Metal bracket and plastic package module for electromagnetic shielding

Abstract

This utility model relates to the field of electromagnetic shielding technology, and discloses a metal bracket and encapsulation module for electromagnetic shielding. The metal bracket for electromagnetic shielding can be placed between a chip and electronic components. Its features include: a shielding wall body, the top of which is bent to form a top plate with a suction plane for a mounting machine nozzle; a first support leg and a second support leg, the first support leg being bent from one end of the shielding wall body and the second support leg being bent from the other end of the shielding wall body, with both the second and first support legs bent towards the same side of the shielding wall body; the first and second support legs, together with the shielding wall body, form an opening with one side open. The advantages of this utility model are that the overall structure of the metal bracket is simple, easy to manufacture, and occupies little space, saving installation space.

Description

Technical Field

[0001] This utility model relates to the field of electromagnetic shielding technology, and in particular to a metal bracket and plastic-encapsulated module for electromagnetic shielding. Background Technology

[0002] Chips are widely used on circuit boards, and signal isolation is typically implemented between the chip and surrounding electronic components to prevent interference. Current technology generally uses a wraparound metal frame around the chip to achieve this, enclosing the chip and thus achieving signal isolation. This type of wraparound metal frame typically includes a main wall, three secondary walls, and four bent plates formed by bending at the top of the main and secondary walls. These bent plates have suction surfaces for the placement machine's nozzle to pick up.

[0003] Using the aforementioned surround-type metal frame for zoned signal isolation presents the following main problems: windows need to be designed at the substrate positions corresponding to the four sides of the metal frame, and sufficient spacing must be maintained between the four sides and electronic components to ensure that the metal frame has enough mounting space; the four pick-up planes at the top occupy a large amount of space; the chamfers at the bends of the four pick-up planes occupy a large amount of space, and due to manufacturing process limitations, the chamfers cannot be eliminated. The chamfers occupy design space in the X and Y directions and package three-dimensional space in the Z direction. At the same time, the chamfers cannot be used as areas for nozzle pick-up. Utility Model Content

[0004] In view of the above-mentioned shortcomings of the existing technology, the technical problem to be solved by this utility model is to propose a metal bracket and plastic-encapsulated module for electromagnetic shielding that is simple in structure, easy to manufacture, occupies little space, and can save installation space.

[0005] The technical solution adopted by this utility model to solve its technical problem is to propose a metal bracket for electromagnetic shielding, which can be set between the chip and electronic components, including:

[0006] The shielding wall body has a top plate that is bent at the top and has a suction surface that can be picked up by the nozzle of the mounting machine.

[0007] The first support leg is formed by bending from one end of the shielding wall body, and the second support leg is formed by bending from the other end of the shielding wall body. The second support leg and the first support leg are bent toward the same side of the shielding wall body. The first support leg, the second support leg and the shielding wall body form an opening with one side open.

[0008] Furthermore, the length of the top plate is equal to the length of the main body of the shielding wall.

[0009] Furthermore, the top plate, the first supporting leg, and the second supporting leg are bent toward the same side of the shielding wall body;

[0010] The bend between the top plate and the main body of the shielding wall forms a first rounded corner.

[0011] Furthermore, the top plate is perpendicular to the main body of the shielding wall.

[0012] Furthermore, the distance between the end face of the top plate away from its bend and the main body of the shielding wall is less than the distance between the end faces of the first and second support feet away from their bends and the main body of the shielding wall.

[0013] Furthermore, the first support foot and the second support foot are symmetrically arranged at both ends of the shielding wall body, and the length of both is less than the length of the shielding wall body.

[0014] Furthermore, both the first support leg and the second support leg are perpendicular to the shielding wall body;

[0015] The bend between the first support leg and the main body of the shielding wall, as well as the bend between the second support leg and the shielding wall component, both form a second rounded corner, and a notch is provided at the bottom of the second rounded corner.

[0016] Furthermore, the thickness of the shielding wall body, the first supporting leg, the second supporting leg, and the top plate are all equal.

