A flip assembly having a flocked region

By directly forming a flocked area on the inner wall of the flip surface of the electronic product flip assembly, the problems of high processing cost and poor wear resistance in the existing technology are solved, realizing a low-cost flip assembly with good wear resistance, improving user experience and product life.

CN224592547UActive Publication Date: 2026-08-04DONGGUAN SIBEIXIU FLOCKING PROD CO LTD
View PDF 0 Cites 0 Cited by

Patent Information

Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
DONGGUAN SIBEIXIU FLOCKING PROD CO LTD
Filing Date
2025-10-17
Publication Date
2026-08-04

AI Technical Summary

Technical Problem

Existing technologies make it difficult to balance wear resistance and processing costs in the flip structure of electronic products while ensuring low clearance. Furthermore, the thickness and process complexity of traditional wear-resistant parts or strips increase processing difficulty and cost.

Method used

The flocking area flipping component is used to form the flocking area directly on the inner wall of the flipping surface. This includes a flocking adhesive layer and a fiber pile layer. The natural height of the fiber pile layer is greater than the height of the overlapping interface space. After compression, it equals this height, avoiding hard friction and filling gaps, thus reducing processing accuracy and cost.

Benefits of technology

It achieves a low-cost, wear-resistant flip-up component, reduces gaps in electronic products, improves user experience and product lifespan, and also has dustproof, waterproof, lubricating and quiet operation.

✦ Generated by Eureka AI based on patent content.

Smart Images

  • Figure CN224592547U_ABST
    Figure CN224592547U_ABST
Patent Text Reader

Abstract

This utility model belongs to the technical field of electronic product flip-fit ​​structures, and particularly relates to a flip component with a flocked area. It includes a first flip surface of a first component and a second flip surface of a second component. When the first flip surface rotates relative to the second flip surface, it can partially cover the surface of the second flip surface. The inner wall of the first flip surface and the surface of the second flip surface form an overlapping interface space that can communicate with the outside. The height of the overlapping interface space is 0.1-1mm. A flocked area is provided on the inner wall of the first flip surface located in the overlapping interface space. The natural height of the flocked area is greater than the height of the overlapping interface space, and the compressed height of the flocked area is equal to the height of the overlapping interface space. This structure balances processing costs and usage effects, simplifies the wear-resistant structural process without additional space occupation, achieves wear resistance and dust prevention, and reduces component shaking, jamming, and impact noise, meeting actual usage needs.
Need to check novelty before this filing date? Find Prior Art

Description

Technical Field

[0001] This utility model belongs to the technical field of electronic product flip-fit ​​structure, and particularly relates to a flip component with a flocked area. Background Technology

[0002] Currently, various electronic products commonly employ folding or flipping structures to maximize screen size during use and minimize it when stored. Because these structures need to meet the requirements of dynamic folding or flipping, there must be a necessary gap between the interfaces of the two relatively moving components to allow for relative movement.

[0003] However, due to limitations in current processing precision and technology, on the one hand, if the gap is to be controlled within a low range, the processing precision standard needs to be significantly improved, which will directly lead to a sharp increase in processing costs; on the other hand, from the perspective of technical principles and actual production, the gap can never be completely eliminated.

[0004] The smaller the gap, the easier it is for relative friction to occur between the two interfaces. To solve the problem of hard friction between the two interfaces, existing technologies attach wear-resistant parts or strips to the inner wall of one of the component interfaces. Traditionally, wear-resistant parts or strips are made by using flocking adhesive to create a soft friction layer on the substrate (such as fabric or plastic sheet). Then, the substrate with the soft friction layer is glued to the flip side of the electronic product to form the wear-resistant part or strip. However, the substrate is generally made of low-elasticity or non-elasticity materials and must have a certain thickness. Combined with the flocking adhesive layer and the adhesive layer that holds the substrate to the component, the overall thickness of the wear-resistant part or strip is relatively large. Therefore, recesses need to be created in the electronic product casing to facilitate adhesion and fixation, increasing the processing difficulty of the casing and complicating the process. The fixed thickness and hardness of the two adhesive layers mean that a large gap must be left between the flip sides of the electronic product, resulting in poor wear resistance and failing to solve the problem of extremely small gaps. Utility Model Content

[0005] The purpose of this invention is to provide a flipping component with a flocked area, which has the advantages of low processing cost and good wear resistance.

