Package heat sink and semiconductor package module

Abstract

This application provides a heat sink and a semiconductor packaging module. The heat sink includes a top surface and a bottom surface disposed opposite to each other. The top surface includes multiple edges, a mounting area, and a molding compound area. The molding compound area is located between the mounting area and at least one of the multiple edges. The molding compound area has multiple spaced-apart strip-shaped grooves. Each strip-shaped groove is recessed from the top surface towards the bottom surface, and the length extension direction of each strip-shaped groove forms an acute angle with the extension direction of at least one of the multiple edges. This application can increase the bonding force between the heat sink and the molding compound, effectively reduce the probability of peripheral delamination, and improve the reliability of the semiconductor packaging module.

Description

Technical Field

[0001] This application relates to the field of semiconductor packaging technology, and in particular to a packaging heat sink and a semiconductor packaging module. Background Technology

[0002] In related technologies, semiconductor packaging modules typically mount a substrate with a fixed chip onto a packaging heat sink. At the same time, a molding compound is used to encapsulate the chip, substrate, and part of the packaging heat sink to achieve sealing and protection. Part of the packaging heat sink is exposed outside the molding compound for heat dissipation.

[0003] Reliability is a crucial performance indicator for semiconductor packaged modules, and the bonding strength between the molded body and the encapsulated components significantly impacts reliability. In existing semiconductor packaged modules, the bonding strength between the molded body and the heat sink is relatively weak, easily leading to periphery delamination and consequently lower reliability. Utility Model Content

[0004] This application provides a heat sink and a semiconductor packaging module, which mainly solves the problem that the bonding force between the plastic encapsulation body and the heat sink of the packaging module is weak in the prior art, and the periphery delamination phenomenon is easy to occur, resulting in low reliability of the semiconductor packaging module.

[0005] To solve the above-mentioned technical problems, one technical solution adopted in this application is: to provide a packaged heat sink, the packaged heat sink including a top surface and a bottom surface disposed opposite to each other, the top surface including multiple sides, a mounting area and a molding area, the molding area being located between the mounting area and at least one of the multiple sides, the molding area being provided with multiple strip-shaped grooves spaced apart from each other, each strip-shaped groove being recessed from the top surface in a direction toward the bottom surface, and the length extension direction of each strip-shaped groove being set at an acute angle to the extension direction of at least one of the multiple sides.

[0006] Another technical solution adopted in this application is: providing a packaged heat sink, the packaged heat sink including a top surface, a bottom surface and sidewalls, the top surface and the bottom surface being disposed opposite to each other, the sidewalls including a first sidewall segment, a second sidewall segment and a third sidewall segment, the first sidewall segment being located between the top surface and the bottom surface and extending along a first direction from the top surface to the bottom surface, the end of the first sidewall segment near the top surface being connected to the top surface, the second sidewall segment being located between the top surface and the bottom surface and extending along the first direction, the end of the second sidewall segment near the bottom surface being connected to the bottom surface, the third sidewall segment being located between the first sidewall segment and the second sidewall segment and extending along a second direction perpendicular to the first direction, one end of the third sidewall segment being connected to the end of the first sidewall segment near the bottom surface, the other end of the third sidewall segment being connected to the end of the second sidewall segment near the top surface, the height of the first sidewall segment in the first direction being equal to the height of the second sidewall segment in the first direction.

[0007] Another technical solution adopted in this application is: providing a semiconductor packaging module, including the above-described packaging heat sink, molding compound, substrate and chip, wherein the substrate is mounted on the mounting area of ​​the packaging heat sink, the chip is mounted on the surface of the substrate facing away from the packaging heat sink, the molding compound encapsulates the substrate, the chip and a portion of the packaging heat sink, the molding compound on the top surface of the packaging heat sink is covered by the molding compound, and at least a portion of the bottom surface of the packaging heat sink is exposed outside the molding compound.

[0008] Unlike existing technologies, the beneficial effects of this application are that the heat sink and semiconductor packaging module provided by this application, by setting multiple spaced strip grooves in the molding area on the top surface of the heat sink, or by having the first and second sidewall segments of the sidewall extend along a first direction from the top surface to the bottom surface and the third sidewall segment extend along a second direction perpendicular to the first direction, greatly increases the bonding area between the heat sink and the molding body, thereby increasing the bonding force between the heat sink and the molding body, effectively reducing the probability of peripheral delamination, preventing moisture and impurities from intruding, and greatly improving the reliability of the semiconductor packaging module. Furthermore, since the length extension direction of each strip groove is set at an acute angle to the extension direction of at least one side of the top surface, the connection between the molding body and the heat sink can simultaneously resist delamination in multiple directions, such as directions parallel to and perpendicular to the at least one side. This makes the connection between the molding body and the heat sink less prone to tearing, further increasing the bonding strength between the molding body and the heat sink, reducing the probability of peripheral delamination, and improving the reliability of the semiconductor packaging module. Attached Figure Description

[0009] To more clearly illustrate the technical solutions in the embodiments of this application, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the accompanying drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0010] Figure 1 This is a schematic diagram of the structure of the encapsulated heat sink provided in the embodiments of this application;

[0011] Figure 2 for Figure 1 Enlarged view of point I in the middle;

[0012] Figure 3 This is a top view of the encapsulated heat sink provided in an embodiment of this application;

[0013] Figure 4 for Figure 3 Enlarged view at point II;

[0014] Figure 5 for Figure 3 BB section view in the middle;

[0015] Figure 6 for Figure 5 Enlarged view of section III;

[0016] Figure 7 A left view of the encapsulated heat sink provided in an embodiment of this application;

[0017] Figure 8 This is a front view of the encapsulated heat sink provided in an embodiment of this application;

[0018] Figure 9 This is a rear view of the encapsulated heat sink provided in an embodiment of this application;

[0019] Figure 10 for Figure 9 DD section view in the middle;

[0020] Figure 11 A bottom view of the encapsulated heat sink provided in an embodiment of this application;

[0021] Figure 12 for Figure 11 Enlarged view of section IV in the middle. Detailed Implementation

[0022] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of this application, and not all of the embodiments. Based on the embodiments of this application, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the scope of protection of this application.

[0023] In the following description, specific details such as particular system architectures, interfaces, and technologies are presented for illustrative purposes rather than for limiting purposes, in order to provide a thorough understanding of this application.

