A profile heat dissipation device for photovoltaic frame processing

Abstract

This utility model discloses a profile heat dissipation device for photovoltaic frame processing, relating to the field of photovoltaic frame processing technology. The utility model includes an upper plate, a lower plate, and several heat dissipation modules. Both the upper and lower plates are strip-shaped plates. An upper profile groove and a lower profile groove are respectively provided along the length direction on the lower surface of the upper plate and the upper surface of the lower plate. The upper plate is fitted onto the upper surface of the lower plate, and a profile through-slot is formed between the upper and lower profile grooves. This utility model utilizes the profile through-slot formed between the upper and lower plates for heat absorption through the profile passing through and contacting it. The heat dissipation modules can quickly dissipate heat, resulting in good integration, reduced conduction paths, and thus reduced thermal resistance, achieving efficient heat dissipation. Simultaneously, the structure is compact and simple, reducing space occupation and enabling rapid integration with the production line. Heat dissipation can be achieved during profile conveying, allowing heat to pass through the heat dissipation device and improving production line stability.

Description

Technical Field

[0001] This utility model belongs to the field of photovoltaic frame processing technology, and in particular relates to a profile heat dissipation device for photovoltaic frame processing. Background Technology

[0002] In the field of photovoltaic frame processing, the profiles generate a certain amount of heat during extrusion, cutting and other processing. Due to the lightweight nature of photovoltaic frames, they are prone to deformation without heat dissipation, which affects subsequent frame assembly and other processes, impacting work efficiency and yield.

[0003] Existing heat dissipation devices are mostly divided into air cooling and liquid cooling. Air cooling relies on air convection and has limited heat dissipation capacity, while liquid cooling has a complex structure, high maintenance costs and the risk of leakage. At the same time, traditional heat dissipation architectures (such as remote cold plates) have long heat transfer paths, high thermal resistance, which affects heat dissipation performance and are prone to problems such as large space occupation and difficulty in integration. Summary of the Invention

[0004] The purpose of this utility model is to provide a profile heat dissipation device for photovoltaic frame processing. The profile through groove formed between the upper and lower plates allows the profile to pass through and absorb heat. The heat dissipation module can quickly dissipate heat, resulting in good integration effect, reduced conduction path and thus reduced thermal resistance, achieving efficient heat dissipation. At the same time, the structure is compact and simple, reducing space occupation, and can be quickly linked with the production line. The profile can pass through the heat dissipation device during the conveying process to achieve heat dissipation, improving the stability of the production line.

[0005] To solve the above-mentioned technical problems, this utility model is achieved through the following technical solution:

[0006] This utility model is a profile heat dissipation device for photovoltaic frame processing, including an upper plate, a lower plate and several heat dissipation modules;

[0007] Both the upper plate and the lower plate are strip-shaped plates. The lower surface of the upper plate and the upper surface of the lower plate are respectively provided with an upper profile groove and a lower profile groove along the length direction. The upper plate is fitted onto the upper surface of the lower plate, and a profile through groove is formed between the upper profile groove and the lower profile groove.

[0008] Several of the aforementioned heat dissipation modules are symmetrically arranged in two rows on the top surface of the upper plate and the bottom surface of the lower plate;

[0009] The heat dissipation module includes a heat absorption plate, which is fixed on the upper surface of the upper plate or the lower surface of the lower plate. A heat collection base is fixed at the center of the top of the heat absorption plate. A heat pipe assembly is provided on the heat collection base. Fin assemblies are connected to both ends of the heat pipe assembly. The fin assemblies are located above the heat absorption plate and the heat collection base. Fans are fixed between and on the outside of the two fin assemblies.

[0010] Furthermore, the heat pipe assembly is composed of several heat pipe bodies, each heat pipe body including a horizontal pipe section, both ends of which are connected to a vertical section via bends, and the two fin assemblies are respectively disposed on the vertical sections at both ends of the several heat pipe bodies.

[0011] Furthermore, the heat collection base is provided with several preset holes, and the horizontal pipe section is fixed through and fixed in the preset holes.

[0012] Furthermore, the three fans on the heat dissipation module are installed in the same direction and the blades rotate in the same direction.

[0013] Furthermore, each of the four corners of the upper and lower plates is provided with an installation port, which is offset from the position of the heat dissipation module.

[0014] Furthermore, thermally conductive adhesive is provided at the connection points between the heat absorber plate and the upper or lower plate, the connection points between the heat collector base and the heat absorber plate, and the connection points between the horizontal pipe section and the preset hole.

[0015] This utility model has the following beneficial effects:

[0016] This utility model uses a profile through-slot formed between the upper and lower plates for the profile to pass through and absorb heat. The heat dissipation module can quickly dissipate the heat, resulting in good integration, reduced conduction path and thus reduced thermal resistance, achieving efficient heat dissipation. At the same time, the structure is compact and simple, reducing space occupation, and can be quickly linked with the production line. The profile can pass through the heat dissipation device during the conveying process to achieve heat dissipation, improving the stability of the production line.

[0017] Of course, any product implementing this utility model does not necessarily need to achieve all of the advantages described above at the same time. Attached Figure Description

[0018] To more clearly illustrate the technical solutions of the embodiments of this utility model, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0019] Figure 1 This is a schematic diagram of the structure of a profile heat dissipation device for photovoltaic frame processing according to the present invention;

[0020] Figure 2 A structural schematic diagram of the heat dissipation module viewed from below;

[0021] The attached diagram lists the components represented by each number as follows:

[0022] 1-Upper plate, 2-Lower plate, 3-Heat dissipation module, 101-Upper profile slot, 102-Mounting port, 201-Lower profile slot, 301-Heat absorber plate, 302-Heat collector base, 303-Heat pipe assembly, 304-Fin assembly, 305-Fan, 306-Horizontal pipe section, 307-Bending section, 308-Vertical section. Detailed Implementation

[0023] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those skilled in the art without creative effort are within the protection scope of the present utility model.

