mold
By incorporating a buffer structure and ejection device in the mold design, the problem of thin areas of the workpiece bulging during ejection was solved, thus achieving high-quality ejection of the workpiece.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- FUYU PRECISION COMPONENTKUNSHANCO LTD
- Filing Date
- 2025-06-30
- Publication Date
- 2026-08-04
AI Technical Summary
During the ejection process, thinner areas of the workpiece are prone to bulging, leading to defects.
The mold design includes a first mold base, an ejection device, a lifting component, an ejection assembly, and a buffer structure. The lifting component drives the ejector to move, and the buffer structure makes the second ejector move away from the workpiece after being subjected to force, reducing its pushing force and preventing deformation of thin areas.
It effectively prevents deformation of thin areas of the workpiece during the ejection process, ensuring that the workpiece meets quality standards.
Smart Images
Figure CN224586947U_ABST
Abstract
Description
Technical Field
[0001] This application belongs to the field of mold technology, and specifically relates to a mold. Background Technology
[0002] Die casting molds are commonly used to injection mold workpieces. After the workpiece is formed, the mold is opened, and then the workpiece is ejected by multiple ejectors. However, during the ejection process, thinner areas of the workpiece are prone to bulging under the push of the ejectors, resulting in defective workpieces. Utility Model Content
[0003] In view of the above, it is necessary to provide a mold that can prevent bulging in thinner areas of the workpiece.
[0004] An embodiment of this application provides a mold, including a first mold base and an ejection device. The first mold base is configured to carry a workpiece, and the ejection device is disposed on the first mold base. A lifting member is disposed on the first mold base and configured to move relative to the first mold base along a first direction. A lifting assembly is connected to the lifting member and passes through the first mold base. The lifting assembly includes a plurality of first ejectors and second ejectors, which are configured to move along the first direction with the lifting member to push the workpiece away from the first mold base. A buffer structure is disposed on the lifting member and corresponds to the second ejectors. The buffer structure is configured to allow the second ejectors to move away from the workpiece relative to the lifting member, such that when the lifting assembly pushes the workpiece away from it, the pushing force of the second ejector on the workpiece is less than the pushing force of the first ejector on the workpiece.
[0005] In the aforementioned mold, a lifting mechanism drives the first and second ejector parts to move together along a first direction toward the workpiece, causing them to push against the workpiece and thus separating it from the first mold base. When the second ejector part pushes against the workpiece, the workpiece generates a reaction force on it. A buffer structure allows the second ejector part to move away from the workpiece along the first direction after being subjected to force, ensuring that the pushing force of the second ejector part on the workpiece is less than that of the first ejector part. This prevents the second ejector part from deforming the area where it contacts the workpiece. When the second ejector part corresponds to a thin or easily deformable area of the workpiece, the buffer structure allows it to move relative to the lifting mechanism, preventing the thin or easily deformable area of the workpiece from being bulged and deformed by the second ejector part.
[0006] In some embodiments, the lifting member is provided with a mounting hole extending in a first direction, and the second ejector is partially disposed in the mounting hole; the buffer structure includes a clearance groove, which is disposed in the lifting member and communicates with the mounting hole, and the side of the clearance groove opposite to the mounting hole in the first direction is defined as the bottom of the groove. When the second ejector pushes the workpiece to move, the second ejector can move toward the bottom of the groove.
[0007] When the second ejector pushes the workpiece to move, the workpiece generates a reaction force on the second ejector. The second ejector is subjected to force and tends to move away from the workpiece. The clearance groove connected to the mounting hole can accommodate part of the second ejector, allowing the second ejector to move towards the bottom of the groove in the first direction, thereby reducing the pushing force exerted by the second ejector on the workpiece.
[0008] In some embodiments, the ejection device further includes a reset member disposed in a clearance groove and configured to push the second ejector member away from the bottom of the groove.
[0009] When the clearance groove accommodates part of the second ejector, the reset member can push the second ejector to move away from the bottom of the groove so that the second ejector exits the clearance groove.
