Power module
By welding a fixing device onto the substrate, the stress of the signal terminals under vibration load is shared, solving the problem of signal terminal root breakage in the power module and improving the vibration resistance of the power module.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- HANGZHOU SILAN MICROELECTRONICS CO LTD
- Filing Date
- 2025-06-20
- Publication Date
- 2026-07-31
AI Technical Summary
In the application environment of new energy vehicles, the signal terminals of power modules are prone to breakage due to vibration, and existing technologies are unable to effectively prevent this failure.
By welding a fixing device onto the substrate, the stress on the signal terminals under vibration load is shared, thereby preventing the root of the signal terminals from breaking.
It effectively prevents breakage at the root of the signal terminal, improving the reliability and durability of the power module in vibration environments.
Smart Images
Figure CN224583752U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of packaging technology, and in particular to a power module. Background Technology
[0002] With the advancement of power electronics technology, power modules have developed rapidly, and the complex application scenarios of power modules have placed higher demands on their packaging. In the application environment of new energy vehicles, the complex vibration environment places higher demands on the vibration resistance of power modules. Among them, the root of the signal terminal is a weak point in vibration, and breakage at the root of the signal terminal is also a common failure after vibration testing. Therefore, there is an urgent need to design a vibration-resistant power module. Utility Model Content
[0003] In view of this, the purpose of this utility model is to provide a power module that distributes the stress on the signal terminals under vibration load by welding a fixing device on the substrate, thereby preventing the signal terminal root from breaking.
[0004] This utility model provides a power module, comprising: a substrate; a plurality of power modules located on a first surface of the substrate, each power module comprising: a power device unit located on the first surface of the substrate; a molding compound covering the substrate and the power device unit, the molding compound including a first side and a second side opposite to each other, and a third side and a fourth side opposite to each other, the first side and the third side being perpendicular to each other; a signal terminal located on the first side of the molding compound, a first end of the signal terminal being electrically connected to the power device unit and extending out of the molding compound; a first power terminal located on the first side of the molding compound, the first power terminal being electrically connected to the power device unit; a second power terminal located on the second side of the molding compound, the second power terminal being electrically connected to the power device unit; and a fixing device soldered to the substrate.
[0005] In some embodiments, the fixing device is provided on the third and fourth sides of the power module, respectively.
[0006] In some embodiments, a plurality of the power device units constitute a half-bridge power unit, and the fixing device is provided between each half-bridge power unit.
[0007] In some implementations, the three half-bridge power units constitute a full-bridge power unit.
[0008] In some embodiments, the fixing device has a first connecting portion, which is fixedly connected to the substrate by reflow soldering or ultrasonic soldering.
[0009] In some embodiments, the power module further includes a PCB driver board that connects the signal terminals and the mounting device.
[0010] In some embodiments, the fixing device has a second connecting portion, which is fixedly connected to the PCB driver board by crimping or welding.
[0011] In some embodiments, the fixing device is in the shape of a pin.
[0012] In some embodiments, the length of the fixing device is 15 to 25 millimeters.
[0013] In some embodiments, the fixing device is a screw post structure.
[0014] In some embodiments, the substrate has an insulating layer with multiple openings, through which the power module and the fixing device pass to be positioned on the substrate.
[0015] In some embodiments, the insulating layer is spaced apart from the signal terminal, the first power terminal, and the second power terminal.
[0016] This utility model provides a power module, which includes a substrate, a fixing device, and at least one power module. The power module is located on the substrate and includes the substrate, a power device unit, a molding compound, and signal terminals. The power device unit is disposed on the substrate, the molding compound covers the substrate and the power device unit, and the signal terminals are electrically connected to the power device unit and extend from the molding compound. Furthermore, the fixing device is soldered to the substrate. Therefore, the fixing device can share the stress on the signal terminals under vibration loads, thereby helping to prevent breakage at the root of the signal terminals. Attached Figure Description
[0017] The above and other objects, features and advantages of the present invention will become clearer from the following description of embodiments of the present invention with reference to the accompanying drawings, in which:
[0018] Figure 1 This is a schematic diagram of the power module provided in an embodiment of the present invention;
[0019] Figure 2 This is a schematic diagram of the arrangement of a fixing device provided in an embodiment of this utility model;
[0020] Figure 3 This is a schematic diagram of the arrangement of another fixing device provided in an embodiment of this utility model.
