Insulated gate bipolar transistor single transistor module fixing device

Abstract

This utility model discloses a single-transistor module fixing device for insulated gate bipolar junction transistors (IGBTs), including a support mechanism for fixing multiple sets of individual transistor fixing mechanisms. A heat dissipation mechanism for heat dissipation is fixedly installed at the bottom of the support mechanism, and a clamping mechanism for fixing and pressing the individual transistor fixing mechanisms is provided on the heat dissipation mechanism. The individual transistor fixing mechanism of this utility model can support and fix a single transistor, and then multiple individual transistor fixing mechanisms can be placed inside the support mechanism for fixing. This arrangement facilitates the disassembly of individual individual transistor fixing mechanisms, thereby facilitating individual maintenance of damaged transistors. The heat dissipation mechanism prevents excessive heat accumulation in the transistors, and after the transistors are installed, the clamping mechanism can be used to re-fix the individual transistor fixing mechanisms to prevent positional displacement of the transistors during use.

Description

Technical Field

[0001] This utility model relates to the field of transistor technology, specifically to a fixing device for a single-tube module of an insulated gate bipolar transistor. Background Technology

[0002] A frequency converter is a power control device that uses frequency conversion technology and microelectronics to control an AC motor by changing the frequency of the power supply. IGBT (Insulated Gate Bipolar Transistor) modules are an important component of frequency converters. They can be divided into integrated modules and single-transistor modules. Frequency converters using integrated IGBT modules have a simple installation process but are very expensive. Frequency converters using single-transistor IGBT modules are cheaper, but their production and installation require assembling and fixing each module individually, and their insulation and thermal conductivity requirements must be considered, making the production process more complex and less efficient.

[0003] Currently, most single-transistor IGBT modules are installed using metal clamps and screws. However, this method may result in poor heat dissipation during use. Furthermore, using metal clamps for direct fixation makes it difficult to disassemble and replace a damaged transistor, thus affecting its normal operation. To address this, we propose a fixing device for single-transistor IGBT modules. Utility Model Content

[0004] The purpose of this invention is to provide a fixing device for a single-tube module of an insulated gate bipolar transistor to solve the problems mentioned in the background art.

[0005] To achieve the above objectives, this utility model provides the following technical solution: a single-transistor module fixing device for insulated gate bipolar transistors, comprising a supporting mechanism, a single-transistor fixing mechanism, and a bottom fixing plate. The supporting mechanism is used to fix multiple sets of single-transistor fixing mechanisms. Multiple sets of first mounting grooves are formed through the bottom fixing plate. A heat dissipation mechanism for heat dissipation is fixedly installed at the bottom of the supporting mechanism. The heat dissipation mechanism is fixedly installed at the top of the bottom fixing plate. The single-transistor fixing mechanism is used to support and fix the transistor. A clamping mechanism for fixing and pressing the single-transistor fixing mechanism is provided on the heat dissipation mechanism.

[0006] Furthermore, the heat dissipation mechanism includes a support column, a first fixed base, and a heat dissipation fan. The bearing mechanism is fixedly installed on the top of the first fixed base. The bottom of the first fixed base is fixedly installed on the top of the bottom fixed plate through multiple sets of support columns. A heat dissipation fan is fixedly installed on the bottom of the first fixed base. A first heat dissipation hole communicating with the heat dissipation fan is opened on the bearing mechanism.

[0007] Furthermore, the bearing mechanism includes a bearing seat, a bearing groove, a first heat dissipation hole, and a second mounting groove. The bearing seat has multiple sets of bearing grooves, and the inner walls of the bearing grooves are provided with second mounting grooves on both sides. The interior of the second mounting groove is provided with a first claw.

[0008] Furthermore, the single-cell transistor fixing mechanism includes a second fixing base, a second heat dissipation hole, a positioning post, and a second claw. The second heat dissipation hole has two sets of second heat dissipation holes that communicate with the first heat dissipation hole. The positioning post is fixedly installed on the top of the second fixing base, and two sets of second claws are fixedly installed on the top of the second fixing base.

