A power semiconductor device

Abstract

This utility model relates to the field of semiconductor device technology and discloses a power semiconductor device, including: a circuit board; an auxiliary positioning mechanism disposed on the top of the circuit board for positioning during soldering; and a protective mechanism disposed on the top of the circuit board for radiation protection. The auxiliary positioning mechanism includes a base support block fixedly mounted on the top of the circuit board. This utility model, through the combined design of the base support block and the limiting foot, allows the power integrated circuit body to be inserted entirely into the space above the base support block during soldering of the pins, and is limited by the limiting foot, preventing misalignment of the power integrated circuit body due to improper operation during soldering, thus ensuring the smoothness and accuracy of soldering.

Description

Technical Field

[0001] This utility model relates to the field of semiconductor device technology, specifically to a power semiconductor device. Background Technology

[0002] Power semiconductor devices are core components of modern power electronic systems, specifically designed for the efficient control and conversion of electrical energy. These devices achieve functions such as frequency conversion, voltage transformation, rectification, inversion, and rapid switching of electrical energy by precisely regulating high voltage and high current. Their core working principle utilizes the unique electrical properties of semiconductor materials to optimize energy conversion efficiency by controlling the movement of charge carriers, thereby significantly reducing system energy consumption.

[0003] Power integrated circuits are a type of power semiconductor device. They are semiconductor devices specifically designed for power conversion, control, and management. They integrate power devices with control circuits such as drive, protection, and detection onto a single chip. They are widely used in power management, motor drive, and new energy power generation, and feature high efficiency, high reliability, and miniaturization. They are the core components for achieving energy saving and intelligent control of electronic devices.

[0004] Power integrated circuits typically have multiple pins. When soldering these pins, they must be manually pressed onto the circuit board before soldering. Improper operation during this process can easily lead to misalignment of the power integrated circuits, significantly hindering the soldering work. Utility Model Content

[0005] The purpose of this invention is to provide a power semiconductor device that solves the problem of poor stability when manually positioning power integrated circuits during soldering in the prior art.

[0006] This utility model provides the following technical solution: a power semiconductor device, comprising:

[0007] Circuit board;

[0008] An auxiliary positioning mechanism is disposed on the top of the circuit board and is used to perform positioning work during soldering.

[0009] A protective mechanism is disposed on the top of the circuit board and is used to implement radiation protection.

[0010] The auxiliary positioning mechanism includes a base support block, which is fixedly installed on the top of the circuit board. A strip groove is opened on the top of the base support block, and a through groove is opened on the side of the base support block. A limit foot is fixedly installed at the corner of the outer wall of the base support block. A power integrated circuit body is movably inserted into the inner side of the limit foot, and pins are fixedly connected to the outer wall of the power integrated circuit body.

[0011] As a preferred embodiment of the above technical solution, the auxiliary positioning mechanism further includes a first side support block and a second side support block. The first side support block is fixedly installed on the side of the bottom support block. A railing is rotatably connected to the top of the first side support block. A pull ring is fixedly connected to the top of the railing. A plastic clip is fixedly installed at the end of the railing away from the first side support block.

[0012] As a preferred embodiment of the above technical solution, the second side support block is fixedly installed on the side of the bottom support block away from the first side support block, and a protrusion is fixedly connected to the outer wall of the second side support block, and the plastic clip is movably engaged with the protrusion.

[0013] As a preferred embodiment of the above technical solution, the protective mechanism includes an annular base, which is fixedly installed on the top of the circuit board, and a through hole is provided at the bottom of the annular base.

[0014] As a preferred embodiment of the above technical solution, the top of the annular base is provided with an annular groove, an annular insert is movably inserted into the inner cavity of the annular groove, and a rubber ring is fixedly sleeved on the outer wall of the annular insert, with the outer wall of the rubber ring movably connected to the inner wall of the annular groove.

[0015] As a preferred embodiment of the above technical solution, a metal shield is fixedly installed on the top of the annular plug, and a graphene film is fixedly connected to the inner wall of the metal shield.

[0016] Compared with the prior art, the beneficial effects of this utility model are:

[0017] This invention utilizes a combination of a base support block and a limiting foot to allow the power integrated circuit (IC) body to be inserted entirely into the space above the base support block during soldering of its pins. The limiting foot then restricts the IC's position, preventing misalignment during soldering and ensuring smooth and accurate soldering. Furthermore, the design of the strip groove and through groove creates a hollow top for the base support block, enhancing the natural heat dissipation of the IC and ensuring its operational stability. Attached Figure Description

[0018] Figure 1 This is a perspective view of the present utility model;

[0019] Figure 2 This is a schematic diagram of the structure of the bottom support block of this utility model;

[0020] Figure 3 This is a structural schematic diagram of the No. 1 and No. 2 side support blocks of this utility model;

[0021] Figure 4 This is a schematic diagram of the protective mechanism of this utility model.

