Surface treatment device for copper-aluminum composite foil

Abstract

The utility model relates to metal surface treatment field, concretely is a kind of copper-aluminum composite foil's surface treatment device.The utility model provides copper-aluminum composite foil's surface treatment device, device runs continuously efficient, belong to new technology production line;Through the continuous production electroplating line of the roughening and passivation of the carbon hydrogen degreasing cleaning, copper plating thickening, copper plating surface of electroplating process copper-aluminum composite foil of independent development, the surface binding force of copper-aluminum composite foil, copper layer appearance and the performance promotion of folding resistance, anti-peeling strength, high-temperature resistance and normal temperature storage can be realized, meet the higher performance requirement of downstream customer to copper-aluminum composite foil.Test shows that, after copper-aluminum composite foil of the surface treatment device described in the utility model carries out surface treatment, surface reaches good binding force and anti-peeling strength of the value of ≥40 and ≥0.8N / mm, and realizes its can be stored at normal temperature ≥6 months and high-temperature oxidation resistance of 180 DEG C high-temperature resistance 1 hour.

Description

Technical Field

[0001] This utility model relates to the field of metal surface treatment, specifically a surface treatment device for copper-aluminum composite foil. Background Technology

[0002] Initially, copper-aluminum composite materials were mainly produced through explosive bonding, which was costly, inefficient, and could only produce single plates. Composite copper-aluminum bars were also limited to composite casting and hot-dip osmosis rolling, resulting in unstable product quality and unresolved aluminum oxidation issues.

[0003] Existing technology uses vacuum magnetron sputtering + electroplating (sputtering method) to prepare copper-aluminum composite foil, and performs surface activation modification treatment on the aluminum foil substrate to improve the adhesion between the thin film substrate and the metal layer. Vacuum physical vapor deposition technology is used to form a transition metal layer and a copper seed layer on the base film. Simultaneously, infrared heating, vacuum surface activation modification technology, and special vacuum-assisted technology are used on the base film to improve the adhesion of the coating, solving the problem of low adhesion between the aluminum and copper metal layers in the base film, achieving a peel strength ≥1.1 N / mm. This process uses a roll-to-roll production process, which is highly efficient, simple, easy to operate and control, and has low production costs. It can easily produce single-sided and double-sided materials, and can also be customized according to customer specifications, entering the copper foil replacement market with the advantages of low cost, high quality, and high output. It significantly reduces costs and increases efficiency, aligning with the development trend of lightweight, thin, short, and small composite material products.

[0004] However, although the vacuum magnetron sputtering + electroplating (sputtering method) process for preparing copper-aluminum composite foil has solved the problem of bonding strength between aluminum and copper metal layers, downstream customers have higher requirements for the bonding strength between the two sides of the copper-aluminum composite material and materials such as PET or PI, the high temperature resistance of the two sides of the copper-aluminum composite material, and the peel strength of the two sides of the copper-aluminum composite material.

[0005] The vacuum magnetron sputtering + electroplating (sputtering method) process for preparing copper-aluminum composite foil cannot meet the requirements of downstream customers. Take the application of 50μm aluminum foil + 4μm copper in the LED field as an example. After a single-sided magnetron sputtering alloy layer is applied to the 50μm aluminum foil, it undergoes an electroplating process to deposit 4μm of copper, and is then slit into finished products for shipment. During the LED manufacturing process, the adhesion between the aluminum surface and the PET is poor, and the copper surface oxidizes and discolors during the heat bonding process.

[0006] Taking the application of copper-aluminum composite foil (50μm aluminum foil with 1μm copper on both sides) in the copper-clad laminate industry as an example. After the 50μm aluminum foil undergoes magnetron sputtering of an alloy layer on one side, it enters an electroplating process to plate 1μm copper on both sides, and then is slit into finished products for shipment. Downstream customers laminate PI (polyimide) onto both sides of the copper-aluminum composite foil, but problems such as poor adhesion and oxidation occur during this manufacturing process. Utility Model Content

[0007] In view of this, the technical problem to be solved by this utility model is to provide a surface treatment device for copper-aluminum composite foil. The surface treatment device provided by this utility model can continuously perform surface treatment on copper-aluminum composite foil, thereby improving the surface adhesion, high temperature resistance, oxidation resistance and peel strength of copper-aluminum composite foil.

