A semiconductor packaging mold that facilitates injection molding.

Abstract

This utility model relates to the field of semiconductor packaging mold technology, and discloses a semiconductor packaging mold that facilitates glue injection. It includes a base, with two supporting side plates symmetrically fixedly mounted on the upper end of the base. The upper ends of the two supporting side plates are symmetrically fixedly mounted on the lower end face of an upper mounting plate. A lower mold is fixedly mounted on the upper end of the base, located between the two supporting side plates. Both supporting side plates slide vertically through a lifting platform. Four hydraulic cylinders are fixedly mounted in a rectangular array on the lower end face of the upper mounting plate. The output ends of the four hydraulic cylinders are fixedly arranged in a rectangular array on the upper end of the lifting platform. An upper mold is fixedly mounted on the lower end of the lifting platform, and the upper mold is located directly above the lower mold. This utility model has a residual material detection function, enabling workers to replenish the glue in the glue cylinder in a timely manner, thereby improving glue injection efficiency.

Description

Technical Field

[0001] This utility model relates to the field of semiconductor packaging mold technology, and in particular to a semiconductor packaging mold that is easy to inject adhesive. Background Technology

[0002] Semiconductor packaging molds are tools used to form the package shell during the semiconductor packaging process. In the semiconductor packaging process, the packaging mold plays a key role in protecting the chip and providing it with physical support and protection. At the same time, it can also realize the connection between the chip and external pins. Through potting encapsulation, semiconductor chips can be effectively protected and provided with good physical support and resistance to external environmental influences. It is an important part of the semiconductor packaging process.

[0003] Currently, during the injection of adhesive into semiconductor packaging molds, the adhesive is not immediately injected into the mold cavity. Instead, it is first placed in an adhesive cartridge for temporary storage. When the adhesive needs to be injected, it is then injected into the mold from the adhesive cartridge. However, the adhesive cartridge in the existing technology does not have a residual detection function, which makes it impossible for the staff to replenish the adhesive in a timely manner, thus easily affecting the injection efficiency. Therefore, a semiconductor packaging mold that facilitates adhesive injection is proposed. Utility Model Content

[0004] This invention provides a semiconductor packaging mold that facilitates glue injection, thus solving the problems in the background art.

[0005] To achieve the above objectives, the present invention adopts the following technical solution:

[0006] A semiconductor packaging mold for easy glue injection includes a base, two support side plates are symmetrically fixedly installed on the upper end of the base, the upper ends of the two support side plates are symmetrically fixedly installed on the lower end face of an upper mounting plate, and a lower mold is fixedly installed on the upper end of the base and located between the two support side plates.

[0007] Both of the supporting side plates slide vertically through the lifting platform. Four hydraulic cylinders are fixedly installed in a rectangular array on the lower end face of the upper mounting plate. The output ends of the four hydraulic cylinders are fixedly installed in a rectangular array on the upper end of the lifting platform. An upper mold is fixedly installed at the lower end of the lifting platform, and the upper mold is located directly above the lower mold.

[0008] Preferably, a glue cylinder is fixedly installed on the upper surface of the lifting platform, a feed pipe is fixedly connected to the front end of the top of the glue cylinder, a pipe cap is installed at the other end of the feed pipe, a glue dispensing pipe is fixedly connected to the lower end of the glue cylinder, a pressure relief valve is installed on the glue dispensing pipe, and the lower end of the glue dispensing pipe passes through the lifting platform and the upper end of the upper mold and extends into the interior of the upper mold.

[0009] Preferably, a drive assembly is fixedly installed at the upper end of the adhesive cylinder.

[0010] Preferably, the drive assembly includes a drive box, which is fixedly installed on the upper end of the rubber cylinder. A motor is fixedly installed on the upper end of the drive box. The lower end of the motor output shaft passes through the upper end of the drive box and extends into the interior of the drive box. A first screw arranged in a vertical direction is fixedly connected to the lower end of the motor output shaft. A second screw arranged in a vertical direction is mechanically linked to the right side of the first screw.

[0011] Both the first screw and the second screw are threaded with drive cylinders. The lower ends of the two drive cylinders pass through the lower end of the drive box and the upper end of the rubber cylinder in sequence, and extend into the inside of the rubber cylinder. The lower ends of the two drive cylinders are symmetrically fixedly installed on the upper end of the piston pressure plate. The outer end face of the piston pressure plate slides and fits against the inner wall of the rubber cylinder in the vertical direction.

