Laser processing device and production line

Abstract

The application provides a laser processing device and production line, comprising a bearing module and a processing module; the bearing module comprises a bearing part; the bearing part is configured to bear a target workpiece for laser processing; the processing module comprises a main frame, a first laser module and a second laser; the first laser module has a first laser output end, the first laser module is arranged on the main frame and the first laser output end faces the bearing part; the second laser has a second laser output end, the second laser is arranged on the main frame and the second laser output end faces the bearing part. In the process of using the first laser to process the target workpiece, the second laser is used to assist in heating the target workpiece, the depth of laser on the target workpiece is improved, and the process quality of laser processing of the target workpiece is improved.

Description

Technical Field

[0001] This application relates to the field of laser processing technology, and more specifically, to a laser processing apparatus and production line. Background Technology

[0002] Laser processing equipment is typically used to perform laser heat treatment on target workpieces, such as bonding and debonding wafers.

[0003] Currently, most laser processing devices use a laser adapted to the target workpiece to irradiate the target workpiece, thereby achieving laser processing of the target workpiece.

[0004] However, taking wafer debonding as an example, most current laser processing equipment can only act on the bonding material of the wafer, and cannot provide auxiliary heating to improve the quality of the laser processing.

[0005] In other words, most laser processing devices currently do not achieve sufficiently high process quality when processing target workpieces such as wafers. Utility Model Content

[0006] The purpose of this application is to provide a laser processing apparatus and production line, which improves the process quality of laser processing of the target workpiece by using a second laser to assist in heating the target workpiece during the laser processing of the target workpiece using a first laser.

[0007] In a first aspect, this application provides a laser processing apparatus, including a support module and a processing module; the support module includes a support portion; the support portion is configured to support a target workpiece for laser processing; the processing module includes a main frame, a first laser module, and a second laser; the first laser module has a first laser output end, the first laser module is disposed on the main frame and the first laser output end faces the support portion; the second laser has a second laser output end, the second laser is disposed on the main frame and the second laser output end faces the support portion.

[0008] The aforementioned laser processing apparatus, based on a first laser module capable of emitting a first laser, is further equipped with a second laser capable of emitting a second laser. This allows the second laser to assist in heating the target workpiece during laser processing, thereby increasing the depth of laser action on the target workpiece and improving the process quality of laser processing.

[0009] In conjunction with the first aspect, optionally, the first laser module includes a first laser, a focusing lens group, a reflector, a first adjustment mechanism, and a centering mechanism; the first laser is connected to the main frame via the centering mechanism, the centering mechanism being configured to adjust the irradiation position of the first laser emitted by the first laser; the focusing lens group is connected to the main frame via the first adjustment mechanism, and the reflector is disposed on the main frame; the laser emission port of the first laser faces the reflector, the reflector being configured to reflect the first laser emitted by the first laser towards the focusing lens group; the first adjustment mechanism is configured to adjust the focal length of the first laser module; the first laser output end is located on the reflector, and the focusing lens group is configured to focus the first laser onto the support portion based on the adjustment of the first adjustment mechanism.

[0010] The aforementioned laser processing apparatus, by equipping the first laser with a focusing lens group, a first adjustment mechanism, and a centering mechanism, achieves better focusing and improves the flexibility of the laser processing apparatus. Ultimately, this further enhances the process quality of laser processing on the target workpiece.

[0011] In conjunction with the first aspect, optionally, the first adjustment mechanism includes a displacement component and a first rotation component; the displacement component is configured to drive the focusing lens group to translate, and the first rotation component is configured to drive the first rotation component to rotate around a first rotation axis; wherein, the first rotation axis is not parallel to the optical axis of the focusing lens group.

[0012] The aforementioned laser processing apparatus, through a first adjustment mechanism consisting of a displacement component and a first rotation component, enables the focusing lens group to adjust both its spatial position relative to the first laser and its tilt angle, achieving full adjustability of the focusing lens group. This further enhances the flexibility of the first laser module and ultimately improves the process quality of laser processing on the target workpiece.

