Crucible and evaporation apparatus
By setting a small-diameter resistance wire around the outer periphery of the crucible and a hollow protruding heating device at the bottom, the problem of clogging caused by low temperature at the crucible opening was solved, thus achieving uniform heating and coating stability in the vapor deposition equipment and improving production efficiency.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- AUNER TECHNOLOGY CO LTD
- Filing Date
- 2025-09-08
- Publication Date
- 2026-08-04
AI Technical Summary
In existing vapor deposition equipment, the temperature at the top opening of the crucible is lower than that at the bottom and center, leading to clogging and affecting the stability and uniformity of the coating, especially in large-scale mass production vapor deposition machines.
Design a crucible with a first resistance wire on the outer periphery, the diameter of which is smaller than that in the middle, and a heating device inside a hollow protrusion at the bottom. Improve the heating efficiency at the opening by using Joule's law and provide uniform heat at the bottom. Use a spiral-wound resistance wire and multiple heating sections working together to optimize heating uniformity.
It improves the heating uniformity of the crucible, avoids condensation blockage at the opening, ensures the continuity of the vapor deposition process, reduces the frequency of equipment maintenance, improves production efficiency, and ensures the uniformity and stability of the coating.
Smart Images
Figure CN224591001U_ABST
Abstract
Description
Technical Field
[0001] This application relates to the field of vapor deposition equipment technology, and more specifically, to a crucible and vapor deposition equipment. Background Technology
[0002] Vacuum resistance evaporation coating, or simply evaporation, involves heating the coating material under vacuum conditions using an evaporation source. This causes the material to evaporate or sublimate into gaseous particles with a certain energy, which are then rapidly transported to the substrate in a near-collision-free linear motion. Some of the particles reaching the substrate surface are reflected back, while others are adsorbed onto the substrate and undergo surface diffusion. Two-dimensional collisions occur between the deposited atoms, forming clusters. These clusters continuously collide with the diffused particles, eventually forming a continuous thin film.
[0003] Evaporation equipment is commonly used in the fabrication of thin films of organic-inorganic materials, electrodes, and organic light-emitting semiconductor display panels for solar cells. The structure of evaporation equipment generally includes an evaporation source, a crucible wound with high-temperature resistance wire, and a vacuum system.
[0004] Heating a high-temperature resistance wire conducts heat to the crucible, heating the material inside to a sublimated state, which is then rapidly transferred to the substrate surface through the opening at the top of the crucible. However, the opening at the top of the crucible typically radiates heat into the vacuum, resulting in a lower temperature at the opening compared to the bottom and center of the crucible. Consequently, severe clogging occurs at the crucible opening after a period of vapor deposition, a problem particularly prevalent in large-scale mass production vapor deposition machines. Simply increasing the power or temperature can lead to material splashing, both of which negatively impact the stability and uniformity of the deposition film.
[0005] In existing technologies, resistance wires are generally only installed on the outer wall of the crucible, resulting in insufficient heating uniformity at the bottom of the crucible. Utility Model Content
[0006] The purpose of this application is to provide a crucible and vapor deposition equipment that can improve the heating uniformity of the crucible.
[0007] The embodiments of this application are implemented as follows: In one aspect of this application, a crucible is provided, including a crucible body and a first resistance wire disposed on the outer periphery of the crucible body. The first resistance wire is disposed on the outer periphery of the crucible body. The diameter of the first resistance wire disposed on the opening side of the crucible body is smaller than the diameter of the first resistance wire disposed in the middle part of the crucible body. The bottom of the crucible body is provided with three or more hollow protrusions, and a heating device is disposed in the hollow protrusions.
[0008] Alternatively, as one possible implementation, the first resistance wire is spirally arranged around the outer periphery of the crucible body.
[0009] Optionally, as an implementable method, the diameter of the first resistance wire disposed at the bottom of the crucible body is smaller than the diameter of the first resistance wire disposed in the middle of the crucible body.
[0010] Optionally, as an implementable method, the heating device is a second resistance wire, which includes a first heating section and a second heating section connected together. The first heating section is disposed close to the chamber of the crucible body, and the diameter of the resistance wire in the first heating section is smaller than the diameter of the resistance wire in the second heating section.
[0011] Optionally, as an implementable method, when the melting point of the vapor-deposited material in the crucible body is 170℃~400℃, the length of the first heating section is less than 1 / 4 of the total length of the second resistance wire or the length of the first heating section is greater than 1 / 3 of the total length of the second resistance wire.
