An outer glue-filling type ring glue-filling mold
By designing a ring potting mold suitable for external potting structures, the problem that existing molds cannot adapt to the production of smart rings with external potting structures has been solved, realizing large-scale production and efficient potting molding, and improving product quality and production efficiency.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- LIANGANG OPTOELECTRONIC TECH CO LTD
- Filing Date
- 2025-08-13
- Publication Date
- 2026-08-04
AI Technical Summary
Existing ring potting molds cannot meet the production requirements of smart rings with external potting structures, making it impossible to achieve mass production.
An externally potting ring potting mold was designed, including a lower mold assembly, a ring shell profile part, and an upper mold assembly. Through mold closing, sealing, and glue injection molding, a potting outer ring is formed, which can meet the production needs of electronic devices being mounted on the outer wall of the ring-shaped shell.
This has enabled the large-scale production of smart rings with external glue filling structure, improving production efficiency and product quality, ensuring the integrity and sealing of the glue filling, and reducing production costs and mold changeover time.
Smart Images

Figure CN224588451U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of mold manufacturing technology, and in particular to an external glue-filling ring glue-filling mold. Background Technology
[0002] As a wearable smart device, a smart ring typically comprises a ring-shaped shell, electronic components (such as FPC flexible circuit boards, batteries, and various sensors) mounted on the shell, and a sealing potting compound for fixing and protecting these components. Traditional manufacturing processes commonly employ an internal potting structure. Specifically, the electronic components are mounted on the inner wall surface of the ring-shaped shell, and an inner potting ring is directly injection molded onto its inner wall using an in-mold injection molding process. This inner potting ring completely encapsulates and fixes the electronic components to the inside of the ring-shaped shell, ensuring structural stability, waterproofing, dustproofing, and electrical insulation. Existing ring potting molds are all designed specifically to achieve this internal potting structure. The core structure of the mold revolves around the process of injecting adhesive into the inner cavity of the ring-shaped shell and forming the inner potting ring.
[0003] However, market demands for the functionality and form of smart rings are becoming increasingly diverse. To accommodate specific electronic component layouts (such as facilitating external signal reception or special sensor arrangement) or to achieve unique wearing effects, a new type of smart ring with an externally potted structure has emerged. Its structural feature is that the electronic components are mounted on the outer surface of a ring-shaped shell, and an outer ring completely encapsulating the electronic components is formed on the outer wall of the ring-shaped shell through in-mold injection molding. This externally potted structure changes the direction of the adhesive injection and the spatial position of the molding process, shifting it from the inner side of the shell to the outer surface. Existing ring potting mold structures, including adhesive flow channel design, cavity sealing methods, demolding mechanisms, and parting surface settings, are all optimized and fixed for the process requirements of internal potting and cannot adapt to the production needs of smart rings with an externally potted structure.
[0004] Therefore, it is necessary to develop a glue-filling mold to meet the production requirements of smart rings with external glue-filling structures, thereby realizing the large-scale production of smart rings with external glue-filling structures.
[0005] The information disclosed in this background section is included only to enhance the understanding of the context of this disclosure, and therefore may contain information that does not constitute prior art known to those skilled in the art. Utility Model Content
[0006] One objective of this invention is to provide an externally glued ring potting mold that can meet the production requirements of externally glued smart rings, thereby enabling the large-scale production of externally glued smart rings.
[0007] To achieve the above objectives, this utility model provides an externally glued ring potting mold, comprising:
[0008] The lower mold assembly encloses and forms an upward-facing receiving cavity;
[0009] A ring-shaped shell profiler is detachably installed in the accommodating cavity and is used to insert into the ring-shaped shell to fix the ring-shaped shell.
[0010] An upper mold assembly is openable and closable above the lower mold assembly to cover the upper opening of the accommodating cavity and cooperate with the lower mold assembly to form a glue inlet channel communicating with the cavity wall of the accommodating cavity.
[0011] Optionally, the lower mold assembly includes:
[0012] The lower mold body encloses and forms the receiving cavity, which is open at both the top and bottom.
[0013] The lower sealing component includes a sealing plate detachably connected to the lower mold body to cover the lower opening of the accommodating cavity, and a contour positioning post that protrudes upward from the center of the sealing plate and penetrates into the annular shell contour component.