[0024] The terms "first," "second," and "third" in this application are for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Therefore, a feature defined as "first," "second," or "third" may explicitly or implicitly include at least one of that feature. In the description of this application, "multiple" means at least two, such as two, three, etc., unless otherwise explicitly specified. All directional indications (such as up, down, left, right, front, back, etc.) in the embodiments of this application are only used to explain the relative positional relationships and movements between components in a specific orientation (as shown in the figures). If the specific orientation changes, the directional indications also change accordingly. Furthermore, the terms "comprising" and "having," and any variations thereof, are intended to cover non-exclusive inclusion. For example, a process, method, system, product, or device that includes a series of steps or units is not limited to the listed steps or units, but may optionally include steps or units not listed, or may optionally include other steps or units inherent to these processes, methods, products, or devices.

[0025] In this document, the term "embodiment" means that a particular feature, structure, or characteristic described in connection with an embodiment may be included in at least one embodiment of this application. The appearance of this phrase in various places throughout the specification does not necessarily refer to the same embodiment, nor is it a separate or alternative embodiment mutually exclusive with other embodiments. It will be explicitly and implicitly understood by those skilled in the art that the embodiments described herein can be combined with other embodiments.

[0026] The following is in conjunction with the appendix Figure 1 To be continued Figure 12 The present application will be described in detail with reference to the embodiments.

[0027] like Figures 1 to 12As shown, this application embodiment provides a packaged heat sink 100, which includes a top surface 101 and a bottom surface 102 disposed opposite to each other. The top surface 101 includes multiple sides, a mounting area 1011, and a molding area 1012. The molding area 1012 is located between the mounting area 1011 and at least one of the multiple sides. The molding area 1012 is provided with multiple strip-shaped grooves 1013 spaced apart from each other. Each strip-shaped groove 1013 is recessed from the top surface 101 in a direction toward the bottom surface 102. The length extension direction A of each strip-shaped groove 1013 is set at an acute angle to the extension direction of at least one of the multiple sides.

[0028] The heat sink 100 in this embodiment can be applied to a semiconductor packaging module, for example, as one of the components of a semiconductor packaging module.

[0029] In this embodiment, the bottom surface 102 can be at least partially exposed outside the molding compound. "At least partially" can refer to a portion or the entirety of the bottom surface 102. When the bottom surface 102 is only partially exposed outside the molding compound, the other portion can be used to connect with the molding compound. Optionally, in some embodiments, the bottom surface 102 can be provided with a heat dissipation section 103. The heat dissipation section 103 may include heat dissipation fins, heat dissipation scales, heat dissipation pins, and heat dissipation rings, etc. The heat dissipation section 103 can be exposed outside the molding compound, and the heat dissipation section can further enhance the heat dissipation effect. Of course, in other embodiments, the bottom surface 102 may not have a heat dissipation section and may dissipate heat solely through the bottom surface itself.

[0030] Each of the aforementioned multiple edges can be a component of the boundary line of the top surface 101. For example, the aforementioned multiple edges of the top surface 101 can be connected in sequence to jointly form the boundary line of the top surface 101. Two connected edges can be directly connected or connected by an arc or a straight line. When two edges are connected by an arc or a straight line, the connection point may form an arc angle or an oblique angle.

[0031] The mounting area 1011 can be one region of the top surface 101, and can be used to mount one or more substrates. The substrates can be mounted in the mounting area 1011 by soldering / sintering them. A chip can be mounted on the surface of the substrate away from the heat sink; the chip can be a semiconductor chip such as silicon, silicon carbide (SiC), or gallium nitride (GaN). The molding compound area 1012 can be another region of the top surface 101, and can be used to connect to the molding compound. The molding compound can be formed of a resin-based material such as epoxy resin. The aforementioned molding area 1012 may be located between the mounting area 1011 and at least one of the plurality of sides. That is, the molding area 1012 may be located between the mounting area 1011 and at least one of the plurality of sides. For example, the molding area 1012 may be located between the mounting area 1011 and one of the plurality of sides, or between the mounting area 1011 and two, three, or more of the plurality of sides, or between the mounting area 1011 and all of the plurality of sides. When the molding area 1012 is located between the mounting area 1011 and one of the aforementioned multiple sides, the molding area 1012 can be located on one side of the mounting area 1011, and the shape of the molding area 1012 can be a polygon (such as a rectangle, square, rhombus or trapezoid) or a circle or other shapes; when the molding area 1012 is located between the mounting area 1011 and all of the aforementioned multiple sides, the molding area 1012 can be arranged around the mounting area 1011, in other words, the molding area can be annular and arranged around the mounting area 1011.

[0032] The aforementioned strip-shaped groove 1013 may be a strip-shaped groove that is recessed to a certain depth from the top surface 101 of the heat sink 100 towards the bottom surface 102 of the heat sink 100. The cross-section of the strip-shaped groove 1013 perpendicular to its length extension direction may be U-shaped, V-shaped, trapezoidal, or other shapes, which are not limited in this embodiment. Specifically, the strip-shaped groove 1013 may be formed by laser etching or CNC machine tool cutting on the molding area 1012 of the top surface 101 of the heat sink 100. The plurality of strip-shaped grooves 1013 may be evenly or unevenly distributed in the molding area 1012, and the spacing between the plurality of strip-shaped grooves 1013 may refer to any two strip-shaped grooves being spaced apart.

[0033] The fact that the length extension direction A of each of the strip grooves 1013 is set at an acute angle to the extension direction of at least one of the multiple sides can be understood as the length extension direction A of each strip groove 1013 being neither perpendicular nor parallel to at least one of the multiple sides. This design allows the connection between the molding compound and the heat sink 100 to resist tensile forces in both directions parallel and perpendicular to the side, making the connection less prone to tearing. The extension direction of each side can refer to the length extension direction of each side. At least one of the multiple sides can be one of the multiple sides, or two or more of the multiple sides. The aforementioned acute angle can be any angle greater than 0 degrees and less than 90 degrees, such as 15°, 30°, 45°, 50°, 60°, 70°, or 80°, etc.

[0034] The heat sink and semiconductor packaging module in this embodiment significantly increase the bonding area between the heat sink and the molding compound by providing multiple spaced strip grooves in the molding area on the top surface of the heat sink. This increases the bonding force between the heat sink and the molding compound, effectively reducing the probability of delamination and preventing moisture and impurities from entering, thus greatly improving the reliability of the semiconductor packaging module. Furthermore, since the extension direction of each strip groove is at an acute angle to the extension direction of at least one side of the top surface, the connection between the molding compound and the heat sink can resist delamination in multiple directions, such as those parallel and perpendicular to the at least one side. This makes the connection between the molding compound and the heat sink less prone to tearing, further increasing the bonding strength between the molding compound and the heat sink, reducing the probability of delamination, and improving the reliability of the semiconductor packaging module.

