Pin heat sink device

Abstract

This utility model discloses a pin heat dissipation device, including a heat-conducting element with at least one through-hole suitable for a pin of a power semiconductor device to pass through, allowing the heat-conducting element to be fitted onto the pin; and a housing supporting the heat-conducting element, the housing being made of insulating material. When the pin heat dissipation device is mounted on the power semiconductor device, at least a portion of the housing is located between the heat-conducting element and the circuit board, separating the heat-conducting element from the circuit board. The heat-conducting element is suitable for being fitted onto the pin of the power semiconductor device, allowing heat to be dissipated from the pin in a timely manner through heat conduction and heat convection, thereby reducing the pin temperature.

Description

Technical Field

[0001] This utility model relates to the field of inverter heat dissipation technology, and in particular to a pin heat dissipation device. Background Technology

[0002] During the operation of power semiconductor devices such as IGBTs and MOSFETs in inverters, Joule heating is generated when current flows through the pins. Simultaneously, due to the packaging structure of these power semiconductor devices, some heat is conducted from the chip junction to the pins, causing a rapid rise in pin temperature, a phenomenon particularly pronounced in high-current applications. Because the pins of power semiconductor devices are small, typically less than 1mm thick, their heat dissipation area is limited, making it difficult to dissipate heat effectively and resulting in persistently high pin temperatures. Prolonged high-temperature operation not only accelerates circuit board aging and affects the reliability of the inverter equipment, but can also lead to solder joint failure, material thermal deformation, and even serious malfunctions such as device burnout or system failure.

[0003] To address the heat dissipation problem of pins in power semiconductor devices, related technologies typically employ methods such as increasing the copper foil area of ​​the circuit board or thickening the circuit board. However, this approach requires redesigning the circuit board, which prolongs the development cycle and hinders the rapid advancement of optimization projects. Utility Model Content

[0004] One objective of this invention is to provide a pin heat dissipation device to improve the heat dissipation efficiency of the pins of power semiconductor devices.

[0005] To achieve the above objectives, the technical solution adopted by this utility model is as follows: a pin heat dissipation device, comprising: a heat-conducting element, wherein the heat-conducting element has at least one through mounting hole, the mounting hole being adapted for the pin of a power semiconductor device to pass through, so that the heat-conducting element is sleeved on the pin; and a housing, wherein the housing supports the heat-conducting element, the housing being made of insulating material, and when the pin heat dissipation device is installed on a power semiconductor device, at least a portion of the housing is located between the heat-conducting element and the circuit board to separate the heat-conducting element and the circuit board.

[0006] As a preferred embodiment, the heat-conducting component is made of an insulating material; the pin heat dissipation device further includes a heat sink and a heat sink plate, with the heat-conducting component sandwiched between the heat sink and the heat sink plate, so as to conduct heat to the outside through the heat sink and the heat sink plate.

[0007] As a preferred embodiment, the thermal conductivity of the heat-conducting component is denoted as λ1, which satisfies: λ1≥5W / (m·K).

[0008] As a preferred embodiment, the thickness of the pins of the power semiconductor device is d, and the thickness of the heat-conducting component is denoted as D, satisfying D≥2d.

[0009] As a preferred embodiment, the outer casing includes a connected peripheral side portion and a back side portion, the peripheral side portion forming a receiving cavity for accommodating the heat sink, the heat-conducting component, and the heat dissipation plate; the back side portion extends from the peripheral side portion toward the receiving cavity to abut against the heat dissipation plate; wherein, the width of the back side portion extending toward the receiving cavity is denoted as L, and satisfies: L≥1mm.

[0010] As a preferred embodiment, the heat-conducting element is made of a conductive material, and the heat-conducting element has a mounting hole for fitting onto one of the pins of a power semiconductor device, and the heat-conducting element is in communication with the pin; the pin heat dissipation device also includes an insulating element, which is sandwiched between two adjacent heat-conducting elements.

[0011] As a preferred embodiment, the heat-conducting component includes a first heat-conducting component and a second heat-conducting component, at least one of the first heat-conducting component and the second heat-conducting component having a pin slot. When the first heat-conducting component and the second heat-conducting component are disposed opposite each other on both sides of the pin of the power semiconductor device, the first heat-conducting component and the second heat-conducting component can be fitted together so that the pin slot forms the mounting hole.