[0014] Optionally, the sealing plate and the lower mold body are locked together by sealing plate bolts.
[0015] Optionally, the positioning post of the contoured part and the contoured part of the ring shell are connected by an interference fit.
[0016] Optionally, the upper mold assembly includes:
[0017] The upper mold body has a receiving groove located directly above the receiving cavity;
[0018] The sealing silicone is located in the receiving groove and is used to press down on the top surface of the ring shell profile to cooperate with the outer wall of the ring shell profile and the cavity wall of the receiving cavity to form a molding space for the glue-filled outer ring.
[0019] Optionally, the top of the upper mold body is provided with a through hole, and the upper mold assembly further includes:
[0020] A vertical pressure bar passes through the through-hole and abuts against the top of the sealing silicone. When driven, it presses the sealing silicone downward to seal the molding space.
[0021] Optionally, an exhaust channel communicating with the receiving cavity is further provided between the upper mold assembly and the lower mold assembly.
[0022] Optionally, the connection positions of the exhaust channel and the receiving cavity, and the connection positions of the glue inlet channel and the receiving cavity, are symmetrically arranged about the axis of the receiving cavity.
[0023] Optionally, the length of the glue inlet channel is less than the length of the exhaust channel.
[0024] The beneficial effects of this utility model are as follows: It provides an externally potting ring potting mold, and the working process is as follows:
[0025] S10: Annular shell fixing:
[0026] Place the annular shell (with electronic components already mounted on its outer wall) onto the annular shell profile (which resembles a cylindrical mandrel) to be coated with adhesive.
[0027] The ring-shaped housing part, which has been fitted with the ring shell, is installed upside down into the receiving cavity of the lower mold assembly.
[0028] Note: The outer wall of the ring-shaped part is tightly fitted to the inner wall of the ring-shaped shell to ensure that the shell does not shift during subsequent glue application and that the glue does not enter between the outer wall of the ring-shaped part and the inner wall of the ring-shaped shell.
[0029] S20: Mold closing seal:
[0030] The upper mold assembly moves downwards and presses against the top of the lower mold assembly, closing the upper opening of the accommodating cavity.
[0031] at this time:
[0032] The upper mold assembly and the lower mold assembly together form a closed cavity. The annular shell and its outer wall electronic components are located in the middle of the cavity (the space between the outer wall of the annular shell and the cavity wall of the accommodating cavity is the subsequent potting space, that is, the molding space of the potting outer ring).
[0033] The upper mold assembly and the lower mold assembly form a glue inlet channel at their parting surfaces, which connects to the cavity wall of the receiving cavity for subsequent glue injection.
[0034] S30: Potting molding:
[0035] High-pressure adhesive is injected into the cavity through the injection system connected to the mold, from the injection channel (located on the parting surface of the upper / lower mold or an independent flow channel), filling the molding space of the outer ring of the injection.
[0036] S40: Pressure holding and curing:
[0037] After the adhesive fills the cavity, maintain the injection pressure for a period of time (holding pressure) to ensure that the adhesive is dense and free of air bubbles.
[0038] After the adhesive material cures and is molded, it forms an outer ring, thus obtaining a smart ring with an externally potted structure.
[0039] S50: Mold opening and demolding:
[0040] The upper mold assembly moves upward and opens first, exposing the top of the ring shell profile.
[0041] Remove the smart ring with the external glue structure by tilting it upwards;
[0042] It should be noted that since the ring shell profile and the lower mold assembly are detachably connected, the ring shell profile along with the cured external glue structure smart ring can also be removed as a whole; then the ring shell can be axially pulled out from the ring shell profile.
[0043] Therefore, the external glue-filling ring potting mold provided by this utility model can meet the production needs of smart rings with external glue-filling structures, thereby realizing the large-scale production of smart rings with external glue-filling structures. Attached Figure Description
[0044] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.
[0045] Figure 1 This is a cross-sectional schematic diagram of the external glue-filling ring mold provided in the embodiment.
[0046] Figure 2 A schematic diagram of the bottom surface of the externally potting ring potting mold provided in the embodiment;
[0047] Figure 3 This is a top view of the lower mold assembly provided in the embodiment.