[0008] This utility model provides a surface treatment device for copper-aluminum composite foil, which includes, in sequence along the conveying direction of the device:

[0009] Feeding device;

[0010] Hydrocarbon degreasing module;

[0011] Copper-plated thickened module;

[0012] Copper layer roughening module;

[0013] Copper passivation module;

[0014] Feeding device;

[0015] A guide roller is disposed between the feeding device and the unloading device.

[0016] The surface treatment apparatus for copper-aluminum composite foil of this invention includes a feeding device. The feeding device is used to feed the copper-aluminum composite foil to be surface treated into the apparatus for surface treatment. This invention does not have a particular limitation on the feeding device; any commonly used copper-aluminum composite foil feeding device in the art will suffice. In some embodiments of this invention, the feeding device is an uncoiler.

[0017] The surface treatment apparatus for copper-aluminum composite foil of this invention includes a hydrocarbon degreasing module. Specifically, the hydrocarbon degreasing module includes, in sequence along the conveying direction of the apparatus, a hydrocarbon degreasing tank, a first drying device, and a first cooling device. The hydrocarbon degreasing tank in the hydrocarbon degreasing module of this invention is used to perform hydrocarbon degreasing on the copper-aluminum composite foil to be surface treated from the feeding device. Specifically, the hydrocarbon degreasing tank is filled with a hydrocarbon degreasing agent solution. The copper-aluminum composite foil to be surface treated from the feeding device enters the hydrocarbon degreasing tank and is immersed in the hydrocarbon degreasing agent solution for hydrocarbon degreasing.

[0018] The first drying device in the hydrocarbon degreasing module of this invention is used to bake the copper-aluminum composite foil from the hydrocarbon degreasing tank; the hydrocarbon degreasing agent on the surface of the material is dried by baking. In some embodiments of this invention, the first drying device is an oven.

[0019] The first cooling device in the hydrocarbon degreasing module of this invention is used to cool the copper-aluminum composite foil from the first drying device. By cooling the copper-aluminum composite foil after baking from the first drying device, the temperature of the foil is rapidly reduced, preventing temperature differences from entering the solution and causing the foil to wrinkle. In some embodiments of this invention, the first cooling device is a cooling fan.

[0020] The surface treatment device for copper-aluminum composite foil of this invention includes a copper plating thickening module. Specifically, the copper plating thickening module includes a copper plating thickening electroplating tank and a first cleaning tank in sequence along the transport direction of the device. The copper plating thickening electroplating tank in the copper plating thickening module of this invention is used to thicken the copper-aluminum composite foil from the first cooling device in the hydrocarbon degreasing module by copper plating. Specifically, the copper plating thickening electrolytic tank is filled with copper plating thickening liquid. The copper-aluminum composite foil from the first cooling device enters the copper plating thickening electrolytic tank and is immersed in the copper plating thickening liquid for hydrocarbon degreasing. The copper plating thickening electroplating tank of this invention is specifically a vertical electroplating tank; the anode plates are parallel to both sides of the copper-aluminum composite foil. To ensure the accuracy of the electrode spacing, a high-precision anode plate slot is designed to ensure that the electrode spacing error is within ±0.1mm; the vertical electroplating tank can thicken the copper-aluminum composite foil by copper plating in a vertical electroplating production method, ensuring the uniformity of the coating thickness. The copper plating thickening module of this utility model also includes a temperature control device installed on the copper plating thickening electroplating tank, used to control the working temperature of the copper plating thickening electroplating tank.

[0021] The first cleaning tank in the copper plating thickening module of this invention is used to clean the copper-aluminum composite foil from the copper plating thickening electroplating tank. Specifically, the first cleaning tank is filled with cleaning solution, and the copper-aluminum composite foil from the copper plating thickening electroplating tank enters the first cleaning tank and is immersed in the cleaning solution for cleaning. In some embodiments of this invention, the first cleaning tank is filled with water, and the copper-aluminum composite foil from the copper plating thickening electroplating tank enters the first cleaning tank and is immersed in the water for cleaning. The first cleaning tank of this invention can clean the copper plating thickening solution from the surface of the copper-aluminum composite foil from the copper plating thickening electroplating tank, preventing contamination of the electroplating solution between different plating tanks.