[0035] Optionally, the plurality of sides includes a first side 1014, a second side 1015, a third side 1016, and a fourth side 1017. The first side 1014 and the second side 1015 are opposite to each other and spaced apart. The third side 1016 and the fourth side 1017 are opposite to each other and spaced apart. The third side 1016 and the fourth side 1017 are both located between the first side 1014 and the second side 1015. The two ends of the third side 1016 are respectively connected to the first side 1014 and the second side 1015. The two ends of the fourth side 1017 are respectively connected to the first side 1014 and the second side 1015.

[0036] The length extension direction A of each of the strip grooves 1013 is set at an acute angle to the extension direction of the first side 1014, and the length extension direction A of each of the strip grooves 1013 is set at an acute angle to the extension direction of the second side 1015; and / or, the length extension direction A of each of the strip grooves 1013 is set at an acute angle to the extension direction of the third side 1016, and the length extension direction of each of the strip grooves 1013 is set at an acute angle to the extension direction of the fourth side 1017.

[0037] In this embodiment of the application, the first side 1014 and the second side 1015 can be arranged parallel or non-parallel, the third side 1016 and the fourth side 1017 can be arranged parallel or non-parallel, the third side 1016 and the first side 1014 can be arranged perpendicular or non-perpendicular, the third side 1016 and the second side 1015 can be arranged perpendicular or non-perpendicular, the fourth side 1017 and the first side 1014 can be arranged perpendicular or non-perpendicular, and the fourth side 1017 and the second side 1015 can be arranged perpendicular or non-perpendicular.

[0038] like Figure 3 As shown, the third side 1016 and the first side 1014 can be connected by the first arc 1018, the third side 1016 and the second side 1015 can be connected by the second arc 1019, the fourth side 1017 and the second side 1015 can be connected by the third arc 1020, and the fourth side 1017 and the first side 1014 can be connected by the straight line 1021. This allows the connection between two adjacent sides to form an arc angle or an oblique angle, thereby achieving a foolproof design.

[0039] By setting the length extension direction of each of the strip grooves at an acute angle to the extension direction of the first side, and also setting the length extension direction of each of the strip grooves at an acute angle to the extension direction of the second side, the connection between the molding compound and the heat sink can simultaneously resist delamination in directions parallel to the first side, perpendicular to the first side, parallel to the second side, and perpendicular to the second side. Similarly, by setting the length extension direction of each of the strip grooves at an acute angle to the extension direction of the third side, and also setting the length extension direction of each of the strip grooves at an acute angle to the extension direction of the fourth side, the connection between the molding compound and the heat sink can simultaneously resist delamination in directions parallel to the third side, perpendicular to the third side, parallel to the fourth side, and perpendicular to the fourth side. This makes the connection between the molding compound and the heat sink less prone to tearing, further increasing the bonding strength between the molding compound and the heat sink, reducing the probability of peripheral delamination, and improving the reliability of the semiconductor packaging module.

[0040] Optionally, the first side 1014 is parallel to the second side 1015, the third side 1016 is parallel to the fourth side 1017, and the first side 1014 is perpendicular to the third side 1016, with the acute angle being 45 degrees.

[0041] In this embodiment, the first side 1014 and the second side 1015 can be arranged parallel to each other, the third side 1016 and the fourth side 1017 can be arranged parallel to each other, the first side 1014 and the third side 1016 can be arranged perpendicular to each other, and the second side 1015 and the fourth side 1017 can be arranged perpendicular to each other. The length extension direction A of each strip groove 1013 can be set at a 45-degree angle with the extension direction of the first side 1014, the second side 1015, the third side 1016, and the fourth side 1017.

[0042] Because the first side is parallel to the second side, the third side is parallel to the fourth side, and the first side is perpendicular to the third side, the connection between the molding compound and the heat sink is resistant to delamination in both directions perpendicular and parallel to each side. Furthermore, setting the acute angle to 45 degrees further balances the resistance, thus better addressing delamination resistance in all directions and reducing the probability of peripheral delamination, thereby improving the reliability of the semiconductor packaging module.

[0043] Optionally, the acute angle is greater than or equal to 30 degrees and less than or equal to 60 degrees; and / or,

[0044] The depth h1 of each of the said strip grooves 1013 is 10-100 μm; and / or,

[0045] The width d2 of each of the said strip grooves 1013 is less than or equal to 100 μm; and / or,

[0046] The distance d3 between any two adjacent strip grooves 1013 is greater than or equal to 50 μm; and / or,

[0047] Any two adjacent strip grooves 1013 are arranged in parallel.

[0048] In this embodiment, the acute angle can be greater than or equal to 30 degrees and less than or equal to 60 degrees, for example, 30 degrees, 40 degrees, 45 degrees, 50 degrees, or 60 degrees. Setting the acute angle between 30 and 60 degrees allows for a more balanced resistance to forces in multiple directions at the connection between the molding compound and the heat sink, thereby further reducing the probability of periphery delamination and improving the reliability of the semiconductor packaging module.

[0049] In this embodiment, the depth h1 of the strip groove 1013 can be understood as the recess depth of the strip groove 1013, for example, referring to the dimension of the strip groove 1013 in the first direction C1 from the top surface 101 to the bottom surface 102 of the packaged heat sink 100. The depth h1 of the strip groove 1013 can be less than 10 μm, or greater than 100 μm, or between 10-100 μm (micrometers), for example, 10 μm, 20 μm, 30 μm, 40 μm, 50 μm, 60 μm, 70 μm, 80 μm, 90 μm, or 100 μm. Considering the increase in contact area and process implementation, the depth of the strip groove can be controlled between 10-100 μm, which can effectively increase the contact area between the molding compound and the packaged heat sink, and also make the process implementation easier.

[0050] In this embodiment, the width d2 of the strip groove 1013 can be less than or equal to 100 μm, for example, 20 μm, 40 μm, 60 μm, 80 μm, 90 μm, or 100 μm, or greater than 100 μm. Considering the increase in contact area and the cleanliness of the base plate after processing, the width of the strip groove can be controlled within the range of less than or equal to 100 μm. This can effectively increase the contact area between the molding compound and the heat sink, and also better ensure the cleanliness of the base plate after processing.

[0051] In this embodiment, the distance d3 between any two adjacent strip grooves 1013 can be less than 50 μm, or greater than or equal to 50 μm, for example, 50 μm, 60 μm, 70 μm, or 80 μm. Considering the increase in contact area and the cleanliness of the base plate after processing, the distance between any two adjacent strip grooves can be controlled within a range greater than or equal to 50 μm. This effectively increases the contact area between the molding compound and the heat sink, and also better ensures the cleanliness of the base plate after processing.