[0048] In the picture:
[0049] 1. Lower mold assembly; 101. Lower mold body; 1011. Receiving cavity; 1011a. Molding space; 102. Lower sealing component; 1021. Sealing plate; 1022. Profiling part positioning post;
[0050] 2. Ring-shaped conforming part;
[0051] 3. Upper mold assembly; 301. Upper mold body; 3011. Through hole; 302. Sealing silicone; 303. Vertical pressure rod;
[0052] 4. Glue inlet channel;
[0053] 5. Exhaust passage. Detailed Implementation
[0054] In this utility model, the reference to "embodiment" means that a specific feature, structure, or characteristic described in connection with an embodiment can be included in at least one embodiment of this utility model. The term "embodiment" appearing in various places throughout the specification does not necessarily refer to the same embodiment, nor does it specifically limit its independence or connection with other embodiments. In principle, in this utility model, as long as there are no technical contradictions or conflicts, the technical features mentioned in each embodiment can be combined in any way to form corresponding implementable technical solutions.
[0055] Unless otherwise defined, the technical terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention pertains; the use of related terms herein is merely for the purpose of describing particular embodiments and is not intended to limit the invention.
[0056] In the description of this utility model, the term "and / or" is used to describe the logical relationship between objects, indicating that three relationships can exist. For example, A and / or B means: A exists, B exists, and A and B exist simultaneously. Additionally, the character " / " generally indicates that the preceding and following objects have an "or" logical relationship.
[0057] In this invention, terms such as "first" and "second" are used only to distinguish one entity or operation from another, and do not necessarily require or imply any actual quantity, hierarchy, or order between these entities or operations.
[0058] Without further limitations, the use of terms such as “comprising,” “including,” “having,” or other similar expressions in this invention is intended to cover non-exclusive inclusion, which does not exclude the presence of additional elements in a process, method, or product that includes the stated elements, such that a process, method, or product that includes a series of elements may include not only those defined elements but also other elements not expressly listed, or elements inherent to such a process, method, or product.
[0059] In this utility model, expressions such as "greater than", "less than", and "exceeding" are understood to exclude the stated number; expressions such as "above", "below", and "within" are understood to include the stated number. Furthermore, in the description of the embodiments of this utility model, "multiple" means two or more (including two), and similar expressions related to "multiple" are also understood in this way, such as "multiple groups" and "multiple times", unless otherwise explicitly specified.
[0060] In the description of the embodiments of this utility model, the space-related expressions used, such as "center," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "vertical," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," "axial," "radial," and "circumferential," indicate the orientation or positional relationship based on the orientation or positional relationship shown in the specific embodiments or drawings. They are only for the convenience of describing the specific embodiments of this utility model or for the reader's understanding, and do not indicate or imply that the device or component referred to must have a specific position, a specific orientation, or be constructed or operated in a specific orientation. Therefore, they should not be construed as limitations on the embodiments of this utility model.
[0061] Unless otherwise expressly specified or limited, the terms "installation," "connection," "linking," "fixing," and "setting," as used in the description of the embodiments of this utility model, should be interpreted broadly. For example, "connection" can be a fixed connection, a detachable connection, or an integral setting; it can be a mechanical connection, an electrical connection, or a communication connection; it can be a direct connection or an indirect connection through an intermediate medium; it can be the internal connection of two components or the interaction between two components. For those skilled in the art to which this utility model pertains, the specific meaning of the above terms in the embodiments of this utility model can be understood according to the specific circumstances.
[0062] The direct drive mechanism in this invention can be a linear motor, a cylinder, a hydraulic cylinder, or a motor lead screw and slider assembly, etc.; the rotary drive mechanism can be a servo motor, a stepper motor, or a rotary cylinder, etc.
[0063] See Figures 1-3 This embodiment provides an externally potting ring potting mold, comprising:
[0064] Lower mold assembly 1, which encloses and forms an upward-facing receiving cavity 1011;
[0065] An annular shell profiler 2 is detachably installed in the accommodating cavity 1011 and is used to be inserted into the annular shell to fix the annular shell.
[0066] The upper mold assembly 3 is openable and closable above the lower mold assembly 1 to cover the upper opening of the accommodating cavity 1011 and cooperate with the lower mold assembly 1 to form a glue inlet channel 4 that connects to the cavity wall of the accommodating cavity 1011.
[0067] The external glue-filling ring potting mold provided by this utility model works as follows:
[0068] S10: Annular shell fixing:
[0069] Place the annular shell (with electronic components already attached to its outer wall) to be coated with adhesive onto the annular shell profile 2 (which is similar in shape to a columnar mandrel).