[0010] In some embodiments, a limiting surface is provided in the mounting hole, and the limiting surface and the bottom of the groove are spaced apart along a first direction; the second ejector includes a first limiting portion, which abuts against the reset member; the limiting surface is configured to stop the first limiting portion from entering the mounting hole when the reset member abuts against the second ejector.
[0011] After the second ejector is pushed out of the relief groove by the reset member, it stops the first limiting part by the limiting surface to prevent the first limiting part from entering the mounting hole, which would cause the second ejector to exert a greater pushing force on the workpiece and push the workpiece out.
[0012] In some embodiments, the first mold base has a receiving cavity, the lifting member is disposed in the receiving cavity and configured to move between a first position and a second position; the receiving cavity has opposing top and bottom surfaces along a first direction; the lifting member also has a functional hole extending along the first direction, the functional hole penetrating the side of the lifting member near the bottom surface and the bottom of the groove; a reset member is disposed in the functional hole and the clearance groove; when the lifting member is in the first position, the lifting member and the reset member abut against the bottom surface, and the reset member pushes the second ejector out of the clearance groove; when the lifting member is in the second position, the lifting member abuts against the top surface, and the first ejector and the second ejector separate the workpiece from the first mold base.
[0013] The top and bottom surfaces of the receiving cavity limit the distance the lifting member can move in the first direction. When the lifting member is in the first position, the bottom surface abuts against the lifting member and the reset member, so that the reset member can drive the second ejector out of the clearance groove under the push of the bottom surface, thereby returning the second ejector to the initial position to prepare for the lifting assembly to push the workpiece. When the lifting member is in the second position, the top surface abuts against the lifting member to position the lifting assembly to separate the workpiece from the first mold base, preventing the lifting member from moving excessively.
[0014] In some embodiments, a pad is provided on the bottom surface and / or top surface, the pad being configured to abut against the lifting member; a reset member extends from the side of the lifting member near the bottom surface, and the bottom surface abuts against the reset member when the pad abuts against the lifting member.
[0015] The bottom and top surfaces contact the lifting component through pads to avoid rigid collisions between the bottom and top surfaces and the lifting component; when the lifting component moves close to the bottom surface, the resetting component extending from the side of the lifting component close to the bottom surface can move towards the second ejector under the push of the bottom surface, so as to push the second ejector away from the bottom of the groove until the lifting component touches the pad on the bottom surface and the second ejector exits the clearance groove.
[0016] In some embodiments, the reset member includes a second limiting portion disposed in the clearance groove and configured to abut against the second ejector; when the lifting assembly pushes the workpiece to move, the second ejector can push the reset member to move together toward the bottom of the groove, and the bottom of the groove is configured to block the second limiting portion from entering the functional hole.
[0017] When the second ejector pushes the workpiece to move, the workpiece generates a reaction force on the second ejector. The second ejector can push the reset member to move towards the bottom of the groove in the first direction. The second limit part is stopped at the bottom of the groove to prevent the second limit part from entering the functional hole and causing the reset member to disengage from the lifting member.
[0018] In some embodiments, the lifting member includes a mounting plate and a back plate, a mounting hole is provided through the mounting plate and configured to receive a portion of the second ejector, the mounting plate is stacked on the back plate, and a clearance groove is provided in the area of the back plate corresponding to the mounting hole to receive a portion of the second ejector when the second ejector moves toward the bottom of the groove; the back plate is configured to drive the mounting plate to move along a first direction.
[0019] The lifting component moves the mounting plate and the lifting assembly along the first direction via the back plate; by opening mounting holes on the mounting plate and opening clearance grooves on the back plate in the area corresponding to the area containing the second ejector, the mounting plate can be stacked on the back plate to form a lifting component with clearance grooves and mounting holes, which facilitates the processing of mounting holes and clearance grooves.
[0020] In some embodiments, the mounting hole is further configured to receive a portion of the first ejector, and the area of the back plate corresponding to the mounting hole receiving the first ejector is used to support the first ejector.
