A cup-type electroplating tank

Abstract

The utility model discloses a cup formula electroplating cell, including frame body, drive mechanism, wafer clamp, lifting mechanism, electroplating cell, spout pipe, be provided with the drive mechanism of can drive wafer clamp rotation on the frame body, wafer clamp horizontal clamping wafer, be provided with the lifting mechanism of can drive electroplating cell vertical lifting on the frame body below wafer clamp, be provided with liquid inlet and liquid outlet on electroplating cell, and the spout pipe in the liquid inlet and electroplating cell intercommunication, be provided with a plurality of spout orifices on spout pipe. The utility model's advantage lies in, can satisfy for research and development stage test and optimization electroplating process parameter, and electroplating cell simple structure small, has saved experimental medicine water, and through the setting of drive mechanism, realizes and the similar rotation effect of mass production condition, reduces research and development experiment cost.

Description

Technical Field

[0001] This utility model relates to the field of electroplating equipment technology, specifically a cup-type electroplating tank. Background Technology

[0002] In the production process of semiconductor integrated circuits, it is necessary to electroplate the surface of the wafer to form a metal layer. Therefore, wafer electroplating is one of the key steps in the semiconductor wafer manufacturing process. The process involves placing the wafer in an electroplating solution, connecting a negative voltage to the wafer as a cathode, and connecting a positive voltage to a soluble or insoluble anode. Through the action of an electric field, metal ions in the electroplating solution are deposited onto the wafer surface.

[0003] In the field of advanced semiconductor packaging, the development of wafer-level electroplating processes requires extensive experimental verification of key parameters such as plating solution formulation, current density, and mass transfer efficiency. Current mainstream R&D platforms rely on commercial cup-type electroplating systems, whose design is geared towards mass production requirements, integrating closed-loop temperature control, high-precision flow management, and complex monitoring modules. This results in excessively high costs for single process verification during the R&D phase. More seriously, the fixed hardware architecture of these devices (such as fixed anode spacing and non-adjustable flow field structures) designed to ensure mass production stability severely limits the freedom of exploration within the process parameter window, leading to significant discrepancies between R&D data and actual operating conditions of mass-production equipment. Utility Model Content

[0004] The technical problem to be solved by this utility model is how to reduce the ownership cost of experimental research and development equipment.

[0005] To solve the above-mentioned technical problems, this utility model provides the following technical solution:

[0006] A cup-type electroplating tank includes a frame, a drive mechanism, a wafer clamp, a lifting mechanism, an electroplating tank, and a spray pipe. The frame is equipped with a drive mechanism that can drive the wafer clamp to rotate. The wafer clamp horizontally holds the wafer. The frame below the wafer clamp is equipped with a lifting mechanism that can drive the electroplating tank to move vertically. The electroplating tank is equipped with an inlet and an outlet. The inlet is connected to the spray pipe inside the electroplating tank. The spray pipe is equipped with multiple spray holes.

[0007] When bubbles are generated on the wafer, some of them are washed away by the electroplating solution sprayed from the nozzle, while the remaining bubbles are thrown off the wafer by the centrifugal force generated when the drive mechanism rotates the wafer. This ensures that there are no bubbles on the wafer during electroplating, improving the quality of wafer electroplating. It can meet the requirements for testing and optimizing electroplating process parameters in the R&D stage. In addition, the electroplating tank has a simple structure and small size, saving experimental chemicals. Furthermore, the drive mechanism can achieve a rotation effect similar to that of mass production conditions, reducing the ownership cost of experimental R&D equipment.

[0008] Preferably, the drive mechanism includes a drive motor, a belt drive assembly, and a rotating shaft. The drive motor is fixed on the frame, and the output end of the drive motor is connected to the rotating shaft through the belt drive assembly. The output end of the rotating shaft is connected to the wafer fixture.

[0009] Preferably, the electroplating tank includes an anodic electroplating tank, a cathodic electroplating tank, and an ion membrane. One end of the anodic electroplating tank is fixed to the lifting end of the lifting mechanism, and the other end is connected to the cathodic electroplating tank. An ion membrane is set between the cathodic electroplating tank and the anodic electroplating tank to divide the electroplating tank into a cathode chamber and an anode chamber. The liquid inlet and liquid outlet are both set on the cathodic electroplating tank.