[0070] The annular shell profile 2, which is fitted with the annular shell, is installed upside down in the receiving cavity 1011 of the lower mold assembly 1.
[0071] Note: The outer wall of the ring shell profile 2 is tightly fitted to the inner wall of the ring shell to ensure that the shell does not shift during subsequent glue application and that the glue does not enter between the outer wall of the ring shell profile 2 and the inner wall of the ring shell.
[0072] S20: Mold closing seal:
[0073] The upper mold assembly 3 is pressed down to the top of the lower mold assembly 1, closing the upper opening of the accommodating cavity 1011.
[0074] at this time:
[0075] The upper mold assembly 3 and the lower mold assembly 1 together form a closed cavity. The annular shell and its outer wall electronic components are located in the middle of the cavity (the space between the outer wall of the annular shell and the cavity wall of the accommodating cavity 1011 is the subsequent potting space, that is, the molding space 1011a of the potting outer ring).
[0076] At the parting surface of the upper mold assembly 3 and the lower mold assembly 1, a glue inlet channel 4 is formed, which connects to the cavity wall of the accommodating cavity 1011 for subsequent glue injection.
[0077] S30: Potting molding:
[0078] High-pressure adhesive is injected into the cavity through the injection system connected to the mold, from the injection channel 4 (located on the parting surface of the upper / lower mold or an independent flow channel), filling the molding space 1011a of the outer ring of the injection ring.
[0079] S40: Pressure holding and curing:
[0080] After the adhesive fills the cavity, maintain the injection pressure for a period of time (holding pressure) to ensure that the adhesive is dense and free of air bubbles.
[0081] After the adhesive material cures and is molded, it forms an outer ring, thus obtaining a smart ring with an externally potted structure.
[0082] S50: Mold opening and demolding:
[0083] The upper mold assembly 3 moves upward and opens first, exposing the top of the ring shell profile 2.
[0084] Remove the smart ring with the external glue structure by tilting it upwards;
[0085] It should be noted that since the ring shell profile 2 and the lower mold assembly 1 are detachably connected, the ring shell profile 2 along with the cured external glue structure smart ring can also be removed as a whole; then the ring shell is axially pulled out from the ring shell profile 2.
[0086] Therefore, the external glue-filling ring potting mold provided by this utility model can meet the production needs of smart rings with external glue-filling structures, thereby realizing the large-scale production of smart rings with external glue-filling structures.
[0087] In this embodiment, the lower mold assembly 1 includes:
[0088] The lower mold body 101 encloses and forms the receiving cavity 1011, which has an open structure at both the top and bottom.
[0089] The lower sealing member 102 includes a sealing plate 1021 that is detachably connected to the lower mold body 101 to cover the lower opening of the accommodating cavity 1011, and a contour positioning post 1022 that protrudes upward from the center of the sealing plate 1021 and enters the annular shell contour member 2.
[0090] When replacing the annular shell with a different inner diameter, the corresponding outer diameter annular shell profile 2 can be replaced; when replacing the annular shell profile 2 with a different inner diameter, a different lower sealing part 102 needs to be replaced.
[0091] The detachable lower sealing component 102 structure allows users to easily replace the different sizes of the contouring positioning post 1022 and sealing plate 1021 to accommodate annular shells with different inner diameters (such as smart ring shells). This not only reduces mold changeover time but also achieves "one machine for multiple uses," lowering production costs. Simultaneously, the contouring positioning post 1022 protrudes upwards and inserts into the annular shell contouring component 2, ensuring the annular shell remains precisely fixed during the glue-filling process. This prevents glue leakage or product scrap due to shell displacement, improving production yield and scalability.
[0092] Optionally, the sealing plate 1021 is locked to the lower mold body 101 by sealing plate bolts. Bolt locking provides a simple and reliable sealing and connection mechanism. Bolt fixing facilitates quick disassembly and assembly, making the replacement process of the sealing plate 1021 efficient and convenient (e.g., replacing lower sealing parts 102 of different sizes to match the annular shell). Simultaneously, it ensures a tight seal at the lower opening of the receiving cavity 1011, preventing glue leakage under high-pressure glue-filling conditions, maintaining the cavity's sealing performance, and thus avoiding the generation of defective products. This facilitates daily mold maintenance and rapid debugging, improving the overall operating efficiency of the production line.