[0052] In this embodiment, the parallel arrangement of two adjacent strip grooves means that the length extension directions of the two adjacent strip grooves are parallel to each other. By arranging any two adjacent strip grooves in parallel, it is easier to process and the stress at the junction of the molding compound and the heat sink is more uniform, thereby further reducing the probability of peripheral delamination and improving the reliability of the semiconductor packaging module.

[0053] Optionally, the molding area 1012 is disposed around the mounting area 1011;

[0054] An annular barrier groove 1022 is provided on the top surface 101. The barrier groove 1022 is located between the encapsulation area 1012 and the mounting area 1011, and the barrier groove 1022 is arranged around the mounting area 1011.

[0055] In this embodiment, the mounting area 1011 can be located in the middle region of the top surface 101, and the encapsulation area 1012 can be located in the edge region of the top surface 101. For example, the encapsulation area 1012 can be an annular region surrounding the outer side of the mounting area 1011. The aforementioned barrier groove 1022 can be an annular groove that is recessed to a certain depth from the top surface 101 of the heat sink 100 along the direction toward the bottom surface 102 of the heat sink 100. Specifically, it can be formed on the top surface 101 of the heat sink 100 by laser etching or CNC machine tool cutting. The barrier groove 1022 being located between the encapsulation area 1012 and the mounting area 1011 can refer to the area of ​​the barrier groove 1022 on the top surface 101 located between the encapsulation area 1012 and the mounting area 1011. The barrier groove 1022 can surround the outer side of the mounting area 1011, and the encapsulation area 1012 can surround the outer side of the barrier groove 1022.

[0056] In this embodiment, by providing an annular barrier groove between the mounting area and the encapsulation area, the overflow of solder (such as solder paste) / sintering material can be effectively prevented in subsequent processes (such as the welding process between the substrate and the package heat sink), which is beneficial to further improve the connection quality.

[0057] Optionally, the number of the barrier grooves 1022 is plurality of, and the plurality of barrier grooves 1022 are arranged sequentially around the mounting area 1011, with any two adjacent barrier grooves 1022 spaced apart; the interval d1 between any two adjacent barrier grooves 1022 is greater than or equal to 0.5 mm; and / or,

[0058] The depth of each of the said barrier grooves 1022 is 10-100 μm; and / or,

[0059] The top surface 101 also includes a plurality of exposed areas 1023 spaced apart from each other. Each exposed area 1023 is exposed outside the molding compound. Each exposed area 1023 is located on the side of the molding compound 1012 away from the mounting area 1011, and each exposed area 1023 is located between the molding compound 1012 and one of the plurality of sides.

[0060] In this embodiment, the number of barrier grooves 1022 can be multiple, such as two, three, four, or more. Multiple barrier grooves 1022 can be sequentially arranged around the mounting area 1011. For example, when there are two barrier grooves 1022, one barrier groove 1022 can surround the mounting area 1011, and the other barrier groove 1022 can surround the aforementioned barrier groove 1022. By setting the number of barrier grooves to multiple, and having multiple barrier grooves sequentially arranged around the mounting area, the overflow of solder / sintering material can be prevented multiple times, thereby further improving the barrier effect against solder / sintering material and further improving the connection quality.

[0061] In this embodiment, the interval d1 between any two adjacent barrier grooves 1022 can be less than 0.5 mm, or greater than or equal to 0.5 mm, for example, 0.6 mm, 0.8 mm, or 10 mm. Considering the barrier effect and processing, the interval between any two adjacent barrier grooves can be controlled within a range greater than or equal to 0.5 mm. This can better balance the prevention of solder / sintering material overflow, the cleanliness of the base plate after processing, and the ease of processing.

[0062] The depth of each of the barrier grooves 1022 can be less than 10 μm, greater than 100 μm, or 10-100 μm, such as 10 μm, 30 μm, 60 μm, 80 μm, or 100 μm. Considering the barrier effect and process implementation, the depth of each barrier groove can be controlled between 10-100 μm. This can effectively improve the barrier effect on solder resist / sintering material and make the process implementation easier.

[0063] In this embodiment, the exposed area 1023 can provide a clamping, pressing, or fixing position for the installation of the associated semiconductor packaging module. That is, the exposed area 1023 can be used to connect with components outside the semiconductor packaging module, such as clamping components, pressing components, or fixing components. Each exposed area 1023 can be located between the molding compound 1012 and one of the multiple edges. For example, assuming there are six exposed areas 1023, three can be located between the molding compound 1012 and one edge, and the other three can be located between the molding compound 1012 and another edge. The one edge and the other edge can be two opposite edges of the top surface 101. This arrangement of exposed areas on the top surface of the heat sink further facilitates the fixing and assembly of the semiconductor packaging module.

[0064] Optionally, the encapsulated heat sink 100 further includes a sidewall 104 connecting the top surface 101 and the bottom surface 102;

[0065] The sidewall 104 of the encapsulated heat sink 100 is stepped and / or a first groove (not shown) is formed on the sidewall 104 of the encapsulated heat sink.

[0066] In this embodiment, the sidewall 104 of the heat sink 100 can be at least partially (e.g., partially or entirely) used for connection with the molding compound. Each step junction of the sidewall 104 can be located at the portion of the sidewall of the heat sink 100 used for connection with the molding compound. The number of first grooves 104 can be one or more. The first groove can be located at the portion of the sidewall of the heat sink 100 used for connection with the molding compound.

[0067] By setting the sidewalls of the packaged heat sink to a stepped shape, the bonding area between the sidewalls and the molding compound can be further increased compared to a single-planar sidewall, thereby further increasing the bonding force and reducing the probability of peripheral delamination, thus further improving the reliability of the semiconductor packaged module.

[0068] By creating a first groove on the sidewall, the bonding area between the sidewall and the molding compound can be further increased, thereby further increasing the bonding force between the sidewall and the molding compound and improving the reliability of the semiconductor packaging module.

[0069] Optionally, the sidewall 104 of the encapsulated heat sink 100 is stepped, and the sidewall 104 includes a first sidewall segment 1041, a second sidewall segment 1042 and a third sidewall segment 1043. The first sidewall segment 1041 is disposed near the top surface 101 and connected to the top surface 101. The second sidewall segment 1042 is disposed near the bottom surface 102 and connected to the bottom surface 102. The third sidewall segment 1043 is located between the first sidewall segment 1041 and the second sidewall segment 1042 and connects the first sidewall segment 1041 and the second sidewall segment 1042.