[0006] To achieve the above objectives, this utility model provides a flipping component with a flocked area, comprising a first flipping surface of a first component and a second flipping surface of a second component. When the first flipping surface rotates relative to the second flipping surface, it can partially cover the surface of the second flipping surface. The inner wall of the first flipping surface and the surface of the second flipping surface form an overlapping interface space that can communicate with the outside. The height of the overlapping interface space is 0.1-1mm. A flocked area is provided on the inner wall of the first flipping surface located in the overlapping interface space. The natural height of the flocked area is greater than the height of the overlapping interface space, and the compressed height of the flocked area is equal to the height of the overlapping interface space. The flocked area includes a flocking adhesive layer and a fiber fluff layer. The flocking adhesive layer is connected to the inner wall of the first flipping surface, the bottom end of the fiber fluff layer is connected to the flocking adhesive layer, and the top end of the fiber fluff layer abuts against the surface of the second flipping surface. The natural height of the flocked area refers to the vertical height of the flocked area when it is not subjected to any external pressure. The compression height of the flocked area refers to the compression height formed when the flocked area is compressed by both the inner wall of the first flipping surface and the surface of the second flipping surface. The compression height of the flocked area is determined by the distance between the inner wall of the first flipping surface and the surface of the second flipping surface.

[0007] Furthermore, the height of the overlapping interface space is 0.1-0.5mm, for example, it can be 0.1mm, 0.2mm, 0.3mm, or 0.4mm.

[0008] Furthermore, the thickness of the flocking adhesive layer in the flocking area is 0.03-0.3mm, for example, it can be 0.03-0.08mm, 0.1-0.15mm, 0.16-0.2mm, or 0.21-0.3mm.

[0009] Furthermore, the natural height of the fiber pile layer in the flocked area is 0.1-5mm, for example, it can be 0.1-1mm, 1-2mm, 2-3mm, or 3-5mm.

[0010] Furthermore, the fiber pile layer in the flocked area has a pile thickness of 0.6D-100D, for example, it can be 0.6-1D, 1-10D, 10-50D, or 50-100D.

[0011] Furthermore, the height of the overlapping interface space is 0.1-0.4mm; the thickness of the flocking adhesive layer in the flocking area is 0.03-0.1mm; the natural height of the fiber flock layer is 0.1-1mm; and the flock thickness of the fiber flock layer is 0.6D-6D.

[0012] Furthermore, the first and second components are folded and flipped via hinges.

[0013] Furthermore, the first flip surface of the first component and the second flip surface of the second component are planes.

[0014] Furthermore, the first component is a mobile phone frame and there are two of them, and the second component is a hinge cover plate. The two mobile phone frames are connected to the hinge cover plate through hinges and can rotate with each other. The two mobile phone frames are folded towards the middle along the hinges. The inner wall of the mobile phone frame rotates along the surface of the hinge cover plate to form an overlapping interface space. The flocked area is set on the inner side wall of the mobile phone frame, and the top of the fiber flock layer abuts against the surface of the hinge cover plate.

[0015] Furthermore, the first component is a keyboard, and the second component is a hinge cover plate. One end of the hinge is connected to a computer screen, and the other end of the hinge is connected to the keyboard. The computer screen flips along the hinge toward the keyboard, and the second flipping surface of the hinge cover plate flips along the first flipping surface of the keyboard to form an overlapping interface space. The flocked area is set on the inner side wall of the keyboard, and the top of the fiber flock layer abuts against the surface of the hinge cover plate.

[0016] The above-described one or more technical solutions of the flipping component with a flocked area provided in this embodiment of the utility model have at least one of the following technical effects: I. Cost and Processing Optimization: The overlap interface height is set to 0.1-1mm to balance processing costs and performance. The flocked area consists only of the flocking adhesive layer and the fiber pile layer. The fiber pile layer, in its natural state, can fully seal the gaps and can be fully compressed during relative rotation. The flocked area can be directly obtained on the surface of the flipping surface through the flocking process, eliminating the need for attachment grooves and reducing processing precision requirements and costs. Compared to existing technologies that require flocking to the substrate before adhesion, this reduces the thickness of the wear-resistant part and minimizes the gap between the flipping surfaces of electronic products. Suitable for the needs of thin, light, foldable, and flip-able electronic products such as mobile phones, laptops, and tablets.

[0017] 2. Wear Resistance: The natural height of the fiber flock layer is greater than the height of the overlapping interface space, and equals the height after compression. When flipping, it can fill the gap between components, which on the one hand avoids hard friction between the first flipping surface and the second flipping surface, reduces component wear, and extends service life (such as in foldable mobile phones, laptops, etc.); on the other hand, it achieves dustproof, waterproof, lubricating, and silent effects, preventing dust from entering and causing problems such as hinge jamming. At the same time, setting the flocked area inside the first flipping surface provides a good concealment effect and protection for the flocked area.

