A novel gap measuring device

Abstract

The utility model provides a novel gap measuring device for measuring the gap between the bearing base and target conductor part belongs to the semiconductor integrated circuit manufacturing technology and industrial measurement field in high -end equipment manufacturing industry is used for placing on the bearing base in the vacuum cavity, including shell (7), circuit board (1), electrode part (2), processing module (3) and power supply circuit (8). Electrode part (2) and processing module (3) are all electrically connected on the circuit board (1), and electrode part (2) is electrically connected with processing module (3) through the circuit board (1), and electrode part (2) forms a capacitor with the target conductor part;At least power supply circuit (8) is arranged on the surface of shell (7), and power supply circuit (8) is at least electrically connected with electrode part (2) and processing module (3) respectively and supplies power to them.

Description

Technical Field

[0001] This application relates to semiconductor integrated circuit manufacturing technology and industrial measurement in the high-end equipment manufacturing industry, and in particular to a novel gap measuring device. Background Technology

[0002] As semiconductor component sizes continue to shrink, advanced semiconductor integrated circuit etching equipment is facing significant challenges in the wafer manufacturing etching process. To ensure product consistency and maximum throughput, many critical process steps rely on precise adjustments to the gap distance between the substrate or wafer pedestal and the target conductor component, as well as the parallelism of the two planes.

[0003] In related technologies, common methods for measuring gaps and parallelism involve using motor drive pulses and lead screw pitch in a machine tool servo system for position calibration and measurement, and then measuring the tilt angle relative to the horizontal position using a level. Building upon this, a method using capacitance principles for distance measurement has emerged, which improves measurement accuracy to some extent.

[0004] However, all of the aforementioned measuring instruments face the problem of powering the measuring module. The battery unit powers the measuring module, and the battery unit needs to use an active power source or a rechargeable battery. The application range of active power sources is limited, and rechargeable batteries will face the problem of battery replacement if they fail, which will increase maintenance costs and reduce production efficiency. Therefore, there is still room for improvement. Utility Model Content

[0005] The purpose of this application is to provide a novel gap measuring device that measures the gap distance between a support base and a target conductor component, as well as the parallelism of two planes, with an externally mounted battery. The battery can be replaced without disassembling the outer casing, thus improving product efficiency.

[0006] To achieve the objectives of this application, the technical solution adopted is as follows:

[0007] A novel gap measuring device for measuring the gap between a support base and a target conductor component, for placement on a support base within a vacuum chamber, comprising at least: a housing 7.

[0008] Circuit board 1, electrode components 2 and processing module 3, power supply circuit 8;

[0009] Both electrode component 2 and processing module 3 are electrically connected to circuit board 1. Electrode component 2 is electrically connected to processing module 3 through circuit board 1. Electrode component 2 and target conductor component form a capacitor.

[0010] Processing module 3 includes controller 31 and amplifier circuit 32. Amplifier circuit 32 is electrically connected to controller 31. Amplifier circuit 32 is used to increase the range of excitation voltage. Controller 31 is used to apply excitation voltage to electrode component 2 and obtain capacitance value, and then convert it to obtain target gap data. Target gap data is used to indicate the gap between the bearing base and the target conductor component.

[0011] At least a power supply circuit 8 is disposed on the surface of the housing, and the power supply circuit is electrically connected to and supplies power to the electrode component 2 and the processing module 3 respectively.

[0012] Preferably, at least the circuit board 1 is disposed within the housing.

[0013] Preferably, the interface of the power supply circuit 8 is electrically connected to the interface on the circuit board 1. Correspondingly, the electrode component 2 and the processing module 3 are also connected to the circuit board 1, so that the power supply circuit 8 is electrically connected to the electrode component 2 and the processing module 3 respectively and supplies them with power.

[0014] Preferably, the power supply circuit 8 is disposed on the outside of the electrode component 2.