[0010] Preferably, an anode is provided inside the anodic electroplating tank.

[0011] Preferably, both the cathode plating tank and the anode plating tank are transparent.

[0012] Preferably, a cathode is provided on the wafer fixture.

[0013] Preferably, the lifting mechanism is a telescopic cylinder.

[0014] Preferably, the jet holes on the jet pipe are evenly spaced.

[0015] Compared with the prior art, the beneficial effects of this utility model are:

[0016] When bubbles are generated on the wafer, some of them are washed away by the electroplating solution sprayed from the nozzle, while the remaining bubbles are thrown off the wafer by the centrifugal force generated when the drive mechanism rotates the wafer. This ensures that there are no bubbles on the wafer during electroplating, improving the quality of wafer electroplating. It can meet the requirements for testing and optimizing electroplating process parameters in the R&D stage. In addition, the electroplating tank has a simple structure and small size, saving experimental chemicals. Furthermore, the drive mechanism can achieve a rotation effect similar to that of mass production conditions, reducing the ownership cost of experimental R&D equipment. Attached Figure Description

[0017] Figure 1 This is a schematic diagram of the structure of an embodiment of the present utility model;

[0018] Figure 2 This is a schematic diagram of the electroplating tank in an embodiment of the present invention. Detailed Implementation

[0019] To facilitate understanding of the technical solution of this utility model by those skilled in the art, the technical solution of this utility model will now be further described in conjunction with the accompanying drawings.

[0020] In this application, unless otherwise expressly specified and limited, the terms "installation," "connection," "linking," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection, an electrical connection, or a communication connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this application according to the specific circumstances.

[0021] In this application, unless otherwise expressly specified and limited, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this application, "multiple" means two or more, unless otherwise expressly and specifically limited.

[0022] See Figure 1 and Figure 2 This embodiment discloses a cup-type electroplating tank, including a frame 1, a drive mechanism 2, a wafer clamp 3, a lifting mechanism 4, an electroplating tank 5, and a jet pipe 6.

[0023] The frame 1 is a rectangular structure with an internal central hole and one of its vertical surfaces open. The drive mechanism 2 is fixed to the outside of the frame 1. The wafer fixture 3, the lifting mechanism 4, and the electroplating tank 5 are all located inside the frame 1.

[0024] The drive mechanism 2 includes a drive motor 21, a belt drive assembly 22, and a rotating shaft 23. The drive motor 21 is fixed to the outside of the frame 1. The output end of the drive motor 21 is connected to the rotating shaft 23 via the belt drive assembly 22. The output end of the rotating shaft 23 extends into the interior of the frame 1 and is connected to the wafer fixture 3. Specifically, driving the drive motor 21 drives the rotating shaft 23 to rotate via the belt drive assembly 22, thereby driving the wafer fixture 3 to rotate. By setting up the drive mechanism 2, a rotation effect similar to that under mass production conditions is achieved, reducing the ownership cost of experimental R&D equipment.

[0025] The wafer clamp 3 is commercially available. The wafer clamp 3 horizontally clamps the wafer, and a cathode 7 is connected to the wafer clamp 3.

[0026] The lifting mechanism 4 is located inside the frame 1 below the wafer fixture 3. In this embodiment, the lifting mechanism is a telescopic cylinder, but it is not limited to this and can also be a screw lifting mechanism. The electroplating tank 5 is fixed to the lifting end of the lifting mechanism 4. Driving the lifting mechanism 4 can cause the electroplating tank 5 to rise or fall.

[0027] The electroplating tank 5 includes a cathode electroplating tank 51, an anode electroplating tank 52, and an ion membrane 53. One end of the anode electroplating tank 51 is fixed to the lifting end of the lifting mechanism 4, and the other end is connected to the cathode electroplating tank 52. An ion membrane 53 is set between the cathode electroplating tank 52 and the anode electroplating tank 51 to divide the electroplating tank 5 into a cathode chamber and an anode chamber. An anode 8 is set on the anode electroplating tank 51. The cathode electroplating tank 52 is provided with an inlet 521 and an outlet 522. Both the inlet 521 and the outlet 522 are connected to an external circulation pump. The inlet 521 is connected to a spray pipe 6 set in the cathode electroplating tank 52. A plurality of spray holes 61 are evenly spaced on the spray pipe 6, and the spray holes 61 are arranged in the direction of the wafer jig 3.