[0017] This utility model also proposes a plastic-encapsulated module, comprising:

[0018] substrate;

[0019] Chips and electronic components are all mounted on the substrate;

[0020] The aforementioned metal bracket is disposed on the substrate and positioned between the chip and the electronic component; the bottom of the shielding wall body, the first support foot, and the second support foot are all supported on the substrate;

[0021] A molding compound is disposed on the substrate and encapsulates the chip, the electronic components, and the metal support, with at least a portion of the top of the metal support exposed from the molding compound;

[0022] A metal layer covers the outer surface of the encapsulated body and is in contact with the top of the metal support.

[0023] This utility model also proposes a plastic-encapsulated module, comprising:

[0024] substrate;

[0025] Chips and electronic components are all mounted on the substrate;

[0026] A metal support is disposed on the substrate and positioned between the chip and the electronic component. The metal support includes a shielding wall body, a first support leg, and a second support leg. The first support leg is formed by bending from one end of the shielding wall body, and the second support leg is formed by bending from the other end of the shielding wall body. The second support leg and the first support leg are bent towards the same side of the shielding wall body. The first support leg, the second support leg, and the shielding wall body form an opening with one side open, and the chip is located on the side close to the opening. The bottom of the shielding wall body, the first support leg, and the second support leg are all supported on the substrate.

[0027] A molding compound is disposed on the substrate and encapsulates the chip, the electronic components, and the metal support, with at least a portion of the top of the metal support exposed from the molding compound;

[0028] A metal layer covers the outer surface of the encapsulated body and is in contact with the top of the metal support.

[0029] Compared with the prior art, the present invention has at least the following beneficial effects:

[0030] In this invention, the shielding wall body of the metal bracket is designed as a single wall, which effectively isolates signals while reducing the size of the metal bracket and saving installation space. The shielding wall body is bent at both ends to form a first support leg and a second support leg, respectively. These two small support legs provide stable support for the shielding wall body, effectively ensuring its upright position. A top plate is bent at the top of the shielding wall body, and the suction surface on this top plate allows the placement machine's nozzle to pick it up. There is no need for suction surfaces on the tops of the two support legs, and the suction surface is designed for central suction, which occupies less space compared to suction from both ends. The metal bracket is C-shaped, a semi-enclosed structure, compact in size, occupies little installation space, and is easy to manufacture.

[0031] In this invention, the length of the top plate is set to be equal to the length of the shielding wall body to ensure the stability of the suction nozzle. Furthermore, the top plate, the first support leg, and the second support leg all bend towards the same side of the shielding wall body, facilitating bending.

[0032] In this invention, when manufacturing the metal bracket, the metal sheet is first punched into a specified shape, then bent once to form the top plate, and then bent twice to form the first and second support legs, which is convenient to manufacture. Attached Figure Description

[0033] Figure 1 This is a schematic diagram of the metal bracket in Embodiment 1 of this utility model;

[0034] Figure 2 for Figure 1 A structural diagram from another perspective;

[0035] Figure 3 for Figure 1 A plan view;

[0036] Figure 4 for Figure 1 A plan view from another perspective;

[0037] Figure 5 This is a schematic diagram of the encapsulation module in Example 2;

[0038] Figure 6 This is a schematic diagram of the encapsulation module in Example 3.

[0039] In the picture:

[0040] 1. Main body of the shielding wall; 120°, first rounded corner; 130°, second rounded corner; 131°, notch; 134°, opening;

[0041] 2. Top plate; 20. Suction surface;

[0042] 3. First supporting leg;

[0043] 4. Second support leg;

[0044] 5. Molded module; 501. Substrate; 502. Chip; 503. Electronic component; 504. Metal bracket; 505. Molded body; 506. Metal layer. Detailed Implementation

[0045] The following are specific embodiments of the present invention, which are described in conjunction with the accompanying drawings. However, the present invention is not limited to these embodiments.

[0046] It should be noted that all directional indicators (such as up, down, left, right, front, back, etc.) in this utility model embodiment are only used to explain the relative positional relationship and movement of each component in a certain specific posture (as shown in the figure). If the specific posture changes, the directional indicator will also change accordingly.

[0047] Furthermore, in this utility model, the use of terms such as "first," "second," and "a" is for descriptive purposes only and should not be construed as indicating or implying their relative importance or implicitly specifying the number of technical features indicated. Therefore, a feature defined as "first" or "second" may explicitly or implicitly include at least one of that feature. In the description of this utility model, "multiple" means at least two, such as two, three, etc., unless otherwise explicitly specified.

