Wafer polishing head

Abstract

The utility model discloses a kind of wafer grinding head, it relates to wafer grinding head structure technical field, to solve the installation process of current wafer grinding head cannot be well installed and disassembled, so that wafer grinding head appears wear and tear in the use process, the problem of inconvenient disassembly, its technical scheme main points include grinding mounting seat, the upper end of the grinding mounting seat is provided with a limiting mounting seat, the upper end of the limiting mounting seat is provided with a positioning mounting seat, the inside of the grinding mounting seat is provided with a limiting fixed groove, the inside of the lower end of the limiting mounting seat is provided with a hexagonal positioning groove, the inside of the positioning mounting seat is provided with a mounting groove, the lower of the grinding mounting seat is provided with a grinding device, the upper end of the grinding device is provided with a limiting fixed seat, the inside of the lower end of the grinding device is provided with a longitudinal drainage groove, the periphery of the longitudinal drainage groove is provided with annular drainage groove.

Description

Technical Field

[0001] This utility model relates to the field of wafer grinding head structure technology, and in particular to a wafer grinding head. Background Technology

[0002] Wafer grinding heads are key equipment used for wafer surface treatment in semiconductor manufacturing. They are mainly used to achieve wafer surface planarization through the synergistic effect of mechanical grinding and chemical etching. They have a high-precision grinding effect and can finely grind and polish wafers.

[0003] A search revealed that authorization announcement number CN222986638U discloses a cooling wafer polishing head, comprising a polishing head body, a spindle, a pressure plate, and a polishing pad. One end of the spindle is fixedly connected to the polishing head body, and the other end is connected to an external power source. The pressure plate is located inside the polishing head body, forming an air chamber between the pressure plate and the polishing head body. A pressure diaphragm is provided at the bottom of the pressure plate, and a protective ring is provided at the bottom of the pressure diaphragm. The polishing pad is located below the protective ring, and a receiving cavity for accommodating the wafer is formed between the pressure diaphragm, the protective ring, and the polishing pad. A thickened layer is provided at the edge of the pressure diaphragm where the wafer is adsorbed. An installation groove is provided inside the polishing pad, and a cooling plate is provided in the installation groove. The cooling plate has an inlet water pipe and an outlet water pipe. This utility model uses the above-mentioned cooling wafer polishing head to reduce the overall temperature of the polishing head by incorporating a cooling water channel in the polishing pad, thereby achieving efficient cooling of the wafer on one side of the polishing head.

[0004] However, existing wafer grinding heads cannot be easily installed and disassembled during the installation process. This makes it inconvenient to disassemble the wafer grinding head when it wears out during use. Therefore, there is an urgent need in the market for a wafer grinding head that can solve these problems. Utility Model Content

[0005] The purpose of this utility model is to provide a wafer grinding head to solve the problem mentioned in the background art that the existing wafer grinding head cannot be easily installed and disassembled during the installation process, making it inconvenient to disassemble when the wafer grinding head is worn during use.

[0006] To achieve the above objectives, the present invention provides the following technical solution:

[0007] A wafer grinding head includes a grinding mounting base. A limiting mounting base is provided at the upper end of the grinding mounting base, and a positioning mounting base is provided at the upper end of the limiting mounting base. A limiting fixing groove is provided inside the grinding mounting base, and a fixing screw hole is provided inside the upper end of the limiting fixing groove. A hexagonal positioning groove is provided inside the lower end of the limiting mounting base, and a mounting groove is provided inside the positioning mounting base. A grinding device is mounted below the grinding mounting base. A limiting fixing base is provided at the upper end of the grinding device, and a hexagonal positioning base is provided at the upper end of the limiting fixing base. A longitudinal drainage groove is provided inside the lower end of the grinding device, and an annular drainage groove is provided around the longitudinal drainage groove.

[0008] By adopting the above technical solution, the wafer grinding head can be easily installed, making it easy to disassemble and replace when the wafer grinding head is damaged.

[0009] Furthermore, the grinding mounting base and the limiting mounting base are integral structures, and the limiting mounting base and the positioning mounting base are integral structures.

[0010] By adopting the above technical solutions, the structure between the grinding mounting base and the limiting mounting base can be made more robust, and the structure between the limiting mounting base and the positioning mounting base can be made more robust.

[0011] Furthermore, ten fixing screw holes are provided, and the ten fixing screw holes are symmetrical about the vertical center line of the grinding mounting base.

[0012] By adopting the above technical solution, it is possible to conveniently install and fix the grinding mounting base and the grinding device.

[0013] Furthermore, the grinding device and the limiting and fixing seat are an integral structure, the limiting and fixing seat and the hexagonal positioning seat are an integral structure, the hexagonal positioning seat is correspondingly arranged with the hexagonal positioning groove, and the hexagonal positioning seat is located inside the hexagonal positioning groove.

