Anti-winding plating device and processing equipment

Abstract

The utility model provides a prevent winding and plating device and processing equipment, include: stage, be provided with the bearing surface on the stage, the bearing surface is used for bearing work piece, press ring, the recess is set up on the one side of press ring towards the stage, the bottom surface of recess abuts on work piece, the bottom surface of recess is set up and exposes the hole, exposes the hole and penetrates press ring, the projection of exposed hole along first direction is in the projection of work piece along first direction, the thickness of work piece in first direction is not less than the depth of recess in first direction, first direction is the direction of bearing surface direction. For the prevent winding and plating device of the utility model, can prevent work piece from happening deviation, can also prevent work piece and appear winding and plating and produce defective product.

Description

Technical Field

[0001] This utility model relates to the field of semiconductor processing technology, and in particular to an anti-plating device and processing equipment. Background Technology

[0002] In semiconductor coating equipment, the process must ensure not only sample integrity but also the uniformity of the coating on the sample surface. Different requirements necessitate different sample handling methods. Some processes also have requirements for the back side of the sample, prohibiting scratches or film formation (i.e., wrap-around coating). However, during the entire process, some samples, due to their inherent thinness or large size, or exposure to high temperatures, may experience varying degrees of deformation or warping. The sample-holding stage also exhibits the same phenomenon, resulting in the sample edges not adhering completely tightly to the stage, leaving some warped areas. In this case, process gases can enter the back side of the sample along the warped areas, reacting and forming a film (i.e., wrap-around coating), leading to sample defects or scrap. Therefore, an anti-wrap-around coating device is needed that can prevent both workpiece displacement and wrap-around coating. Utility Model Content

[0003] This invention aims to solve at least one of the technical problems existing in the prior art. To this end, this invention proposes an anti-plating device that can prevent workpiece displacement and plating wrapping, thereby reducing the defect rate.

[0004] This utility model also proposes a processing equipment.

[0005] According to a first aspect of the present invention, an anti-plating device includes: a platform, wherein a bearing surface is provided on the platform for bearing a workpiece; a pressing ring, wherein a groove is formed on one side of the pressing ring facing the platform, the bottom surface of the groove abuts against the workpiece, an exposed hole is formed on the bottom surface of the groove, the exposed hole penetrates the pressing ring, the projection of the exposed hole along a first direction is within the projection of the workpiece along the first direction, the thickness of the workpiece in the first direction is not less than the depth of the groove in the first direction, and the first direction is the direction in which the bearing surface faces.

[0006] The anti-plating device according to the first aspect of this utility model has at least the following beneficial effects: by pressing the edge of the workpiece against the bearing surface with the pressing ring, the deformation of the workpiece during processing is reduced, and the edge of the workpiece is prevented from warping. This ensures that the back of the workpiece is tightly attached to the bearing surface, preventing process gas from entering the back of the workpiece along the warped area, thus preventing plating snagging. Simultaneously, pressing the workpiece against the bearing surface also prevents the workpiece from shifting during rotation or translation.

[0007] According to some embodiments of the present invention, a driving member is also included, which is connected to the pressing ring and is used to drive the pressing ring to reciprocate along the first direction.

[0008] According to some embodiments of the present invention, a through hole is provided on the platform, the through hole passes through the bearing surface, the driving member passes through the through hole, and the projection of the driving member along the first direction is outside the projection of the groove along the first direction.

[0009] According to some embodiments of the present invention, there is a gap between the side of the groove and the side of the workpiece.

[0010] According to some embodiments of this utility model, the distance between the edge of the exposed hole and the edge of the workpiece is not greater than 15mm and not less than 1mm.

[0011] According to some embodiments of the present invention, the pressing ring includes a plurality of pressing blocks, the driving member includes a plurality of lifting rods, and at least one lifting rod is connected to one of the pressing blocks.

[0012] According to some embodiments of the present invention, the pressing ring is further provided with an elastic element, the elastic element is disposed on the side of the pressing ring facing the bearing surface, the elastic element surrounds the outside of the groove, and the elastic element abuts against the bearing surface.

[0013] According to some embodiments of the present invention, the elastic element includes a compressed state and a released state; when the elastic element is in the released state, in a first direction, the distance between the end of the elastic element away from the bottom surface of the groove and the bottom surface of the groove is greater than the thickness of the workpiece; when the elastic element is in the compressed state, in a first direction, the distance between the end of the elastic element away from the bottom surface of the groove and the bottom surface of the groove is not greater than the thickness of the workpiece.