[0048] In this utility model, unless otherwise explicitly specified and limited, the terms "connection," "fixing," etc., should be interpreted broadly. For example, "fixing" can mean a fixed connection, a detachable connection, or an integral part; it can mean a mechanical connection or an electrical connection; it can mean a direct connection or an indirect connection through an intermediate medium; it can mean the internal communication of two components or the interaction between two components, unless otherwise explicitly limited. Those skilled in the art can understand the specific meaning of the above terms in this utility model according to the specific circumstances.

[0049] Furthermore, the technical solutions of the various embodiments of this utility model can be combined with each other, but only if they are based on the ability of those skilled in the art to implement them. When the combination of technical solutions is contradictory or cannot be implemented, it should be considered that such combination of technical solutions does not exist and is not within the scope of protection claimed by this utility model.

[0050] Example 1:

[0051] like Figures 1-4 As shown, this embodiment of a metal bracket for electromagnetic shielding is disposed between a chip and electronic components, including: a shielding wall body 1, a top plate 2, a first support leg 3, and a second support leg 4. The top of the shielding wall body 1 is bent to form the top plate 2, which has a suction surface 20 for a placement machine nozzle to pick up. During the encapsulation process, the suction surface 20 on the top plate 2 can be picked up by the placement machine nozzle. The first support leg 3 is bent from one end of the shielding wall body 1, and the second support leg 4 is bent from the other end of the shielding wall body 1, with the second support leg 4 and the first support leg 3 bending towards the same side of the shielding wall body 1. The first support leg 3, the second support leg 4, and the shielding wall body 1 form an opening 134 with one side open, meaning the first support leg 3 and the second support leg 4 are located at opposite ends of the shielding wall body 1, forming an open structure rather than a closed frame, which effectively reduces the volume and space occupied by the metal bracket.

[0052] In this embodiment, the shielding wall body 1 of the metal bracket is set as a single wall instead of an integral frame structure. This not only achieves zoned signal isolation but also effectively reduces the volume of the metal bracket, saving installation space. First support legs 3 and second support legs 4 are formed by bending at both ends of the shielding wall body 1. The lengths of the first support legs 3 and second support legs 4 are much smaller than the length of the shielding wall body 1. These two small support legs provide stable support for the shielding wall body 1, effectively ensuring its upright position. A top plate 2 is formed by bending at the top of the shielding wall body 1. The suction surface 20 on the top plate 2 can be picked up by the nozzle of the placement machine. There is no need to set a suction surface 20 at the top of the two support legs, and this suction surface 20 is set in the middle for suction, which occupies less space compared to suction from both ends. The metal bracket is C-shaped, a semi-enclosed structure, compact in size, occupies little installation space, and is easy to manufacture.

[0053] Preferably, in this embodiment, the length of the top plate 2 is equal to the length of the shielding wall body 1. While ensuring a small footprint, the longer suction plane 20 also ensures stability during suction. Furthermore, the distance between the end face of the top plate 2 away from its bend and the shielding wall body 1 is smaller than the distance between the end faces of the first support leg 3 and the second support leg 4 away from their bends and the shielding wall body 1. That is, the width of the top is smaller than the length of the first support leg 3 and the second support leg 4, ensuring that the installation space occupied by the top plate 2 is small, and it is also relatively easy to grind off the top plate 2 during plastic sealing if necessary.

[0054] The top plate 2 is perpendicular to the shielding wall body 1, meaning it is formed by bending 90 degrees from the top of the shielding wall body 1. The top plate 2, the first supporting leg 3, and the second supporting leg 4 all bend towards the same side of the shielding wall body 1, ensuring convenient bending. Furthermore, a first rounded corner 120 is formed at the bend between the top plate 2 and the shielding wall body 1. Since the top plate 2 is formed by bending from the top of the shielding wall body 1, the formation of the first rounded corner 120 is unavoidable, ensuring the feasibility of the bending process.

[0055] In this embodiment, the first support leg 3 and the second support leg 4 are symmetrically arranged at both ends of the shielding wall body 1, and the lengths of the first support leg 3 and the second support leg 4 are both less than the length of the shielding wall body 1. In use, only the shielding wall body 1 and the two shorter support legs are needed to meet the usage requirements, that is, to provide stable support for the shielding wall body 1, thereby ensuring the standing effect of the shielding wall body 1.