[0012] Optionally, as an implementable method, when the melting point of the vapor-deposited material in the crucible body is 400℃~1000℃, the length of the first heating section is greater than 4 / 5 of the total length of the second resistance wire.
[0013] Alternatively, as an implementable method, the length of the second resistance wire is less than the thickness of the bottom surface of the crucible body.
[0014] In another aspect of this application, a vapor deposition apparatus is provided, including a vapor deposition chamber, a rotating platform disposed within the vapor deposition chamber, and a crucible as described in any of the above embodiments. The rotating platform is disposed above the crucible, and a substrate is disposed on the side of the rotating platform facing the crucible. The crucible is used to contain vapor deposition material.
[0015] Optionally, as an implementable method, a molecular pump and a dry mechanical pump connected to the vapor deposition chamber of the vapor deposition chamber are also provided on the outside of the vapor deposition chamber.
[0016] Optionally, as an implementable method, a positive electrode and a negative electrode are also provided in the vapor deposition chamber, and the two ends of the first resistance wire are electrically connected to the positive electrode and the negative electrode, respectively.
[0017] The beneficial effects of the embodiments of this application include: The crucible and vapor deposition equipment provided in this application include a crucible body and a first resistance wire disposed on the outer periphery of the crucible body. The diameter of the first resistance wire disposed on the opening side of the crucible body is smaller than the diameter of the first resistance wire disposed in the middle of the crucible body. Three or more hollow protrusions are provided at the bottom of the crucible body, and heating devices are disposed within the hollow protrusions. By employing a specially designed first resistance wire, i.e., the diameter of the first resistance wire on the opening side of the crucible body is smaller than the diameter in the middle, when the same current passes through, according to Joule's law, resistance is inversely proportional to the cross-sectional area of the wire; a smaller diameter results in higher resistance. This allows for more efficient and targeted heating of the opening of the crucible body, compensating for heat loss at the opening, preventing the vapor deposition material from condensing and clogging the opening due to low temperature, ensuring the continuity of the vapor deposition process, reducing equipment maintenance frequency, and improving production efficiency. By providing hollow protrusions at the bottom of the crucible body, with heating devices disposed within the hollow protrusions, more uniform and efficient heating of the crucible body can be achieved directly from the bottom. Compared to the traditional method of simply installing resistance wires on the outer wall, the addition of a heating device at the bottom ensures that the material receives sufficient and uniform heat at the bottom of the crucible body. This avoids uneven heating due to insufficient heat at the bottom, which can affect the sublimation rate and coating uniformity. The coordinated operation of multiple heating devices also allows for flexible adjustment of the heating power in each area according to the evaporation requirements of different materials, further optimizing the coating process. Attached Figure Description
[0018] To more clearly illustrate the technical solutions of the embodiments of this application, the accompanying drawings used in the embodiments will be briefly introduced below. It should be understood that the following drawings only show some embodiments of this application and should not be regarded as a limitation of the scope. For those skilled in the art, other related drawings can be obtained based on these drawings without creative effort.
[0019] Figure 1 This is one of the structural schematic diagrams of the vapor deposition equipment provided in the embodiments of this application; Figure 2 This is a second schematic diagram of the vapor deposition equipment provided in the embodiments of this application; Figure 3 This is a schematic diagram of the structure of the second resistance wire in the vapor deposition equipment provided in the embodiments of this application.
[0020] Icons: 100 - Evaporation equipment; 110 - Evaporation chamber; 111 - Positive electrode; 112 - Negative electrode; 120 - Crucible body; 130 - Rotating platform; 140 - Substrate; 150 - First resistance wire; 160 - Second resistance wire; 161 - First heating section; 162 - Second heating section; 170 - Molecular pump; 180 - Dry mechanical pump; 190 - Hollow protrusion. Detailed Implementation
[0021] To make the objectives, technical solutions, and advantages of the embodiments of this application clearer, the technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. The components of the embodiments of this application described and shown in the accompanying drawings can generally be arranged and designed in various different configurations.
[0022] Therefore, the following detailed description of the embodiments of this application provided in the accompanying drawings is not intended to limit the scope of the claimed application, but merely to illustrate selected embodiments of the application. All other embodiments obtained by those skilled in the art based on the embodiments of this application without inventive effort are within the scope of protection of this application.