[0012] As a preferred embodiment, the outer casing includes a bottom side portion and a peripheral side portion connected together. The bottom side portion is located below the heat-conducting element and is used to support the heat-conducting element. The peripheral side portion surrounds the bottom side portion to form a receiving groove between the peripheral side portion and the bottom side portion, and the receiving groove is used to accommodate the heat-conducting element and the insulating element. The inner height of the peripheral side portion is denoted as H, and the height of the heat-conducting element is denoted as h, satisfying: H≥h / 3.

[0013] As a preferred embodiment, the heat-conducting component, the insulating component, and the outer casing are bonded together.

[0014] As a preferred embodiment, the thermal conductivity of the outer shell is denoted as λ2, which satisfies: λ2≥2W / (m·K).

[0015] Compared with the prior art, the beneficial effects of this utility model are as follows:

[0016] (1) The heat-conducting component is suitable for being fitted onto the pins of power semiconductor devices, so as to dissipate the heat of the pins in a timely manner through heat conduction and heat convection, thereby reducing the temperature of the pins.

[0017] (2) The outer shell is made of insulating material. At least part of the outer shell is located between the heat-conducting component and the circuit board, which can separate the heat-conducting component and the circuit board and help avoid short circuits between the heat-conducting component and the circuit board. Attached Figure Description

[0018] Figure 1This is a perspective structural diagram of a pin heat dissipation device according to some embodiments of this application.

[0019] Figure 2 This is a schematic diagram of a pin heat sink device mounted on a pin according to some embodiments of this application.

[0020] Figure 3 This is an exploded view of a pin heat dissipation device according to some embodiments of this application.

[0021] Figure 4 This is a perspective structural diagram of the housing of a pin heat dissipation device according to some embodiments of this application.

[0022] Figure 5 This is a perspective structural diagram of a pin heat dissipation device according to some other embodiments of this application.

[0023] Figure 6 This is a schematic diagram of a pin heat sink device mounted on a pin according to other embodiments of this application.

[0024] Figure 7 This is an exploded view of a pin heat dissipation device according to some other embodiments of this application.

[0025] Figure 8 This is a perspective structural diagram of a pin heat dissipation device according to some other embodiments of this application.

[0026] Figure 9 This is a schematic diagram of a pin heat sink device mounted on a pin according to other embodiments of this application.

[0027] Figure 10 This is a perspective structural diagram of a pin heat dissipation device according to some other embodiments of this application.

[0028] In the figure: 1. Pin heat dissipation device; 10. Heat conductor; 11. Mounting hole; 12. First heat conductor; 13. Second heat conductor; 14. Pin slot; 20. Housing; 21. Peripheral side; 22. Back side; 23. Bottom side; 24. Clearance hole; 25. Receiving cavity; 26. Receiving groove; 30. Heat sink; 31. Main body; 32. Finned part; 40. Heat sink plate; 50. Fastener; 60. Insulator; 2. Power semiconductor device; 201. Pin. Detailed Implementation

[0029] The present invention will be further described below with reference to specific embodiments. It should be noted that, without conflict, the various embodiments or technical features described below can be arbitrarily combined to form new embodiments.

[0030] In the description of this utility model, it should be noted that the directional terms such as "center", "lateral", "longitudinal", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", and "counterclockwise" are based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. They should not be construed as limiting the specific protection scope of this utility model.

[0031] It should be noted that the terms "first," "second," etc., in the specification and claims of this application are used to distinguish similar objects and are not necessarily used to describe a specific order or sequence.

[0032] In the description of this utility model, it should also be noted that, unless otherwise explicitly specified and limited, the terms "set," "install," "connect," and "link" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection, a contact connection, or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model according to the specific circumstances.

[0033] A pin heat dissipation device 1, such as Figures 1-10 As shown, the device includes a heat-conducting element 10 and a housing 20. The heat-conducting element 10 has at least one through mounting hole 11, which is suitable for the pins 201 of the power semiconductor device 2 to pass through, so that the heat-conducting element 10 is fitted onto the pins 201, allowing heat to be dissipated from the pins 201 in a timely manner through heat conduction, thereby reducing the temperature of the pins 201. The housing 20 supports the heat-conducting element 10 and is made of insulating material. When the pin heat dissipation device 1 is installed on the power semiconductor device 2, at least a portion of the housing 20 is located between the heat-conducting element 10 and the circuit board to separate the heat-conducting element 10 from the circuit board. This is especially beneficial when the heat-conducting element 10 is made of metal, as it helps to prevent short circuits between the heat-conducting element 10 and the circuit board.