[0012] Preferably, both the first screw and the second screw are fitted with transmission wheels located above the drive cylinder, and the two transmission wheels are connected by a transmission belt.

[0013] Preferably, the upper end of the second screw passes through the upper end of the drive box and is fixedly connected to the lower end of the angle sensor detection end, wherein the angle sensor is fixed to the upper end of the drive box.

[0014] Preferably, each of the two drive cylinders is fixedly mounted with a guide rod at one end away from each other, and the other ends of the two guide rods are slidably connected to the left and right ends of the drive box in the vertical direction via slide rails.

[0015] Preferably, a controller and an alarm are fixedly installed on the upper end of the rubber cylinder, the angle sensor is electrically connected to the controller, and the controller is electrically connected to the alarm and the motor.

[0016] The beneficial effects of this utility model are:

[0017] 1. This semiconductor packaging mold that facilitates glue injection uses a starting motor to drive the first screw to rotate. The rotating first screw can drive the second screw to rotate through two transmission wheels and a transmission belt. The rotating first and second screws can drive the drive cylinder up and down, thereby driving the piston pressure plate in the vertical direction. The downward-moving piston pressure plate can press the semiconductor glue in the glue cylinder into the glue filling tube. At this time, the pressure relief valve is opened by force, so that the semiconductor glue can be smoothly introduced into the upper and lower molds through the glue filling tube, thereby realizing automatic glue injection.

[0018] 2. This type of semiconductor packaging mold that facilitates glue injection has an extreme value set for the controller based on the height of the glue cylinder. The angle sensor can collect the angle information of the second screw rotation and transmit the angle information to the controller. The controller converts the angle information into data and compares the data with the extreme value. When the data equals the extreme value, it means that the piston plate has moved to the bottom of the glue cylinder, that is, the semiconductor glue in the glue cylinder needs to be replenished. At this time, the controller sends a command to the motor and the alarm. The motor stops working and the alarm starts to sound to remind the staff that the semiconductor glue needs to be replenished.

[0019] This invention features a residual quantity detection function, enabling workers to replenish the adhesive in the adhesive cartridge in a timely manner, thereby improving the adhesive injection efficiency. Attached Figure Description

[0020] Figure 1 This is a schematic diagram of the structure of a semiconductor packaging mold that facilitates glue injection, as proposed in this utility model.

[0021] Figure 2 This is a schematic diagram of the right side of a semiconductor packaging mold that facilitates glue injection, as proposed in this utility model.

[0022] Figure 3 This is a front view of a semiconductor packaging mold that facilitates glue injection, as proposed in this utility model.

[0023] Figure 4 This is a partial structural cross-sectional view of a semiconductor packaging mold that facilitates glue injection, as proposed in this utility model.

[0024] The following components are labeled in the diagram: 1. Base, 2. Lower mold, 3. Upper mold, 4. Support side plate, 5. Lifting platform, 6. Glue cylinder, 7. Drive assembly, 8. Upper mounting plate, 9. Hydraulic cylinder, 10. Feed pipe, 11. Controller, 12. Alarm, 13. Dispensing pipe.

[0025] 701 Drive box, 702 Piston pressure plate, 703 Drive cylinder, 704 Guide side rod, 705 Second screw, 706 Angle sensor, 707 Transmission belt, 708 Motor, 709 First screw. Detailed Implementation

[0026] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present utility model. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments.

[0027] Reference Figure 1-3A semiconductor packaging mold that facilitates glue injection includes a base 1, two support side plates 4 are symmetrically fixedly installed on the upper end of the base 1, the upper ends of the two support side plates 4 are symmetrically fixedly installed on the lower end face of the upper mounting plate 8, and a lower mold 2 is fixedly installed on the upper end of the base 1 and located between the two support side plates 4.

[0028] Both support side plates 4 slide vertically through the lifting platform 5. Four hydraulic cylinders 9 are fixedly installed in a rectangular array on the lower end face of the upper mounting plate 8. The output ends of the four hydraulic cylinders 9 are fixed in a rectangular array on the upper end of the lifting platform 5. An upper mold 3 is fixedly installed at the lower end of the lifting platform 5, and the upper mold 3 is located directly above the lower mold 2.