[0021] The back plate supports the first ejector, which restricts the movement of the first ejector relative to the lifting member in the first direction, thereby making the first ejector rigidly connected to the lifting member. Compared with the pushing force of the second ejector on the workpiece, the pushing force of the first ejector on the workpiece is greater, thereby providing the main pushing force for the workpiece to separate the workpiece from the first mold base.
[0022] In some embodiments, the mold further includes a second mold base configured to connect to the first mold base. When the first mold base and the second mold base are closed, the first mold base and the second mold base are configured to inject a workpiece. When the second mold base is separated from the first mold base, the workpiece is located on the first mold base.
[0023] The desired workpiece can be obtained by injection molding through the closing of the first mold base and the second mold base. When the second mold base separates from the first mold base, the workpiece placed on the first mold base can be pushed by the ejection device, so that the workpiece is separated from the first mold base. Attached Figure Description
[0024] Figure 1 This is a perspective view of a mold in one embodiment of this application.
[0025] Figure 2 yes Figure 1 Sectional view at point II-II along the middle line.
[0026] Figure 3 yes Figure 2 A magnified view of section III after the second ejector and reset components have been removed.
[0027] Figure 4 yes Figure 1 A schematic diagram of the lifting component in the first position.
[0028] Figure 5 yes Figure 4 A magnified view of the middle V section.
[0029] Figure 6 yes Figure 2 A schematic diagram showing the lifting component in the second position.
[0030] Figure 7 yes Figure 6 A magnified view of section VII in the middle.
[0031] Explanation of main component symbols
[0032] 100. Mold; 10. First mold base; 11. Receiving cavity; 111. Top surface; 112. Bottom surface; 1121. Pad block; 113. Side surface; 12. Ejector pin hole; 20. Second mold base; 30. Ejection device; 31. Lifting component; 311. Mounting plate; 3111. Mounting hole; 3112. Limiting surface; 312. Back plate; 3121. Functional hole; 32. Lifting assembly; 321. First ejector; 322. Second ejector; 3221. First limiting part; 33. Buffer structure; 331. Clearance groove; 3311. Groove bottom; 34. Reset component; 341. Second limiting part; 200. Ejector pin; 300. Workpiece; X, Second direction; Z, First direction.
[0033] The following detailed description, in conjunction with the accompanying drawings, will further illustrate this application. Detailed Implementation
[0034] The technical solutions of the embodiments of this application will be described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments.
[0035] In the description of the embodiments of this application, the technical terms "first", "second", etc. are used only to distinguish different objects and should not be construed as indicating or implying relative importance or implicitly indicating the number, specific order or primary and secondary relationship of the indicated technical features.
[0036] In the description of the embodiments of this application, the term "perpendicular" is used to describe the ideal state between two components. In actual production or use, two components may be in a state that is approximately perpendicular. The term "parallel" is used to describe the ideal state between two components. In actual production or use, two components may be in a state that is approximately parallel.
[0037] In this document, the term "embodiment" means that a particular feature, structure, or characteristic described in connection with an embodiment may be included in at least one embodiment of this application. The appearance of this phrase in various places in the specification does not necessarily refer to the same embodiment, nor is it a separate or alternative embodiment that is mutually exclusive with other embodiments.
[0038] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the application.
[0039] Die casting molds are commonly used to injection mold workpieces. After the workpiece is formed, the mold is opened, and then the workpiece is ejected by multiple ejectors. However, during the ejection process, thinner areas of the workpiece are prone to bulging under the push of the ejectors, resulting in defective workpieces.
[0040] An embodiment of this application provides a mold, including a first mold base and an ejection device. The first mold base is configured to carry a workpiece, and the ejection device is disposed on the first mold base. A lifting member is disposed on the first mold base and configured to move relative to the first mold base along a first direction. A lifting assembly is connected to the lifting member and passes through the first mold base. The lifting assembly includes a plurality of first ejectors and second ejectors, which are configured to move along the first direction with the lifting member to push the workpiece away from the first mold base. A buffer structure is disposed on the lifting member and corresponds to the second ejectors. The buffer structure is configured to allow the second ejectors to move away from the workpiece relative to the lifting member, such that when the lifting assembly pushes the workpiece away from it, the pushing force of the second ejector on the workpiece is less than the pushing force of the first ejector on the workpiece.