[0014] By adopting the above technical solution, the structure between the grinding device and the limiting and fixing seat can be made more robust, and the structure between the limiting and fixing seat and the hexagonal positioning seat can be made more robust. This setting can prevent relative shaking between the grinding mounting seat and the grinding device during grinding, thereby affecting the grinding effect.

[0015] Furthermore, several longitudinal drainage channels are provided, and these channels are sequentially distributed inside the lower end of the grinding device.

[0016] By adopting the above technical solution, this arrangement allows coolant to easily enter between the grinding device and the wafer, thereby enabling cooling.

[0017] Furthermore, the limiting fixing seat is provided with a second fixing screw hole, and there are ten fixing screw holes. The second fixing screw hole is provided in correspondence with the first fixing screw hole. The limiting fixing seat is located inside the limiting fixing groove.

[0018] By adopting the above technical solution, it is possible to conveniently install and fix the grinding mounting base and the grinding device.

[0019] Furthermore, the grinding mounting base and the limiting fixing base are fixedly connected by hexagonal screws, with one end of the hexagonal screw passing through fixing screw hole one and extending into fixing screw hole two.

[0020] By adopting the above technical solution, the grinding mounting base and the grinding device can be easily installed and fixed.

[0021] Compared with the prior art, the beneficial effects of this utility model are:

[0022] (1) This utility model installs the limiting fixing seat of the grinding device into the limiting fixing groove of the grinding mounting seat. At this time, the hexagonal positioning seat is located inside the hexagonal positioning groove. Then, the grinding mounting seat and the grinding device are installed and fixed by hexagonal screws. This way, when the grinding device grinds the wafer, there will be no relative rotation between the grinding device and the grinding mounting seat, which will make the hexagonal screws easy to shake and fall off. This will make the grinding device and the grinding mounting seat easy to fall off, thus affecting the grinding effect on the wafer.

[0023] (2) When polishing, coolant needs to be sprayed to cool the wafer. The longitudinal drainage groove can allow the coolant to enter or exit from the longitudinal drainage groove, thereby effectively dissipating heat and avoiding excessive temperature between the wafer and the polishing head during polishing, which would affect the polishing effect and easily damage the wafer and polishing head. Attached Figure Description

[0024] Figure 1 This is a perspective view of the entire utility model;

[0025] Figure 2 This is an overall bottom view of the present invention;

[0026] Figure 3 This is an overall exploded view of the present invention;

[0027] Figure 4 For the present utility model Figure 1 A magnified view of a portion of area A.

[0028] In the diagram: 1. Grinding mounting base; 101. Limiting and fixing groove; 102. Fixing screw hole one; 2. Limiting mounting base; 201. Hexagonal positioning groove; 3. Positioning mounting base; 301. Mounting groove; 4. Grinding device; 401. Longitudinal drainage groove; 402. Annular drainage groove; 5. Limiting and fixing base; 501. Fixing screw hole two; 6. Hexagonal positioning base; 7. Hexagonal screw. Detailed Implementation

[0029] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present utility model. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments.

[0030] Please see Figures 1-4 This utility model provides an embodiment of a wafer grinding head, including a grinding mounting base 1, a limiting mounting base 2 at the upper end of the grinding mounting base 1, and a positioning mounting base 3 at the upper end of the limiting mounting base 2. The grinding mounting base 1 and the limiting mounting base 2 are integral structures, as are the limiting mounting base 2 and the positioning mounting base 3. The grinding mounting base 1 has a limiting fixing groove 101 inside, and ten fixing screw holes 102 are provided inside the upper end of the limiting fixing groove 101. These ten fixing screw holes 102 are symmetrical about the vertical center line of the grinding mounting base 1. The limiting mounting base 2 has a hexagonal positioning groove 201 inside the lower end, and the positioning mounting base 3 has a mounting groove 301 inside. A grinding device 4 is mounted below the grinding mounting base 1, and a limiting fixing base 5 is provided at the upper end of the grinding device 4. The upper end of the limiting and fixing seat 5 is provided with a hexagonal positioning seat 6. The lower end of the grinding device 4 is provided with a longitudinal drainage groove 401. The longitudinal drainage groove 401 is surrounded by an annular drainage groove 402. Several longitudinal drainage grooves 401 are provided. Several longitudinal drainage grooves 401 are distributed sequentially inside the lower end of the grinding device 4. The mounting groove 301 provided by the positioning mounting seat 3 allows the rotating shaft to be installed. The longitudinal drainage grooves 401 and annular drainage grooves 402 allow water during the grinding process to be discharged through the longitudinal drainage grooves 401 and annular drainage grooves 402, and at the same time, heat dissipation is well achieved. This can effectively protect the wafer. It should be noted that, in order to save space and highlight the innovative elements of this patent, such as the specific working principle and working process of the wafer grinding head, it will not be described in detail in this patent.