[0070] The height h2 of the first sidewall segment 1041 in the first direction C1 from the top surface 101 to the bottom surface 102 is equal to the height h3 of the second sidewall segment 1042 in the first direction C1; and / or, the shortest distance d8 between the first sidewall segment 1041 and the central axis E of the encapsulated heat sink 100 perpendicular to the top surface 101 is greater than the shortest distance d9 between the second sidewall segment 1042 and the central axis E; and / or, the height h2 of the first sidewall segment 1041 and the second sidewall segment 1042 in the first direction C1 is equal to the height h3 of the second sidewall segment 1042 in the first direction C1 ... Both sidewall segments 1042 extend along a first direction C1 from the top surface 101 to the bottom surface 102, and the third sidewall segment 1043 extends along a second direction C2 perpendicular to the first direction C1; and / or, the first sidewall segment 1041 has a creepage notch 10411, the creepage notch 10411 extends along the first direction C1 from the top surface 101 to the bottom surface 102, and the creepage notch 10411 penetrates the top surface 101 and the third sidewall segment 1043.

[0071] In this embodiment, both the first sidewall segment 1041 and the third sidewall segment 1043 can be used to connect with the molding compound, and the second sidewall segment 1042 can be partially or entirely used to connect with the molding compound. The height h2 of the first sidewall segment 1041 in the first direction C1 can be greater than, less than, or equal to the height h3 of the second sidewall segment 1042 in the first direction C1. Setting the height of the first sidewall segment in the first direction to be equal to the height of the second sidewall segment in the first direction not only improves the bonding force between the molding compound and the heat sink and makes the stress distribution more uniform, but also facilitates processing.

[0072] The shortest distance d8 between the first sidewall segment 1041 and the central axis E of the encapsulated heat sink 100 perpendicular to the top surface 101 can refer to the distance between the first sidewall segment 1041 and the central axis E in the second direction C2; the shortest distance d9 between the second sidewall segment 1042 and the central axis E can refer to the distance between the second sidewall segment 1042 and the central axis E in the second direction C2. The shortest distance d8 between the first sidewall segment 1041 and the central axis E of the encapsulated heat sink 100 perpendicular to the top surface 101 can be greater than or less than the shortest distance d9 between the second sidewall segment 1042 and the central axis E. Setting the shortest distance between the first sidewall segment and the central axis of the encapsulated heat sink perpendicular to the top surface to be greater than the shortest distance between the second sidewall segment and the central axis, that is, reducing the second sidewall segment inward relative to the first sidewall segment, can make the combination between the molding compound and the encapsulated heat sink more stable and stronger.

[0073] In this embodiment of the application, the above-mentioned creepage gap 10411 can be used to increase the creepage distance and improve the reliability of the semiconductor packaging module.

[0074] Optionally, the bottom surface 102 is provided with a heat dissipation part 103, which is used to expose the plastic encapsulation body; the heat dissipation part 103 includes a plurality of heat dissipation pins 1032 protruding from the bottom surface 102 and a heat dissipation ring 1031 protruding from the bottom surface 102, the plurality of heat dissipation pins 1032 are spaced apart from each other, and the heat dissipation ring 1031 is arranged around the plurality of heat dissipation pins 1032, with each heat dissipation pin 1032 and the heat dissipation ring 1031 being spaced apart;

[0075] The cross-sectional shape of each of the heat dissipation pins 1032 is rhomboid;

[0076] At least one heat dissipation protrusion 10312 is provided on the inner sidewall 10311 of the heat dissipation ring 1031 facing the plurality of heat dissipation pins 1032.

[0077] Each of the heat dissipation protrusions 10312 includes a first protrusion segment 10312-1 and a second protrusion segment 10312-2. The first protrusion segment 10312-1 is spaced apart from the inner wall 10311 of the heat dissipation ring 1031. The second protrusion segment 10312-2 is located between the first protrusion segment 10312-1 and the inner wall 10311 of the heat dissipation ring 1031 and connects the first protrusion segment 10312-1 and the inner wall 10311 of the heat dissipation ring 1031. The cross-sectional shape of the first protrusion segment 10312-1 is a semi-rhombus shape, and the cross-sectional shape of the second protrusion segment 10312-2 is a rectangle shape. The length of the long side of the rectangle is equal to the length of the longest side of the semi-rhombus. The overall cross-sectional shape of each heat dissipation protrusion 10312 is a planar figure formed by connecting the long side of the rectangle and the longest side of the semi-rhombus.

[0078] In this embodiment, both the heat dissipation pins 1032 and the heat dissipation ring 1031 can extend from the bottom surface 102 of the encapsulated heat sink 100 and in a direction away from the bottom surface 102 of the encapsulated heat sink 100. The heat dissipation ring 1031 can be arranged around the plurality of heat dissipation pins 1032, that is, sleeved on the outside of the plurality of heat dissipation pins 1032. The simultaneous arrangement of heat dissipation pins and a heat dissipation ring on the bottom surface of the encapsulated heat sink enables the encapsulated heat sink to have excellent heat dissipation capabilities.

[0079] Each heat dissipation fin 1032 can have a rhomboid cross-section perpendicular to its own extension direction, or each heat dissipation fin 1032 can have a rhomboid cross-section perpendicular to the first direction C1. Using fins with a rhomboid cross-section allows the heat dissipation fins to have a better turbulence effect, while also compensating for water pressure drop and improving system efficiency.

[0080] Each of the aforementioned heat dissipation protrusions 10312 may extend from the inner sidewall 10311 of the heat dissipation ring 1031 and in a direction away from the inner sidewall 10311 of the heat dissipation ring 1031. There may be one or more heat dissipation protrusions 10312. When there are multiple heat dissipation protrusions 10312, they may be uniformly or non-uniformly distributed on the inner sidewall of the heat dissipation ring 1031. By providing heat dissipation protrusions on the inner sidewall of the heat dissipation ring, the heat dissipation capacity of the packaged heat sink can be further improved, enhancing the heat dissipation effect.