[0093] Optionally, the contouring positioning post 1022 and the ring shell contouring part 2 are connected by an interference fit. The interference fit design creates a strong mechanical connection between the contouring positioning post 1022 and the ring shell contouring part 2, ensuring that the ring shell contouring part 2 does not loosen or shift during the glue-filling process. This directly solves the problem of potential wobbling of the annular shell during operation, preventing glue from seeping between the annular shell and the contouring part, thereby preventing product defects (such as uneven glue distribution or shell deformation). Furthermore, the interference fit simplifies the assembly process, improves positioning accuracy, enhances the reliability and reusability of the mold, and improves the quality of the final glue-filled ring.
[0094] In this embodiment, the upper mold component 3 includes:
[0095] The upper mold body 301 has a receiving groove located directly above the receiving cavity 1011;
[0096] The sealing silicone 302 is located in the receiving groove and is used to press down on the top surface of the ring shell profile 2 so as to cooperate with the outer wall of the ring shell profile 2 and the cavity wall of the receiving cavity 1011 to form the molding space 1011a of the glue-filled outer ring.
[0097] Furthermore, the top of the upper mold body 301 is provided with a rod hole 3011, and the upper mold assembly 3 also includes a vertical pressure rod 303. The vertical pressure rod 303 passes through the rod hole 3011 and abuts against the top of the sealing silicone 302. After being driven, it presses the sealing silicone 302 downward to seal the molding space 1011a.
[0098] The vertical pressure rod 303 is driven downwards by a direct-drive mechanism such as a cylinder, which presses the sealing silicone 302 downwards. The design of the vertical pressure rod 303 provides a precise and controllable pressure application mechanism, optimizing the sealing effect. After passing through the rod hole 3011, the vertical pressure rod 303 acts directly on the sealing silicone 302, allowing operators or automated equipment to easily adjust the downward pressure, ensuring that the silicone is evenly pressed against the top surface of the ring shell profile 2, preventing air or glue leakage in the injection space. This simplifies the mold closing process, supports continuous production and high-efficiency operation (such as semi-automatic control when combined with a glue injection system), while reducing human error and improving the stability and consistency of the glue injection molding process.
[0099] The use of sealing silicone 302 significantly improves the sealing and cushioning performance of the mold. The flexibility of the silicone material allows it to self-adaptively conform when pressed downwards against the top surface of the ring shell profile 2, effectively sealing the molding space 1011a of the outer ring and preventing material leakage upwards or air ingress. This ensures the cavity's airtightness, creating a stable potting environment and eliminating problems such as air bubbles or insufficient potting due to poor sealing. Simultaneously, the elastic cushioning of the silicone reduces the risk of mechanical damage to the ring shell and its electronic components, protecting sensitive components and making it suitable for high-precision potting requirements.
[0100] Furthermore, when it is necessary to produce smart rings of different specifications, as long as the outer diameter of the smart ring remains unchanged, only different ring shell profile parts 2 and sealing silicone 302 need to be replaced, and all other parts can be reused.
[0101] In this embodiment, an exhaust channel 5 communicating with the receiving cavity 1011 is also provided between the upper mold assembly 3 and the lower mold assembly 1. The design of the exhaust channel 5 effectively solves the problem of air retention during the potting process and improves the density of the adhesive. It allows air in the cavity to be smoothly discharged during high-pressure adhesive injection, preventing bubble formation and ensuring that the adhesive completely fills the molding space 1011a. This significantly reduces product defects (such as pores or internal cavities) and improves the structural integrity and appearance quality of the outer ring of the potting process. At the same time, the exhaust channel 5 enhances the safety performance of the mold, avoids mold damage or difficulty in mold opening caused by air pressure accumulation, and supports an efficient pressure holding and curing process.
[0102] Furthermore, the connection positions of the venting channel 5 and the receiving cavity 1011, as well as the connection positions of the glue inlet channel 4 and the receiving cavity 1011, are symmetrically arranged about the axis of the receiving cavity 1011. This symmetrical design optimizes the flow of the glue and the dynamics of venting, achieving uniformity in the glue-filling process. Through this symmetrical layout, the glue can diffuse evenly when injected from the glue inlet channel 4, while air is smoothly discharged from the venting channel 5, reducing the risk of localized air stagnation or uneven filling, thereby avoiding product warping or uneven density. This is particularly suitable for glue-filling ring-shaped structures, ensuring the circumferential consistency of the outer ring and improving the mechanical properties and aesthetics of the product. Simultaneously, the symmetrical layout simplifies mold manufacturing and maintenance, reducing the requirements for operational precision.
