A field-effect transistor lead bonding base

Abstract

This utility model discloses a field-effect transistor (FET) lead bonding base, relating to the field of FET technology. It includes a base assembly and first pins. First pins are mounted on both the left and right sides of the base assembly, and second pins are mounted on both the front and rear ends of the base assembly. A protective cover is movably inserted into the top of the base assembly. This FET lead bonding base, by equidistantly arranging the first and second pins on the sides of the base assembly, allows for selective use of their interaction to achieve different bonding operations, ensuring the base assembly's flexibility and practicality. The number of first and second pins can also be adjusted within a certain range as needed. Furthermore, the protective cover on the top of the base assembly provides structural protection at the connection points of the base assembly, the first pins, and the second pins, reducing damage.

Description

Technical Field

[0001] This utility model relates to the field of field-effect transistor technology, specifically to a field-effect transistor lead bonding base. Background Technology

[0002] A field-effect transistor (FET) is a voltage-controlled semiconductor device that controls the drain-source current by adjusting the width of the conductive channel through the gate voltage. It features high input impedance (down to hundreds of megohms), low power consumption, and low noise. Its structure includes three electrodes: gate, drain, and source. It conducts based on majority carriers, and a high-resistance isolation layer (such as silicon dioxide) is used between the gate and the channel.

[0003] Conventional pin-soldering bases, due to their structural design, make the pin structure susceptible to damage from external factors, resulting in the device being unable to function properly. Furthermore, the shape and number of pins are difficult to adjust structurally. Utility Model Content

[0004] The purpose of this invention is to provide a field-effect transistor pin bonding base to solve the problems mentioned in the background art.

[0005] To achieve the above objectives, the present invention provides the following technical solution: a field-effect transistor pin bonding base, comprising a base assembly and a first pin, wherein the first pin is mounted on both the left and right sides of the base assembly, and a second pin is mounted on both the front and rear ends of the base assembly, and a protective cover component is movably inserted into the top of the base assembly; the first pin comprises a pin body, a mating hole and a first fixing post, wherein the mating hole is vertically opened at one end of the pin body near the base assembly, and the first fixing post is embedded inside the mating hole.

[0006] Furthermore, the base assembly includes a main base, welding plates, connecting plates, assembly grooves, and fixing slots. The bottom surface of the main base is provided with welding plates, and the top center of the main base is provided with a connecting plate. Assembly grooves are provided on all four edges of the top of the main base, and fixing slots are provided between the assembly grooves and the connecting plates.

[0007] Furthermore, the welding pieces are respectively located at the middle of the bottom of the main base and at the four opposite corners, and adopt two different sizes. The connecting plate is fixed to the top surface of the main base, and the assembly slots are equidistantly arranged on the surface of the top side edge of the main base.

[0008] Furthermore, the first fixing post is vertically inserted into the interior of the docking hole and is combined with each other in an embedded structure. The pin body and the first fixing post are tightly inserted into the interior of the assembly groove, and the pin body is set in a "Z" shaped structure.

[0009] Furthermore, the second pin includes a support foot, a second fixing post, and a pin. The second fixing post is vertically inserted at the end of the support foot near the base assembly, and a pin is vertically inserted at the end of the support foot away from the second fixing post.

[0010] Furthermore, the support leg and the second fixing pile are tightly inserted into the interior of the assembly groove, and the pins are tightly inserted into the support leg away from the second fixing pile.

[0011] Furthermore, the protective cover component includes a cover plate, a stabilizing slot, and an antistatic coating. The bottom perimeter of the protective cover component is provided with a stabilizing slot, and the surface of the cover plate is coated with an antistatic coating.

[0012] Furthermore, the surface structure of the stabilizing slot matches the surface structure of the pin body and the end of the support near the base assembly, and the inner surface structure of the fixing slot matches the bottom surface structure of the cover plate.

[0013] This invention provides a field-effect transistor lead bonding base, which has the following advantages:

[0014] 1. This utility model, by providing assembly grooves on the top surfaces of the four sides of the main base, allows the first pin and the second pin to be used in the structure between the pin body, the first fixing post, the support foot, and the second fixing post, respectively, realizing a quick-connect structure for the base assembly, the first pin, and the second pin to be inserted into each other. At the same time, the bottom surface of the main base is also provided with welding plates. With the above structure, three different welding connection structures can be realized for the base assembly according to the installation needs. At the same time, the number of the first pin and the second pin can be controlled to a certain extent as needed, thereby maximizing the flexibility and convenience of use between structural components.