[0013] In conjunction with the first aspect, the device may optionally further include a second adjustment mechanism; the second laser is connected to the main frame via the second adjustment mechanism; the second adjustment mechanism includes a three-dimensional translation component configured to drive the second laser to translate in three dimensions.

[0014] The aforementioned laser processing apparatus, by equipping the second laser with a three-dimensional translation component, enables the second laser to adjust its spatial position in three dimensions, thereby enhancing the flexibility of the second laser and ultimately further improving the process quality of laser processing on the target workpiece.

[0015] In conjunction with the first aspect, optionally, the second adjustment mechanism further includes a second rotating component; one connecting end of the second rotating component is connected to the second laser, and the other connecting end of the second rotating component is connected to one connecting end of the three-dimensional translation component, and the other connecting end of the three-dimensional translation component is connected to the main frame; the second rotating component is configured to drive the second laser to rotate around a second rotation axis to adjust the angle between the second laser emitted by the second laser and the plane where the support part is located; wherein, the second rotation axis is not parallel to the second laser and not parallel to the plane where the support part is located.

[0016] The aforementioned laser processing apparatus, by configuring a second rotating component for the second laser, not only enables the second laser to adjust its spatial position in three dimensions, but also allows for adjustable tilt angle of the second laser, that is, adjustable incident angle of the second laser relative to the target workpiece. This further enhances the flexibility of the second laser and ultimately improves the process quality of laser processing on the target workpiece.

[0017] In conjunction with the first aspect, the device may optionally further include a monitoring module; the monitoring module includes a temperature sensor; the temperature sensor is disposed on the main frame and configured to acquire the temperature of the target workpiece on the support section.

[0018] The aforementioned laser processing apparatus monitors the temperature of the target workpiece using a temperature sensor, thereby facilitating real-time adjustment of the energy of the first and second lasers based on the monitored temperature information. This ensures that the laser energy used for processing the target workpiece is optimal, further improving the process quality of laser processing of the target workpiece.

[0019] In conjunction with the first aspect, optionally, the monitoring module further includes an image acquisition device; the image acquisition device is disposed on the main frame and configured to acquire the light spot of the first laser and the light spot of the second laser on the bearing part.

[0020] The aforementioned laser processing device acquires images of the laser spot using an image acquisition device, enabling the adjustment of laser energy and other parameters based on the acquired spot images, thereby further improving the process quality of laser processing on the target workpiece.

[0021] In conjunction with the first aspect, optionally, the monitoring module further includes a third adjustment mechanism; one connection end of the third adjustment mechanism is connected to the image acquisition device, and the other connection end of the third adjustment mechanism is connected to the main frame; the third adjustment mechanism is configured to drive the image acquisition device to move, so as to adjust the field of view of the image acquisition device.

[0022] The aforementioned laser processing device, by configuring a third adjustment mechanism for the image acquisition unit, enables the field of view of the image acquisition unit to be adjustable, thereby improving the flexibility of the image acquisition unit in acquiring laser spots.

[0023] In conjunction with the first aspect, optionally, the bearing module includes a base, a two-dimensional translation component, and a bearing member; one connection end of the two-dimensional translation component is connected to the base, and the other connection end of the two-dimensional translation component is connected to the bearing member; the bearing member includes the bearing portion and is used to bear the target workpiece; the two-dimensional translation component is configured to drive the bearing member to translate in two dimensions within its plane.

[0024] The aforementioned laser processing device, by configuring a dimensional translation component for the carrier, enables the target workpiece to be positioned on the carrier module while being carried, thereby improving the flexibility of the target workpiece position during processing and ultimately further improving the process quality of laser processing of the target workpiece.

[0025] Secondly, this application provides a production line including the laser processing apparatus described in the first aspect.

[0026] The above-described production line has the same beneficial effects as the laser processing apparatus described in the first aspect or any alternative embodiment of the first aspect, and will not be repeated here.