[0018] 3. Low rebound damping: The flocked area is thin, so there is no need to overcome excessive resistance when folding and flipping electronic products, making the operation smoother and effectively improving the user experience. At the same time, it avoids the problem of operation jamming or component wear caused by excessive damping force. Attached Figure Description

[0019] To more clearly illustrate the technical solutions in the embodiments of this utility model, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0020] Figure 1 This is a cross-sectional schematic diagram of a flipping component provided in Embodiment 1 of this utility model.

[0021] Figure 2 for Figure 1 A magnified view of a portion of point A in the middle.

[0022] Figure 3 This is a schematic diagram of the flocked area.

[0023] Figure 4 This is a schematic diagram of a folding phone according to Embodiment 2 of this utility model.

[0024] Figure 5 This is a schematic diagram of a laptop computer according to Embodiment 3 of this utility model.

[0025] Figure 6 for Figure 5 A partial sectional view at point B in the middle.

[0026] The following are the labeling elements in the figure: 1 First component, 11 First flipping surface, 2 Second component, 21 Second flipping surface, 3 Overlapping interface space, 4 Flocking area, 5 Flocking adhesive layer, 6 Fiber fluff layer. Detailed Implementation

[0027] The embodiments of the present invention are described in detail below, examples of which are shown in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and intended to explain the embodiments of the present invention, and should not be construed as limiting the present invention.

[0028] In the description of the embodiments of this utility model, it should be understood that the terms "length", "width", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings. They are only for the convenience of describing the embodiments of this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model.

[0029] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of embodiments of this utility model, "a plurality of" means two or more, unless otherwise explicitly specified.

[0030] In this embodiment of the invention, unless otherwise explicitly specified and limited, the terms "installation," "connection," "linking," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this embodiment of the invention according to the specific circumstances.

[0031] like Figure 1-2 As shown, in one embodiment of this utility model, a flipping assembly with a flocked area is provided, including a first flipping surface 11 of a first component 1 and a second flipping surface 21 of a second component 2. When the first flipping surface 11 rotates relative to the second flipping surface 21, it can partially cover the surface of the second flipping surface 21. The inner wall of the first flipping surface 11 and the surface of the second flipping surface 21 form an overlapping interface space 3 that can communicate with the outside. With the flipping movement of the first component 1 and the second component 2, the overlapping interface space 3 that communicates with the outside drives the orderly flow of air. When folded, the air is squeezed out, forming an airflow barrier to prevent dust from entering and also to avoid negative pressure from sucking in foreign objects.

[0032] Specifically, the height of the overlapping interface space 3 is 0.1-1mm. For example, a gap height of 0.1-0.5mm is the minimum gap that can be maintained in some high-precision products such as foldable screen phones or foldable cameras; it can also be 0.5-1mm, such as the minimum gap that can be maintained in relatively large electronic products like laptops and foldable tablets. This parameter can balance processing costs and actual usage effects, avoiding problems such as excessive gaps between components due to excessive height of the overlapping interface space 3 leading to insufficient aesthetics and easy entry of foreign objects, or excessive processing costs or movement obstruction due to excessive height of the overlapping interface space 3. Preferably, the first component 1 and the second component 2 are folded and flipped through a hinge; the first flipping surface 11 of the first component 1 and the second flipping surface 21 of the second component 2 are planar.

[0033] The folding and flipping process of the above components is as follows: In the initial state, the first component 1 and the second component 2 are in an unfolded state (usually around 180°), and the first flipping surface 11 is separated from the second flipping surface 21. When the user applies external force, the hinge drives the first component 1 and the second component 2 to rotate relative to each other around the axis, enter the folding and flipping stage, and finally rotate to a preset angle (such as 0° closed or a specific angle positioning), completing the entire movement process.

