Metal bracket and plastic package module for electromagnetic shielding

Abstract

This utility model relates to the field of electromagnetic shielding technology, and discloses a metal bracket and encapsulation module for electromagnetic shielding. The metal bracket for electromagnetic shielding can be placed between a chip and electronic components, and includes: a shielding wall body; a first support leg and a second support leg, the first support leg extending from one end of the shielding wall body and the second support leg extending from the other end of the shielding wall body, with the first support leg, the second support leg, and the shielding wall body forming an opening with one side open; the top of both the first and second support legs is bent to form a top plate, and the top plate has a suction surface for the placement machine nozzle to pick up. The advantages of this utility model are that the overall structure of the metal bracket is simple, easy to manufacture, and occupies little space, saving installation space and reducing product thickness.

Description

Technical Field

[0001] This utility model relates to the field of electromagnetic shielding technology, and in particular to a metal bracket and plastic-encapsulated module for electromagnetic shielding. Background Technology

[0002] Chips are widely used on circuit boards. Generally, it is necessary to isolate the signals between the chip and the surrounding electronic components to avoid signal interference.

[0003] In existing technologies, a wraparound metal frame is typically used to surround the chip, enclosing the chip that needs signal isolation to achieve zoned signal isolation. This type of wraparound metal frame generally includes a main wall, three secondary walls, and four bent plates formed by bending at the top of the main and secondary walls. These bent plates have suction surfaces for the placement machine's nozzle. Using this type of wraparound metal frame for zoned signal isolation has the following main problems: windows need to be designed at the substrate positions on all four sides of the metal frame, and sufficient spacing must be maintained between the metal frame and electronic components to ensure adequate placement space; the four suction surfaces at the top occupy a large amount of space; the chamfers at the bends of the four suction surfaces occupy a significant amount of space, and due to manufacturing limitations, the chamfers cannot be eliminated. The chamfers occupy design space in the X and Y directions and package space in the Z direction; furthermore, the chamfers cannot be used as areas for the nozzle to pick up the chip. Utility Model Content

[0004] In view of the above-mentioned shortcomings of the existing technology, the technical problem to be solved by this utility model is to propose a metal bracket and plastic-encapsulated module for electromagnetic shielding that has a simple structure, occupies little space, saves installation space and reduces product thickness.

[0005] The technical solution adopted by this utility model to solve its technical problem is to propose a metal bracket for electromagnetic shielding, which can be set between the chip and electronic components, including:

[0006] The main body of the shielding wall;

[0007] The first support foot extends from one end of the shielding wall body, and the second support foot extends from the other end of the shielding wall body. The first support foot, the second support foot, and the shielding wall body together form an opening with one side open.

[0008] Both the first support leg and the second support leg have their tops bent to form a top plate, which has a suction surface that can be picked up by the nozzle of the mounting machine.

[0009] Furthermore, the absorption plane is flush with the top surface of the shielding wall body.

[0010] Furthermore, the first support foot and the second support foot are respectively formed by bending from both ends of the shielding wall body, and are symmetrically arranged at both ends of the shielding wall body, and are both perpendicular to the shielding wall body.

[0011] Furthermore, the lengths of both the first and second support feet are less than the length of the shielding wall body.

[0012] Furthermore, the bends between the first support leg and the shielding wall body, as well as the bends between the second support leg and the shielding wall body, all form first rounded corners, and the bottom of the first rounded corners is provided with a first notch.

[0013] Furthermore, the top plates at the top of both the first support leg and the second support leg are bent toward the side closer to the opening, and the top plates at the top of both are symmetrically arranged, perpendicular to the first support leg and the second support leg, respectively.

[0014] Furthermore, the bend between the top plate of the first support foot and the first support foot, and the bend between the top of the second support foot and the second support foot, both form a second rounded corner, and the second rounded corner is provided with a second notch near the side of the shielding wall body.

[0015] Furthermore, the thickness of the shielding wall body, the first supporting leg, the second supporting leg, and the top plate are all equal.

[0016] This utility model also proposes a plastic-encapsulated module, comprising:

[0017] substrate;

[0018] Chips and electronic components are all mounted on the substrate;

[0019] The aforementioned metal bracket is disposed on the substrate and positioned between the chip and the electronic component; the bottom of the shielding wall body, the first support foot, and the second support foot are supported on the substrate;

[0020] A molding compound is disposed on the substrate and encapsulates the chip, the electronic components, and the metal support, with at least a portion of the top of the metal support exposed from the molding compound;

[0021] A metal layer covers the outer surface of the encapsulated body and is in contact with the top of the metal support.