[0027] In summary, the laser processing apparatus and production line provided in this application improve the laser's penetration depth on the target workpiece by using a second laser to assist in heating the target workpiece during laser processing with a first laser, thereby enhancing the process quality of laser processing. By constructing a first adjustment mechanism consisting of a displacement component and a second rotation component, full adjustability of the focusing lens group is achieved, improving the flexibility of the first laser module and further enhancing the process quality of laser processing. The flexibility of the second laser is enhanced by equipping it with a three-dimensional translation component, and further enhanced by equipping it with a second rotation component, again improving the process quality of laser processing. Monitoring the temperature of the target workpiece using a temperature sensor facilitates real-time adjustment of the laser energy by comparing the temperatures monitored by the two sensors. Image acquisition of the laser spot allows for adjustment of the laser energy and other parameters based on the acquired spot image, further improving the process quality of laser processing. Attached Figure Description

[0028] To more clearly illustrate the technical solutions of the embodiments of this application, the accompanying drawings used in the embodiments will be briefly introduced below. It should be understood that the following drawings only show some embodiments of this application and should not be regarded as a limitation of the scope. For those skilled in the art, other related drawings can be obtained based on these drawings without creative effort.

[0029] Figure 1 A perspective view of the laser processing apparatus provided in the embodiments of this application;

[0030] Figure 2 A front view and a partial enlarged view of the laser processing apparatus provided in the embodiments of this application;

[0031] Figure 3 A side view of a laser processing apparatus provided in an embodiment of this application.

[0032] Icons: 100, Laser processing device; 110, Support module; 111, Base; 112, Two-dimensional translation component; 113, Support component; 120, Processing module; 121, Main frame; 122, First laser module; 1221, First laser; 1222, Focusing lens group; 1223, Reflector; 1224, First adjustment mechanism; 1225, Centering mechanism; 123, Second laser; 130, Second adjustment mechanism; 131, Three-dimensional translation component; 132, Second rotation component; 140, Monitoring module; 141, Temperature sensor; 142, Image acquisition device; 143, Third adjustment mechanism. Detailed Implementation

[0033] To make the objectives, technical solutions, and advantages of the embodiments of this application clearer, the technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. The components of the embodiments of this application described and shown in the accompanying drawings can generally be arranged and designed in various different configurations.

[0034] Therefore, the following detailed description of the embodiments of this application provided in the accompanying drawings is not intended to limit the scope of the claimed application, but merely to illustrate selected embodiments of the application. All other embodiments obtained by those skilled in the art based on the embodiments of this application without inventive effort are within the scope of protection of this application.

[0035] It should be noted that similar labels and letters in the following figures indicate similar items. Therefore, once an item is defined in one figure, it does not need to be further defined and explained in subsequent figures.

[0036] In the description of this application, it should be noted that the terms "center," "upper," "lower," "left," "right," "vertical," "horizontal," "inner," and "outer," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, or the orientation or positional relationship commonly used when the utility model product is in use. They are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this application. In addition, the terms "first," "second," and "third," etc., are only used to distinguish descriptions and should not be construed as indicating or implying relative importance.

[0037] Furthermore, terms such as "horizontal" and "vertical" do not imply that components must be absolutely horizontal or suspended, but rather that they can be slightly tilted. For example, "horizontal" simply means that its direction is more horizontal than "vertical," and does not mean that the structure must be completely horizontal, but can be slightly tilted.

[0038] In the description of this application, it should also be noted that, unless otherwise expressly specified and limited, the terms "set up," "install," "connect," and "link" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this application based on the specific circumstances.

[0039] Please refer to Figure 1 , Figure 1 This is a perspective view of the laser processing apparatus 100 provided in an embodiment of this application. The laser processing apparatus 100 provided in this embodiment may include a support module 110 and a processing module 120. The support module 110 may include a support portion. The support portion may be configured to support a target workpiece for laser processing. The processing module 120 may include a main frame 121, a first laser 1221 module 122, and a second laser 123. The first laser 1221 module 122 may have a first laser output end, and the first laser 1221 module 122 may be disposed on the main frame 121 with the first laser output end facing the support portion. The second laser 123 may have a second laser output end, and the second laser 123 may be disposed on the main frame 121 with the second laser output end facing the support portion.

[0040] The target workpiece can be a wafer or other workpiece to be processed. The processing module 120 can be mounted on the support module 110. In addition to supporting the target workpiece, the support module 110 can also support the processing module 120 in the target area. The target area can be a region in the working environment of the laser processing device 100.