[0034] In some embodiments, the thermal conductivity of the outer casing 20 is denoted as λ2, satisfying: λ2≥2W / (m·K), thereby enabling the heat from the heat-conducting element 10 to be transferred to the outer casing 20 more quickly and dissipated through the outer casing 20. This helps to avoid excessively high temperatures on the side of the heat-conducting element 10 that is in contact with the outer casing 20, resulting in a more uniform temperature of the heat-conducting element 10. This, in turn, helps to prevent the heat-conducting element 10 from cracking due to thermal stress, thereby improving the reliability of the heat-conducting element 10 and extending its service life.

[0035] Furthermore, the outer casing 20 is made of an insulating and high-temperature resistant material, thereby reducing the risk of deformation or cracking of the outer casing 20 due to excessive temperature, and improving the structural reliability and stability of the outer casing 20. The material of the outer casing 20 includes, but is not limited to, thermally conductive engineering plastics, alumina ceramics, etc., and this application does not impose specific limitations on this.

[0036] In some embodiments, such as Figure 3 As shown, the heat-conducting element 10 is made of insulating material; the pin heat dissipation device 1 also includes a heat sink 30 and a heat sink 40, with the heat-conducting element 10 sandwiched between the heat sink 30 and the heat sink 40, allowing heat to be conducted to the outside through the heat sink 30 and the heat sink 40. It should be understood that the heat sink 30 and the heat sink 40 further increase the heat dissipation area and improve heat dissipation efficiency, thereby more effectively reducing the temperature of the pin 201 of the power semiconductor device 2. It is worth mentioning that the heat-conducting element 10 can also be sandwiched between two heat sinks 40 or between two heat sinks 30; this application does not impose specific limitations on this.

[0037] In some embodiments, the thermal conductivity of the heat-conducting element 10 is denoted as λ1, which satisfies: λ1≥5W / (m·K), thereby enabling the heat of the pin 201 to be transferred to the heat-conducting element 10 more quickly and dissipated to the outside through the heat sink 30 and heat sink 40 connected to the heat-conducting element 10. This can reduce the risk of solder joint failure, extend the service life of the circuit board, and improve the reliability of the inverter equipment operation.

[0038] In some embodiments, such as Figure 2 and Figure 3 As shown, the thickness of the pin 201 of the power semiconductor device 2 is d, and the thickness of the heat conductor 10 is denoted as D. The thickness satisfies D≥2d, which helps to avoid the structural strength being low due to the wall thickness of the heat conductor 10 being too thin, thereby improving the structural reliability and processability of the heat conductor 10.

[0039] In some embodiments, the thermal conductivity of both the heat sink 30 and the heat sink 40 is greater than or equal to that of the heat conductor 10. For example, the heat sink 30 and the heat sink 40 can be made of metals with high thermal conductivity, such as copper or aluminum. This allows the heat from the heat conductor 10 to dissipate more quickly, further improving the heat dissipation performance of the pin heat sink 1. It should be understood that since the heat conductor 10 is an insulating material, it separates the pin 201 from the heat sink 30 and from the heat sink 40, which helps to prevent short circuits between the pin 201 and the metal heat sink 30 and heat sink 40, thereby improving the safety of the pin heat sink 1 during use.

[0040] In at least one embodiment, the heat sink 40 is made of copper to suit high power density heat dissipation, thereby further improving the heat dissipation performance of the pin heat sink 1.

[0041] In at least one embodiment, such as Figure 3 As shown, the heat sink 30 includes a main body 31 and a plurality of finned portions 32 connected to the main body 31. The main body 31 is in close contact with the heat-conducting element 10, which helps to ensure a large heat transfer area between the main body 31 and the heat-conducting element 10. The finned portions 32 and the heat-conducting element 10 are located on opposite sides of the main body 31. The finned portions 32 increase the heat dissipation area of ​​the heat sink 30, thereby improving the heat dissipation performance of the pin heat dissipation device 1. It is worth mentioning that the heat sink 30 can be made of aluminum, which is beneficial for the one-time molding of the relatively complex finned portions 32, and the overall weight is relatively light.

[0042] In at least one embodiment, such as Figure 3 As shown, the radiator 30, the heat-conducting component 10, and the heat sink 40 are stacked sequentially and connected by fasteners 50 to ensure a reliable and tight fit between them. This improves the connection strength and reliability of the three components and facilitates rapid assembly. It is worth noting that the radiator 30, the heat-conducting component 10, and the heat sink 40 can also be bonded together with high-temperature resistant adhesive, which helps avoid the need for through holes or threaded holes in these components, thus reducing processing difficulty.