[0022] Furthermore, the bottom of the metal bracket is soldered onto the substrate using solder paste.

[0023] Compared with the prior art, the present invention has at least the following beneficial effects:

[0024] In this invention, the metal bracket mainly comprises a shielding wall body, a first support leg, and a second support leg, which together form an open side opening, creating an overall C-shape. The shielding wall body isolates chip signals, while the first and second support legs provide stable support. Only two small support legs are needed to ensure the shielding wall body's stability. The overall structure is simple and easy to manufacture, and the single-wall design effectively reduces the volume and installation space occupied by existing metal shielding brackets. A top plate is formed by bending the top of the first and second support legs. The top plate has a suction surface for the placement machine's nozzle to pick up the components. Both support legs have suction surfaces at their tops, enabling two-end suction and ensuring suction stability.

[0025] In this invention, the absorption plane on the top plate of the first and second support feet is flush with the top surface of the shielding wall body, which can effectively reduce the total design height of the metal bracket and save the total thickness of the plastic-encapsulated module.

[0026] In this invention, only the two ends of the shielding wall body and the first and second support feet have rounded corners in the circumferential direction of the metal bracket, which greatly saves the planar design space. Attached Figure Description

[0027] Figure 1 This is a schematic diagram of the metal bracket in Embodiment 1 of this utility model;

[0028] Figure 2 for Figure 1 A structural diagram from another perspective;

[0029] Figure 3 for Figure 1 A plan view;

[0030] Figure 4 This is a schematic diagram of the encapsulation module in Example 2.

[0031] In the picture:

[0032] 1. Main body of the shielding wall; 120. First rounded corner; 121. First notch; 123. Opening;

[0033] 2. First supporting leg;

[0034] 3. Second support leg;

[0035] 4. Top plate; 40. Suction surface;

[0036] 100. Molded module; 101. Substrate; 102. Chip; 103. Electronic component; 104. Metal bracket; 105. Molded body; 106. Metal layer. Detailed Implementation

[0037] The following are specific embodiments of the present invention, which are described in conjunction with the accompanying drawings. However, the present invention is not limited to these embodiments.

[0038] It should be noted that all directional indicators (such as up, down, left, right, front, back, etc.) in this utility model embodiment are only used to explain the relative positional relationship and movement of each component in a certain specific posture (as shown in the figure). If the specific posture changes, the directional indicator will also change accordingly.

[0039] Furthermore, in this utility model, the use of terms such as "first," "second," and "a" is for descriptive purposes only and should not be construed as indicating or implying their relative importance or implicitly specifying the number of technical features indicated. Therefore, a feature defined as "first" or "second" may explicitly or implicitly include at least one of that feature. In the description of this utility model, "multiple" means at least two, such as two, three, etc., unless otherwise explicitly specified.

[0040] In this utility model, unless otherwise explicitly specified and limited, the terms "connection," "fixing," etc., should be interpreted broadly. For example, "fixing" can mean a fixed connection, a detachable connection, or an integral part; it can mean a mechanical connection or an electrical connection; it can mean a direct connection or an indirect connection through an intermediate medium; it can mean the internal communication of two components or the interaction between two components, unless otherwise explicitly limited. Those skilled in the art can understand the specific meaning of the above terms in this utility model according to the specific circumstances.

[0041] Furthermore, the technical solutions of the various embodiments of this utility model can be combined with each other, but only if they are based on the ability of those skilled in the art to implement them. When the combination of technical solutions is contradictory or cannot be implemented, it should be considered that such combination of technical solutions does not exist and is not within the scope of protection claimed by this utility model.

[0042] Example 1:

[0043] like Figures 1-3 As shown in the figure, a metal bracket for electromagnetic shielding in this embodiment is disposed between the chip and electronic components to isolate signals between the chip and electronic components.

[0044] The metal support for electromagnetic shielding includes a shielding wall body 1, a first support leg 2, a second support leg 3, and a top plate 4. The first support leg 2 extends from one end of the shielding wall body 1, and the second support leg 3 extends from the other end. The first support leg 2, the second support leg 3, and the shielding wall body 1 together form an open opening 123 on one side. That is, the first support leg 2 and the second support leg 3 are located at opposite ends of the shielding wall body 1, forming an open structure rather than a closed frame, effectively reducing the volume and space occupied by the metal support. Furthermore, the tops of both the first support leg 2 and the second support leg 3 are bent to form a top plate 4. The top plate 4 has a suction surface 40 for the placement machine nozzle to pick up, meaning the suction surface 40 is designed for suction from both ends, ensuring the stability of the placement machine nozzle's suction.