[0041] The main frame 121 serves as a support frame for integrating the first laser module 1221, the second laser 123, and other components. Its specific shape and structure can be determined by those skilled in the art based on relevant technical means known to them and in combination with actual application requirements. This application embodiment does not impose specific limitations on this.

[0042] In the case of the laser processing apparatus 100 provided in this application embodiment for processing wafers, the first laser 1221 module 122 can be a CO2 laser module, and the second laser 123 can be a red 808 laser. The first laser 1221 module 122 includes the first laser 1221, and may also include corresponding mechanical adjustment components and optical elements for focusing, shaping, etc., of the first laser.

[0043] In the above implementation process, based on configuring a first laser 1221 module 122 capable of emitting a first laser on the laser processing device 100, a second laser 123 capable of emitting a second laser is further configured on the laser processing device 100. The second laser is used to assist in heating the target workpiece during the laser processing process, thereby increasing the depth of laser action on the target workpiece and improving the process quality of laser processing of the target workpiece.

[0044] Please combine Figure 1 Reference Figure 3 , Figure 3This is a side view of the laser processing apparatus 100 provided in an embodiment of this application. In some optional embodiments, the first laser 1221 module 122 may include a first laser 1221, a focusing lens group 1222, a reflector 1223, a first adjustment mechanism 1224, and a centering mechanism 1225. The first laser 1221 can be connected to the main frame 121 via the centering mechanism 1225, which can be configured to adjust the irradiation position of the first laser emitted by the first laser 1221. The focusing lens group 1222 can be connected to the main frame 121 via the first adjustment mechanism 1224, and the reflector 1223 can be disposed on the main frame 121. The laser emission port of the first laser 1221 can face the reflector 1223 group, and the reflector 1223 can be configured to reflect the first laser emitted by the first laser 1221 toward the focusing lens group 1222. The first adjustment mechanism 1224 can be configured to adjust the focal length of the first laser 1221 module 122. The first laser output end can be located on the reflector group 1223, and the focusing lens group 1222 can be configured to focus the first laser onto the carrier based on the adjustment of the first adjustment mechanism 1224.

[0045] In other words, the centering mechanism 1225, the focusing lens group 1222, the reflector 1223, and the first adjustment mechanism 1224 can all be integrated onto the main frame 121. The centering mechanism 1225 can be any adjustment mechanism known to those skilled in the art, capable of adjusting the first laser 1221 for centering. The focusing lens group 1222 can be a two-piece spherical focusing lens, a single-piece spherical focusing lens, or an aspherical focusing lens, etc. Of course, those skilled in the art can also adopt other types of focusing lens groups 1222 according to the performance of different optical elements and actual process requirements. It is worth mentioning that the focusing lens group 1222 provided in this application embodiment does not necessarily mean that it contains two or more optical elements, but can be a single-piece focusing lens such as a single-piece spherical focusing lens or an aspherical focusing lens as described above.

[0046] The angle between the mirror surface of the reflector 1223 and the first laser emitted by the first laser 1221 can be 45°.

[0047] In the laser processing apparatus 100 provided in this application embodiment, the optical path of the first laser emitted by the first laser 1221 can be as follows: the first laser is emitted from the first laser 1221, reflected by the reflector 1223 and irradiated onto the focusing lens group 1222. The focusing lens group 1222 focuses the first laser so that the focal point is located above the support part, so as to facilitate laser processing of the target workpiece on the support part.

[0048] The first adjustment mechanism 1224 is an adjustment mechanism known to those skilled in the art, capable of adjusting the spatial position and tilt angle of the focusing lens group 1222. Through the adjustment of the first adjustment mechanism 1224, the focal position of the first laser and other parameters can be adjusted.

[0049] In the above implementation process, by configuring the first laser 1221 with a focusing lens group 1222, a first adjustment mechanism 1224, and a centering mechanism 1225, the focusing effect of the laser processing device 100 is improved, and the flexibility of the laser processing device 100 is enhanced. Ultimately, the process quality of laser processing on the target workpiece is further improved.