[0041] In the aforementioned mold, a lifting mechanism drives the first and second ejector parts to move together along a first direction toward the workpiece, causing them to push against the workpiece and thus separating it from the first mold base. When the second ejector part pushes against the workpiece, the workpiece generates a reaction force on it. A buffer structure allows the second ejector part to move away from the workpiece along the first direction after being subjected to force, ensuring that the pushing force of the second ejector part on the workpiece is less than that of the first ejector part. This prevents the second ejector part from deforming the area where it contacts the workpiece. When the second ejector part corresponds to a thin or easily deformable area of the workpiece, the buffer structure allows it to move relative to the lifting mechanism, preventing the thin or easily deformable area of the workpiece from being bulged and deformed by the second ejector part.
[0042] The embodiments of this application will be further described below with reference to the accompanying drawings. Unless otherwise specified, the various embodiments in this application can be combined with each other.
[0043] Please see Figure 1 and Figure 2 This application provides a mold 100, including a first mold base 10, a second mold base 20 (not shown), and an ejector device 30, the ejector device 30 being disposed on the first mold base 10. When the first mold base 10 and the second mold base 20 are closed, a workpiece 300 can be injection molded. When the second mold base 20 is separated from the first mold base 10, the workpiece 300 is located in the first mold base 10, and the ejector device 30 can eject the workpiece 300 from the first mold base 10 to obtain the desired workpiece 300.
[0044] Please see Figure 2 In some embodiments, the ejection device 30 includes a lifting member 31 and a lifting assembly 32. The lifting member 31 is disposed on the first mold base 10 and is movable relative to the first mold base 10 in a first direction Z. The lifting assembly 32 is connected to the lifting member 31 and passes through the first mold base 10, and the lifting assembly 32 is configured to move with the lifting member 31 in the first direction Z.
[0045] The lifting assembly 32 includes a second ejector 322 and a plurality of first ejectors 321. The second ejector 322 and the plurality of first ejectors 321 can move along the first direction Z with the lifting member 31, so that the second ejector 322 and the plurality of first ejectors 321 push against the workpiece 300, thereby pushing the workpiece 300 away from the first mold base 10 until the workpiece 300 separates from the first mold base 10.
[0046] In some embodiments, both the first ejector 321 and the second ejector 322 are ejector pins.
[0047] In some embodiments, the first direction Z is parallel to the vertical direction. In the illustrated embodiment, the first direction Z is the height direction of the first mold base 10.
[0048] Please see 2 and Figure 3 The ejector device 30 also includes a buffer structure 33, which is disposed on the lifting member 31 and corresponds to the second ejector 322. The buffer structure 33 is configured to allow the second ejector 322 to move away from the workpiece 300 relative to the lifting member 31, so that when the lifting assembly 32 pushes the workpiece 300 to move, the pushing force of the second ejector 322 on the workpiece 300 is less than the pushing force of the first ejector 321 on the workpiece 300.
[0049] Please see Figure 4 and Figure 5 When the lifting member 31 is in the first position, the top ends of both the first ejector 321 and the second ejector 322 are in contact with the lower surface of the workpiece 300. (See also...) Figure 6 and Figure 7 When the lifting member 31 rises along the first direction Z, the first ejector 321 and the second ejector 322 rise to push against the workpiece 300. When the second ejector 322 pushes against the workpiece 300, the workpiece 300 can generate a reaction force on the second ejector 322. The buffer structure 33 enables the second ejector 322 to move away from the workpiece 300 along the first direction Z after being subjected to force. That is, the second ejector 322 descends relative to the lifting member 31, so that the pushing force of the second ejector 322 on the workpiece 300 is less than the pushing force of the first ejector 321 on the workpiece 300. This can prevent the second ejector 322 from pushing and deforming the area where the workpiece 300 and the second ejector 322 are in contact.