[0015] 2. This utility model, by providing a fixing slot on the top surface of the main base and a stabilizing slot on the bottom edge surface of the cover plate, allows the entire protective cover component to be inserted into the top surface of the base assembly after the first or second pin has been structurally assembled and adjusted. This structural design not only provides good structural limiting and fixing for the installed first and second pins, but also provides structural protection for the connection points between the base assembly, the first and second pins, preventing unnecessary structural damage caused by accidental factors. In addition, the modular structure between the base assembly, the first and second pins, and the protective cover component allows for quick maintenance in case of structural damage to the first and second pins, thus ensuring ease of use and extending the service life of the structure. Attached Figure Description

[0016] Figure 1This is a schematic diagram of the main body axial side view of a field-effect transistor lead bonding base according to the present invention;

[0017] Figure 2 This is a schematic diagram of the disassembled structure of a field-effect transistor lead bonding base according to the present invention;

[0018] Figure 3 This is a three-dimensional structural diagram of a base assembly for a field-effect transistor lead bonding base according to the present invention;

[0019] Figure 4 This is a three-dimensional structural diagram of the first pin of a field-effect transistor pin bonding base according to the present invention;

[0020] Figure 5 This is a three-dimensional structural diagram of the second pin of a field-effect transistor pin bonding base according to the present invention;

[0021] Figure 6 This is a three-dimensional structural diagram of a protective cover component for a field-effect transistor pin welding base according to the present invention.

[0022] In the diagram: 1. Base assembly; 101. Main base; 102. Welding piece; 103. Connecting plate; 104. Assembly slot; 105. Fixing slot; 2. First pin; 201. Pin body; 202. Docking hole; 203. First fixing post; 3. Second pin; 301. Support leg; 302. Second fixing post; 303. Pin; 4. Protective cover component; 401. Cover plate; 402. Stabilizing slot; 403. Antistatic coating. Detailed Implementation

[0023] The embodiments of this utility model will be described in further detail below with reference to the accompanying drawings and examples. The following examples are for illustrative purposes only and should not be construed as limiting the scope of this utility model.

[0024] like Figures 1 to 6As shown, a field-effect transistor (FET) lead bonding base includes a base assembly 1 and first pins 2. First pins 2 are mounted on both the left and right sides of the base assembly 1, and second pins 3 are mounted on both the front and rear ends of the base assembly 1. A protective cover component 4 is movably inserted into the top of the base assembly 1. The first pin 2 includes a pin body 201, a mating hole 202, and a first fixing post 203. The mating hole 202 is vertically opened at one end of the pin body 201 near the base assembly 1, and the first fixing post 203 is embedded inside the mating hole 202. The first fixing post 203 vertically penetrates the interior of the mating hole 202 and is assembled with an embedded structure. The pin body 201 and the first fixing post 203 are tightly inserted into the interior of the mounting groove 104. The body 201 adopts a "Z" shaped structure. The second pin 3 includes a support 301, a second fixing post 302, and a pin 303. The second fixing post 302 is vertically inserted into the end of the support 301 near the base assembly 1, and the pin 303 is vertically inserted into the end of the support 301 away from the second fixing post 302. The support 301 and the second fixing post 302 are tightly inserted into the interior of the assembly groove 104, and the pin 303 is tightly inserted into the support 301 away from the second fixing post 302. This allows the first pin 2 and the second pin 3 to be used in the structure between the pin body 201, the first fixing post 203, and the support 301 and the second fixing post 302, respectively, realizing a quick-connect structure for the base assembly 1, the first pin 2, and the second pin 3 to be inserted into each other.

[0025] like Figures 1 to 6As shown, the base assembly 1 includes a main base 101, welding pieces 102, a connecting plate 103, assembly grooves 104, and fixing slots 105. The bottom surface of the main base 101 is provided with welding pieces 102, and the top center of the main base 101 is provided with the connecting plate 103. Assembly grooves 104 are formed around the top edges of the main base 101, and fixing slots 105 are provided between the assembly grooves 104 and the connecting plate 103. The welding pieces 102 are respectively located at the center of the bottom of the main base 101 and at the four opposite corners, and use two different sizes. The connecting plate 103 is fixed to the top surface of the main base 101, and the assembly grooves 104 are equidistantly arranged on the surface of the top side edges of the main base 101. The protective cover component 4 includes... The protective cover component 4 has a cover plate 401, a stabilizing slot 402, and an antistatic coating 403. The stabilizing slot 402 is provided on the bottom periphery of the protective cover component 4, and the surface of the cover plate 401 is sprayed with an antistatic coating 403. The surface structure of the stabilizing slot 402 matches the surface structure of the pin body 201 and the end of the support 301 near the base assembly 1. The inner surface structure of the fixing slot 105 matches the bottom surface structure of the cover plate 401. By providing a fixing slot 105 on the top surface of the main base 101 and cooperating with the stabilizing slot 402 on the bottom edge surface of the cover plate 401, the entire protective cover component 4 can be inserted into the top surface of the base assembly 1 after the first pin 2 or the second pin 3 is structurally assembled and adjusted.