[0050] Please continue to refer to Figure 1 and Figure 3 In some alternative embodiments, the first adjustment mechanism 1224 may include a displacement component and a first rotation component. The displacement component may be configured to drive the focusing lens group 1222 to translate, and the first rotation component may be configured to drive the first rotation component to rotate around a first rotation axis.

[0051] The displacement component can be a component that can automatically or manually drive the focusing lens group 1222 to translate in one, two or three dimensions. Specifically, it can be a structure such as "guide rail + slider" or "slide groove + slider".

[0052] The first rotating component can also be a component capable of automatically or manually rotating the focusing lens assembly 1222 around a first rotation axis. Specifically, it may include two rotating parts rotatably connected to each other, one connected to the focusing lens assembly 1222 and the other connected to a displacement assembly; or, one of the first rotating components is connected to the main frame 121, and the other connected to the displacement assembly, with the focusing lens assembly 1222 mounted on a sliding assembly. The first rotation axis is not parallel to the optical axis of the focusing lens assembly 1222, thereby allowing adjustment of the tilt angle of the focusing lens assembly 1222.

[0053] In the above implementation process, by forming a first adjustment mechanism 1224 consisting of a displacement component and a first rotation component, the focusing lens group 1222 can be adjusted not only in its spatial position relative to the first laser 1221, but also in its tilt angle. This achieves full adjustability of the focusing lens group 1222, thereby further improving the flexibility of the first laser 1221 module 122 and ultimately further improving the process quality of laser processing on the target workpiece.

[0054] Please continue to refer to Figure 1In some optional embodiments, the laser processing apparatus 100 provided in this application may further include a second adjustment mechanism 130. The second laser 123 can be connected to the main frame 121 through the second adjustment mechanism 130. The second adjustment mechanism 130 may include a three-dimensional translation component 131, which can be configured to drive the second laser 123 to translate in three dimensions.

[0055] For example, the three-dimensional translation component 131 may include a first slider and a second slider. The first slider is slidably connected to the main frame 121, and its sliding direction is a first direction. The second slider is slidably connected to the first slider, and its sliding direction is a second direction. The second laser 123 is slidably connected to the second slider, and its sliding direction is a third direction. Any two of the first direction, the second direction, and the third direction are not parallel. As a preferred embodiment, the first direction may be the height direction, the second direction may be the width direction, and the third direction may be the length direction.

[0056] In the above implementation process, by configuring the second laser 123 with a three-dimensional translation component 131, the second laser 123 can adjust its spatial position in three dimensions, thereby improving the flexibility of the second laser 123 and ultimately further improving the process quality of laser processing on the target workpiece.

[0057] Please continue to refer to Figure 1 In some optional embodiments, the second adjustment mechanism 130 may further include a second rotating assembly 132. One connection end of the second rotating assembly 132 may be connected to the second laser 123, and the other connection end of the second rotating assembly 132 may be connected to one connection end of the three-dimensional translation assembly 131, the other connection end of the three-dimensional translation assembly 131 may be connected to the main frame 121. The second rotating assembly 132 may be configured to drive the second laser 123 to rotate around a second rotation axis to adjust the angle between the second laser emitted by the second laser 123 and the plane where the support portion is located. The second rotation axis may not be parallel to the second laser and may not be parallel to the plane where the support portion is located.

[0058] For example, the second rotating assembly 132 may include a rotating pin connector and a rotating pin. The rotating pin connector may be disposed on the second sliding member, and the second laser 123 may be rotatably connected to the rotating pin connector via the rotating pin. As a further optional implementation, the rotating pin may be a bolt. When it is necessary to adjust the tilt of the second laser 123, the bolt is loosened by rotation, and then the tilt of the second laser 123 is adjusted. After the tilt of the second laser 123 is adjusted, the bolt can be tightened by rotation, thereby fixing the current angle of the second laser 123.

[0059] In the above implementation process, by configuring the second rotating component 132 for the second laser 123, the second laser 123 is not only able to adjust its spatial position in three dimensions, but also has an adjustable tilt angle, that is, the incident angle of the second laser relative to the target workpiece is adjustable, thereby further improving the flexibility of the second laser 123 and ultimately further improving the process quality of laser processing on the target workpiece.