[0056] Furthermore, both the first support leg 3 and the second support leg 4 are perpendicular to the shielding wall body 1. That is, the first support leg 3 is formed by bending 90 degrees from one end of the shielding wall body 1, and the second support leg 4 is formed by bending 90 degrees from the other end of the shielding wall body 1. A second rounded corner 130 is formed at the bend between the first support leg 3 and the shielding wall body 1, and at the bend between the second support leg 4 and the shielding wall component. Similarly, since the two support legs are formed by bending from both ends of the shielding wall body 1, the second rounded corner 130 is unavoidable, ensuring the feasibility of the bending process.

[0057] Furthermore, a notch 131 is provided at the bottom of the second rounded corner 130. The notch 131 can, on the one hand, allow excess metal material to be squeezed toward the notch 131 during bending, thus preventing material accumulation and deformation. On the other hand, during molding, gas in the molding module 5 can be discharged from the notch 131.

[0058] In this embodiment, the thickness of the shielding wall body 1, the first support leg 3, the second support leg 4, and the top plate 2 are all equal, that is, the metal bracket can be made by a metal plate of equal thickness.

[0059] In the actual manufacturing process, firstly, the thin metal sheet is stamped and cut, and the shape of the cut thin metal sheet is the shape of the flattened metal bracket; then, the top of the cut thin metal sheet in the width direction is bent at 90 degrees for the first time to form the top plate 2; finally, the two ends of the thin metal sheet in the length direction are bent at 90 degrees for the second time to form the first support leg 3 and the second support leg 4 respectively, and the metal bracket is manufactured. The manufacturing of the metal bracket in this embodiment is simple.

[0060] Example 2:

[0061] like Figure 5 As shown, a molding module 5 in this embodiment includes:

[0062] substrate 501;

[0063] Chip 502 and electronic component 503 are both mounted on substrate 501;

[0064] In Embodiment 1, the metal bracket 504 is disposed on the substrate 501 and is located between the chip 502 and the electronic component 503; the bottom of the shielding wall body 1, the first support foot 3 and the second support foot 4 are all supported on the substrate 501; ensuring the standing effect of the metal bracket 504 on the substrate 501, and the bottom of the metal bracket 504 is fixed to the substrate 501 by soldering with solder paste, forming a passage with the substrate 501;

[0065] A molding compound 505 is disposed on a substrate 501 and encapsulates a chip 502, electronic components 503, and a metal bracket 504. That is, after the chip 502, electronic components 503, and metal bracket 504 are mounted and fixed on the substrate 501, they are encapsulated and protected by a plastic material, and the filling plastic forms the molding compound 505. The top of the metal bracket 504 is at least partially exposed from the molding compound 505. Specifically, after the plastic material completely encapsulates the metal bracket 504, the top of the metal bracket 504 can be exposed from the molding compound 505 by laser engraving, or the top of the molding compound 505 can be ground flat until the top of the metal bracket 504 is exposed, so that the product is thinner and more aesthetically pleasing.

[0066] A metal layer 506 covers the outer surface of the molding compound 505. The metal layer 506 is set as an external electromagnetic shielding layer. The metal layer 506 is in contact with the top of the metal bracket 504. The metal bracket 504 is used for partitioning and grounding the external electromagnetic shielding layer, thereby increasing the shielding effect. The metal layer 506 can be formed on the surface of the molding compound 505 by sputtering. Optionally, the metal layer 506 can be made of copper.

[0067] Example 3:

[0068] like Figure 6 As shown, a molding module 5 in this embodiment includes:

[0069] substrate 501;

[0070] Chip 502 and electronic component 503 are both mounted on substrate 501;

[0071] A metal support 504 is disposed on a substrate 501 and positioned between a chip 502 and an electronic component 503. The metal support 504 includes a shielding wall body 1, a first support leg 3, and a second support leg 4. The first support leg 3 is formed by bending from one end of the shielding wall body 1, and the second support leg 4 is formed by bending from the other end of the shielding wall body 1. The second support leg 4 and the first support leg 3 are bent toward the same side of the shielding wall body 1. The first support leg 3, the second support leg 4, and the shielding wall body 1 form an opening 134 with one side open. The chip 502 is located on the side close to the opening 134. The bottom of the shielding wall body 1, the first support leg 3, and the second support leg 4 are all supported on the substrate 501.