[0009] Furthermore, the clamping mechanism includes a locking screw, a winged thread cap, a pressure plate, a through groove, and a baffle. A positioning groove is provided on one side of the top of the second fixed seat. Two sets of locking screws are fixedly installed on the top of the heat dissipation mechanism. The pressure plate overlaps inside the positioning groove. A through groove is provided on the pressure plate at the position corresponding to the locking screw. A winged thread cap that contacts the top of the pressure plate is threaded onto the external thread of the locking screw. A baffle is fixedly connected to the bottom of the pressure plate and outside the second fixed seat.

[0010] Furthermore, a first inclined clearance groove is provided on one side of the bottom of the baffle, and a second inclined clearance groove is provided on the bottom of the fixing seat.

[0011] Compared with the prior art, the present invention has the following advantages: The single transistor fixing mechanism provided in the present invention can support and fix a single transistor. Subsequently, multiple single transistor fixing mechanisms can be placed inside the support mechanism for fixing. This arrangement facilitates the disassembly of the single transistor fixing mechanism, thereby making it convenient to perform individual maintenance on damaged transistors. The heat dissipation mechanism can prevent excessive heat accumulation in the transistor. Furthermore, after the transistor is installed, the single transistor fixing mechanism can be used to fix it again, preventing the transistor from shifting position during use. Attached Figure Description

[0012] Figure 1 This is a first perspective structural diagram of the present invention;

[0013] Figure 2 This is a second perspective view of the structure of this utility model;

[0014] Figure 3 This is an enlarged schematic diagram of structure A of this utility model;

[0015] Figure 4 This is the single-cell transistor fixing mechanism of this utility model.

[0016] In the diagram: 1. Bearing mechanism, 2. Single transistor fixing mechanism, 3. Heat dissipation mechanism, 4. Pressing mechanism, 5. Bottom fixing plate, 6. First mounting slot, 7. Support column, 8. First fixing seat, 9. Cooling fan, 10. Bearing seat, 11. Bearing slot, 12. First heat dissipation hole, 13. Second mounting slot, 14. First claw, 15. Second fixing seat, 16. Second heat dissipation hole, 17. Positioning column, 18. Second claw, 19. Positioning slot, 20. Locking screw, 21. Butterfly threaded cap, 22. Pressure plate, 23. Through slot, 24. Baffle, 25. First clearance slot, 26. Second clearance slot. Detailed Implementation

[0017] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0018] Please see Figures 1-4 This utility model provides a technical solution: a single-tube module fixing device for an insulated gate bipolar transistor, including a supporting mechanism 1, a single-unit transistor fixing mechanism 2, and a bottom fixing plate 5. The supporting mechanism 1 is used to fix multiple sets of single-unit transistor fixing mechanisms 2. Multiple sets of first mounting grooves 6 are formed through the bottom fixing plate 5. A heat dissipation mechanism 3 for heat dissipation is fixedly installed at the bottom of the supporting mechanism 1. The heat dissipation mechanism 3 is fixedly installed at the top of the bottom fixing plate 5. The single-unit transistor fixing mechanism 2 is used to support and fix the transistor. A clamping mechanism 4 is provided on the heat dissipation mechanism 3 to fix and press the single-unit transistor fixing mechanism 2.

[0019] The individual transistor fixing mechanism 2 can support and fix a single transistor. Subsequently, multiple individual transistor fixing mechanisms 2 can be placed inside the support mechanism 1 for fixation. This configuration facilitates the disassembly of individual individual transistor fixing mechanisms 2, thereby making it convenient to perform individual maintenance on damaged transistors. The heat dissipation mechanism 3 can prevent excessive heat accumulation in the transistor. After the transistor is installed, the clamping mechanism 4 can be used to fix the individual transistor fixing mechanism 2 a second time to prevent the transistor from shifting position during use.

[0020] Please see Figure 1 and Figure 2The heat dissipation mechanism 3 includes a support column 7, a first fixed seat 8 and a heat dissipation fan 9. The bearing mechanism 1 is fixedly installed on the top of the first fixed seat 8. The bottom of the first fixed seat 8 is fixedly installed on the top of the bottom fixed plate 5 through multiple sets of support columns 7. The heat dissipation fan 9 is fixedly installed on the bottom of the first fixed seat 8. The bearing mechanism 1 has a first heat dissipation hole 12 that communicates with the heat dissipation fan 9.