[0060] Please combine Figure 1 Reference Figure 2 , Figure 2 These are a front view and a partial enlarged view of the laser processing apparatus 100 provided in this application embodiment. In some optional embodiments, the laser processing apparatus 100 provided in this application embodiment may further include a monitoring module 140. The monitoring module 140 may include a temperature sensor 141. The temperature sensor 141 may be disposed on the main frame 121 and may be configured to acquire the temperature of the target workpiece on the support section.

[0061] Temperature sensor 141 may specifically include a high-temperature sensor and a low-temperature sensor. The low-temperature sensor can be used to monitor the temperature of the target workpiece when it is not being processed. The high-temperature sensor can be used to monitor the temperature of the target workpiece during processing, thereby facilitating real-time adjustment of the laser energy by comparing the temperatures monitored by the two temperature sensors 141.

[0062] In the above implementation process, the temperature of the target workpiece is monitored by the temperature sensor 141, so that the energy of the first laser 1221 and the second laser 123 can be adjusted in real time according to the monitored temperature information, so that the energy of the laser used to process the target workpiece is optimal, thereby further improving the process quality of laser processing of the target workpiece.

[0063] Please continue to refer to Figure 1 and Figure 2 In some alternative implementations, the monitoring module 140 may further include an image acquisition unit 142. The image acquisition unit 142 may be mounted on the main frame 121 and may be configured to acquire the light spots of the first laser and the second laser on the carrier.

[0064] The image acquisition unit 142 can specifically be a spot camera to acquire images of the laser spot focused on the target workpiece. Based on the acquired spot image, parameters such as the energy of the first and second lasers can also be adjusted.

[0065] In the above process, the image acquisition device 142 acquires images of the laser spot, and adjusts the laser energy and other parameters according to the acquired spot image, thereby further improving the process quality of laser processing of the target workpiece.

[0066] Please continue to refer to Figure 1 and Figure 2 In some optional implementations, the monitoring module may further include a third adjustment mechanism 143. One connection end of the third adjustment mechanism 143 may be connected to the image acquisition unit 142, and the other connection end of the third adjustment mechanism 143 may be connected to the main frame 121. The third adjustment mechanism 143 may be configured to drive the image acquisition unit 142 to adjust the field of view of the image acquisition unit 142.

[0067] The third adjustment mechanism 143 can be a mechanism capable of one-dimensional, two-dimensional, or three-dimensional adjustment of the spatial position of the image acquisition device 142, and its specific structure can be the same as the first adjustment mechanism 1224 or the second adjustment mechanism 130 mentioned above. The third adjustment mechanism 143 can also be a mechanism capable of adjusting the tilt of the image acquisition device 142 by rotation, and its specific structure can be the same as the second rotation component 132 mentioned above.

[0068] Of course, the third adjustment mechanism 143 can also have both spatial position adjustment and tilt adjustment functions. By adjusting the spatial position and / or tilt of the image acquisition device 142, the field of view of the image acquisition device 142 can be adjusted.

[0069] In the above implementation process, by configuring a third adjustment mechanism 143 for the image acquisition device 142, the field of view of the image acquisition device 142 can be adjusted, thereby improving the flexibility of the image acquisition device 142 in acquiring laser spots.

[0070] Please continue to refer to Figure 1 In some optional embodiments, the support module 110 may include a base 111, a two-dimensional translation component 112, and a support member 113. One end of the two-dimensional translation component 112 may be connected to the base 111, and the other end of the two-dimensional translation component 112 may be connected to the support member 113. The support member 113 may include a support portion and may be used to support the target workpiece. The two-dimensional translation component 112 may be configured to drive the support member 113 to translate in two dimensions within its plane.

[0071] The two-dimensional translation component 112 can have a structure similar to the displacement component or the three-dimensional translation component 131 described above. The two-dimensional translation component 112 drives the carrier 113 and the target workpiece to move in two dimensions, which can be manual or automatic.

[0072] In the above implementation process, by configuring a dimensional translation component for the carrier 113, the position of the target workpiece on the carrier module 110 can be adjusted while carrying the target workpiece, thereby improving the flexibility of the target workpiece position during the processing of the target workpiece, and ultimately further improving the process quality of laser processing of the target workpiece.