[0028] Furthermore, both the cathode plating tank 52 and the anode plating tank 51 are transparent tanks. In this embodiment, the transparent tanks are made of PVC round pipes, which have good effect and allow the plating status inside the tanks to be seen.

[0029] The working principle of this embodiment is as follows: First, the wafer is fixed on the wafer clamp 3. Then, the lifting mechanism 4 is driven to raise the electroplating tank 5, so that the wafer clamp 3 extends into the cathode electroplating tank 51. Then, the external circulation pump is driven, so that the electroplating solution is sprayed out from the spray hole 61 and aligned with the wafer on the wafer clamp 3. At the same time as the electroplating solution is sprayed, the drive motor 21 is driven, which drives the rotating shaft 23 to rotate through the belt drive assembly 22, thereby driving the wafer clamp 3 to rotate. When bubbles are generated on the wafer, some of the bubbles are... The air bubbles will be washed away by the electroplating solution sprayed from the nozzle 61. The remaining air bubbles that are not washed away by the electroplating solution will be thrown out of the wafer by the centrifugal force generated when the wafer rotates. This ensures that there are no air bubbles on the wafer during electroplating, thus improving the quality of wafer electroplating. By setting the lifting mechanism 4, the distance between the nozzle 6 and the wafer can be changed, thereby changing the scouring force of the electroplating solution on the wafer and meeting the requirements for wafer electroplating uniformity. It can be used for testing and optimizing electroplating process parameters in the research and development stage. Moreover, the electroplating tank 5 has a simple structure and small size, which saves experimental chemicals and reduces costs.

[0030] It will be apparent to those skilled in the art that this invention is not limited to the details of the exemplary embodiments described above, and that it can be implemented in other specific forms without departing from the spirit or essential characteristics of this invention. Therefore, the embodiments should be considered illustrative and non-limiting in all respects, and the scope of this invention is defined by the appended claims rather than the foregoing description. Thus, all variations falling within the meaning and scope of equivalents of the claims are intended to be included within this invention, and no reference numerals in the claims should be construed as limiting the scope of the claims.

[0031] The above-described embodiments are merely examples of implementation methods of the utility model. The scope of protection of this utility model is not limited to the above-described embodiments. For those skilled in the art, several modifications and improvements can be made without departing from the concept of this utility model, and these all fall within the scope of protection of this utility model.

Claims

1. A cup-type electroplating cell characterized by: The device includes a frame, a drive mechanism, a wafer clamp, a lifting mechanism, an electroplating tank, and a spray pipe. The frame is equipped with a drive mechanism that can rotate the wafer clamp. The wafer clamp holds the wafer horizontally. The frame below the wafer clamp is equipped with a lifting mechanism that can vertically lift the electroplating tank. The electroplating tank is equipped with an inlet and an outlet. The inlet is connected to a spray pipe inside the electroplating tank. The spray pipe is equipped with multiple spray holes.

2. A cup-type electroplating cell according to claim 1, wherein: The drive mechanism includes a drive motor, a belt drive assembly, and a rotating shaft. The drive motor is fixed on the frame, and the output end of the drive motor is connected to the rotating shaft through the belt drive assembly. The output end of the rotating shaft is connected to the wafer fixture.

3. A cup-type electroplating cell according to claim 1, wherein: The electroplating tank includes an anode electroplating tank, a cathode electroplating tank, and an ion membrane. One end of the anode electroplating tank is fixed to the lifting end of the lifting mechanism, and the other end is connected to the cathode electroplating tank. An ion membrane is set between the cathode electroplating tank and the anode electroplating tank to divide the electroplating tank into a cathode chamber and an anode chamber. The liquid inlet and liquid outlet are both set on the cathode electroplating tank.

4. A cup-type electroplating cell according to claim 3, wherein: An anode is installed inside the anodic electroplating tank.

5. A cup-type electroplating cell according to claim 3, wherein: Both the cathode plating tank and the anode plating tank are transparent.

6. A cup-type electroplating cell according to claim 1, wherein: A cathode is placed on the wafer fixture.

7. A cup-type electroplating cell according to claim 1 wherein: The lifting mechanism is a telescopic cylinder.

8. A cup-type electroplating cell according to claim 1, wherein: The jet holes on the jet pipe are evenly spaced.

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