[0031] See Figures 1-4The grinding device 4 and the limiting fixing seat 5 are integrated structures. The limiting fixing seat 5 and the hexagonal positioning seat 6 are integrated structures. The hexagonal positioning seat 6 is correspondingly set with the hexagonal positioning groove 201. The hexagonal positioning seat 6 is located inside the hexagonal positioning groove 201. The limiting fixing seat 5 is provided with ten fixing screw holes 501. The fixing screw holes 501 are correspondingly set with the fixing screw holes 102. The limiting fixing seat 5 is located inside the limiting fixing groove 101. The grinding mounting seat 1 and the limiting fixing seat 5 are connected by a... The hexagonal screw 7 is used for fixed connection. One end of the hexagonal screw 7 passes through the fixing screw hole 102 and extends into the fixing screw hole 501. The hexagonal positioning seat 6 and the hexagonal positioning groove 201 are correspondingly provided, so that the hexagonal positioning seat 6 can be installed into the hexagonal positioning groove 201. This can position the grinding device 4 and prevent the grinding device 4 from rotating relative to the grinding mounting seat 1 during grinding, which would affect the grinding effect. The hexagonal screw 7 can be used to easily install and fix the grinding mounting seat 1 and the grinding device 4.

[0032] Working principle: During use, the limiting fixing seat 5 of the grinding device 4 is installed into the limiting fixing groove 101 of the grinding mounting seat 1. At this time, the hexagonal positioning seat 6 is located inside the hexagonal positioning groove 201. Then, the grinding mounting seat 1 and the grinding device 4 are installed and fixed by the hexagonal screws 7. This prevents relative rotation between the grinding device 4 and the grinding mounting seat 1 when the grinding device 4 grinds the wafer, thus preventing the hexagonal screws 7 from easily shaking and falling off. This could cause the grinding device 4 and the grinding mounting seat 1 to fall off, thus affecting the grinding effect of the wafer. During grinding, coolant needs to be sprayed to cool the wafer. The longitudinal drainage groove 401 allows the coolant to enter or exit, thus effectively dissipating heat and preventing the temperature between the wafer and the grinding head from becoming too high during the grinding process, which would affect the grinding effect and easily damage the wafer and the grinding head.

[0033] It will be apparent to those skilled in the art that this invention is not limited to the details of the exemplary embodiments described above, and that it can be implemented in other specific forms without departing from the spirit or essential characteristics of this invention. Therefore, the embodiments should be considered illustrative and non-limiting in all respects, and the scope of this invention is defined by the appended claims rather than the foregoing description. Thus, it is intended that all variations falling within the meaning and scope of equivalents of the claims be included within this invention. No reference numerals in the claims should be construed as limiting the scope of the claims.

Claims

1. A wafer polishing head comprising a polishing mount (1), characterized in that: The upper end of the grinding mounting base (1) is provided with a limiting mounting base (2), the upper end of the limiting mounting base (2) is provided with a positioning mounting base (3), the interior of the grinding mounting base (1) is provided with a limiting fixing groove (101), the interior of the upper end of the limiting fixing groove (101) is provided with a fixing screw hole (102), the interior of the lower end of the limiting mounting base (2) is provided with a hexagonal positioning groove (201), the interior of the positioning mounting base (3) is provided with a mounting groove (301), the grinding device (4) is installed below the grinding mounting base (1), the upper end of the grinding device (4) is provided with a limiting fixing base (5), the upper end of the limiting fixing base (5) is provided with a hexagonal positioning base (6), the interior of the lower end of the grinding device (4) is provided with a longitudinal drainage groove (401), and the periphery of the longitudinal drainage groove (401) is provided with an annular drainage groove (402).

2. The wafer polishing head of claim 1, wherein: The grinding mounting base (1) and the limiting mounting base (2) are an integral structure, and the limiting mounting base (2) and the positioning mounting base (3) are an integral structure.

3. The wafer polishing head of claim 2, wherein: The first fixing screw hole (102) is provided in ten places, and the ten first fixing screw holes (102) are symmetrical about the vertical center line of the grinding mounting base (1).

4. The wafer polishing head of claim 3, wherein: The grinding device (4) and the limiting fixing seat (5) are an integral structure. The limiting fixing seat (5) and the hexagonal positioning seat (6) are an integral structure. The hexagonal positioning seat (6) is correspondingly set with the hexagonal positioning groove (201). The hexagonal positioning seat (6) is located inside the hexagonal positioning groove (201).

5. The wafer polishing head of claim 4, wherein: The longitudinal drainage grooves (401) are provided in several ways, and the longitudinal drainage grooves (401) are distributed sequentially inside the lower end of the grinding device (4).

6. The wafer polishing head of claim 5, wherein: The limiting fixing seat (5) is provided with a second fixing screw hole (501) inside. There are ten second fixing screw holes (501). The second fixing screw hole (501) is provided in correspondence with the first fixing screw hole (102). The limiting fixing seat (5) is located inside the limiting fixing groove (101).

7. The wafer polishing head of claim 6, wherein: The grinding mounting base (1) and the limiting fixing base (5) are fixedly connected by a hexagonal screw (7), one end of which passes through the fixing screw hole one (102) and extends into the interior of the fixing screw hole two (501).

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