[0072] A molding compound 505 is disposed on a substrate 501 and encapsulates a chip 502, an electronic component 503, and a metal support 504, with at least a portion of the top of the metal support 504 exposed from the molding compound 505.

[0073] A metal layer 506 covers the outer surface of the molding compound 505 and is in contact with the top of the metal support 504.

[0074] Compared with Embodiment 2, the metal bracket 504 in this embodiment has its top plate 2 ground flat, so the top plate 2 no longer exists after the molding is completed to form the molding module 5.

[0075] In this solution, the metal bracket has a simple overall structure, is easy to manufacture, and occupies little space, thus saving installation space.

Claims

1. A metal bracket for electromagnetic shielding, which can be disposed between a chip and electronic components, characterized in that, include: The shielding wall body has a top plate that is bent at the top and has a suction surface that can be picked up by the nozzle of the mounting machine. The first support leg is formed by bending from one end of the shielding wall body, and the second support leg is formed by bending from the other end of the shielding wall body. The second support leg and the first support leg are bent toward the same side of the shielding wall body. The first support leg, the second support leg and the shielding wall body form an opening with one side open.

2. The metal support for electromagnetic shielding according to claim 1, characterized in that, The length of the top plate is equal to the length of the main body of the shielding wall.

3. The metal support for electromagnetic shielding according to claim 1, characterized in that, The top plate, the first supporting leg, and the second supporting leg bend toward the same side of the shielding wall body; The bend between the top plate and the main body of the shielding wall forms a first rounded corner.

4. The metal support for electromagnetic shielding according to claim 1 or 3, characterized in that, The top plate is perpendicular to the main body of the shielding wall.

5. The metal support for electromagnetic shielding according to claim 1, characterized in that, The distance between the end face of the top plate away from its bend and the main body of the shielding wall is less than the distance between the end faces of the first and second support feet away from their bends and the main body of the shielding wall.

6. The metal support for electromagnetic shielding according to claim 1, characterized in that, The first support foot and the second support foot are symmetrically arranged at both ends of the shielding wall body, and the length of both is less than the length of the shielding wall body.

7. The metal support for electromagnetic shielding according to claim 6, characterized in that, Both the first support leg and the second support leg are perpendicular to the shielding wall body; The bend between the first support leg and the main body of the shielding wall, as well as the bend between the second support leg and the shielding wall component, both form a second rounded corner, and a notch is provided at the bottom of the second rounded corner.

8. The metal support for electromagnetic shielding according to claim 1, characterized in that, The thickness of the shielding wall body, the first supporting leg, the second supporting leg, and the top plate are all equal.

9. A plastic-encapsulated module, characterized in that, include: substrate; Chips and electronic components are all mounted on the substrate; The metal bracket as described in any one of claims 1-8 is disposed on the substrate and positioned between the chip and the electronic component; the bottom of the shielding wall body, the first support foot, and the second support foot are all supported on the substrate; A molding compound is disposed on the substrate and encapsulates the chip, the electronic components, and the metal support, with at least a portion of the top of the metal support exposed from the molding compound; A metal layer covers the outer surface of the encapsulated body and is in contact with the top of the metal support.

10. A plastic-encapsulated module, characterized in that, include: substrate; Chips and electronic components are all mounted on the substrate; A metal support is disposed on the substrate and positioned between the chip and the electronic component. The metal support includes a shielding wall body, a first support leg, and a second support leg. The first support leg is formed by bending from one end of the shielding wall body, and the second support leg is formed by bending from the other end of the shielding wall body. The second support leg and the first support leg are bent towards the same side of the shielding wall body. The first support leg, the second support leg, and the shielding wall body form an opening with one side open, and the chip is located on the side close to the opening. The bottom of the shielding wall body, the first support leg, and the second support leg are all supported on the substrate. A molding compound is disposed on the substrate and encapsulates the chip, the electronic components, and the metal support, with at least a portion of the top of the metal support exposed from the molding compound; A metal layer covers the outer surface of the encapsulated body and is in contact with the top of the metal support.

Images