[0043] In some embodiments, such as Figures 1-4 As shown, the housing 20 includes a connected peripheral side portion 21 and a back side portion 22. The peripheral side portion 21 forms a receiving cavity 25, which accommodates the heat sink 30, the heat conductor 10, and the heat sink 40, making the pin heat sink 1 neater and more aesthetically pleasing. The back side portion 22 extends from the peripheral side portion 21 toward the receiving cavity 25 and abuts against the heat sink 40. This allows for positioning of the overall structure composed of the heat sink 30, the heat conductor 10, and the heat sink 40 during the assembly of the pin heat sink 1, thereby improving production efficiency and product assembly uniformity. It should be understood that one sidewall of the peripheral side portion 21 can separate the heat sink 30 and the heat sink 40 from the circuit board, thereby helping to avoid short circuits between the heat sink 30 / heat sink 40 and the circuit board, and improving the safety of the pin heat sink 1 during use.

[0044] In at least one embodiment, such as Figure 4As shown, the width of the back side portion 22 extending toward the receiving cavity 25 is denoted as L, which satisfies: L≥1mm. That is, the back side portion 22 is a hollow frame structure, which is beneficial for the heat sink 40 to conduct heat to the outside and improve heat dissipation efficiency. Furthermore, the width L of the back side portion 22 extending toward the receiving cavity 25 is ≥1mm, which helps to ensure that the back side portion 22 has good structural strength, so that the heat sink 40 and the back side portion 22 can reliably abut against each other; and it is also convenient to apply high-temperature adhesive between the back side portion 22 and the heat sink 40 to reliably bond the outer shell 20 and the heat sink 40.

[0045] In at least one embodiment, such as Figure 3 and Figure 4 As shown, clearance holes 24 are provided on the two sidewalls of the peripheral portion 21 that are perpendicular to the extension direction of the pin 201. The clearance holes 24 allow the pin 201 of the power semiconductor device 2 to pass through, which helps to avoid interference between the housing 20 and the pin 201.

[0046] In at least one embodiment, such as Figure 1 and Figure 2 As shown, at least a portion of the fin portion 32 of the radiator 30 extends outward from the receiving cavity 25 of the housing 20 to be exposed to the outside, thereby improving the heat dissipation efficiency of the radiator 30.

[0047] In some embodiments, such as Figures 5-10 As shown, the heat-conducting element 10 is made of conductive material and has a mounting hole 11, which allows it to be fitted onto one of the pins 201 of the power semiconductor device 2. The heat-conducting element 10 is connected to the pin 201, thereby increasing the cross-sectional area of ​​the conductive part and reducing the resistance value. Furthermore, the pin heat dissipation device 1 also includes an insulating element 60, which is sandwiched between two adjacent heat-conducting elements 10, which helps to prevent two adjacent pins 201 from being connected through the heat-conducting element 10 and causing a short circuit.

[0048] It is understandable that, due to the small cross-sectional area of ​​the pin 201 of the power semiconductor device 2, a large amount of Joule heat will be generated when it is turned on. According to Joule's law, Q = I 2 Rt and the resistance law R = ρL / S, where: Q is the heat generated, I is the current intensity, R is the resistance of the conductor, t is the current-carrying time, ρ is the resistivity, L represents the length of the conductor, and S is the cross-sectional area of ​​the conductor. It can be seen that Joule heating can be reduced by decreasing the length of pin 201 or increasing the cross-sectional area of ​​pin 201. However, if Joule heating is reduced by decreasing the length of pin 201, since the length of pin 201 is fixed at the factory, secondary processing of pin 201 is required. This is not only time-consuming but may also shorten the distance between the main body of the power semiconductor device 2 and the circuit board, leading to other problems such as insufficient creepage clearance and electrical clearance.

[0049] In this embodiment, by attaching a heat-conducting element 10 to pin 201, the heat dissipation area is increased; and since the heat-conducting element 10 is connected to pin 201, the cross-sectional area of ​​the conductive portion is increased, thereby reducing Joule heating. In at least one embodiment, the heat-conducting element 10 is made of copper, which has good thermal conductivity to improve the heat dissipation efficiency of pin 201; it also facilitates the processing of mounting holes 11 so that the heat-conducting element 10 and pin 201 can be connected by insertion. It should be understood that the heat-conducting element 10 can also be implemented as other metal materials that can conduct electricity and have a high thermal conductivity, and this application does not impose specific limitations on this.