[0029] By activating the hydraulic cylinder 9, the height of the lifting platform 5 can be automatically adjusted, which in turn can automatically adjust the height of the upper mold 3, thereby achieving automatic control of the opening and closing of the upper mold.

[0030] In this embodiment, refer to Figure 3-4 A glue cylinder 6 is fixedly installed on the upper surface of the lifting platform 5. A feed pipe 10 is fixedly connected to the front end of the top of the glue cylinder 6. A pipe cover is installed at the other end of the feed pipe 10. By opening the pipe cover, the semiconductor glue in the glue cylinder 6 can be replenished through the feed pipe 10. A dispensing pipe 13 is fixedly connected to the lower end of the glue cylinder 6. A pressure relief valve is installed on the dispensing pipe 13. The lower end of the dispensing pipe 13 passes through the lifting platform 5 and the upper mold 3 and extends into the interior of the upper mold 3.

[0031] The semiconductor adhesive in the adhesive cylinder 6 can be injected into the space between the upper mold 3 and the lower mold 2 through the dispensing tube 13.

[0032] A drive assembly 7 is fixedly installed on the upper end of the glue cylinder 6. The drive assembly 7 includes a drive housing 701, which is fixedly installed on the upper end of the glue cylinder 6. A motor 708 is fixedly installed on the upper end of the drive housing 701. The lower end of the output shaft of the motor 708 passes through the upper end of the drive housing 701 and extends into the interior of the drive housing 701. A first screw 709 arranged vertically is fixedly connected to it. A second screw 705 arranged vertically is mechanically linked to the right side of the first screw 709. The first screw 709 and the second screw... Drive cylinders 703 are threaded onto each of the two drive cylinders 705. The lower ends of the two drive cylinders 703 pass through the lower end of the drive box 701 and the upper end of the rubber cylinder 6, and extend into the interior of the rubber cylinder 6. The lower ends of the two drive cylinders 703 are symmetrically fixedly installed on the upper end of the piston pressure plate 702. The outer end face of the piston pressure plate 702 slides and fits against the inner wall of the rubber cylinder 6 in the vertical direction. Transmission wheels are fitted on the first screw 709 and the second screw 705 above the drive cylinders 703. The two transmission wheels are connected by a transmission belt 707.

[0033] By starting the motor 708, the motor 708 drives the first screw 709 to rotate. The rotating first screw 709 can drive the second screw 705 to rotate through two transmission wheels and the transmission belt 707. The rotating first screw 709 and the second screw 705 can drive the drive cylinder 703 up and down, thereby driving the piston pressure plate 702 in the vertical direction. The downward moving piston pressure plate 702 can press the semiconductor adhesive in the adhesive cylinder 6 into the dispensing tube 13. At this time, the pressure relief valve is opened by force, so that the semiconductor adhesive can be smoothly introduced into the upper mold 3 and the lower mold 2 through the dispensing tube 13.

[0034] The upper end of the second screw 705 passes through the upper end of the drive box 701 and is fixedly connected to the lower end of the detection end of the angle sensor 706. The angle sensor 706 is fixed to the upper end of the drive box 701.

[0035] By setting an angle sensor 706 and a second screw 705, the vertical movement of the piston plate 702 can be converted into the rotation angle of the second screw 705, and detected by the angle sensor 706, thereby obtaining the precise vertical movement of the piston plate 702.

[0036] Two drive cylinders 703 are fixedly mounted with guide rods 704 at one end away from each other. The other ends of the two guide rods 704 are slidably connected to the left and right ends of the drive box 701 in the vertical direction via slide rails.

[0037] The guide rail can guide the guide rod 704 in the vertical direction, thereby improving the stability of the drive cylinder 703 in the vertical direction.

[0038] A controller 11 and an alarm 12 are fixedly installed on the upper end of the rubber cylinder 6. An angle sensor 706 is electrically connected to the controller 11, and the controller 11 is electrically connected to the alarm 12 and the motor 708.

[0039] The controller 11 is an SC200 general-purpose controller. An extreme value is set for the controller 11 according to the height of the glue cylinder 6. The angle sensor 706 can collect the angle information of the rotation of the second screw 705 and transmit the angle information to the controller 11. The controller 11 converts the angle information into data and compares the data with the extreme value. When the data is equal to the extreme value, it means that the piston plate 702 has moved to the bottom of the glue cylinder 6, that is, the semiconductor glue in the glue cylinder 6 needs to be replenished. At this time, the controller 11 sends a command to the motor 708 and the alarm 12. The motor 708 stops working and the alarm 12 starts to sound to remind the staff that the semiconductor glue needs to be replenished.