[0081] In this embodiment, the aforementioned semi-rhombus can refer to half a rhombus, that is, a rhombus obtained by cutting along one of its diagonals, and the aforementioned cut diagonal can be considered as the longest side of the cut semi-rhombus. The second protrusion 10312-2 can extend from the inner wall 10311 of the heat dissipation ring 1031 and extend away from the inner wall 10311 of the heat dissipation ring 1031. The shape of the cross-section of the second protrusion 10312-2 parallel to its own extension direction can be rectangular, or the shape of the cross-section of the second protrusion 10312-2 perpendicular to the first direction C1 can be rectangular. The first protrusion 10312-1 may extend from the end face of the second protrusion 10312-2 away from the inner wall 10311 and in a direction away from the second protrusion 10312-2. The shape of the cross-section of the first protrusion 10312-1 parallel to its extension direction may be semi-rhomboid, or the shape of the cross-section of the first protrusion 10312-1 perpendicular to the first direction C1 may be semi-rhomboid. Since each heat dissipation protrusion includes a first protrusion and a second protrusion, and the cross-section of the first protrusion is semi-rhomboid, the heat dissipation protrusion can have a better turbulence effect, while compensating for water pressure drop and improving system efficiency. At the same time, since the second protrusion connects the first protrusion and the inner wall of the heat dissipation ring, and the cross-section of the second protrusion is rectangular, the heat dissipation protrusion can have a better heat dissipation effect and is easier to process and manufacture, making the process simpler to implement.

[0082] Optionally, the side length d4 of the rhombus is greater than or equal to 0.9 mm and less than or equal to 2 mm; and / or,

[0083] The side length d5 ​​of the rhombus corresponding to the semi-rhombus is greater than or equal to 0.9 mm and less than or equal to 2 mm; and / or,

[0084] The gap d6 between any two adjacent heat dissipation pins 1032 is greater than or equal to 0.8 mm and less than or equal to 1.2 mm; and / or,

[0085] The distance d7 between each of the heat dissipation protrusions 10312 and the nearest heat dissipation fin 1032 is greater than or equal to 0.8 mm and less than or equal to 1.2 mm; and / or,

[0086] Multiple heat dissipation protrusions 10312 are provided on each of the two opposite inner sidewalls of the heat dissipation ring 1031.

[0087] In this embodiment, the cross-sectional shape of the heat dissipation pin 1032 can be rhomboid, and the side length d4 of the rhombus can be greater than or equal to 0.9 mm and less than or equal to 2 mm, for example, 1 mm, 1.2 mm, 1.4 mm, 1.6 mm, or 1.8 mm. Using a rhomboid pin fin with a side length greater than or equal to 0.9 mm and less than or equal to 2 mm enables the heat dissipation pin fin to have a better turbulence effect, further optimizing the heat dissipation effect.

[0088] The cross-sectional shape of the first protrusion segment 10312-1 of the heat dissipation protrusion 10312 can be a semi-rhombus. The side length d5 ​​of the rhombus corresponding to the semi-rhombus can be greater than or equal to 0.9 mm and less than or equal to 2 mm, for example, 1 mm, 1.1 mm, 1.3 mm, 1.5 mm, 1.7 mm or 1.9 mm; the aforementioned value of d4 can be equal to or not equal to the value of d5. A semi-rhombus can refer to half a rhombus, that is, half a rhombus obtained by cutting along one of the diagonals of a rhombus, and the complete rhombus can be regarded as the rhombus corresponding to the semi-rhombus. For example, assuming that the semi-rhombus is half of the first rhombus obtained by cutting along one of the diagonals of the first rhombus, then the first rhombus is the rhombus corresponding to the semi-rhombus. Since the cross-section of the first protruding section of the heat dissipation protrusion is a semi-rhombus, and the side length of the rhombus corresponding to the semi-rhombus is greater than or equal to 0.9 mm and less than or equal to 2 mm, the heat dissipation protrusion can have a better turbulence effect, further enhancing the heat dissipation effect.

[0089] The gap between any two adjacent heat dissipation pins 1032 can be greater than or equal to 0.8 mm and less than or equal to 1.2 mm, for example, 0.85 mm, 0.9 mm, 1 mm, 1.05 mm, 1.1 mm or 1.15 mm. This allows for better overall heat dissipation from the multiple heat dissipation pins.

[0090] The distance between each of the heat dissipation protrusions 10312 and the nearest heat dissipation pin 1032 can be greater than or equal to 0.8 mm and less than or equal to 1.2 mm, for example, 0.85 mm, 0.9 mm, 1 mm, 1.05 mm, 1.1 mm, or 1.15 mm. This allows for better overall heat dissipation performance of the heat dissipation protrusions and multiple heat dissipation pins.

[0091] Multiple heat dissipation protrusions are provided on each of the two opposite inner sidewalls of the heat dissipation ring. On the one hand, this can further increase the heat dissipation area to enhance heat dissipation, and on the other hand, it can make heat dissipation more balanced.

[0092] This application embodiment also provides a heat sink 100, which includes a top surface 101, a bottom surface 102, and a sidewall 104. The top surface 101 and the bottom surface 102 are disposed opposite to each other. The sidewall 104 includes a first sidewall segment 1041, a second sidewall segment 1042, and a third sidewall segment 1043. The first sidewall segment 1041 is located between the top surface 101 and the bottom surface 102 and extends along a first direction C1 from the top surface 101 to the bottom surface 102. One end of the first sidewall segment 1041 near the top surface 101 is connected to the top surface 101. The second sidewall segment 1042 is located between the top surface 101 and the bottom surface 102 and extends along the first direction C1. Extending from C1, the second sidewall segment 1042 has one end near the bottom surface 102 connected to the bottom surface 102. The third sidewall segment 1043 is located between the first sidewall segment 1041 and the second sidewall segment 1042 and extends along a second direction C2 perpendicular to the first direction C1. One end of the third sidewall segment 1043 is connected to the end of the first sidewall segment 1041 near the bottom surface 102, and the other end of the third sidewall segment 1043 is connected to the end of the second sidewall segment 1042 near the top surface 101. The height h2 of the first sidewall segment 1041 in the first direction C1 is equal to the height h3 of the second sidewall segment 1042 in the first direction C1.

[0093] In this embodiment of the application, both the first sidewall segment 1041 and the third sidewall segment 1043 can be used to connect with the molding compound, and the second sidewall segment 1042 can be used at least partially (i.e. partially or entirely) to connect with the molding compound.

[0094] Because the first and second sidewall segments extend along a first direction from the top surface to the bottom surface, and the third sidewall extends along a second direction perpendicular to the first direction, the sidewalls are stepped. This greatly increases the bonding area between the sidewalls of the heat sink and the molding compound, thereby increasing the bonding force between the heat sink and the molding compound, effectively reducing the probability of peripheral delamination, preventing moisture and impurities from intruding, and greatly improving the reliability of the semiconductor packaging module. In addition, setting the height of the first sidewall segment in the first direction to be equal to the height of the second sidewall segment in the first direction makes the bonding force at the connection between the sidewall and the molding compound better and the stress more even, making the connection between the molding compound and the heat sink less prone to tearing, and also making it easier to process.