[0045] In this embodiment, the metal bracket mainly includes a shielding wall body 1, a first support leg 2, and a second support leg 3, which together form an opening 123 with one side open, forming an overall C-shape. The shielding wall body 1 can isolate the signal of the chip 102, and the first support leg 2 and the second support leg 3 can provide stable support for the shielding wall body 1. Only two small support legs are needed to ensure the standing effect of the shielding wall body 1. The overall structure is simple and easy to manufacture, and the single-wall design effectively reduces the volume of existing metal shielding brackets and the installation space occupied. The top of the first support leg 2 and the second support leg 3 is bent to form a top plate 4. The top plate 4 has a suction plane 40 for the placement machine nozzle to pick up. The suction plane 40 is provided on the top of both support legs, which is a two-end suction method to ensure the stability of the suction.

[0046] The first support leg 2 and the second support leg 3 are formed by bending from both ends of the shielding wall body 1, and both the first support leg 2 and the second support leg 3 are bent toward the same side of the shielding wall body 1. The first support leg 2 and the second support leg 3 are symmetrically arranged at both ends of the shielding wall body 1, and both are perpendicular to the shielding wall body 1. The first support leg 2 and the second support leg 3 can provide stable support for the shielding wall body 1 and ensure the standing effect of the shielding wall body 1.

[0047] Furthermore, the lengths of the first support leg 2 and the second support leg 3 are much shorter than the length of the shielding wall body 1. During use, only the shielding wall body 1 and the two shorter support legs are needed to meet the usage requirements.

[0048] Furthermore, a first rounded corner 120 is formed at the bend between the first support leg 2 and the shielding wall body 1, and at the bend between the second support leg 3 and the shielding wall body 1. Since the first support leg 2 and the second support leg 3 are both formed by bending from the end of the shielding wall body 1, the first rounded corner 120 is inevitably formed to ensure the feasibility of the bending process. In addition, a first notch 121 is provided at the bottom of the two first rounded corners 120. The setting of the first notch 121 can, on the one hand, allow excess metal material to be squeezed toward the first notch 121 during bending, avoiding material accumulation and deformation. On the other hand, during plastic sealing, the gas in the plastic sealing module 100 can be discharged from the first notch 121.

[0049] In the circumferential direction of the metal bracket, only the two ends of the shielding wall body 1 have rounded corners with the first support leg 2 and the second support leg 3, which greatly saves the floor plan design space.

[0050] In this embodiment, the absorption plane 40 on the top plate 4 of both the first support leg 2 and the second support leg 3 is flush with the top surface of the shielding wall body 1, which can effectively reduce the total design height of the metal bracket and save the total thickness of the plastic-encapsulated module 100.

[0051] Specifically, the top plates 4 of both the first support leg 2 and the second support leg 3 are bent towards the opening 123, ensuring that the bending is on the same side. The top plates 4 of the first support leg 2 and the second support leg 3 are symmetrically arranged, with each top plate 4 perpendicular to the first support leg 2 and the second support leg 3, respectively, simplifying the bending process. Furthermore, a second rounded corner is formed at the bend between the top plate 4 of the first support leg 2 and the first support leg 2, and at the bend between the top of the second support leg 3 and the second support leg 3. Similarly, since the two top plates 4 are formed by bending from the tops of the first support leg 2 and the second support leg 3 respectively, this second rounded corner ensures the feasibility of the bending process. Additionally, a second notch is provided on the side of the second rounded corner near the shielding wall body 1, separating the side of the top plate 4 from the shielding wall body 1, facilitating the bending of the top plate 4.

[0052] Preferably, in this embodiment, the thickness of the shielding wall body 1, the first support leg 2, the second support leg 3, and the top plate 4 are all equal, that is, the metal bracket can be made by a metal plate of equal thickness.

[0053] In the actual manufacturing process, firstly, the metal sheet is cut, and the shape of the cut metal sheet is the shape of the flattened metal bracket; then, the two ends of the cut metal sheet are bent at 90 degrees for the first time to form the first support leg 2 and the second support leg 3; finally, the top of the first support leg 2 and the second support leg 3 are bent at 90 degrees for the second time to form two top plates 4, and the metal bracket is manufactured. The manufacturing of the metal bracket in this embodiment is simple.