[0021] After the transistor is installed, the heat dissipation fan 9 can quickly dissipate the heat generated by the transistor. The heat dissipation fan 9 is mounted on the bottom fixing plate 5 through the support column 7. This arrangement allows for a gap between the heat dissipation fan 9 and the bottom fixing plate 5, which facilitates the rapid dissipation of heat.

[0022] Please see Figure 1 , Figure 2 and Figure 3 The bearing mechanism 1 includes a bearing seat 10, a bearing groove 11, a first heat dissipation hole 12, and a second mounting groove 13. The bearing seat 10 has multiple sets of bearing grooves 11. The inner walls of the bearing grooves 11 are provided with second mounting grooves 13 on both sides. The interior of the second mounting groove 13 is provided with a first claw 14.

[0023] When the single transistor fixing mechanism 2 needs to be installed, it is placed inside the support groove 11. Then, the single transistor fixing mechanism 2 will press the first claw 14 to move along the inside of the second mounting groove 13. After the single transistor fixing mechanism 2 is fully inserted into the support groove 11, the first claw 14 can be used to fix and lock the single transistor fixing mechanism 2. The first heat dissipation hole 12 can facilitate the rapid dissipation of heat generated by the transistor.

[0024] Please see Figure 1 and Figure 4 The single-cell transistor fixing mechanism 2 includes a second fixing base 15, a second heat dissipation hole 16, a positioning post 17, and a second claw 18. Two sets of second heat dissipation holes 16 are provided through the second heat dissipation hole 16 and communicate with the first heat dissipation hole 12. The positioning post 17 is fixedly installed on the top of the second fixing base 15, and two sets of second claws 18 are fixedly installed on the top of the second fixing base 15.

[0025] The second heat dissipation hole 16 allows the transistor to dissipate heat quickly, while the positioning post 17 can be engaged with the fixing hole of the transistor. Then, as the transistor is installed, the second claw 18 and the positioning post 17 can work together to lock and fix the transistor.

[0026] Please see Figure 1 , Figure 2 , Figure 3and Figure 4 The clamping mechanism 4 includes a locking screw 20, a winged thread cap 21, a pressure plate 22, a through groove 23, and a baffle 24. A positioning groove 19 is provided on one side of the top of the second fixed seat 15. Two sets of locking screws 20 are fixedly installed on the top of the heat dissipation mechanism 3. The pressure plate 22 overlaps inside the positioning groove 19. A through groove 23 is provided on the pressure plate 22 at the position corresponding to the locking screw 20. The locking screw 20 is externally threaded to a winged thread cap 21 that contacts the top of the pressure plate 22. A baffle 24 is fixedly connected to the bottom of the pressure plate 22 and outside the second fixed seat 15.

[0027] The pressure plate 22 is sleeved on the outside of the locking screw 20, and then the pressure plate 22 can contact the inner wall of the positioning groove 19. The baffle 24 then contacts the outside of the second fixing seat 15. Then, rotating the butterfly thread cap 21 can fix the pressure plate 22. In this way, the pressure plate 22 and the baffle 24 can be used to prevent the second fixing seat 15 from shifting after installation.

[0028] Please see Figure 1 , Figure 2 and Figure 4 The bottom side of the baffle 24 is provided with an inclined first clearance groove 25, and the bottom of the second fixing seat 15 is provided with an inclined second clearance groove 26. The first clearance groove 25 allows the baffle 24 to be conveniently placed outside the second fixing seat 15, while the second clearance groove 26 allows the second fixing seat 15 to be conveniently inserted into the bearing groove 11.