[0050] It is worth mentioning that, such as Figures 5-7 As shown, the cross-section of the heat-conducting element 10 perpendicular to the extension direction of the pin 201 can be rectangular, L-shaped, or other shapes, and this application does not impose specific limitations on this. Furthermore, the surface of the heat-conducting element 10 can be wavy, serrated, or other shapes to further increase the surface area of ​​the heat-conducting element 10 while ensuring that the volume of the heat-conducting element 10 is small, thereby improving the heat dissipation efficiency of the heat-conducting element 10.

[0051] In at least one instance, such as Figures 5-7 As shown, the housing 20 is plate-shaped and extends in a plane perpendicular to the extension direction of the pin 201. It should be understood that the housing 20 separates the heat-conducting component 10 from the circuit board, which helps to prevent short circuits between the pin 201, the heat-conducting component 10, and the circuit board, thereby improving the safety of the pin heat dissipation device 1 during use. Furthermore, the housing 20 is provided with clearance holes 24, which allow the pin 201 of the power semiconductor device 2 to pass through, helping to prevent interference between the housing 20 and the pin 201.

[0052] In some embodiments, such as Figures 8-10 As shown, the heat-conducting component 10 includes a first heat-conducting component 12 and a second heat-conducting component 13. At least one of the first heat-conducting component 12 and the second heat-conducting component 13 has a pin slot 14. When the first heat-conducting component 12 and the second heat-conducting component 13 are disposed opposite each other on both sides of the pin 201 of the power semiconductor device 2, the first heat-conducting component 12 and the second heat-conducting component 13 can be in contact with each other so that the pin slot 14 forms a mounting hole 11. It should be understood that compared with opening a rectangular through hole in the heat-conducting component 10, in this embodiment, by opening a pin slot 14 in at least one of the first heat-conducting component 12 and the second heat-conducting component 13, the processing difficulty can be reduced, the production efficiency can be improved, and the manufacturing cost can be saved.

[0053] In at least one embodiment, such as Figure 10As shown, the second heat-conducting element 13 has a pin groove 14 on its side facing the first heat-conducting element 12, and the side of the first heat-conducting element 12 facing the second heat-conducting element 13 is flat. This reduces the processing difficulty of the first heat-conducting element 12, thereby further saving manufacturing costs. It should be understood that... Figure 8 As shown, when the first heat-conducting element 12 and the second heat-conducting element 13 are in contact, a mounting hole 11 is formed between the first heat-conducting element 12 and the second heat-conducting element 13 through the pin groove 14, so as to facilitate reliable insertion and conduction with the pin 201.

[0054] In some embodiments, such as Figure 10 As shown, the housing 20 includes a connected bottom side portion 23 and a peripheral side portion 21. The bottom side portion 23 is located below the heat-conducting element 10 and supports the heat-conducting element 10. That is, the bottom side portion 23 extends in a plane perpendicular to the extension direction of the pin 201, thereby separating the heat-conducting element 10 and the circuit board, which helps to avoid short circuits between the pin 201, the heat-conducting element 10, and the circuit board. In at least one embodiment, a clearance hole 24 is provided on the bottom side portion 23, which allows the pin 201 of the power semiconductor device 2 to pass through, which helps to avoid interference between the housing 20 and the pin 201.

[0055] Furthermore, such as Figure 10 As shown, the peripheral side portion 21 surrounds the bottom side portion 23 to form a receiving groove 26 between the peripheral side portion 21 and the bottom side portion 23. The receiving groove 26 can accommodate the heat-conducting component 10 and the insulating component 60, thereby limiting the first heat-conducting component 12, the second heat-conducting component 13 and the insulating component 60, reducing the assembly difficulty of the pin heat dissipation device 1 and improving the assembly efficiency. In addition, the limiting effect of the peripheral side portion 21 also helps to make the first heat-conducting component 12, the second heat-conducting component 13 and the pin 201 fit tightly, thereby improving the reliability of the conduction between the heat-conducting component 10 and the pin 201.