[0054] Example 2:

[0055] like Figure 4 As shown, a molding compound module 100 in this embodiment includes:

[0056] substrate 101;

[0057] Chip 102 and electronic component 103 are both disposed on substrate 101;

[0058] In Embodiment 1, the metal bracket 104 is disposed on the substrate 101 and is located between the chip 102 and the electronic component 103. The bottom of the shielding wall body 1, the first support foot 2 and the second support foot 3 are all supported on the substrate 101 to ensure the standing effect of the metal bracket 104 on the substrate 101. Furthermore, the bottom of the metal bracket 104 is fixed to the substrate 101 by soldering with solder paste, forming a passage with the substrate 101.

[0059] A molding compound 105 is disposed on a substrate 101 and encapsulates the chip 102, electronic components 103, and metal bracket 104. That is, after the chip 102, electronic components 103, and metal bracket 104 are mounted and fixed on the substrate 101, they are encapsulated and protected by plastic material, and the filling plastic forms the molding compound 105. The top of the metal bracket 104 is at least partially exposed from the molding compound 105. Specifically, after the plastic material completely encapsulates the metal bracket 104, the top of the metal bracket 104 can be exposed from the molding compound 105 by laser engraving, or the top of the molding compound 105 can be ground flat until the top of the metal bracket 104 is exposed, so that the product is thinner and more aesthetically pleasing.

[0060] A metal layer 106 covers the outer surface of the molding compound 105. This metal layer 106 serves as an external electromagnetic shielding layer. The metal layer 106 is in contact with the top of the metal support 104. The metal support 104 is used for partitioning and grounding the external electromagnetic shielding layer, thereby increasing the shielding effect. The metal layer 106 can be formed on the surface of the molding compound 105 by sputtering. Optionally, the metal layer 106 can be made of copper.

[0061] In this solution, the metal bracket has a simple overall structure, is easy to manufacture, and occupies little space, which can save installation space and reduce product thickness.

Claims

1. A metal bracket for electromagnetic shielding, which is provided between a chip and an electronic component, characterized by, include: The main body of the shielding wall; The first support foot extends from one end of the shielding wall body, and the second support foot extends from the other end of the shielding wall body. The first support foot, the second support foot, and the shielding wall body together form an opening with one side open. Both the first support leg and the second support leg have their tops bent to form a top plate, which has a suction surface that can be picked up by the nozzle of the mounting machine.

2. The metal bracket for electromagnetic shielding according to claim 1, characterized by, The absorption plane is flush with the top surface of the shielding wall body.

3. The metal bracket for electromagnetic shielding according to claim 1, wherein The first support leg and the second support leg are formed by bending from both ends of the shielding wall body, and are symmetrically arranged at both ends of the shielding wall body, and are both perpendicular to the shielding wall body.

4. The metal holder for electromagnetic shielding according to claim 1 or 3, characterized by, The lengths of both the first and second support feet are less than the length of the shielding wall body.

5. The metal bracket for electromagnetic shielding according to claim 3, wherein The bends between the first support leg and the shielding wall body, as well as the bends between the second support leg and the shielding wall body, both form a first rounded corner, and the bottom of the first rounded corner is provided with a first notch.

6. The metal bracket for electromagnetic shielding according to claim 1, wherein The top plates at the top of both the first support leg and the second support leg are bent toward the side closer to the opening, and the top plates at the top of both are symmetrically arranged, perpendicular to the first support leg and the second support leg, respectively.

7. The metal support for electromagnetic shielding according to claim 1 or 6, characterized in that, The bend between the top plate of the first support leg and the first support leg, and the bend between the top of the second support leg and the second support leg, both form a second rounded corner. The second rounded corner has a second notch on the side near the main body of the shielding wall.

8. The metal support for electromagnetic shielding according to claim 1, characterized in that, The thickness of the shielding wall body, the first supporting leg, the second supporting leg, and the top plate are all equal.

9. A plastic-encapsulated module, characterized in that, include: substrate; Chips and electronic components are all mounted on the substrate; The metal bracket as described in any one of claims 1-8 is disposed on the substrate and positioned between the chip and the electronic component; the bottom of the shielding wall body, the first support foot, and the second support foot are supported on the substrate; A molding compound is disposed on the substrate and encapsulates the chip, the electronic components, and the metal support, with at least a portion of the top of the metal support exposed from the molding compound; A metal layer covers the outer surface of the encapsulated body and is in contact with the top of the metal support.

10. The encapsulated module according to claim 9, characterized in that, The bottom of the metal bracket is soldered onto the substrate by applying solder paste.

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