[0050] In some embodiments, the second ejector 322 corresponds to a thinner or more easily deformable area of the workpiece 300, while the first ejector 321 corresponds to a thicker and less easily deformable area of the workpiece 300. The buffer structure 33 enables the second ejector 322 to move relative to the lifting member 31, thereby preventing the thinner or more easily deformable area of the workpiece 300 from being convex and deformed by the second ejector 322.
[0051] In some embodiments, there may be multiple second ejectors 322, each of which corresponds to a thinner or more deformable region of the workpiece 300 to prevent the workpiece 300 from being deformed by the ejector device 30.
[0052] Please see Figure 2 In some embodiments, the first mold base 10 is provided with a receiving cavity 11, and the lifting member 31 is disposed in the receiving cavity 11 and can move between a first position and a second position within the receiving cavity 11. Along the first direction Z, the receiving cavity 11 has a top surface 111 and a bottom surface 112 opposite to each other, and the bottom surface 112 and the top surface 111 of the receiving cavity 11 can limit the movement distance of the lifting member 31 in the first direction Z.
[0053] Please see Figure 4 and Figure 5When the lifting component 31 is in the first position, the lifting component 31 abuts against the bottom surface 112. At this time, the top of the lifting component 32 contacts the workpiece 300 and the workpiece 300 is located on the first mold base 10.
[0054] Please see Figure 6 and Figure 7 When the lifting component 31 is in the second position, the lifting component 31 abuts against the top surface 111. At this time, the top of the lifting component 32 pushes against the workpiece 300 and the workpiece 300 separates from the first mold base 10.
[0055] Please see Figure 4 and Figure 6 Along the second direction X, the receiving cavity 11 also has two opposing side surfaces 113, which can limit the lifting member 31 and prevent the lifting member 31 from deviating along the second direction X when it moves along the first direction Z. The second direction X is perpendicular to the first direction Z.
[0056] In some embodiments, both the bottom surface 112 and the top surface 111 are provided with pads 1121, and the pads 1121 on the bottom surface 112 and the top surface 111 are used to contact the lifting member 31 to prevent the lifting member 31 from rigidly colliding with the top surface 111 or the bottom surface 112.
[0057] In some embodiments, the pad 1121 may be a rubber pad 1121.
[0058] In some embodiments, the first mold base 10 has a push rod hole 12, and the push rod 200 of the machine tool passes through the push rod hole 12 to connect to the lifting member 31, so as to drive the lifting member 31 to move along the first direction Z.
[0059] In some embodiments, the lifting member 31 includes a mounting plate 311 and a back plate 312, with the mounting plate 311 stacked on the back plate 312. The mounting plate 311 is used to mount the lifting assembly 32, and the back plate 312 is used to connect the top rod 200 to drive the mounting plate 311 and the lifting assembly 32 to move along the first direction Z.
[0060] Please combine Figures 3 to 5 In some embodiments, the mounting plate 311 has a mounting hole 3111, which penetrates the mounting plate 311 along the first direction Z. The first ejector 321 and the second ejector 322 are both partially disposed in the corresponding mounting hole 3111. That is, the structure of the first ejector 321 and the second ejector 322 and their connection with the mounting plate 311 are the same.
[0061] The area of the back plate 312 corresponding to the mounting hole 3111 that accommodates the first ejector 321 is used to support the first ejector 321, so that the first ejector 321 is rigidly connected to the lifting member 31, thereby providing the first ejector 321 with the main pushing force for the workpiece 300.
[0062] The buffer structure 33 is provided in the area of the back plate 312 corresponding to the mounting hole 3111 that accommodates the second ejector 322, so that the pushing force of the second ejector 322 on the workpiece 300 is less than the pushing force of the first ejector 321 on the workpiece 300.
[0063] In some embodiments, a second ejector 322 is disposed between at least two first ejectors 321.