[0021] Explanation of reference numerals in the attached figures:
[0022] 1-Substrate; 11-Insulating layer; 111-Opening; 2-Power module; 24-Signal terminal; 25-First power terminal; 26-Second power terminal; 3-Fixing device; 31-First connecting part; 32-Second connecting part; 33-Threaded hole; 4-PCB driver board. Detailed Implementation
[0023] The present application is described below based on embodiments, but it is not limited to these embodiments. In the detailed description of the present application below, certain specific details are described in detail. Those skilled in the art can fully understand the present application without these details. To avoid obscuring the substance of the present application, well-known methods, processes, flows, elements, and circuits are not described in detail.
[0024] Furthermore, those skilled in the art should understand that the accompanying drawings provided herein are for illustrative purposes only and are not necessarily drawn to scale.
[0025] Unless otherwise expressly specified and limited, the terms "installation," "connection," "linking," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components, unless otherwise expressly limited. Those skilled in the art can understand the specific meaning of the above terms in this application based on the specific circumstances.
[0026] For ease of explanation, spatially related terms such as “inside,” “outside,” “below,” “below,” “lower,” “above,” “upper,” etc., are used herein to describe the relationship between one element or feature illustrated in the figure and another. It will be understood that spatially related terms may be intended to encompass different orientations of the device in use or operation besides those depicted in the figure. For example, if the device in the figure is flipped, an element described as “below” or “below” another element or feature would then be positioned “above” that other element or feature. Thus, the exemplified term “below” can encompass both above and below orientations. The device may be oriented in other ways (rotated 90 degrees or in other orientations), and the spatially related descriptive terms used herein should be interpreted accordingly.
[0027] Unless the context explicitly requires it, words such as "including" or "contains" throughout the application should be interpreted as including rather than exclusive or exhaustive; that is, meaning "including but not limited to".
[0028] In the description of this application, it should be understood that the terms "first," "second," etc., are used for descriptive purposes only and should not be construed as indicating or implying relative importance. Furthermore, in the description of this application, unless otherwise stated, "a plurality of" means two or more.
[0029] Figure 1 This is a schematic diagram of the power module provided in an embodiment of the present invention, as shown below. Figure 1 As shown, the power module includes a substrate 1, multiple power modules 2, a fixing device 3, and a PCB driver board 4. Optionally, it should be noted that the power modules 2 are disposed on the first surface of the substrate 1, and the number of power modules 2 is at least one. Further, the power module includes a power device unit encapsulation, signal terminals, a first power terminal, and a second power terminal. Specifically, the power device unit is located on the first surface of the substrate, the encapsulation covers the substrate and the power device unit, the encapsulation includes opposing first and second sides, and opposing third and fourth sides, the first and third sides being perpendicular, the signal terminal is located on the first side of the encapsulation, the first end of the signal terminal is electrically connected to the power device unit and extends out of the encapsulation, the first power terminal is located on the first side of the encapsulation and is electrically connected to the power device unit, and the second power terminal is located on the second side of the encapsulation and is electrically connected to the power device unit. Optionally, the substrate 1 is an insulating ceramic substrate. For example, power device units include MOS (Metal-Oxide-Semiconductor Field-Effect Transistor), RC-IGBT (Reverse Conducting Insulated-Gate Bipolar Transistor), IGBT (Insulated-Gate Bipolar Transistor), and FRD (Fast Recovery Diode), etc. Further, such as Figure 1 As shown, the signal terminal is bent perpendicular to the substrate 1, and its top end is used for contacting the PCB driver board 4 for electrical connection. Optionally, each power module 2 has two or more signal terminals, with the signal terminals and the first power terminal located on the same side, and the first power terminal and the second power terminal located on opposite sides. Furthermore, Figure 2 This is a schematic diagram of the arrangement of a fixing device provided in an embodiment of this utility model, combined with... Figure 1 and Figure 2 As shown, the fixing device 3 is disposed on the substrate 1 and is used for contact electrical connection with the PCB driver board 4. It should be noted that the fixing device 3 is fixed to the substrate 1 by welding, which can improve the vibration resistance of the fixing device 3. Thus, the fixing device 3 can share the stress of the signal terminal on the PCB driver board 4 under vibration load, thereby helping to prevent the root of the signal terminal from breaking.