[0056] In at least one instance, such as Figure 10 As shown, the inner height of the peripheral side portion 21 is denoted as H, and the height of the heat-conducting component 10 is denoted as h. The condition is satisfied that H≥h / 3. This helps to ensure that the peripheral side portion 21 has good structural strength, thereby reliably limiting the first heat-conducting component 12 and the second heat-conducting component 13 through the peripheral side portion 21; and also helps to improve the structural reliability of the outer shell 20 and extend the service life of the outer shell 20.

[0057] In some embodiments, the heat-conducting element 10, the insulating element 60, and the housing 20 are bonded together. Specifically, the heat-conducting element 10 may first be bonded to the insulating element 60, and then the integral structure consisting of the heat-conducting element 10 and the insulating element 60 may be bonded to the bottom side portion 23 of the housing 20; alternatively, the heat-conducting element 10 and the insulating element 60 may be bonded to the bottom side portion 23 of the housing 20 respectively; this application does not impose specific limitations on this. It is worth mentioning that the adhesive or bonding agent used for bonding is made of a high-temperature resistant material to improve the connection reliability between the heat-conducting element 10, the insulating element 60, and the housing 20.

[0058] The basic principles, main features, and advantages of this utility model have been described above. Those skilled in the art should understand that this utility model is not limited to the above embodiments. The embodiments and descriptions in the specification are merely the principles of this utility model. Various changes and modifications can be made to this utility model without departing from its spirit and scope, and all such changes and modifications fall within the scope of the claimed utility model. The scope of protection of this utility model is defined by the appended claims and their equivalents.

Claims

1. A pin heat dissipation device, characterized by, include: A heat-conducting component, wherein the heat-conducting component has at least one through mounting hole, the mounting hole being adapted for a pin of a power semiconductor device to pass through, such that the heat-conducting component is fitted onto the pin; The housing, which supports the heat-conducting component, is made of insulating material. When the pin heat sink is mounted on a power semiconductor device, at least a portion of the housing is located between the heat-conducting component and the circuit board to separate the heat-conducting component and the circuit board.

2. The pin heat sink device of claim 1, wherein, The heat-conducting component is made of insulating material; the pin heat dissipation device also includes a heat sink and a heat sink plate, and the heat-conducting component is sandwiched between the heat sink and the heat sink plate, so as to conduct heat to the outside through the heat sink and the heat sink plate.

3. The pin heat sink device of claim 2, wherein, The thermal conductivity of the heat-conducting component is denoted as λ1, which satisfies: λ1≥5W / (m·K).

4. The pin heat sink device of claim 2, wherein, The thickness of the pins of the power semiconductor device is d, and the thickness of the heat-conducting component is denoted as D, satisfying D≥2d.

5. The pin heat sink device of claim 2, wherein, The outer casing includes a peripheral side portion and a back side portion connected together. The peripheral side portion forms a receiving cavity, which accommodates the heat sink, the heat-conducting component, and the heat dissipation plate. The back side portion extends from the peripheral side portion toward the receiving cavity and abuts against the heat dissipation plate. The width of the back side portion extending toward the receiving cavity is denoted as L, which satisfies: L≥1mm.

6. The pin heat sink device of claim 1, wherein, The heat-conducting component is made of a conductive material and has a mounting hole for fitting onto one of the pins of a power semiconductor device. The heat-conducting component is in communication with the pin. The pin heat dissipation device also includes an insulating component sandwiched between two adjacent heat-conducting components.

7. The pin heat dissipation device according to claim 6, characterized in that, The thermal conductive component includes a first thermal conductive component and a second thermal conductive component. At least one of the first thermal conductive component and the second thermal conductive component has a pin slot. When the first thermal conductive component and the second thermal conductive component are disposed opposite each other on both sides of the pin of the power semiconductor device, the first thermal conductive component and the second thermal conductive component can fit together so that the pin slot forms the mounting hole.

8. The pin heat sink device of claim 7, wherein, The outer casing includes a bottom side portion and a peripheral side portion connected together, the bottom side portion being located below the heat-conducting element to support the heat-conducting element; The peripheral side surrounds the bottom side to form a receiving groove between the peripheral side and the bottom side, the receiving groove accommodating the heat-conducting component and the insulating component; wherein, the inner height of the peripheral side is denoted as H, and the height of the heat-conducting component is denoted as h, satisfying: H≥h / 3.

9. The pin heat sink device of claim 6, wherein, The heat-conducting component, the insulating component, and the outer shell are bonded together.

10. The pin heat sink device of any of claims 1-9, wherein, The thermal conductivity of the outer shell is denoted as λ2, which satisfies: λ2≥2W / (m·K).

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