[0034] like Figure 1-3 As shown, specifically, the flocked area 4 is directly obtained on the inner wall of the first flipped surface 11 within the overlapping interface space 3 through a flocking process, without the need for attaching grooves or additional anti-wear structures as in existing technologies. This flocked area 4 consists of only two parts: a flocking adhesive layer 5 with a thickness of 0.03-0.3 mm, and a fiber flock layer 6 with a natural height of 0.1-5 mm and a flock thickness of 0.6D-100D. The unit of flock thickness is denier (D). Specifically, the flocking adhesive layer 5 is connected to the inner wall of the first flipped surface 11, the bottom end of the fiber flock layer 6 is connected to the flocking adhesive layer 5, and the top end of the fiber flock layer 6 abuts against the surface of the second flipped surface 21. The fiber flock layer 6 must satisfy the following adaptation relationship: the natural height of the fiber flock layer 6 before compression > the height of the overlapping interface space 3; the height of the fiber flock layer 6 after compression = the height of the overlapping interface space 3. The natural height of the flocked area 4 refers to the vertical height of the flocked area 4 when it is not subjected to any external pressure. The compression height of the flocked area 4 refers to the compression height formed by the flocked area 4 when it is compressed by both the inner wall of the first flipping surface 11 and the surface of the second flipping surface 21. The compression height of the flocked area 4 is determined by the distance between the inner wall of the first flipping surface 11 and the surface of the second flipping surface 21.

[0035] When the first flipping surface 11 flips along the second flipping surface 21, the second flipping surface 21 comes into contact with the fiber pile layer 6 of the flocked area 4. The fiber pile layer 6 is simultaneously compressed to the height of the overlapping interface space 3. This avoids hard friction during relative movement of components (folding, flattening) to achieve wear resistance and noise reduction, while also filling the gaps to achieve dust and water resistance. Specifically, the flocked area 4 is hidden within the overlapping interface space 3 of the first flipping surface 11 and the second flipping surface 21, in the inner contact area of ​​the electronic product in the closed state or in the visual blind spot near the hinge cover. It will not form visible marks on the product's appearance surface, nor will it affect the integrity of the overall design, thus maintaining the product's exquisite aesthetics while achieving functionality.

[0036] Compared to existing technologies that require multiple steps such as "component cleaning - attachment groove parameter design - milling - flocking - hot melt adhesive bonding" to attach wear-resistant parts, and where the attachment groove occupies internal space of the component, the structure of this utility model obtains the flocked area 4 directly in the first flipping surface 11 through the flocking process. This not only eliminates the need for additional space but also greatly simplifies the process, reducing costs and processing accuracy requirements.

[0037] In addition, the flocked area 4 is thin, so when electronic products are folded and flipped, there is no need to overcome excessive resistance, making the operation smoother and effectively improving the user experience. At the same time, it avoids the problem of operation jamming or component wear caused by excessive damping force.

[0038] Based on the above-mentioned basic structure of a flip component with a flocked area, this utility model is further adapted to different application scenarios, forming multiple specific embodiments.

[0039] like Figure 1-4 As shown, in the second embodiment of this utility model, for foldable mobile phone scenarios, it can generally have a double-fold and triple-fold structure. As a double-fold mobile phone, the first component 1 is the mobile phone frame and there are two of them. The second component 2 is the hinge cover. The two mobile phone frames are connected to the hinge cover through hinges and realize mutual flipping movement to form a folded and unfolded state. The first flipping surface 11 is the plane of the mobile phone frame close to the hinge cover. The second flipping surface 21 is the upper surface of the hinge cover. Under the restriction of the hinge, the two mobile phone frames flip from the side of the hinge cover to cover the surface of the hinge cover to form an unfolded structure. The reverse movement forms a folded structure. Therefore, the two mobile phone frames form an overlapping interface space 3 with the surface of the hinge cover. The flocked area 4 is correspondingly set on the inner wall of the first flipping surface 11 of the two mobile phone frames. The top of the fiber flock layer 6 abuts against the surface of the hinge cover and moves.

[0040] Preferably, the thickness of the flocking adhesive layer 5 in the flocking area 4 is 0.03-0.1mm, the natural height of the fiber flock layer 6 in the flocking area 4 is 0.1-1mm, the flock thickness of the fiber flock layer 6 is 0.6-6D, and the height of the overlapping interface space 3 is 0.1-0.4mm, to meet the requirements of thinner and lighter mobile phones. Specifically, when the two mobile phone frames are folded towards the middle along the hinge, the first flip surface 11 of the two mobile phone frames simultaneously flips along the second flip surface 21 of the hinge cover. At this time, the fiber flock layer 6 is compressed, filling the gap between the mobile phone frame and the hinge cover, avoiding hard friction and friction noise between the first flip surface 11 and the second flip surface 21, which would cause wear on the first component 1 and the second component 2, reduce service life, and also prevent dust from entering the inside of the body (in traditional structures, dust easily accumulates due to gaps, causing the hinge to jam).