[0026] In summary, as Figures 1 to 6 As shown, the field-effect transistor pin soldering base can be used by first selecting whether to use the first pin 2 or the second pin 3 according to the soldering needs. If not used, the main base 101 can be directly soldered to the circuit board using the soldering pad 102 on the bottom surface.

[0027] If the first pin 2 or the second pin 3 is required, simply select an appropriate number of the first pin 2 or the second pin 3 as needed. Use the first fixing post 203 embedded inside the mating hole 202 to embed and fix one end of the pin body 201 into the assembly groove 104, or use the second fixing post 302 at one end of the support 301 to embed and fix the support 301 with the pin 303 connected to one end into the assembly groove 104, thereby realizing the structural combination between the base assembly 1 and the first pin 2 and the second pin 3.

[0028] After the structural assembly is completed, the cover plate 401 with the antistatic coating 403 on its surface is finally installed and connected with the bottom stabilizing slot 402 and the fixing slot 105 on the surface of the main base 101, thereby realizing the structural assembly of the base component 1 and the protective cover component 4, thus ensuring the structural safety of the connection between the base component 1, the first pin 2, and the second pin 3.

[0029] The embodiments of this utility model are given for illustrative and descriptive purposes only, and are not intended to be exhaustive or to limit the utility model to the forms disclosed. Many modifications and variations will be apparent to those skilled in the art. The embodiments were chosen and described in order to better illustrate the principles and practical applications of this utility model, and to enable those skilled in the art to understand this utility model and design various embodiments with various modifications suitable for a particular purpose.

Claims

1. A field effect transistor pin solder base comprising a base assembly (1) and a first pin (2), characterized in that: The base assembly (1) is provided with first pins (2) on both the left and right sides, and second pins (3) are provided at both the front and rear ends of the base assembly (1). A protective cover component (4) is movably inserted into the top of the base assembly (1). The first pin (2) includes a pin body (201), a docking hole (202) and a first fixing post (203). The pin body (201) has a docking hole (202) vertically opened at one end near the base assembly (1), and the first fixing post (203) is embedded inside the docking hole (202).

2. A field effect transistor lead bonding base according to claim 1, wherein The base assembly (1) includes a main base (101), a welding piece (102), a connecting plate (103), an assembly groove (104), and a fixing slot (105). The bottom surface of the main base (101) is provided with a welding piece (102), and the top center of the main base (101) is provided with a connecting plate (103). The top four edges of the main base (101) are provided with assembly grooves (104), and a fixing slot (105) is provided between the assembly groove (104) and the connecting plate (103).

3. The field-effect transistor lead bonding base according to claim 2, characterized in that, The welding pieces (102) are respectively located at the middle of the bottom of the main base (101) and at the four opposite corners, and adopt two different sizes. The connecting plate (103) is fixed to the top surface of the main base (101), and the assembly grooves (104) are equidistantly arranged on the surface of the top side edge of the main base (101).

4. A field-effect transistor lead bonding base according to claim 2, characterized in that, The first fixing post (203) is vertically inserted into the interior of the docking hole (202) and is combined with each other in an embedded structure. The pin body (201) and the first fixing post (203) are tightly inserted into the interior of the assembly groove (104). The pin body (201) is set in a "Z" shaped structure.

5. A field effect transistor lead bonding base according to claim 2, wherein The second pin (3) includes a foot (301), a second fixing post (302) and a pin (303). The second fixing post (302) is vertically inserted at the end of the foot (301) near the base assembly (1), and the pin (303) is vertically inserted at the end of the foot (301) away from the second fixing post (302).

6. A field effect transistor lead bonding base according to claim 5, wherein The support leg (301) and the second fixing post (302) are tightly inserted into the assembly groove (104), and the pin (303) is tightly inserted into the support leg (301) away from the second fixing post (302).

7. A field effect transistor lead bonding base according to claim 2, wherein The protective cover component (4) includes a cover plate (401), a stabilizing slot (402), and an antistatic coating (403). The bottom perimeter of the protective cover component (4) is provided with a stabilizing slot (402), and the surface of the cover plate (401) is coated with an antistatic coating (403).

8. A field effect transistor lead bonding base according to claim 7, wherein The surface structure of the stabilizing slot (402) matches the surface structure of the pin body (201) and the end of the support (301) near the base assembly (1), and the inner surface structure of the fixing slot (105) matches the bottom surface structure of the cover plate (401).

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