[0022] The surface treatment device for copper-aluminum composite foil of this invention includes a copper layer roughening module. Specifically, the copper layer roughening module includes a copper layer roughening electroplating tank and a second cleaning tank in sequence along the conveying direction of the device. The copper layer roughening electroplating tank in the copper layer roughening module of this invention is used to roughen the copper layer of the copper-aluminum composite foil from the first cleaning tank in the copper plating thickening module. Specifically, the copper layer roughening electroplating tank is filled with a copper layer roughening solution. The copper-aluminum composite foil from the first cleaning tank enters the copper layer roughening electroplating tank and is immersed in the copper layer roughening solution for copper layer roughening. The copper layer roughening electroplating tank of this invention is specifically a vertical electroplating tank; the anode plates are parallel to both sides of the copper-aluminum composite foil. To ensure the accuracy of the electrode spacing, a high-precision anode plate slot is designed to ensure that the electrode spacing error is within ±0.1mm; the vertical electroplating tank can roughen the copper layer of the copper-aluminum composite foil in a vertical electroplating production method, ensuring the uniformity of copper layer roughening. The copper layer roughening module of this utility model also includes a temperature control device installed on the copper layer roughening electroplating tank for controlling the working temperature of the copper layer roughening electroplating tank.

[0023] The second cleaning tank in the copper layer roughening module of this invention is used to clean the copper-aluminum composite foil from the copper layer roughening electroplating tank. Specifically, the second cleaning tank is filled with cleaning solution, and the copper-aluminum composite foil from the copper layer roughening electroplating tank enters the second cleaning tank and is immersed in the cleaning solution for cleaning. In some embodiments of this invention, the second cleaning tank is filled with water, and the copper-aluminum composite foil from the copper layer roughening electroplating tank enters the second cleaning tank and is immersed in the water for cleaning. The second cleaning tank of this invention can clean the copper layer roughening solution from the surface of the copper-aluminum composite foil from the copper layer roughening electroplating tank, preventing contamination of the electroplating solution between different plating tanks.

[0024] The surface treatment device for copper-aluminum composite foil of this invention includes a copper passivation module. Specifically, the copper passivation module includes a copper passivation electroplating tank and a third cleaning tank. The copper passivation electroplating tank in the copper passivation module of this invention is used to passivate the copper-aluminum composite foil from the second cleaning tank in the copper roughening module. Specifically, the copper passivation electroplating tank is filled with copper passivation solution. The copper-aluminum composite foil from the second cleaning tank enters the copper passivation electroplating tank and is immersed in the copper passivation solution for copper passivation. The copper passivation electroplating tank of this invention is specifically a vertical electroplating tank; the anode plates are parallel to both sides of the copper-aluminum composite foil. To ensure the accuracy of the electrode spacing, a high-precision anode plate slot is designed to ensure that the electrode spacing error is within ±0.1mm; the vertical electroplating tank can passivate the copper-aluminum composite foil in a vertical electroplating production method, ensuring the uniformity of copper passivation. The copper passivation module of this utility model also includes a temperature control device disposed on the copper passivation electroplating tank for controlling the working temperature of the copper passivation electroplating tank.

[0025] The third cleaning tank in the copper passivation module of this invention is used to clean the copper-aluminum composite foil from the copper passivation electroplating tank. Specifically, the third cleaning tank is filled with cleaning solution, and the copper-aluminum composite foil from the copper passivation electroplating tank enters the third cleaning tank and is immersed in the cleaning solution for cleaning. In some embodiments of this invention, the third cleaning tank is filled with water, and the copper-aluminum composite foil from the copper passivation electroplating tank enters the third cleaning tank and is immersed in the water for cleaning. The third cleaning tank of this invention can clean the copper passivation solution from the surface of the copper-aluminum composite foil from the copper passivation electroplating tank, preventing contamination of the electroplating solutions between different plating tanks.

