooves (61) that extend along the length of the substrate (1) at intervals, and the strip block (3) is connected to at least two guide blocks (62) that are slidably disposed in the guide grooves (61).

4. The bonded jig for power devices of claim 1, wherein: A lifting plate (7) is provided between the pressing block (2) and the horizontal part (42) of the support frame (4). The surface of the lifting plate (7) opposite to the pressing block (2) is connected to the piston rod of the cylinder (5). The other surface of the lifting plate (7) is connected to the upper surface of the pressing block (2) by at least two elastic members (8).

5. The bonded jig for power devices of claim 4, wherein: All three elastic elements (8) are springs.

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