[0073] Based on the same concept, this application also provides a production line that may include the laser processing apparatus described above.

[0074] The above implementation process can be the same as that of the laser processing device described above, and will not be repeated here.

[0075] The above description is merely a preferred embodiment of this application and is not intended to limit this application. Various modifications and variations can be made to this application by those skilled in the art. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this application should be included within the protection scope of this application.

Claims

1. A laser processing apparatus characterized by comprising: Includes a load-bearing module and a processing module; The carrier module includes a carrier section; The support portion is configured to support the target workpiece for laser processing; The processing module includes a main frame, a first laser module, and a second laser; The first laser module has a first laser output end, and the first laser module is disposed on the main frame with the first laser output end facing the support part; The second laser has a second laser output end, the second laser is disposed on the main frame and the second laser output end faces the support portion.

2. The laser processing apparatus according to claim 1, characterized by The first laser module includes a first laser, a focusing lens group, a reflector, a first adjustment mechanism, and a centering mechanism; The first laser is connected to the main frame via the centering mechanism, which is configured to adjust the irradiation position of the first laser emitted by the first laser. The focusing lens assembly is connected to the main frame via the first adjustment mechanism, and the reflecting mirror is mounted on the main frame; The laser emission port of the first laser is directed toward the reflector, and the reflector is configured to reflect the first laser emitted by the first laser toward the focusing lens group; The first adjustment mechanism is configured to adjust the focal length of the first laser module; The first laser output end is located on the reflector, and the focusing lens group is configured to focus the first laser onto the support portion based on the adjustment of the first adjustment mechanism.

3. The laser processing apparatus according to claim 2, characterized by The first adjustment mechanism includes a displacement component and a first rotation component; The displacement component is configured to drive the focusing lens group to translate, and the first rotation component is configured to drive the first rotation component to rotate around a first rotation axis; wherein the first rotation axis is not parallel to the optical axis of the focusing lens group.

4. The laser processing apparatus according to claim 1, characterized by The device also includes a second adjustment mechanism; The second laser is connected to the main frame via the second adjustment mechanism; The second adjustment mechanism includes a three-dimensional translation component configured to drive the second laser to translate in three dimensions.

5. The laser processing apparatus according to claim 4, characterized by The second adjustment mechanism further includes a second rotating component; One connection end of the second rotating component is connected to the second laser, and the other connection end of the second rotating component is connected to one connection end of the three-dimensional translation component, and the other connection end of the three-dimensional translation component is connected to the main frame; The second rotating component is configured to drive the second laser to rotate around the second rotation axis to adjust the angle between the second laser emitted by the second laser and the plane where the support part is located; wherein the second rotation axis is not parallel to the second laser and not parallel to the plane where the support part is located.

6. The laser processing apparatus according to claim 1, characterized by The device also includes a monitoring module; The monitoring module includes a temperature sensor; The temperature sensor is mounted on the main frame and configured to acquire the temperature of the target workpiece on the support.

7. The laser processing apparatus according to claim 6, characterized by The monitoring module also includes an image acquisition device; The image acquisition device is mounted on the main frame and configured to acquire the light spots of the first laser and the second laser on the support unit.

8. The laser processing apparatus according to claim 7, characterized by The monitoring module also includes a third adjustment mechanism; One connection end of the third adjustment mechanism is connected to the image acquisition unit, and the other connection end of the third adjustment mechanism is connected to the main frame; The third adjustment mechanism is configured to drive the image acquisition device to move, thereby adjusting the field of view of the image acquisition device.

9. The laser processing apparatus according to any one of claims 1 to 8, characterized by, The support module includes a base, a two-dimensional translation component, and a support element; One connection end of the two-dimensional translation component is connected to the base, and the other connection end of the two-dimensional translation component is connected to the carrier. The carrier includes the carrier portion and is used to carry the target workpiece; The two-dimensional translation component is configured to drive the carrier to translate in two dimensions within its plane.

10. A production line, characterized in that, Includes the laser processing apparatus as described in any one of claims 1 to 8.

Images