[0026] In the surface treatment apparatus for copper-aluminum composite foil of this invention, a second drying device and a second cooling device are further provided along the transport direction of the apparatus between the copper layer passivation module and the feeding device. The second drying device is used to bake the copper-aluminum composite foil from the third cleaning tank in the copper layer passivation module; the baking process removes moisture from the surface of the material. In some embodiments of this invention, the second drying device is an oven. The second cooling device is used to cool the copper-aluminum composite foil from the second drying device; by cooling the baked copper-aluminum composite foil from the second drying device, the foil temperature is rapidly reduced for feeding. In some embodiments of this invention, the second cooling device is a cooling fan.

[0027] The surface treatment apparatus for copper-aluminum composite foil of this invention includes a feeding device. This feeding device serves two purposes: firstly, it pulls the copper-aluminum composite foil from the feeding device along the conveying direction of the apparatus; secondly, it winds the copper-aluminum composite foil from the second cooling device, completing the surface treatment of the copper-aluminum composite foil and obtaining the surface-treated copper-aluminum composite foil. This invention does not have a special limitation on the feeding device; any commonly used copper-aluminum composite foil feeding device in the art is acceptable. In some embodiments of this invention, the feeding device is a winding machine.

[0028] The surface treatment device for copper-aluminum composite foil of this invention further includes guide rollers, which are disposed between the feeding device and the unloading device. The guide rollers are used to guide the copper-aluminum composite foil from the feeding device to be stably conveyed along the conveying direction of the device. Specifically, the guide rollers are respectively disposed in the hydrocarbon degreasing module, the copper plating thickening module, the copper layer roughening module, and the copper layer passivation module. More specifically, guide rollers are respectively disposed in the hydrocarbon degreasing tank, the first drying device, and the first cooling device of the hydrocarbon degreasing module; guide rollers are respectively disposed in the copper plating thickening electroplating tank and the first cleaning tank of the copper plating thickening module; guide rollers are respectively disposed in the copper layer roughening electroplating tank and the second cleaning tank of the copper layer roughening module; and guide rollers are respectively disposed in the copper layer passivation electroplating tank and the third cleaning tank of the copper layer passivation module. This invention does not have a special limitation on the number of guide rollers, as long as they are sufficient to stably convey the copper-aluminum composite foil along the conveying direction of the device. In some embodiments of this utility model, six guide rollers are respectively provided in the hydrocarbon degreasing tank, the first drying device, the first cooling device, the copper thickening electroplating tank, the first cleaning tank, the copper roughening electroplating tank, the second cleaning tank, the copper passivation electroplating tank, and the third cleaning tank.

[0029] This invention provides a surface treatment device for copper-aluminum composite foil. The device operates continuously and efficiently, representing a new process production line. Through a self-developed continuous electroplating line that performs hydrocarbon degreasing and cleaning, copper plating thickening, and surface roughening and passivation of the copper-aluminum composite foil during the electroplating process, it can improve the surface adhesion, copper layer appearance, folding resistance, peel strength, high-temperature resistance, and room-temperature storage performance of the copper-aluminum composite foil, meeting the higher performance requirements of downstream customers. Tests show that the copper-aluminum composite foil treated by the device described in this invention exhibits excellent adhesion with a surface dyne value ≥40 and a peel strength ≥0.8 N / mm. Furthermore, it achieves high-temperature oxidation resistance, allowing for storage at room temperature for ≥6 months and withstanding 180℃ for 1 hour. Attached Figure Description

[0030] Figure 1 This is a structural diagram of the surface treatment device for copper-aluminum composite materials described in a specific embodiment of this utility model;

[0031] Figure 2 This is a detailed view of the copper-plating thickening electroplating tank described in this utility model. Detailed Implementation

[0032] This utility model discloses a surface treatment apparatus for copper-aluminum composite foil. Those skilled in the art can refer to the content of this document and appropriately modify the process parameters to achieve the desired result. It should be particularly noted that all similar substitutions and modifications are obvious to those skilled in the art and are considered to be included in this utility model. The methods and applications of this utility model have been described through preferred embodiments. Those skilled in the art can clearly modify or appropriately change and combine the methods and applications described herein without departing from the content, spirit, and scope of this utility model to realize and apply the technology of this utility model.