[0064] When the back plate 312 moves the mounting plate 311 and the lifting assembly 32 along the first direction Z, the first ejector 321, which is rigidly connected to the back plate 312, provides a large pushing force to separate the workpiece 300 from the first mold base 10. The second ejector 322, which can move along the first direction Z, provides a smaller pushing force to prevent the thinner areas of the workpiece 300 from being deformed by the second ejector 322. Placing the second ejector 322 among multiple first ejectors 321 can prevent the pushing force of the second ejector 322 from being too small, causing the area corresponding to the workpiece 300 and the second ejector 322 to stick to the first mold base 10 and become unable to be separated.
[0065] Please see Figure 3 In some implementations, the buffer structure 33 includes a clearance groove 331, which is disposed on the back plate 312. The clearance groove 331 communicates with the mounting hole 3111 that accommodates the second ejector 322. The side of the clearance groove 331 opposite to the mounting hole 3111 along the first direction Z is defined as the groove bottom 3311. When the second ejector 322 pushes the workpiece 300 to move, the second ejector 322 can move toward the groove bottom 3311. The clearance groove 331 can accommodate part of the second ejector 322, so that the pushing force of the second ejector 322 on the workpiece 300 is less than the pushing force of the first ejector 321 on the workpiece 300.
[0066] By opening mounting holes 3111 on the mounting plate 311 and opening clearance grooves 331 on the back plate 312 corresponding to the area containing the second ejector 322, the mounting plate 311 is stacked on the back plate 312 to form a lifting member 31 with clearance grooves 331 and mounting holes 3111, which facilitates the processing of mounting holes 3111 and clearance grooves 331.
[0067] In some embodiments, the ejection device 30 further includes a reset member 34 disposed within the clearance groove 331. The reset member 34 is configured to push the second ejector 322 away from the bottom of the groove 3311 to reset the second ejector 322, i.e., the second ejector 322 exits the clearance groove 331.
[0068] Please combine Figure 3 and Figure 5In some embodiments, a limiting surface 3112 is provided within the mounting hole 3111, and the limiting surface 3112 is spaced apart from and opposite to the groove bottom 3311 along a first direction Z. The second ejector 322 includes a first limiting portion 3221, which is configured to abut against the reset member 34. The limiting surface 3112 is configured to prevent the first limiting portion 3221 from entering the mounting hole 3111 when the reset member 34 pushes against the second ejector 322.
[0069] When the second ejector 322 rises under the push of the reset member 34, the first limiting part 3221 is stopped by the limiting surface 3112 to limit the rising height of the first limiting part 3221, so as to prevent the second ejector 322 from exerting too much pushing force on the workpiece 300 under the push of the reset member 34 and deforming the workpiece 300.
[0070] In some embodiments, the reset member 34 is an elastic member (not shown in the figure). The elastic member is disposed in the relief groove 331 and abuts against the bottom 3311 of the groove and the second ejector member 322, so that the second ejector member 322 partially enters the relief groove 331 when subjected to the reaction force of the workpiece 300, and exits the relief groove 331 when not subjected to the reaction force of the workpiece 300. The elastic member is a spring.
[0071] Please see Figure 4 and Figure 5 In some embodiments, the reset member 34 is rod-shaped. A functional hole 3121 is provided on the back plate 312, extending along the first direction Z through the side of the back plate 312 near the bottom surface 112 and the bottom of the groove 3311. The reset member 34 passes through the functional hole 3121 and the clearance groove 331, and extends out of the side of the back plate 312 near the bottom surface 112, so that as the lifting member 31 moves towards the bottom surface 112, the bottom surface 112 can abut against the bottom end of the reset member 34, causing the reset member 34 to push the second ejector 322 out of the clearance groove 331.
[0072] Please combine Figure 3 and Figure 7 In some embodiments, the reset member 34 includes a second limiting part 341, which is disposed within the clearance groove 331 and configured to abut against the first limiting part 3221. When the lifting assembly 32 pushes the workpiece 300 to move, the second ejector 322, after being subjected to force, can push the reset member 34 together to move towards the bottom of the groove 3311. The bottom of the groove 3311 is configured to block the second limiting part 341 from entering the functional hole 3121.