[0023] It should be noted that similar reference numerals and letters in the following figures indicate similar items; therefore, once an item is defined in one figure, it does not need to be further defined and explained in subsequent figures. Furthermore, the terms "first," "second," "third," etc., are used only to distinguish descriptions and should not be construed as indicating or implying relative importance.
[0024] In the description of this application, it should also be noted that, unless otherwise expressly specified and limited, the terms "set up," "install," "connect," and "link" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this application based on the specific circumstances.
[0025] Please refer to Figure 1 and Figure 2 The crucible provided in this embodiment includes a crucible body 120 and a first resistance wire 150 disposed on the outer periphery of the crucible body 120. The diameter of the first resistance wire 150 disposed on the opening side of the crucible body 120 is smaller than the diameter of the first resistance wire 150 disposed in the middle of the crucible body 120. The bottom of the crucible body 120 is provided with three or more hollow protrusions 190, and a heating device is disposed inside the hollow protrusions 190.
[0026] When applying the crucible of this application to the vapor deposition equipment 100, the vacuum device is first activated to extract the air from the chamber, achieving the vacuum level required for vapor deposition. Generally, a high vacuum environment is required to reduce collision interference during the transport of gaseous particles, ensuring that the particles can be rapidly transported to the substrate 140 with essentially collision-free linear motion. The power supply to the first resistance wire 150 is then turned on, and current flows through the resistance wire. Due to the difference in diameter between the resistance wire at the crucible opening and in the middle, a stronger heating effect is automatically achieved at the opening, heating the crucible and the material inside, causing the material to gradually sublimate. The operator can monitor the temperature of different parts of the crucible in real time using the equipment's built-in temperature monitoring device to ensure that the heating process conforms to the predetermined process curve. As the material sublimates, the gaseous particles move towards the substrate 140. At this time, the rotating platform 130 is activated, rotating slowly and uniformly, driving the substrate 140 to rotate, ensuring that the material delivered from the crucible opening can be uniformly deposited on all parts of the substrate 140, forming a uniform thin film.
[0027] The crucible provided in this application includes a crucible body 120 and a first resistance wire 150 disposed on the outer periphery of the crucible body 120. The diameter of the first resistance wire 150 disposed on the open side of the crucible body 120 is smaller than the diameter of the first resistance wire 150 disposed in the middle of the crucible body 120. Three or more hollow protrusions 190 are provided at the bottom of the crucible body 120, and a heating device is disposed within each hollow protrusion 190. By employing a specially designed first resistance wire 150, i.e., the diameter of the first resistance wire 150 on the open side of the crucible body 120 is smaller than the diameter in the middle, when the same current passes through, according to Joule's law, resistance is inversely proportional to the cross-sectional area of the wire; a smaller diameter results in higher resistance. This allows for more efficient heating of the opening of the crucible body 120, compensating for heat loss at the opening, preventing the vapor-deposited material from condensing and clogging the opening due to low temperature, ensuring the continuity of the vapor deposition process, reducing equipment maintenance frequency, and improving production efficiency. By embedding multiple hollow protrusions 190 at the bottom of the crucible body 120, and installing heating devices within these protrusions 190, the crucible body 120 can be heated more uniformly and efficiently directly from the bottom. Compared to the traditional method of only setting resistance wires on the outer wall, the addition of heating devices at the bottom ensures that the material receives sufficient and uniform heat at the bottom of the crucible body 120, avoiding uneven heating due to insufficient heat at the bottom, which could affect the sublimation rate and coating uniformity. The coordinated operation of multiple heating devices also allows for flexible adjustment of the heating power in each area according to the evaporation requirements of different materials, further optimizing the coating process.
[0028] In one possible embodiment of this application, such as Figure 1 and Figure 2As shown, the first resistance wire 150 is spirally wound around the outer periphery of the crucible body 120. This spiral winding arrangement ensures that the first resistance wire 150 is uniformly and tightly attached to the outer surface of the crucible body 120, guaranteeing uniform and efficient heat transfer. Compared to a non-spiral winding layout, the spiral structure increases the contact area between the resistance wire and the crucible body 120, reducing localized heat accumulation or uneven heat dissipation, resulting in more even heating of the crucible body 120 and providing a stable sublimation environment for the vaporized material. The spirally wound first resistance wire 150 ensures that all parts of the crucible body 120, from the bottom to the opening, receive heat evenly from the resistance wire, avoiding inconsistent material evaporation rates due to uneven heating, thus guaranteeing the uniformity of the coating. Whether for small-scale experimental vapor deposition or large-scale mass production, it can stably produce high-quality, uniformly thick films, meeting the requirements of applications with extremely high requirements for film flatness and consistency, such as organic light-emitting semiconductor display panels.