[0022] In the diagram: 1. Circuit board; 2. Auxiliary positioning mechanism; 21. Base support block; 22. Strip groove; 23. Through groove; 24. Limiting foot; 25. Power integrated circuit body; 26. Pin; 27. First side support block; 271. Railing; 272. Pull ring; 273. Plastic clip; 28. Second side support block; 281. Protrusion block; 3. Protective mechanism; 31. Annular base; 32. Through hole; 33. Annular groove; 34. Annular plug; 35. Rubber ring; 36. Metal shielding cover; 37. Graphene film. Detailed Implementation

[0023] The technical solutions of the present invention will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present invention.

[0024] like Figures 1-4 As shown, this utility model provides a technical solution: a power semiconductor device, comprising:

[0025] Circuit board 1;

[0026] Auxiliary positioning mechanism 2 is disposed on the top of circuit board 1 and is used to perform positioning work during soldering.

[0027] The protective mechanism 3 is located on the top of the circuit board 1 and is used to implement radiation protection.

[0028] The auxiliary positioning mechanism 2 includes a base support block 21, which is fixedly installed on the top of the circuit board 1. A strip groove 22 is formed on the top of the base support block 21, and a through groove 23 is formed on the side of the base support block 21. A limiting foot 24 is fixedly installed at the corner of the outer wall of the base support block 21. A power integrated circuit body 25 is movably inserted into the inner side of the limiting foot 24. Pins 26 are fixedly connected to the outer wall of the power integrated circuit body 25. When soldering the pins 26 on the power integrated circuit body 25, the power integrated circuit body 25 is inserted into the space above the base support block 21. At this time, the limiting foot 24 limits the power integrated circuit body 25, avoiding the problem of misalignment of the power integrated circuit body 25 due to improper operation during the soldering process, and ensuring the smoothness and accuracy of the soldering. Through the design of the strip groove 22 and the through groove 23, the top of the base support block 21 is hollowed out, which improves the natural heat dissipation performance of the power integrated circuit body 25 and ensures the stability of the operation of the power integrated circuit body 25.

[0029] As one implementation method in this embodiment, such as Figure 3 As shown, the auxiliary positioning mechanism 2 also includes a first side support block 27 and a second side support block 28. The first side support block 27 is fixedly installed on the side of the bottom support block 21. A railing 271 is rotatably connected to the top of the first side support block 27. A pull ring 272 is fixedly connected to the top of the railing 271. A plastic clip 273 is fixedly installed at the end of the railing 271 away from the first side support block 27. Through the connection design between the first side support block 27 and the railing 271, the user can rotate the railing 271 to open and close. After inserting the power integrated circuit body 25 into the space above the bottom support block 21, the railing 271 can be rotated to a horizontal state to limit the power integrated circuit body 25, freeing the user's hand from fixing the power integrated circuit body 25 and facilitating the user's soldering operation.

[0030] As one implementation method in this embodiment, such as Figure 3 As shown, the second side support block 28 is fixedly installed on the side of the bottom support block 21 away from the first side support block 27. A protrusion block 281 is fixedly connected to the outer wall of the second side support block 28. The plastic clip 273 is movably engaged with the protrusion block 281. When the railing 271 is rotated to a horizontal position, the plastic clip 273 will undergo elastic deformation and smoothly insert into the inner side of the protrusion block 281, thus locking the position of the railing 271. By applying upward force from the pull ring 272, the railing 271 can be pulled out for easy use by the user.

[0031] As one implementation method in this embodiment, such as Figure 4As shown, the protective mechanism 3 includes an annular base 31, which is fixedly installed on the top of the circuit board 1. A through hole 32 is provided at the bottom of the annular base 31. The design of the through hole 32 can improve the ventilation and heat dissipation effect at the bottom of the power integrated circuit body 25.