[0041] refer to Figure 1-35-6 In the third embodiment of this utility model, specifically for the opening and closing scenario of a laptop computer, the first component 1 is a keyboard, the second component 2 is a hinge cover, one end of the hinge is connected to the computer screen, the other end of the hinge is connected to the keyboard, the computer screen flips along the hinge toward the keyboard, the second flipping surface 21 of the hinge cover flips along the first flipping surface 11 of the keyboard to form an overlapping interface space 3, the flocked area 4 is set on the inner side wall of the keyboard, and the top of the fiber flock layer 6 abuts against the surface of the hinge cover. Preferably, the thickness of the flocking adhesive layer 5 in the flocking area 4 is 0.1-0.15mm, the natural height of the fiber pile layer 6 in the flocking area 4 is 2-3mm, the pile thickness of the fiber pile layer 6 is 30-50D, and the height of the overlapping interface space 3 is 0.5-1mm. When the computer screen flips and folds along the hinge toward the keyboard, the second flip surface 21 of the hinge cover moves along the first flip surface 11 of the keyboard, the fiber pile layer 6 is compressed, and fills the gap between the hinge cover and the keyboard. The elastic deformation of the fiber pile layer 6 can buffer the impact force and reduce the wear of the hinge cover and the keyboard.

[0042] The rest of the above embodiments are the same as those in Embodiment 1. Features not explained in the above embodiments are explained using the methods in Embodiment 1, and will not be repeated here.

[0043] The above description is only a preferred embodiment of the present utility model and is not intended to limit the present utility model. Any modifications, equivalent substitutions and improvements made within the spirit and principles of the present utility model should be included within the protection scope of the present utility model.

Claims

1. A flip-up component with a flocked area, characterized in that: The device includes a first flipping surface of a first component and a second flipping surface of a second component. When the first flipping surface rotates relative to the second flipping surface, it can partially cover the surface of the second flipping surface. The inner wall of the first flipping surface and the surface of the second flipping surface form an overlapping interface space that can communicate with the outside. The height of the overlapping interface space is 0.1-1mm. A flocked area is provided on the inner wall of the first flipping surface located in the overlapping interface space. The natural height of the flocked area is greater than the height of the overlapping interface space. The compressed height of the flocked area is equal to the height of the overlapping interface space. The flocked area includes a flocking adhesive layer and a fiber fluff layer. The flocking adhesive layer is connected to the inner wall of the first flipping surface. The bottom end of the fiber fluff layer is connected to the flocking adhesive layer. The top end of the fiber fluff layer abuts against the surface of the second flipping surface.

2. A flipping component with a flocked area according to claim 1, characterized in that: The height of the overlapping interface space is 0.1-0.5mm.

3. A flipping component with a flocked area according to claim 1, characterized in that: The thickness of the flocking adhesive layer in the flocked area is 0.03-0.3 mm.

4. A flipping component with a flocked area according to claim 1, characterized in that: The natural height of the fiber pile layer in the flocked area is 0.1-5mm.

5. A flipping component with a flocked area according to claim 1, characterized in that: The fiber pile layer of the flocked area has a pile thickness of 0.6D-100D.

6. A flipping component with a flocked area according to any one of claims 1-5, characterized in that: The height of the overlapping interface space is 0.1-0.4mm; the thickness of the flocking adhesive layer in the flocking area is 0.03-0.1mm; the natural height of the fiber flock layer is 0.1-1mm, and the flock thickness of the fiber flock layer is 0.6D-6D.

7. A flipping component with a flocked area according to claim 1, characterized in that: The first component and the second component are folded and flipped by hinges.

8. A flipping component with a flocked area according to claim 7, characterized in that: The first flip surface of the first component and the second flip surface of the second component are planes.

9. A flipping component with a flocked area according to claim 1, characterized in that: The first component is a mobile phone frame, and there are two of them. The second component is a hinge cover plate. The two mobile phone frames are connected to the hinge cover plate by hinges and can rotate relative to each other. The two mobile phone frames are folded towards the middle along the hinges. The inner wall of the mobile phone frame rotates along the surface of the hinge cover plate to form an overlapping interface space. The flocked area is set on the inner side wall of the mobile phone frame, and the top of the fiber flock layer abuts against the surface of the hinge cover plate.

10. A flipping component with a flocked area according to claim 1, characterized in that: The first component is a keyboard, and the second component is a hinge cover. One end of the hinge is connected to a computer screen, and the other end of the hinge is connected to the keyboard. The computer screen flips along the hinge toward the keyboard, and the second flipping surface of the hinge cover flips along the first flipping surface of the keyboard to form an overlapping interface space. The flocked area is located on the inner sidewall of the keyboard, and the top of the fiber flock layer abuts against the surface of the hinge cover.