[0014] According to some embodiments of the present invention, in the first direction, the distance between the bottom surface of the groove and the side of the pressing ring facing away from the platform does not exceed 1 mm.

[0015] A processing apparatus according to a second aspect of the present invention includes the anti-wrapping plating device described in any of the above embodiments.

[0016] Additional aspects and advantages of this invention will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of the invention. Attached Figure Description

[0017] Figure 1 This is a schematic diagram of a rectangular structure of an anti-plating device according to the present invention; Figure 2 This is a schematic diagram of the circular structure of an anti-plating device according to the present invention; Figure 3 This is a partial cross-sectional schematic diagram of an anti-plating device according to the present invention; Figure 4 This is a partial cross-sectional schematic diagram of an anti-plating device according to the present invention, including an elastic element.

[0018] Icon labels: 1. Platform; 11. Bearing surface; 12. Through hole; 2. Pressing ring; 21. Groove; 22. Exposed hole; 3. Workpiece; 4. Driving component; 5. Elastic component. Detailed Implementation

[0019] The embodiments of this utility model are described in detail below. Examples of these embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain this utility model, and should not be construed as limiting this utility model.

[0020] In the description of this utility model, it should be understood that the directional descriptions, such as up and down, are based on the directional or positional relationships shown in the accompanying drawings. They are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model.

[0021] In the description of this utility model, "multiple" refers to two or more. The use of "first" and "second" is for distinguishing technical features only and should not be construed as indicating or implying relative importance, or implicitly indicating the number of technical features or their sequential relationship.

[0022] In the description of this utility model, unless otherwise explicitly defined, terms such as "setting," "installation," and "connection" should be interpreted broadly, and those skilled in the art can reasonably determine the specific meaning of the above terms in this utility model in conjunction with the specific content of the technical solution.

[0023] In semiconductor manufacturing processes, wafer deposition is a crucial step, significantly impacting the final performance of the semiconductor. The deposition process includes wafer preparation, selection of deposition technology, deposition itself, and quality control. Chemical deposition techniques include chemical vapor deposition (CVD) and atomic layer deposition (ALD). Taking CVD as an example, the wafer deposition process involves placing the wafer in a reaction chamber and adjusting the temperature and pressure. Then, a gaseous precursor is introduced to react and deposit the film. Controlling parameters ensures the uniformity and quality of the deposited film on the wafer.

[0024] It is particularly important to note that when performing single-sided coating on a wafer, extending the material onto other surfaces that do not require coating can trigger a series of negative effects. Firstly, it can cause uneven distribution of mechanical stress on the wafer, leading to stress concentration and even wafer warping or cracking and peeling of the thin film. Secondly, differences in thermal expansion coefficients can cause thermal stress, resulting in thin film cracking or wafer damage. Furthermore, it can alter the electrical properties of the semiconductor, affecting its electrical insulation properties and dielectric constant stability. Additionally, it can impair the semiconductor's optical properties, such as reducing its light transmittance. Therefore, when performing single-sided coating on semiconductors, the coating process must be strictly controlled to ensure that the material is deposited only on the target surface, i.e., the coating surface.

[0025] Reference Figure 1 , Figure 2 and Figure 3The anti-coating device in the first embodiment of this utility model includes: a platform 1 and a pressing ring 2. The platform 1 is provided with a bearing surface 11, which is used to support the workpiece 3. When the workpiece 3 is placed on the platform 1, the side of the workpiece 3 that needs to be coated is placed with its back to the bearing surface 11, while the side of the workpiece 3 that does not need to be coated is attached to the bearing surface 11. At this time, the side of the workpiece 3 attached to the bearing surface 11 will not come into contact with the process gas, and thus will not be coated. However, when the workpiece 3 is processed, it will deform due to factors such as temperature, causing the edge of the workpiece 3 to curl up. At this time, the process gas will enter the side of the workpiece 3 facing the bearing surface 11 along the curled-up position, making the workpiece 3 unqualified, that is, failing to achieve the above-mentioned goal of ensuring that the material is deposited only on the target surface, i.e., the coating surface. Therefore, the pressing ring 2 is provided to press the workpiece 3. A groove 21 is formed on the side of the pressing ring 2 facing the platform 1. The bottom surface of the groove 21 abuts against the workpiece 3. An exposed hole 22 is formed on the bottom surface of the groove 21, penetrating the pressing ring 2. The projection of the exposed hole 22 along a first direction falls within the projection of the workpiece 3 along the first direction. The thickness of the workpiece 3 in the first direction is not less than the depth of the groove 21 in the first direction, which is the direction in which the bearing surface 11 faces. By setting the groove 21 on the pressing ring 2, the bottom surface of the groove 21 presses the edge of the workpiece 3, thereby effectively preventing the edge of the workpiece 3 from deforming and lifting. This avoids the process gas from passing through the lifted part of the workpiece 3 and coating the area of ​​the workpiece 3 that does not need to be coated. The exposed hole 22 exposes the area of ​​the workpiece 3 that needs to be coated, meaning that the bottom of the groove 21 only presses the edge of the workpiece 3, thus avoiding affecting the area of ​​the workpiece 3 that needs to be coated. The thickness of workpiece 3 in the first direction is not less than the depth of groove 21 in the first direction, ensuring that the bottom surface of groove 21 can press against workpiece 3, thereby preventing workpiece 3 from sliding within groove 21. Secondly, pressing ring 2 presses against workpiece 3, thus firmly fixing workpiece 3 on stage 1 and preventing it from shifting relative to stage 1 when workpiece 3 rotates or translates. It should be noted that on the semiconductor coating surface, areas that do not require coating are set at the edges according to the process, and the bottom of groove 21 abuts against workpiece 3 in these areas.