[0073] When the second ejector 322 descends under force, it stops the second limiting part 341 by the bottom of the groove 3311 to limit the descent height of the second limiting part 341 and the first limiting part 3221, preventing the reset part 34 from falling out of the functional hole 3121; it can also prevent the pushing force of the second ejector 322 on the workpiece 300 from being too small by limiting the position of the second limiting part 341.
[0074] In some embodiments, when the lifting member 31 is in the first position, the first limiting part 3221 retracts from the clearance groove 331, the first limiting part 3221 abuts against the limiting surface 3112, and the second limiting part 341 is spaced apart from the bottom of the groove 3311 by a preset distance. The preset distance is 0.1mm-0.5mm.
[0075] When the lifting member 31 is in the second position, the first limiting part 3221 is partially located in the clearance groove 331, and the first limiting part 3221 is spaced apart from the limiting surface 3112 by a preset distance, and the second limiting part 341 abuts against the bottom of the groove 3311. Alternatively, when the lifting member 31 is in the second position, the first limiting part 3221 is partially located in the clearance groove 331, and the first limiting part 3221 is spaced apart from the limiting surface 3112, and the second limiting part 341 is spaced apart from the bottom of the groove 3311.
[0076] The movement distance of the first limiting part 3221 and the second limiting part 341 is limited by the limiting surface 3112 and the bottom of the groove 3311, thereby limiting the movement distance of the second ejector 322 relative to the mounting plate 311.
[0077] Please see Figure 4 and Figure 5 In some embodiments, along the first direction Z, the length of the reset member 34 extending out of the back plate 312 is the same as the height of the pad 1121 on the bottom surface 112, so that when the pad 1121 abuts against the lifting member 31, the bottom surface 112 abuts against the bottom end of the reset member 34.
[0078] As the lifting member 31 moves toward the bottom surface 112, the bottom surface 112 pushes against the bottom end of the reset member 34, causing the reset member 34 to push the second ejector 322 upward until the back plate 312 abuts against the pad block 1121. At this time, the second ejector 322 exits the relief groove 331, and the lifting member 31 is in the first position.
[0079] In some embodiments, the first ejector 321 and the second ejector 322 have the same length along the first direction Z. For uneven workpiece 300, the lengths of the first ejector 321 and the second ejector 322 may also be different in the first direction Z to accommodate the shape of the lower surface of workpiece 300, and this application does not impose any restrictions on this.
[0080] Please see Figure 4 and Figure 5In some embodiments, when the lifting member 31 is in the first position, the pushing force exerted by the first ejector 321 and the second ejector 322 on the workpiece 300 is the same. At this time, the first ejector 321 and the second ejector 322 begin to apply a pushing force to the workpiece 300, attempting to separate the workpiece 300 from the first mold base 10, and the first ejector 321 and the second ejector 322 operate on a horizontal plane.
[0081] Please combine Figures 4 to 7 As the lifting member 31 moves from the first position to the second position, the first ejector 321 and the second ejector 322 rise with the lifting member 31. When the second ejector 322 pushes against the workpiece 300, it receives a reaction force from the workpiece 300. When the reaction force is greater than the frictional force between the reset member 34 and the second ejector 322, the second ejector 322 moves towards the bottom 3311 of the relief groove 331, thereby gradually reducing the pushing force of the second ejector 322 on the workpiece 300 to prevent the thinner areas of the workpiece 300 from being deformed by the second ejector 322. Multiple first ejectors 321 apply a large pushing force to the less deformable areas of the workpiece 300, and the thinner areas of the workpiece 300 will detach from the first mold base 10 along with the demolding of other areas of the workpiece 300, thereby causing the workpiece 300 to move away from the first mold base 10. When the lifting component 31 is in the second position, the workpiece 300 separates from the first mold base 10, the lifting component 31 returns to the first position, and the second ejector 322 exits the clearance groove 331 to prepare for the next ejection of the workpiece 300.
[0082] Furthermore, those skilled in the art should recognize that the above embodiments are merely illustrative of this application and are not intended to limit this application. Any appropriate changes and variations made to the above embodiments within the essential spirit and scope of this application fall within the scope of this application's disclosure.