[0032] As one implementation method in this embodiment, such as Figure 4 As shown, the top of the annular base 31 has an annular groove 33. An annular plug 34 is movably inserted into the inner cavity of the annular groove 33. A rubber ring 35 is fixedly sleeved on the outer wall of the annular plug 34. The outer wall of the rubber ring 35 is movably connected to the inner wall of the annular groove 33. Through the connection design between the annular plug 34 and the annular groove 33, the annular plug 34 can be installed as a whole after the pin 26 is soldered, which facilitates the soldering work. The design of the rubber ring 35 improves the stability of the annular plug 34 inserted into the annular groove 33.

[0033] As one implementation method in this embodiment, such as Figure 4 As shown, a metal shield 36 is fixedly installed on the top of the ring plug 34, and a graphene film 37 is fixedly connected to the inner wall of the metal shield 36. External electromagnetic waves can invade the internal circuit of the power integrated circuit body 25, inducing additional voltage / current on the wires or semiconductor nodes. These noise signals may overwrite the normal control logic, causing switching timing errors, output voltage fluctuations, or even device breakdown. Through the combined design of the metal shield 36 and the graphene film 37, external electromagnetic waves can be blocked to a certain extent, reducing the impact of external electromagnetic waves on the power integrated circuit body 25 and improving the stability of the operation of the power integrated circuit body 25. The top and bottom of the metal shield 36 extend relative to the plane where the top and bottom of the power integrated circuit body 25 are located to ensure the protective effect.

[0034] Working principle: During use, when soldering the pins 26 on the power integrated circuit body 25, the power integrated circuit body 25 is inserted into the space above the bottom support block 21. At this time, the power integrated circuit body 25 is limited by the limiting foot 24. Then, the railing 271 is rotated to a horizontal state to further limit the power integrated circuit body 25. When the railing 271 is rotated to a horizontal state, the plastic clip 273 will produce elastic deformation and smoothly insert into the inner side of the protrusion block 281, completing the locking of the position of the railing 271. Then, soldering can be performed from the pins 26. After soldering, the ring plug 34 is installed as a whole. Through the combined design of the metal shield 36 and the graphene film 37, external electromagnetic waves can be blocked to a certain extent, reducing the impact of external electromagnetic waves on the power integrated circuit body 25.

[0035] The above embodiments are only used to illustrate the technical solution of this utility model, and are not intended to limit it.

Claims

1. A power semiconductor device, characterized in that, include: Circuit board (1); An auxiliary positioning mechanism (2) is provided on the top of the circuit board (1) and is used to perform positioning work during welding. The protective mechanism (3) is disposed on the top of the circuit board (1) and is used to implement the function of radiation protection; The auxiliary positioning mechanism (2) includes a bottom support block (21), which is fixedly installed on the top of the circuit board (1). A strip groove (22) is provided on the top of the bottom support block (21), and a through groove (23) is provided on the side of the bottom support block (21). A limiting foot rod (24) is fixedly installed at the corner of the outer wall of the bottom support block (21). A power integrated circuit body (25) is movably inserted into the inner side of the limiting foot rod (24), and a pin (26) is fixedly connected to the outer wall of the power integrated circuit body (25).

2. The power semiconductor device according to claim 1, characterized in that: The auxiliary positioning mechanism (2) further includes a first side support block (27) and a second side support block (28). The first side support block (27) is fixedly installed on the side of the bottom support block (21). A railing (271) is rotatably connected to the top of the first side support block (27). A pull ring (272) is fixedly connected to the top of the railing (271). A plastic clip (273) is fixedly installed at the end of the railing (271) away from the first side support block (27).

3. A power semiconductor device according to claim 2, characterized in that: The second side support block (28) is fixedly installed on the side of the bottom support block (21) away from the first side support block (27). A protrusion block (281) is fixedly connected to the outer wall of the second side support block (28), and the plastic clip (273) is movably clipped to the protrusion block (281).

4. A power semiconductor device according to claim 1, characterized in that: The protective mechanism (3) includes an annular base (31), which is fixedly installed on the top of the circuit board (1), and a through hole (32) is provided at the bottom of the annular base (31).

5. A power semiconductor device according to claim 4, characterized in that: The top of the annular base (31) is provided with an annular groove (33), and an annular insert (34) is movably inserted into the inner cavity of the annular groove (33). A rubber ring (35) is fixedly sleeved on the outer wall of the annular insert (34), and the outer wall of the rubber ring (35) is movably connected to the inner wall of the annular groove (33).

6. A power semiconductor device according to claim 5, characterized in that: A metal shield (36) is fixedly installed on the top of the annular plug (34), and a graphene film (37) is fixedly connected to the inner wall of the metal shield (36).

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