[0026] In the semiconductor manufacturing process, wafers need to be transported and moved during various stages, including wafer fabrication, grinding and polishing, oxidation, photolithography, and etching. Therefore, it is particularly important to use the pressing ring 2 to prevent the workpiece 3 from shifting during movement.

[0027] According to some embodiments of this utility model, a driving component 4 is also included. The driving component 4 is connected to the pressing ring 2 and is used to drive the pressing ring 2 to reciprocate along a first direction. The driving component 4 drives the pressing ring 2 to press or release the workpiece 3, making the picking and placing of the workpiece 3 more convenient. The connection between the driving component 4 and the pressing ring 2 can be a fixed connection or an abutting connection.

[0028] According to some embodiments of this utility model, a through hole 12 is provided on the platform 1, the through hole 12 passes through the bearing surface 11, and the driving member 4 passes through the through hole 12. The projection of the driving member 4 along the first direction is outside the projection of the groove 21 along the first direction. Driving the pressing ring 2 by the driving member 4 passing through the through hole 12 makes the entire device more compact. Furthermore, most of the structure of the driving member 4 can be located on the side of the platform 1 facing away from the workpiece 3, thereby minimizing the impact of the driving member 4 on the processing of the workpiece 3. The fact that the projection of the driving member 4 along the first direction is outside the projection of the groove 21 along the first direction also prevents interference between the driving member 4 and the workpiece 3.

[0029] According to some embodiments of this utility model, there is a gap between the side surface of the groove 21 and the side surface of the workpiece 3. The workpiece 3 needs to be abutted by the bottom surface of the groove 21, requiring it to enter the groove 21. Therefore, a certain gap is provided between the side surface of the groove 21 and the side surface of the workpiece 3 to prevent friction between the workpiece 3 and the side wall of the groove 21 when it enters, thus avoiding damage to the workpiece 3. Furthermore, providing a certain gap also allows the workpiece 3 to expand to a certain extent after being heated, thereby preventing excessive compression and breakage of the workpiece 3 within the groove 21.

[0030] According to some embodiments of this utility model, the distance between the edge of the exposed hole 22 and the edge of the workpiece 3 is not greater than 15mm and not less than 1mm. When the distance between the edge of the exposed hole 22 and the edge of the workpiece 3 is too large, it will have a significant impact on the coated surface of the workpiece 3. Conversely, when the distance between the edge of the exposed hole 22 and the edge of the workpiece 3 is too small, the pressure on the workpiece 3 will be greater, which may easily damage the workpiece 3.

[0031] According to some embodiments of this utility model, the pressing ring 2 includes multiple pressing blocks, and the driving component 4 includes multiple lifting rods, with at least one lifting rod connected to each pressing block. By having multiple pressing blocks collectively form the pressing ring 2, the use and installation of the pressing ring 2 become more flexible, and the phenomenon of the pressing ring 2 being damaged by inconsistent lifting of the lifting rods can be better avoided. The pressing ring 2 can be circular, rectangular, or other shapes.