[0095] Optionally, the shortest distance d8 between the first sidewall segment 1041 and the central axis E of the encapsulated heat sink 100 perpendicular to the top surface 101 is greater than the shortest distance d9 between the second sidewall segment 1042 and the central axis E.

[0096] In this embodiment, the shortest distance d8 between the first sidewall segment 1041 and the central axis E of the encapsulated heat sink 100 perpendicular to the top surface 101 can refer to the distance between the first sidewall segment 1041 and the central axis E in the second direction C2; the shortest distance d9 between the second sidewall segment 1042 and the central axis E can refer to the distance between the second sidewall segment 1042 and the central axis E in the second direction C2. The shortest distance d8 between the first sidewall segment 1041 and the central axis E of the encapsulated heat sink 100 perpendicular to the top surface 101 can be greater than or less than the shortest distance d9 between the second sidewall segment 1042 and the central axis E. Setting the shortest distance between the first sidewall segment and the central axis of the encapsulated heat sink perpendicular to the top surface to be greater than the shortest distance between the second sidewall segment and the central axis, that is, reducing the second sidewall segment inward relative to the first sidewall segment, can make the combination between the molding compound and the encapsulated heat sink more stable and stronger.

[0097] Optionally, the first sidewall segment 1041 is provided with a creepage notch 10411, which extends along a first direction C1 from the top surface 101 to the bottom surface 102, and the creepage notch 10411 penetrates the top surface 101 and the third sidewall segment 1043. Providing a creepage notch can increase the creepage distance and further improve the reliability of the semiconductor packaging module.

[0098] Optionally, at least one of the first sidewall segment 1041, the second sidewall segment 1042, and the third sidewall segment 1043 is provided with a first groove.

[0099] In this embodiment, the number of first grooves 104 can be one or more. By forming first grooves on at least one of the first sidewall segment, the second sidewall segment, and the third sidewall segment, the bonding area between the sidewall and the molding compound can be further increased, thereby further increasing the bonding force with the molding compound and improving the reliability of the semiconductor packaging module.

[0100] This application embodiment also provides a semiconductor packaging module, including a packaging heat sink 100, a molding compound, a substrate, and a chip as described in any of the above embodiments. The substrate is mounted on the mounting area 1011 of the packaging heat sink 100, and the chip is mounted on the surface of the substrate facing away from the packaging heat sink 100. The molding compound encapsulates the substrate, the chip, and a portion of the packaging heat sink 100. The molding compound area 1012 of the top surface 101 of the packaging heat sink 100 is covered by the molding compound, and at least a portion of the bottom surface 102 of the packaging heat sink 100 is exposed outside the molding compound.

[0101] In this embodiment, the substrate can be a ceramic-copper substrate, such as an Active Metal Brazing Ceramic Substrate (AMB) or a Direct Bond Copper (DBC) ceramic substrate, or other types of substrates with circuit designs, which are not limited here. The substrate is mounted in the mounting area 1011 of the packaged heat sink 100 by means of welding or sintering.

[0102] The aforementioned chip can be any type of semiconductor chip, such as silicon, silicon carbide (SiC), or gallium nitride (GaN). The chip is mounted on the surface of the substrate opposite to the packaging heat sink 100 by means of welding or sintering.

[0103] The aforementioned molding compound can protect the internal components of the device from moisture and ensure stable mechanical properties. Specifically, the molding compound may include epoxy resin material. The sidewalls 104 connecting the top surface 101 and bottom surface 102 of the aforementioned encapsulated heat sink 100 may be at least partially (i.e., partially or completely) encapsulated by the molding compound. The bottom surface 102 of the aforementioned encapsulated heat sink 100 may be partially encapsulated and partially unencapsulated, or it may be completely unencapsulated. A heat dissipation portion 103 may be provided on the bottom surface 102 of the encapsulated heat sink 100, and the heat dissipation portion 103 may be exposed outside the molding compound to enhance heat dissipation.

[0104] The semiconductor packaging module in this embodiment, by including the packaging heat sink as described in any of the above embodiments, greatly increases the bonding area between the packaging heat sink and the molding compound, thereby increasing the bonding force between the packaging heat sink and the molding compound, effectively reducing the probability of peripheral delamination, and greatly improving the reliability of the semiconductor packaging module. Secondly, since the length extension direction of each strip groove is set at an acute angle to the extension direction of at least one side of the top surface, the connection between the molding compound and the packaging heat sink can simultaneously resist delamination in multiple directions, such as directions parallel to and perpendicular to the at least one side. This makes the connection between the molding compound and the packaging heat sink less prone to tearing, further increasing the bonding strength between the molding compound and the packaging heat sink, reducing the probability of peripheral delamination, effectively preventing moisture and impurities from intruding, and improving the reliability of the semiconductor packaging module.

[0105] It will be apparent to those skilled in the art that this application is not limited to the details of the exemplary embodiments described above, and that this application can be implemented in other specific forms without departing from the spirit or essential characteristics of this application. Therefore, the embodiments should be considered illustrative and non-limiting in all respects, and the scope of this application is defined by the appended claims rather than the foregoing description. Thus, all variations falling within the meaning and scope of the equivalent elements of the claims are intended to be included within this application. No reference numerals in the claims should be construed as limiting the scope of the claims.

[0106] The above description is merely an embodiment of this application and does not limit the patent scope of this application. Any equivalent structural or procedural transformations made using the content of this application's specification and drawings, or direct or indirect applications in other related technical fields, are similarly included within the patent protection scope of this application.

Claims

1. A package heat spreader, characterized by, The encapsulated heat sink includes a top surface and a bottom surface disposed opposite to each other. The top surface includes multiple edges, a mounting area, and a molding area. The molding area is located between the mounting area and at least one of the multiple edges. The molding area is provided with multiple strip-shaped grooves spaced apart from each other. Each strip-shaped groove is recessed from the top surface in a direction toward the bottom surface. The length extension direction of each strip-shaped groove is set at an acute angle to the extension direction of at least one of the multiple edges.

2. The encapsulated heat spreader of claim 1, wherein, The plurality of sides include a first side, a second side, a third side, and a fourth side. The first side and the second side are opposite to each other and spaced apart. The third side and the fourth side are opposite to each other and spaced apart. The third side and the fourth side are both located between the first side and the second side. The two ends of the third side are connected to the first side and the second side, respectively. The two ends of the fourth side are connected to the first side and the second side, respectively. The length extension direction of each of the strip grooves is set at an acute angle to the extension direction of the first side, the length extension direction of each of the strip grooves is set at an acute angle to the extension direction of the second side; and / or, the length extension direction of each of the strip grooves is set at an acute angle to the extension direction of the third side, and the length extension direction of each of the strip grooves is set at an acute angle to the extension direction of the fourth side.