Claims
1. A mold characterized in that, The system includes a first mold base and an ejector device. The first mold base is configured to carry a workpiece, and the ejector device is disposed on the first mold base. The ejector device includes: A lifting component is disposed on the first mold base and configured to move relative to the first mold base along a first direction; A lifting assembly is connected to the lifting member and passes through the first mold base. The lifting assembly includes a plurality of first ejector members and second ejector members. The plurality of first ejector members and second ejector members are configured to move along the first direction with the lifting member to push the workpiece and move the workpiece away from the first mold base. A buffer structure is provided on the lifting member and corresponds to the second ejector member. The buffer structure is configured to allow the second ejector member to move away from the workpiece relative to the lifting member, such that when the lifting assembly pushes the workpiece to move, the pushing force of the second ejector member on the workpiece is less than the pushing force of the first ejector member on the workpiece.
2. The mold of claim 1, wherein: The lifting component is provided with a mounting hole extending along the first direction, and the second ejector part is disposed in the mounting hole; The buffer structure includes a clearance groove, which is disposed on the lifting member and connected to the mounting hole. The side of the clearance groove opposite to the mounting hole along the first direction is defined as the bottom of the groove. When the second ejector pushes the workpiece to move, the second ejector can move toward the bottom of the groove.
3. The mold of claim 2, wherein: The ejection device further includes a reset member disposed within the clearance groove, and the reset member is configured to push the second ejection member away from the bottom of the groove.
4. The mold of claim 3, wherein: A limiting surface is provided in the mounting hole, and the limiting surface and the bottom of the groove are spaced apart along the first direction; The second ejector includes a first limiting part, which abuts against the reset part; The limiting surface is configured to prevent the first limiting portion from entering the mounting hole when the reset member pushes against the second ejector member.
5. A mould as claimed in claim 3 or 4, characterised in that: The first mold base is provided with a receiving cavity, the lifting member is disposed in the receiving cavity and configured to move between a first position and a second position; along the first direction, the receiving cavity has opposing top and bottom surfaces; The lifting component is further provided with a functional hole extending along the first direction, the functional hole penetrating the side of the lifting component near the bottom surface and the bottom of the groove; the resetting component passes through the functional hole and the clearance groove; When the lifting member is in the first position, the lifting member and the reset member abut against the bottom surface, and the reset member pushes the second ejector out of the clearance groove; When the lifting member is in the second position, the lifting member abuts against the top surface, and the first ejector and the second ejector separate the workpiece from the first mold base.
6. The mold of claim 5, wherein: The bottom surface and / or the top surface are provided with pads, which are configured to abut against the lifting member; The reset member extends from the side of the lifting member near the bottom surface, and the bottom surface abuts against the reset member when the pad block abuts against the lifting member.
7. The mold of claim 5, wherein: The reset member includes a second limiting part, which is disposed in the clearance groove and configured to abut against the second ejector member; When the lifting assembly pushes the workpiece to move, the second ejector can push the reset member together to move toward the bottom of the groove, and the bottom of the groove is configured to stop the second limiting part from entering the functional hole.
8. The mold of claim 2, wherein: The lifting component includes a mounting plate and a back plate. The mounting hole extends through the mounting plate and is configured to accommodate a portion of the second ejector. The mounting plate is stacked on the back plate. The clearance groove is located in the area of the back plate corresponding to the mounting hole accommodating the second ejector, so as to accommodate a portion of the second ejector when the second ejector moves toward the bottom of the groove. The back plate is configured to drive the mounting plate to move along the first direction.
9. The mold of claim 8, wherein: The mounting hole is also configured to receive a portion of the first ejector, and the area of the back plate corresponding to the mounting hole receiving the first ejector is used to support the first ejector.
10. The mold of claim 1, wherein: The mold further includes a second mold base, which is configured to connect to the first mold base. When the first mold base and the second mold base are closed, the first mold base and the second mold base are configured to injection mold the workpiece. When the second mold base is separated from the first mold base, the workpiece is located on the first mold base.