[0040] In the description of this utility model, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", etc., indicating the orientation or positional relationship are based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing this utility model and simplifying the description, and are not intended to indicate or imply that the device or component referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this utility model.

[0041] Furthermore, the terms "first," "second," etc., are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Therefore, a feature defined with "first," "second," etc., may explicitly or implicitly include one or more of that feature. In the description of this utility model, "a plurality of" means two or more, unless otherwise explicitly specified.

[0042] The above description is only a preferred embodiment of the present utility model, but the protection scope of the present utility model is not limited thereto. Any equivalent substitutions or changes made by those skilled in the art within the technical scope disclosed in the present utility model, based on the technical solution and the inventive concept of the present utility model, should be included within the protection scope of the present utility model.

Claims

1. A semiconductor packaging mold for easy dispensing, comprising a base (1), characterized in that, Two support side plates (4) are symmetrically fixedly installed on the upper end of the base (1). The upper ends of the two support side plates (4) are symmetrically fixedly installed on the lower end face of the upper mounting plate (8). A lower mold (2) is fixedly installed on the upper end of the base (1) and between the two support side plates (4). Both of the support side plates (4) slide through the lifting platform (5) in the vertical direction. Four hydraulic cylinders (9) are fixedly installed in a rectangular array on the lower end face of the upper mounting plate (8). The output ends of the four hydraulic cylinders (9) are fixedly installed in a rectangular array on the upper end of the lifting platform (5). An upper mold (3) is fixedly installed on the lower end of the lifting platform (5), and the upper mold (3) is located directly above the lower mold (2). A glue cylinder (6) is fixedly installed on the upper surface of the lifting platform (5). A feed pipe (10) is fixedly connected to the front end of the top of the glue cylinder (6). A pipe cap is installed at the other end of the feed pipe (10). A glue filling pipe (13) is fixedly connected to the lower end of the glue cylinder (6). A pressure relief valve is installed on the glue filling pipe (13). The lower end of the glue filling pipe (13) passes through the lifting platform (5) and the upper end of the upper mold (3) and extends into the interior of the upper mold (3). A drive assembly (7) is fixedly installed at the upper end of the rubber cylinder (6); The drive assembly (7) includes a drive box (701), which is fixedly installed on the upper end of the rubber cylinder (6). A motor (708) is fixedly installed on the upper end of the drive box (701). The lower end of the output shaft of the motor (708) passes through the upper end of the drive box (701) and extends into the interior of the drive box (701). A first screw (709) arranged in the vertical direction is fixedly connected to the first screw (709). A second screw (705) arranged in the vertical direction is mechanically linked to the right side of the first screw (709). Both the first screw (709) and the second screw (705) are threaded with drive cylinders (703). The lower ends of the two drive cylinders (703) pass through the lower end of the drive box (701) and the upper end of the rubber cylinder (6) in sequence, and extend into the inside of the rubber cylinder (6). The lower ends of the two drive cylinders (703) are symmetrically fixedly installed on the upper end of the piston plate (702). The outer end face of the piston plate (702) slides and fits against the inner wall of the rubber cylinder (6) in the vertical direction. Both the first screw (709) and the second screw (705) are fitted with transmission wheels located above the drive cylinder (703), and the two transmission wheels are connected by a transmission belt (707). The upper end of the second screw (705) passes through the upper end of the drive box (701) and is fixedly connected to the lower end of the detection end of the angle sensor (706), which is fixed to the upper end of the drive box (701).

2. The semiconductor packaging mold for easy dispensing according to claim 1, characterized in that, The two drive cylinders (703) are each fixedly mounted with a guide rod (704) at one end away from each other. The other ends of the two guide rods (704) are slidably connected to the left and right ends of the drive box (701) in the vertical direction via slide rails.

3. A semiconductor packaging mold for easy dispensing according to claim 2, characterized in that, The upper end of the rubber cylinder (6) is fixedly installed with a controller (11) and an alarm (12). The angle sensor (706) is electrically connected to the controller (11), and the controller (11) is electrically connected to the alarm (12) and the motor (708).

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