[0033] The surface treatment device for copper-aluminum composite materials of this utility model includes, in sequence along the transmission direction of the device: a feeding device, a hydrocarbon degreasing tank, a first drying device, a first cooling device, a copper thickening electroplating tank, a first cleaning tank, a copper roughening electroplating tank, a second cleaning tank, a copper passivation electroplating tank, a third cleaning tank, a second drying device, a second cooling device, and a discharging device.

[0034] like Figure 1 As shown, Figure 1 The diagram shows the structure of the surface treatment device for copper-aluminum composite materials described in a specific embodiment of this utility model. It includes: an uncoiler, a hydrocarbon degreasing tank, an oven 1, a cooling fan 1, a copper thickening electroplating tank, a water washing tank 1, a copper roughening electroplating tank, a water washing tank 2, a copper passivation electroplating tank, a water washing tank 3, an oven 2, a cooling fan 2, and a rewinder. Each of the hydrocarbon degreasing tank, copper thickening electroplating tank, water washing tank 1, copper roughening electroplating tank, water washing tank 2, copper passivation electroplating tank, and water washing tank 3 is equipped with six guide rollers.

[0035] The present invention will be further described below with reference to the embodiments:

[0036] Example 1

[0037] (1) Opening the book

[0038] The copper-aluminum composite foil to be surface treated is unwound using an uncoiler and then fed into a hydrocarbon degreasing tank.

[0039] The copper-aluminum composite foil to be surface treated is prepared by vacuum magnetron sputtering and electroplating (sputtering method). Its structure, from bottom to top, consists of an aluminum layer, a nickel-chromium alloy layer sputtered on the aluminum layer, and a copper layer electroplated on the nickel-chromium alloy layer.

[0040] (2) Hydrogen defatting

[0041] After being uncoiled, the copper-aluminum composite foil to be surface treated enters a hydrocarbon degreasing tank, where a hydrocarbon degreasing agent is used to degrease its surface, and then it is air-cooled in an oven.

[0042] The hydrocarbon degreasing agent used for the hydrocarbon degreasing treatment is Tianjin Huayang Xinxing Technology SKH-620 hydrocarbon cleaning agent, and its specifications are shown in Table 1:

[0043] Table 1

[0044]

[0045] After hydrocarbon degreasing treatment, the surface dyne value of copper-aluminum composite foil is ≥40.

[0046] (3) Oven air cooling

[0047] After being degreased with hydrocarbons, the copper-aluminum composite foil is baked in an oven at 120°C to dry the hydrocarbon degreaser on the surface of the material. Then, it is cooled by a cooling fan to reduce the temperature of the material before being sent into a copper-plating thickening electroplating tank.

[0048] (4) Copper plating thickening

[0049] After being air-cooled in an oven, the copper-aluminum composite foil is fed into a copper-thickening electroplating tank. Copper thickening is performed in the copper-thickening solution within the tank, primarily involving the deposition of 1μm of copper into the sputtered alloy layer of the aluminum foil. This copper plating is not only bright but also dense, without affecting the bending resistance of the copper-aluminum composite foil. The process parameters for controlling the copper-thickening solution during the copper-thickening process are shown in Table 2.

[0050] Table 2

[0051]

[0052] To ensure uniform coating thickness, a vertical electroplating process is used for copper thickening. The anode plates are parallel to both sides of the copper-aluminum composite material. A high-precision anode plate slot is designed to ensure the electrode spacing accuracy, guaranteeing an error within ±0.1mm. Figure 2 As shown, Figure 2 This is a detailed view of the copper-plating thickening electroplating tank described in this utility model.

[0053] (5) Wash with water

[0054] The copper-aluminum composite foil, after being thickened by copper plating, is sent to a cleaning tank for washing, and then sent to a copper layer roughening tank.

[0055] (6) Copper layer roughening

[0056] The copper-aluminum composite foil, after being washed with water, underwent copper roughening in a copper roughening solution in a copper roughening electroplating bath for 10 seconds. The process parameters for controlling the copper roughening solution during the roughening process are shown in Table 3.