[0103] In this embodiment, the length of the glue inlet channel 4 is shorter than the length of the venting channel 5. This difference in channel length improves glue filling efficiency and quality control. The shorter glue inlet channel 4 allows the glue to be injected into the cavity quickly, reducing filling time and improving production efficiency; at the same time, the longer venting channel 5 provides a more sufficient path for air to escape, ensuring more thorough gas removal and avoiding residual air bubbles. This synergistically optimizes glue filling dynamics, especially under high-pressure glue filling conditions, reducing glue waste and defect rate, and achieving a dense, defect-free glued outer ring. This design is particularly suitable for the production scenarios of high-precision, high-volume smart rings.
[0104] Finally, it should be noted that although the above embodiments have been described in the text and drawings of this application, this should not limit the scope of patent protection of this application. Any technical solutions that are based on the essential concept of this application and utilize the content described in the text and drawings of this application, resulting in equivalent structural or procedural substitutions or modifications, as well as the direct or indirect application of the technical solutions of the above embodiments to other related technical fields, are all included within the scope of patent protection of this application.
Claims
1. An overmolded ring overmold mold, comprising: include: The lower mold assembly (1) surrounds and forms an upward-facing receiving cavity (1011). The annular shell profile (2) is detachably installed in the accommodating cavity (1011) and is used to insert into the annular shell to fix the annular shell. The upper mold assembly (3) is openable and closed above the lower mold assembly (1) to cover the upper opening of the accommodating cavity (1011) and cooperate with the lower mold assembly (1) to form a glue inlet channel (4) that connects to the cavity wall of the accommodating cavity (1011).
2. The outer dip-injection ring dip-injection mold according to claim 1, wherein, The lower mold assembly (1) includes: The lower mold body (101) surrounds and forms the receiving cavity (1011) with openings at both the top and bottom. The lower sealing member (102) includes a sealing plate (1021) detachably connected to the lower mold body (101) to cover the lower opening of the accommodating cavity (1011), and a contour positioning post (1022) that protrudes upward from the center of the sealing plate (1021) and enters the annular shell contour member (2).
3. The outer dip-injection ring dip-injection mold according to claim 2, wherein, The sealing plate (1021) and the lower mold body (101) are locked together by sealing plate bolts.
4. The outer dip-injection ring dip-injection mold according to claim 2, wherein, The positioning post (1022) of the contoured part and the contoured part (2) of the ring shell are connected by an interference fit.
5. The outer dip-injection ring dip-injection mold according to claim 1, wherein, The upper mold assembly (3) includes: The upper mold body (301) has a receiving groove located directly above the receiving cavity (1011); The sealing silicone (302) is located in the receiving groove and is used to press down on the top surface of the ring shell profile (2) so as to cooperate with the outer wall of the ring shell profile (2) and the cavity wall of the receiving cavity (1011) to form a molding space (1011a) for the glue-filled outer ring.
6. The outer dip-injection ring dip-injection mold according to claim 5, wherein, The top of the upper mold body (301) is provided with a rod hole (3011), and the upper mold assembly (3) further includes: A vertical pressure bar (303) passes through the through-rod hole (3011) and abuts against the top of the sealing silicone (302). When driven, it presses the sealing silicone (302) downward to seal the molding space (1011a).
7. The outer dip-injection ring dip-injection mold according to claim 1, wherein, An exhaust channel (5) is provided between the upper mold assembly (3) and the lower mold assembly (1) and is connected to the receiving cavity (1011).
8. The outer dip-injection ring dip-injection mold according to claim 7, wherein, The connection positions of the exhaust channel (5) and the accommodating cavity (1011), and the connection positions of the glue inlet channel (4) and the accommodating cavity (1011), are symmetrically arranged about the axis of the accommodating cavity (1011).
9. The outer dip-injection ring dip-injection mold according to claim 8, wherein, The length of the glue inlet channel (4) is less than the length of the exhaust channel (5).