[0029] In use, firstly, the individual transistor fixing mechanism 2 can support and fix a single transistor. Then, multiple individual transistor fixing mechanisms 2 can be placed inside the support mechanism 1 for fixation. This arrangement facilitates the disassembly of individual transistor fixing mechanisms 2, making it convenient to perform individual maintenance on damaged transistors. The heat dissipation mechanism 3 prevents excessive heat accumulation in the transistor. After the transistor is installed, the clamping mechanism 4 can be used to further fix the individual transistor fixing mechanism 2, preventing positional displacement during use. After the transistor is installed, the cooling fan 9 can quickly dissipate the heat generated by the transistor. The cooling fan 9 is mounted on the base fixing plate 5 via the support column 7. This arrangement allows for a gap between the cooling fan 9 and the base fixing plate 5, facilitating rapid heat dissipation. When the individual transistor fixing mechanism 2 needs to be installed, it is placed inside the support groove 11, and then the individual transistor is fixed. Mechanism 2 will press the first claw 14 to move it along the inside of the second mounting groove 13. After the single transistor fixing mechanism 2 is fully inserted into the bearing groove 11, the first claw 14 can be used to fix and lock the single transistor fixing mechanism 2. The first heat dissipation hole 12 can facilitate the rapid dissipation of heat generated by the transistor. The second heat dissipation hole 16 can facilitate the rapid dissipation of heat from the transistor. The positioning post 17 can be engaged with the fixing hole of the transistor. Then, as the transistor is installed, the second claw 18 and the positioning post 17 can cooperate to lock and fix the transistor. The pressure plate 22 is sleeved on the outside of the locking screw 20. Then the pressure plate 22 can contact the inner wall of the positioning groove 19. The baffle 24 will then contact the outside of the second fixing seat 15. Then, rotating the wing thread cap 21 can fix the pressure plate 22. In this way, the pressure plate 22 and the baffle 24 can prevent the second fixing seat 15 from shifting after installation.

[0030] Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A fixing device for a single-transistor module of an insulated gate bipolar junction transistor (IGBT), comprising a support mechanism (1), a single-transistor fixing mechanism (2), and a bottom fixing plate (5), wherein the support mechanism (1) is used to fix multiple sets of single-transistor fixing mechanisms (2), and multiple sets of first mounting slots (6) are formed through the bottom fixing plate (5), characterized in that: The bottom of the support mechanism (1) is fixedly installed with a heat dissipation mechanism (3) for heat dissipation. The heat dissipation mechanism (3) is fixedly installed on the top of the bottom fixing plate (5). The single transistor fixing mechanism (2) is used to support and fix the transistor. The heat dissipation mechanism (3) is provided with a pressing mechanism (4) for fixing and pressing the single transistor fixing mechanism (2). The heat dissipation mechanism (3) includes a support column (7), a first fixed seat (8) and a heat dissipation fan (9). The bearing mechanism (1) is fixedly installed on the top of the first fixed seat (8). The bottom of the first fixed seat (8) is fixedly installed on the top of the bottom fixed plate (5) through multiple sets of support columns (7). The bottom of the first fixed seat (8) is fixedly installed with a heat dissipation fan (9). The bearing mechanism (1) has a first heat dissipation hole (12) communicating with the heat dissipation fan (9). The bearing mechanism (1) includes a bearing seat (10), a bearing groove (11), a first heat dissipation hole (12), and a second mounting groove (13). The bearing seat (10) has multiple sets of bearing grooves (11). The inner walls of the bearing grooves (11) are provided with second mounting grooves (13) on both sides. The second mounting grooves (13) are provided with first claws (14) inside. The single-cell transistor fixing mechanism (2) includes a second fixing base (15), a second heat dissipation hole (16), a positioning post (17), and a second claw (18). The second heat dissipation hole (16) has two sets of second heat dissipation holes (16) that communicate with the first heat dissipation hole (12). The positioning post (17) is fixedly installed on the top of the second fixing base (15), and two sets of second claws (18) are fixedly installed on the top of the second fixing base (15). The clamping mechanism (4) includes a locking screw (20), a winged thread cap (21), a pressure plate (22), a through groove (23), and a baffle (24). A positioning groove (19) is provided on one side of the top of the second fixed seat (15). Two sets of locking screws (20) are fixedly installed on the top of the heat dissipation mechanism (3). The pressure plate (22) overlaps inside the positioning groove (19). A through groove (23) is provided on the pressure plate (22) at the position corresponding to the locking screw (20). The external thread of the locking screw (20) is connected to a winged thread cap (21) that contacts the top of the pressure plate (22). A baffle (24) is fixedly connected to the bottom of the pressure plate (22) and outside the second fixed seat (15). The bottom side of the baffle (24) is provided with an inclined first clearance groove (25), and the bottom of the second fixing seat (15) is provided with an inclined second clearance groove (26).

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