[0030] Optionally, the power module 2 is provided with fixing devices 3 on its third and fourth sides respectively. Figure 2As shown, in one embodiment, each power module 2 has a fixing device 3 on at least one side. Exemplarily, multiple power modules 2 are arranged on a substrate 1 in the same direction, with each pair of power modules 2 forming a group. Multiple groups of power modules 2 are spaced apart on the substrate 1, and a fixing device 3 is provided in the gap between each pair of power modules 2. Simultaneously, a fixing device 3 is provided on the outer side of each pair of power modules 2 located at the edge. Thus, by providing a fixing device 3 on one side of each power module 2, the number of fixing devices 3 can be reduced while ensuring the sharing of the fixing device's function, thereby reducing costs. In another embodiment, each power module 2 has a fixing device 3 on each of its opposite sides. Exemplarily, multiple power modules 2 are arranged on a substrate 1 in the same direction.
[0031] In one embodiment, several power device units form a half-bridge power unit, and a fixing device 3 is provided between each half-bridge power unit. Further, three half-bridge power units form a full-bridge power unit.
[0032] like Figure 2 As shown, in one embodiment, the fixing device 3 has a first connecting portion 31 and a second connecting portion 32. The first connecting portion 31 is located at the bottom end of the fixing device 3, while the second connecting portion 32 is located at the top end of the fixing device 3. Specifically, the first connecting portion 31 is fixedly connected to the substrate 1 by reflow soldering or ultrasonic soldering. It should be noted that reflow soldering and ultrasonic soldering have advantages such as high efficiency, controllable welding process parameters, high adaptability to miniature high-density fixing devices, and high solder joint reliability, which can meet the vibration resistance requirements of the power module. Further, the second connecting portion 32 is fixedly connected to the PCB driver board 4 by crimping or welding. It should be noted that crimping or welding can ensure connection efficiency and reliability, thus making it suitable for scenarios with multiple vibrations. Optionally, a combination of crimping and partial welding can also be used to fix the second connecting portion 32 and the PCB driver board 4. It should be noted that in one embodiment, the length of the fixing device 3 is 15 to 25 mm. It is easy to understand that the length of the fixing device 3 matches the length of the signal terminal 24, thereby ensuring that when the fixing device 3 and the signal terminal 24 are connected to the PCB driver board 4, the PCB driver board 4 remains parallel to the substrate 1. This, in turn, ensures that the fixing device 3 and the signal terminal 24 are subjected to uniform force in each area, ultimately helping to prevent the root of the signal terminal 24 from breaking. It should be noted that the lengths of the fixing device 3 and the signal terminal 24 can be adjusted according to design requirements.
[0033] Combination Figure 1 and Figure 2As shown, in one embodiment, an insulating layer 11 is provided on the substrate 1. Further, the insulating layer 11 has multiple openings 111 through which the power module 2 and the fixing device 3 pass to be mounted on the substrate 1. It is readily understood that the dimensions of the multiple openings 111 are respectively adapted to the corresponding power module 2 and fixing device 3, thereby facilitating the corresponding mounting of the power module 2 and fixing device 3 while ensuring the insulating effect of the insulating layer 11. Optionally, the insulating layer 11 is configured as an FR-4 (glass fiber reinforced epoxy resin laminate) insulating layer or a PI (polyimide) insulating layer. It should be noted that the FR-4 insulating layer has good mechanical strength and electrical properties. It should be noted that the PI insulating layer has excellent high-temperature resistance, electrical insulation, and mechanical strength.