3. The encapsulated heat spreader of claim 2, wherein, The first side is parallel to the second side, the third side is parallel to the fourth side, and the first side is perpendicular to the third side. The acute angle is 45 degrees.

4. The encapsulated heat spreader of claim 1, wherein, The acute angle is greater than or equal to 30 degrees and less than or equal to 60 degrees; and / or, The depth of each of the said grooves is 10-100 μm; And / or, The width of each of the said strip grooves is less than or equal to 100 μm; And / or, The distance between any two adjacent strip grooves is greater than or equal to 50 μm; And / or, Any two adjacent strip grooves are arranged in parallel.

5. The encapsulated heat spreader of claim 1, wherein, The encapsulation area is arranged around the installation area; An annular barrier groove is formed on the top surface. The barrier groove is located between the encapsulation area and the mounting area, and the barrier groove is arranged around the mounting area.

6. The encapsulated heat spreader of claim 5, wherein, The number of the barrier grooves is multiple, and the multiple barrier grooves are arranged sequentially around the installation area, with any two adjacent barrier grooves spaced apart; the interval between any two adjacent barrier grooves is greater than or equal to 0.5 mm; and / or, The depth of each of the aforementioned barrier grooves is 10-100 μm; and / or, The top surface also includes a plurality of exposed areas spaced apart from each other. Each exposed area is exposed outside the molding compound. Each exposed area is located on the side of the molding compound away from the mounting area, and each exposed area is located between the molding compound and one of the plurality of sides.

7. The encapsulated heat spreader of claim 1, wherein, The encapsulated heat sink also includes a sidewall connecting the top surface and the bottom surface; The sidewall of the encapsulated heat sink is stepped and / or a first groove is formed on the sidewall of the encapsulated heat sink.

8. The encapsulated heat spreader of claim 7, wherein, The sidewall of the encapsulated heat sink is stepped, and the sidewall includes a first sidewall segment, a second sidewall segment and a third sidewall segment. The first sidewall segment is disposed near the top surface and connected to the top surface. The second sidewall segment is disposed near the bottom surface and connected to the bottom surface. The third sidewall segment is located between the first sidewall segment and the second sidewall segment and connects the first sidewall segment and the second sidewall segment. The height of the first sidewall segment in the first direction from the top surface to the bottom surface is equal to the height of the second sidewall segment in the first direction; And / or, the shortest distance between the first sidewall segment and the central axis of the encapsulated heat sink perpendicular to the top surface is greater than the shortest distance between the second sidewall segment and the central axis; and / or, both the first sidewall segment and the second sidewall segment extend along a first direction from the top surface to the bottom surface, and the third sidewall segment extends along a second direction perpendicular to the first direction; and / or, the first sidewall segment has a creepage notch that extends along the first direction from the top surface to the bottom surface, and the creepage notch penetrates the top surface and the third sidewall segment.

9. The encapsulated heat spreader of claim 1, wherein, The bottom surface is provided with a heat dissipation part, which is used to be exposed outside the plastic encapsulation body; the heat dissipation part includes a plurality of heat dissipation pins protruding from the bottom surface and a heat dissipation ring protruding from the bottom surface, the plurality of heat dissipation pins are spaced apart from each other, the heat dissipation ring is arranged around the plurality of heat dissipation pins, and each heat dissipation pin and the heat dissipation ring are spaced apart. The cross-sectional shape of each of the aforementioned heat dissipation pins is rhomboid; At least one heat dissipation protrusion is provided on the inner sidewall of the heat dissipation ring facing the plurality of heat dissipation pins. Each of the heat dissipation protrusions includes a first protrusion segment and a second protrusion segment. The first protrusion segment is spaced apart from the inner wall of the heat dissipation ring. The second protrusion segment is located between the first protrusion segment and the inner wall of the heat dissipation ring and connects the first protrusion segment and the inner wall of the heat dissipation ring. The cross-sectional shape of the first protrusion segment is a semi-rhombus shape, and the cross-sectional shape of the second protrusion segment is a rectangle shape. The length of the long side of the rectangle is equal to the length of the longest side of the semi-rhombus. The overall cross-sectional shape of each heat dissipation protrusion is a planar figure formed by connecting the long side of the rectangle and the longest side of the semi-rhombus.

10. The encapsulated heat sink according to claim 9, characterized in that, The side length of the rhombus is greater than or equal to 0.9 mm and less than or equal to 2 mm; and / or, The side length of the rhombus corresponding to the semi-rhombus is greater than or equal to 0.9 mm and less than or equal to 2 mm; and / or, The gap between any two adjacent heat dissipation pins is greater than or equal to 0.8 mm and less than or equal to 1.2 mm; and / or, The distance between each of the heat dissipation protrusions and the nearest heat dissipation pin is greater than or equal to 0.8 mm and less than or equal to 1.2 mm; and / or, Multiple heat dissipation protrusions are provided on each of the two opposite inner sidewalls of the heat dissipation ring.

11. A packaged heat spreader, characterized by, The encapsulated heat sink includes a top surface, a bottom surface, and sidewalls. The top surface and the bottom surface are disposed opposite to each other. The sidewalls include a first sidewall segment, a second sidewall segment, and a third sidewall segment. The first sidewall segment is located between the top surface and the bottom surface and extends along a first direction from the top surface to the bottom surface. One end of the first sidewall segment near the top surface is connected to the top surface. The second sidewall segment is located between the top surface and the bottom surface and extends along the first direction. One end of the second sidewall segment near the bottom surface is connected to the bottom surface. The third sidewall segment is located between the first sidewall segment and the second sidewall segment and extends along a second direction perpendicular to the first direction. One end of the third sidewall segment is connected to the end of the first sidewall segment near the bottom surface, and the other end of the third sidewall segment is connected to the end of the second sidewall segment near the top surface. The height of the first sidewall segment in the first direction is equal to the height of the second sidewall segment in the first direction.

12. A semiconductor package module, characterized by comprising: The package includes a heat sink, a molding compound, a substrate, and a chip as described in any one of claims 1-11, wherein the substrate is mounted in the mounting area of ​​the heat sink, the chip is mounted on the surface of the substrate facing away from the heat sink, the molding compound encapsulates a portion of the substrate, the chip, and the heat sink, the molding compound covers the top surface of the heat sink with the top area covered by the molding compound, and at least a portion of the bottom surface of the heat sink is exposed outside the molding compound.

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