[0057] Table 3

[0058]

[0059] (5) Wash with water

[0060] The copper-aluminum composite foil, after being roughened by the copper layer, is sent to a cleaning tank for washing, and then sent to a copper passivation electroplating tank.

[0061] (6) Copper layer passivation

[0062] The copper-aluminum composite foil, after being washed with water, undergoes copper passivation in a copper passivation plating bath. The process parameters for controlling the copper passivation solution during the passivation process are shown in Table 4.

[0063] Table 4

[0064]

[0065] (7) Washing - Oven cooling - Rewinding

[0066] The copper-aluminum composite foil, after passivation with copper layer, is sent to a cleaning tank for washing, then baked in an oven at 120°C, then cooled by a cooling fan to reduce the material temperature, and finally wound up by a winding machine to obtain the surface-modified copper-aluminum composite foil.

[0067] The copper-aluminum composite foil after the above surface treatment was subjected to performance tests, including surface dyne value test, peel strength test, room temperature storage test, and high temperature resistance test. The copper-aluminum composite foil before surface treatment was used as a comparison. The results are as follows:

[0068] The copper-aluminum composite foil treated by the surface treatment device described in this utility model has a surface dyne value of 42; the surface dyne value of the copper-aluminum composite foil before surface treatment is ≤36.

[0069] The copper-aluminum composite foil treated by the surface treatment device described in this utility model has a peel strength of 0.86 N / mm, which is higher than that of the copper-aluminum composite foil before surface treatment.

[0070] The copper-aluminum composite foil treated by the surface treatment device described in this utility model showed no oxidation or discoloration of the copper surface after being stored at room temperature for 200 days.

[0071] Copper-aluminum composite foil that has undergone surface treatment by the surface treatment device described in this utility model showed no oxidation or discoloration of the copper surface after being stored at 180°C for 1 hour.

[0072] The above description is only a preferred embodiment of the present utility model, but the protection scope of the present utility model is not limited thereto. Any equivalent substitutions or changes made by those skilled in the art within the technical scope disclosed in the present utility model, based on the technical solution and concept of the present utility model, should be included within the protection scope of the present utility model.

Claims

1. A surface treatment apparatus for copper-aluminum composite foil, characterized in that, Along the transmission direction of the device, the following are included in sequence: Feeding device; Hydrocarbon degreasing module; Copper-plated thickened module; Copper layer roughening module; Copper passivation module; Feeding device; A guide roller is disposed between the feeding device and the unloading device.

2. The surface treatment device of claim 1, wherein, The guide rollers are respectively disposed in the hydrocarbon degreasing module, the copper plating thickening module, the copper layer roughening module, and the copper layer passivation module.

3. The surface treatment device of claim 1, wherein, The hydrocarbon degreasing module includes, in sequence along the transport direction of the device, a hydrocarbon degreasing tank, a first drying device, and a first cooling device.

4. The surface treatment device of claim 1, wherein, The copper plating thickening module includes, in sequence along the transmission direction of the device, a copper plating thickening electroplating tank and a first cleaning tank. The copper plating thickening module also includes a temperature control device installed on the copper plating thickening electroplating tank.

5. The surface treatment device of claim 4, wherein, The copper plating thickening electroplating tank is a vertical electroplating tank.

6. The surface treatment device of claim 1, wherein, The copper layer roughening module includes, in sequence, a copper layer roughening electroplating tank and a second cleaning tank along the transmission direction of the device. The copper layer roughening module also includes a temperature control device installed on the copper layer roughening electroplating tank.

7. The surface treatment device of claim 6, wherein, The copper roughening electroplating tank is a vertical electroplating tank.

8. The surface treatment device of claim 1, wherein, The copper passivation module includes, in sequence along the transmission direction of the device, a copper passivation electroplating tank and a third cleaning tank. The copper passivation module also includes a temperature control device installed on the copper passivation electroplating tank.

9. The surface treatment device of claim 8, wherein, The copper passivation electroplating tank is a vertical electroplating tank.

10. The surface treatment device of claim 1, wherein, A second drying device and a second cooling device are also provided between the copper passivation module and the feeding device along the transmission direction of the device.

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