[0034] like Figure 2 As shown, in one embodiment, the insulating layer 11 has a certain distance between it and the signal terminal 24, the first power terminal 25, and the second power terminal 26. Therefore, the signal terminal 24, the first power terminal 25, and the second power terminal 26 of the power module 2 are insulated from the substrate 1, thereby ensuring that the power module can function normally.
[0035] like Figure 2 As shown, in one embodiment, the fixing device 3 is in the shape of a pin. Figure 3 This is a schematic diagram of the arrangement of another fixing device provided in an embodiment of this utility model, as shown below. Figure 3 As shown, in another embodiment, the fixing device 3 is configured as a columnar structure. Optionally, the fixing device 3 has a threaded hole 33, and the fixing device 3 is fixedly connected to the PCB driver board 4 by screws.
[0036] This utility model provides a power module, which includes a substrate, a fixing device, and at least one power module. The power module is located on the substrate and includes the substrate, a power device unit, a molding compound, and signal terminals. The power device unit is disposed on the substrate, the molding compound covers the substrate and the power device unit, and the signal terminals are electrically connected to the power device unit and extend from the molding compound. Furthermore, the fixing device is soldered to the substrate. Therefore, the fixing device can share the stress on the signal terminals from the PCB drive board under vibration loads, thereby helping to prevent breakage at the root of the signal terminals.
[0037] The above description is merely a preferred embodiment of this application and is not intended to limit this application. Various modifications and variations can be made to this application by those skilled in the art. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this application should be included within the protection scope of this application.
Claims
1. A power module, characterized in that, The power module includes: substrate; Multiple power modules, wherein the power modules are located on a first surface of the substrate, the power modules comprising: A power device unit is located on the first surface of the substrate; A molding compound that encapsulates the substrate and the power device unit, the molding compound including opposing first and second sides and opposing third and fourth sides, the first side and the third side being perpendicular; A signal terminal is located on the first side of the plastic package, and the first end of the signal terminal is electrically connected to the power device unit and extends out of the plastic package; A first power terminal is located on the first side of the plastic encapsulation, and the first power terminal is electrically connected to the power device unit. A second power terminal is located on the second side of the encapsulation, and the second power terminal is electrically connected to the power device unit; and A fixing device is welded to the substrate.
2. The power module of claim 1, wherein, The fixing device is provided on the third and fourth sides of the power module, respectively.
3. The power module of claim 1, wherein, A plurality of the power device units constitute a half-bridge power unit, and the fixing device is provided between each half-bridge power unit.
4. The power module of claim 3, wherein, The three half-bridge power units together form a full-bridge power unit.
5. The power module of claim 1, wherein, The fixing device has a first connecting part, which is fixedly connected to the substrate by reflow soldering or ultrasonic soldering.
6. The power module of claim 1, wherein, The power module also includes a PCB driver board, which connects the signal terminals and the fixing device.
7. The power module of claim 6, wherein, The fixing device has a second connecting part, which is fixedly connected to the PCB driver board by crimping or welding.
8. The power module of claim 1, wherein, The fixing device is in the shape of a pin.
9. The power module of claim 8, wherein, The length of the fixing device is 15 to 25 millimeters.
10. The power module of claim 1, wherein, The fixing device is a columnar structure.
11. The power module of claim 10, wherein, The fixing device has a threaded hole and is fixedly connected to the PCB driver board by screws.
12. The power module of claim 1, wherein, An insulating layer is provided on the substrate, and the insulating layer has multiple openings. The power module and the fixing device pass through the openings in the insulating layer to be located on the substrate.
13. The power module of claim 12, wherein, The insulating layer has a certain distance between itself and the signal terminal, the first power terminal, and the second power terminal.