[0029] In one possible embodiment of this application, such as Figure 1 and Figure 2 As shown, the diameter of the first resistance wire 150 located at the bottom of the crucible body 120 is smaller than the diameter of the first resistance wire 150 located in the middle of the crucible body 120. Considering that the bottom of the crucible body 120 is where materials accumulate, and that compared to the middle, the bottom material directly contacts the bottom surface of the crucible body 120, resulting in a shorter heat transfer path and higher temperature sensitivity, reducing the diameter of the bottom first resistance wire 150, according to Joule's law, increases the heating power of the bottom resistance wire under the same current. This precisely compensates for heat loss at the bottom, and, in conjunction with the specially designed resistance wire at the opening of the crucible body 120, comprehensively ensures the stability of the thermal environment of the materials inside the crucible body 120.
[0030] In one possible embodiment of this application, such as Figure 1 , Figure 2 and Figure 3 As shown, the heating device is a second resistance wire 160, which includes a first heating section 161 and a second heating section 162 connected to each other. The first heating section 161 is located close to the chamber of the crucible body 120, and the diameter of the resistance wire in the first heating section 161 is smaller than the diameter of the resistance wire in the second heating section 162. The first heating section 161 can focus on providing high heat to the area closest to the material within the crucible body 120, ensuring that high-melting-point, high-viscosity materials can quickly obtain sufficient energy to begin sublimation in the initial stage, improving the material evaporation start-up efficiency, reducing preheating waiting time, and improving the overall evaporation efficiency.
[0031] In one possible embodiment of this application, such as Figure 1 , Figure 2 and Figure 3As shown, when the melting point of the vapor-deposited material in the crucible body 120 is 170℃~400℃, the length of the first heating section 161 is less than 1 / 4 of the total length of the second resistance wire 160, or the length of the first heating section 161 is greater than 1 / 3 of the total length of the second resistance wire 160. When the melting point of the vapor-deposited material in the crucible body 120 is 170℃~400℃, and the vapor-deposited material is a material that is prone to splashing, such as fullerene (C60), fullerene derivatives (PCBM), copper bath (BCP), carbon (C), etc., the length of the first heating section 161 is less than 1 / 4 of the total length of the second resistance wire 160. When the vapor-deposited material is a material that is not prone to splashing, the length of the first heating section 161 is greater than 1 / 3 of the total length of the second resistance wire 160.
[0032] In one possible embodiment of this application, such as Figure 1 , Figure 2 and Figure 3 As shown, when the melting point of the vapor-deposited material in the crucible body 120 is 400℃~1000℃, the length of the first heating section 161 is greater than 4 / 5 of the total length of the second resistance wire 160. For high-melting-point materials (400℃-1000℃), evaporation startup is difficult and requires a strong and sustained initial heat supply. Designing the first heating section 161 to occupy most of the length of the second resistance wire 160 means maximizing the high-heat power area near the crucible body 120 chamber, which can concentrate energy to quickly raise the material temperature, overcome the thermal inertia of high-melting-point materials, ensure that the material reaches the sublimation point as soon as possible, and start a stable vapor deposition process.
[0033] In one possible embodiment of this application, such as Figure 1 , Figure 2 and Figure 3 As shown, the length of the second resistance wire 160 is less than the thickness of the bottom surface of the crucible body 120. This ensures that the bottom surface of the crucible body is intact and undamaged, guaranteeing the quality of vapor deposition and reducing the scrap rate caused by vacuum leakage.
[0034] In one possible embodiment of this application, such as Figure 1 , Figure 2 and Figure 3 As shown, a vapor deposition apparatus 100 is provided, including a vapor deposition chamber 110, a rotating base 130 disposed inside the vapor deposition chamber 110, and a crucible as described above. The rotating base 130 is disposed above the crucible, and a substrate 140 is disposed on the side of the rotating base 130 facing the crucible. The crucible is used to contain vapor deposition materials.
[0035] Furthermore, a positive electrode 111 and a negative electrode 112 are also provided in the vapor deposition chamber, and the two ends of the first resistance wire 150 are electrically connected to the positive electrode 111 and the negative electrode 112 respectively.