[0032] According to some embodiments of this utility model, refer to Figure 4The pressing ring 2 is also equipped with an elastic element 5, which is located on the side of the pressing ring 2 facing the bearing surface 11. The elastic element 5 surrounds the outside of the groove 21 and abuts against the bearing surface 11. In order to press the workpiece 3 onto the platform 1, the bottom surface of the groove 21 needs to abut against the workpiece 3. At this time, a gap can easily appear between the pressing ring 2 and the bearing surface 11. When a gap appears between the pressing ring 2 and the bearing surface 11, the side of the workpiece 3 will be coated, which will also have a certain impact on the processing of the workpiece 3. Therefore, the elastic element 5 is provided to ensure that the bottom surface of the groove 21 presses against the workpiece 3, and also allows the pressing ring 2 to be indirectly pressed against the platform 1 through the elastic element 5, thereby improving the sealing performance and preventing the side of the workpiece 3 from being coated.

[0033] According to some embodiments of this utility model, the elastic member 5 includes a compressed state and a released state. When the elastic member 5 is in the released state, in the first direction, the distance between the end of the elastic member 5 away from the bottom surface of the groove 21 and the bottom surface of the groove 21 is greater than the thickness of the workpiece 3. This ensures that the space jointly restricted by the groove 21 and the elastic member 5 can completely accommodate the workpiece 3. When the elastic member 5 is in the compressed state, in the first direction, the distance between the end of the elastic member 5 away from the bottom surface of the groove 21 and the bottom surface of the groove 21 is not greater than the thickness of the workpiece 3. This ensures that the bottom surface of the groove 21 can abut against the workpiece 3, applying pressure to the workpiece 3.

[0034] According to some embodiments of this utility model, in the first direction, the distance between the bottom surface of the groove 21 and the side of the pressing ring 2 facing away from the platform 1 does not exceed 1 mm. This avoids the exposed hole 22 being too large in the first direction, thereby better reducing the impact on the workpiece 3 and the reverse coating. When the exposed hole 22 is too large in the first direction, it may cause the coating at the edge of the coating area of ​​the workpiece 3 to be thinner, resulting in an uneven coating of the workpiece 3.

[0035] A processing apparatus according to a second aspect of the present invention includes an anti-wrapping plating device according to any one of the above embodiments.

[0036] The embodiments of the present utility model have been described in detail above with reference to the accompanying drawings. However, the present utility model is not limited to the above embodiments. Within the scope of knowledge possessed by those skilled in the art, various changes can be made without departing from the spirit of the present utility model.

Claims

1. An anti-plating device, characterized in that, include: A platform, wherein a bearing surface is provided on the platform, and the bearing surface is used to bear the workpiece; A pressing ring has a groove on one side facing the platform. The bottom surface of the groove abuts against the workpiece. An exposed hole is formed on the bottom surface of the groove, which penetrates the pressing ring. The projection of the exposed hole along a first direction is within the projection of the workpiece along the first direction. The thickness of the workpiece in the first direction is not less than the depth of the groove in the first direction. The first direction is the direction in which the bearing surface faces.

2. The plating preventing device according to claim 1, wherein The anti-wrapping plating device further includes a driving component, which is connected to the pressing ring and is used to drive the pressing ring to reciprocate along the first direction.

3. The anti-curling device according to claim 2, wherein The platform is provided with a through hole that passes through the bearing surface. The driving member passes through the through hole, and the projection of the driving member along the first direction is outside the projection of the groove along the first direction.

4. The plating preventing device according to claim 1, wherein There is a gap between the side of the groove and the side of the workpiece.

5. The plating preventing device according to claim 1, wherein The distance between the edge of the exposed hole and the edge of the workpiece is not greater than 15mm and not less than 1mm.

6. The anti-curling and anti-shorting apparatus of claim 2, wherein, The pressing ring includes multiple pressing blocks, and the driving component includes multiple lifting rods, with at least one lifting rod connected to each pressing block.

7. The plating preventing device according to claim 1, wherein The pressing ring is also provided with an elastic element, which is disposed on the side of the pressing ring facing the bearing surface, surrounds the outside of the groove, and abuts against the bearing surface.

8. The anti-curling and anti-shorting apparatus of claim 7, wherein the first and second electrodes are formed of a conductive material. The elastic element includes a compressed state and a released state; when the elastic element is in the released state, in a first direction, the distance between the end of the elastic element away from the bottom surface of the groove and the bottom surface of the groove is greater than the thickness of the workpiece; when the elastic element is in the compressed state, in a first direction, the distance between the end of the elastic element away from the bottom surface of the groove and the bottom surface of the groove is not greater than the thickness of the workpiece.

9. The plating preventing device according to claim 1, wherein In the first direction, the distance between the bottom surface of the groove and the side of the pressing ring facing away from the platform does not exceed 1 mm.

10. A processing apparatus characterized by comprising: The anti-plating device includes any one of claims 1-9.

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