[0024] Please see Figure 1-2 As shown, this utility model is a profile heat dissipation device for photovoltaic frame processing, including an upper plate 1, a lower plate 2 and several heat dissipation modules 3;

[0025] Both the upper plate 1 and the lower plate 2 are strip-shaped plates. The lower surface of the upper plate 1 and the upper surface of the lower plate 2 are respectively provided with an upper profile groove 101 and a lower profile groove 201 along the length direction. The upper plate 1 is attached to the upper surface of the lower plate 2, and a profile through groove is formed between the upper profile groove 101 and the lower profile groove 201.

[0026] Several heat dissipation modules 3 are symmetrically arranged in two rows on the top surface of the upper plate 1 and the bottom surface of the lower plate 2;

[0027] The heat dissipation module 3 includes a heat absorption plate 301, which is fixed on the upper surface of the upper plate 1 or the lower surface of the lower plate 2. A heat collector 302 is fixed at the center of the top of the heat absorption plate 301. A heat pipe assembly 303 is provided on the heat collector 302. Fin assemblies 304 are connected to both ends of the heat pipe assembly 303. The fin assemblies 304 are located above the heat absorption plate 301 and the heat collector 302. Fans 305 are fixed between the two fin assemblies 304 and on the outside.

[0028] Among them, such as Figure 2 As shown, the heat pipe assembly 303 is composed of several heat pipe bodies. Each heat pipe body includes a horizontal pipe section 306. Both ends of the horizontal pipe section 306 are connected to a vertical section 308 via a bend 307. Two fin assemblies 304 are respectively disposed on the vertical sections 308 at both ends of the several heat pipe bodies.

[0029] Among them, such as Figure 2 As shown, the heat collector base 302 is provided with several preset holes, and the horizontal pipe section 306 is fixed through and fixed in the preset holes.

[0030] Among them, the three fans 305 on the heat dissipation module 3 are installed in the same direction and the blades rotate in the same direction.

[0031] Among them, such as Figure 1 As shown, mounting ports 102 are provided at the four corners of the upper plate 1 and the lower plate 2, and the mounting ports 102 are misaligned with the heat dissipation module 3.

[0032] Thermal conductive adhesive is provided at the connection points of the heat absorber plate 301 with the upper plate 1 or the lower plate 2, the connection points of the heat collector 302 with the heat absorber plate 301, and the connection points of the horizontal pipe section 306 with the preset hole.

[0033] In the description of this specification, references to terms such as "an embodiment," "example," "specific example," etc., indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of the present invention. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples.

[0034] The preferred embodiments of this utility model disclosed above are merely illustrative of the present utility model. These preferred embodiments do not exhaustively describe all details, nor do they limit the utility model to the specific implementations described. Clearly, many modifications and variations can be made based on the content of this specification. This specification selects and specifically describes these embodiments to better explain the principles and practical applications of this utility model, thereby enabling those skilled in the art to better understand and utilize it. This utility model is limited only by the claims and their full scope and equivalents.

Claims

1. A profile heat dissipation device for photovoltaic frame processing, characterized in that: It includes an upper plate (1), a lower plate (2), and several heat dissipation modules (3); The upper plate (1) and the lower plate (2) are both strip plates. The lower surface of the upper plate (1) and the upper surface of the lower plate (2) are respectively provided with an upper profile groove (101) and a lower profile groove (201) along the length direction. The upper plate (1) is attached to the upper surface of the lower plate (2). A profile through groove is formed between the upper profile groove (101) and the lower profile groove (201). Several heat dissipation modules (3) are respectively arranged symmetrically in two rows on the top surface of the upper plate (1) and the bottom surface of the lower plate (2); The heat dissipation module (3) includes a heat absorption plate (301), which is fixed on the upper surface of the upper plate (1) or the lower surface of the lower plate (2). A heat collector (302) is fixed at the center of the top of the heat absorption plate (301). A heat pipe assembly (303) is provided on the heat collector (302). A fin assembly (304) is connected to both ends of the heat pipe assembly (303). The fin assembly (304) is located above the heat absorption plate (301) and the heat collector (302). A fan (305) is fixed between and on the outside of the two fin assemblies (304).

2. The profile heat sink device for photovoltaic frame processing according to claim 1, characterized in that, The heat pipe assembly (303) is composed of several heat pipe bodies, each heat pipe body including a horizontal pipe section (306), both ends of which are connected to a vertical section (308) via a bend (307), and two fin assemblies (304) are respectively disposed on the vertical sections (308) at both ends of the several heat pipe bodies.

3. The profile heat sink device for photovoltaic frame processing according to claim 2, characterized in that, The heat collection base (302) is provided with several preset holes, and the horizontal pipe section (306) is fixed through and fixed in the preset holes.

4. The profile heat sink device for photovoltaic frame processing according to claim 1, characterized in that, The three fans (305) on the heat dissipation module (3) are installed in the same direction and the blades rotate in the same direction.

5. The profile heat sink device for photovoltaic frame processing according to claim 1, characterized in that, The upper plate (1) and the lower plate (2) are provided with mounting ports (102) at the four corners, and the mounting ports (102) are misaligned with the heat dissipation module (3).

6. The profile heat sink device for photovoltaic frame processing according to claim 3, characterized in that, The heat-conducting adhesive is provided at the connection between the heat-absorbing plate (301) and the upper plate (1) or the lower plate (2), at the connection between the heat-collecting base (302) and the heat-absorbing plate (301), and at the connection between the horizontal pipe section (306) and the preset hole.

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