[0036] When using the vapor deposition equipment 100 of this application, the vacuum device is first activated to extract the air from the chamber, achieving the vacuum level required for vapor deposition. Generally, a high vacuum environment is required to reduce collision interference during the transport of gaseous particles, ensuring that the particles can be rapidly transported to the substrate 140 with essentially collision-free linear motion. The power supply to the first resistance wire 150 and the second resistance wire 160 is then connected. Current flows through the resistance wires. Due to the difference in diameter between the resistance wires at the opening and the center of the crucible body 120, a stronger heating effect is automatically achieved at the opening, heating the crucible body 120 and the material inside, causing the material to gradually sublimate. The operator can monitor the temperature of different parts of the crucible body 120 in real time using the built-in temperature monitoring device to ensure that the heating process conforms to the predetermined process curve. As the material sublimates, the gaseous particles move towards the substrate 140. At this time, the rotating platform 130 is activated, rotating slowly and uniformly, causing the substrate 140 to rotate. This ensures that the material delivered from the opening of the crucible body 120 can be uniformly deposited on all parts of the substrate 140, forming a uniform thin film.
[0037] In one possible embodiment of this application, such as Figure 1 , Figure 2 and Figure 3 As shown, a molecular pump 170 and a dry mechanical pump 180, connected to the vapor deposition chamber of the vapor deposition chamber 110, are also installed on the outside of the vapor deposition chamber 110. Maintaining a high vacuum environment in the vapor deposition chamber is crucial during the vapor deposition process. The molecular pump 170 utilizes high-speed rotating blades to generate directional momentum transfer to gas molecules, achieving extremely high vacuum extraction, and has the advantages of fast pumping speed and high ultimate vacuum. The dry mechanical pump 180, as a backing pump, can initially evacuate the chamber, handling a large amount of atmospheric pressure gas, creating favorable working conditions for the molecular pump 170. The two work together to efficiently and stably extract the gas from the vapor deposition chamber, achieving and maintaining the ultra-high vacuum required for vapor deposition.
[0038] The above description is merely a preferred embodiment of this application and is not intended to limit this application. Various modifications and variations can be made to this application by those skilled in the art. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this application should be included within the protection scope of this application.
Claims
1. A crucible, characterized by, The crucible includes a crucible body and a first resistance wire disposed on the outer periphery of the crucible body. The diameter of the first resistance wire disposed on the open side of the crucible body is smaller than the diameter of the first resistance wire disposed in the middle of the crucible body. The bottom of the crucible body is provided with three or more hollow protrusions, and a heating device is disposed inside the hollow protrusions.
2. The crucible of claim 1, wherein The first resistance wire is spirally arranged around the outer periphery of the crucible body.
3. The crucible of claim 1, wherein The diameter of the first resistance wire located at the bottom of the crucible body is smaller than the diameter of the first resistance wire located in the middle of the crucible body.
4. The crucible of claim 1, wherein The heating device is a second resistance wire, which includes a first heating section and a second heating section connected together. The first heating section is located close to the chamber of the crucible body, and the diameter of the resistance wire in the first heating section is smaller than the diameter of the resistance wire in the second heating section.
5. The crucible of claim 4, wherein When the melting point of the vapor-deposited material in the crucible body is 170℃~400℃, the length of the first heating section is less than 1 / 4 of the total length of the second resistance wire, or the length of the first heating section is greater than 1 / 3 of the total length of the second resistance wire.
6. The crucible of claim 4, wherein When the melting point of the vapor-deposited material in the crucible body is 400℃~1000℃, the length of the first heating section is greater than 4 / 5 of the total length of the second resistance wire.
7. The crucible of claim 1, wherein The length of the second resistance wire is less than the thickness of the bottom surface of the crucible body.
8. An evaporation apparatus, characterized by, The invention includes a vapor deposition chamber, a rotating platform disposed within the vapor deposition chamber, and a crucible as described in any one of claims 1-7. The rotating platform is disposed above the crucible, and a substrate is disposed on the side of the rotating platform facing the crucible. The crucible is used to contain vapor deposition materials.
9. The evaporation apparatus according to claim 8, characterized in that, The outer side of the vapor deposition chamber is also equipped with a molecular pump and a dry mechanical pump that are connected to the vapor deposition cavity of the vapor deposition chamber.
10. The evaporation apparatus according to claim 9, characterized in that, The vapor deposition chamber is also provided with a positive electrode and a negative electrode, and the two ends of the first resistance wire are electrically connected to the positive electrode and the negative electrode, respectively.