[0015] Preferably, the height relationship of the upper surface of the power supply circuit 8 is as follows: the upper surface is at the same level as the upper surface of the electrode component 2; the upper surface (85) is lower than the upper surface of the electrode component (2); or the upper surface is higher than the upper surface of the electrode component 2.

[0016] Preferably, the power supply circuit 8 is fixed to the housing in any one or more of the following ways: welding; screw fixing; bonding; inserting into the housing (7) by plugging; or embedding in a groove provided on the housing, the size of the groove being adapted to the size of the power supply.

[0017] Preferably, the housing includes at least a first step 71 and a second step 72, the first step 71 is disposed on the second step 72, the electrode component 2 is fixed on the first step 71, and at least a part of the power supply circuit 8 is disposed on the second step 72.

[0018] Preferably, the surface area of ​​the first step 71 is smaller than the surface area of ​​the second step 72.

[0019] Preferably, the height relationship between the first step 71 and the second step 72 is as follows: the first step 71 is higher than the second step 72; the upper surfaces of the first step 71 and the second step 72 are on the same horizontal plane; or the second step 72 is higher than the first step 71.

[0020] Preferably, the inner end 81 of the power supply circuit 8 is disposed in contact with the outer edge of the first step 71.

[0021] More preferably, at least from the perspective of ease of processing, the shape of the inner end 81 is adapted to the edge shape of the first step 71, so that the power circuit 8, more precisely the battery 83, is disposed in contact with the edge of the first step 71. In particular, when the first step 71 is higher than the second step 72, the power circuit 8 is easier to install and fix by being disposed in contact with the edge.

[0022] More preferably, the inner end 81 is connected to an adapter interface, the shape of which facing the first step 71 is adapted to the edge shape of the first step 71. Correspondingly, the adapter interface is preferably connected to the circuit board 1, or it can be directly electrically connected to the electrode component 2 and the processing module 3 respectively.

[0023] Preferably, there is a gap between the inner end 81 of the power supply circuit 8 and the outer edge of the first step 71, and the power supply circuit 8 is electrically connected to the processing module 3 disposed in the housing by means of a wire 82 attached to the second step 72.

[0024] Preferably, the height relationship of the upper surface 85 of the power supply circuit 8 is as follows: the upper surface 85 is lower than the upper surface 85 of the first step 71; 85 and the upper surface 85 of the first step 71 are on the same horizontal plane; or the upper surface 85 is higher than the upper surface 85 of the first step 71.

[0025] Preferably, the power supply circuit 8 includes multiple batteries 83, at least a portion of which are distributed on the second step 72.

[0026] Preferably, the multiple batteries 83 are arranged in a centrally symmetrical manner.

[0027] Preferably, at least one of the multiple batteries 83 is a rechargeable battery 83.

[0028] Preferably, a charging interface is provided on the outer end 84 of at least one of the multiple batteries 83.

[0029] The beneficial effects of this application are:

[0030] This application places the battery outside the casing, offering the following advantages: 1. When the battery is low on power, it can be replaced to continue operation; when the battery ages, it can be replaced without disassembling the casing. The external design facilitates quick replacement or maintenance, reducing downtime caused by power failures. 2. The absence of a battery inside the device facilitates product transportation. 3. The power module generates significant heat; the external design prevents heat conduction to the measurement area, which could cause thermal deformation of the wafer or electrodes, affecting the accuracy of gap measurements. 4. Given the limited internal space of the electrode structure, an external power supply simplifies internal wiring and avoids the introduction of parasitic capacitance from the intersection of high-voltage lines and measurement lines. 5. It simultaneously achieves the advantages of protecting the circuit board through the casing while maintaining high efficiency in battery replacement. Attached Figure Description

[0031] To more clearly illustrate the technical solutions in the embodiments of this utility model, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0032] Figure 1 This is a schematic diagram of the lower surface of the novel gap measuring device of this application in one embodiment;

[0033] Figure 2 This is a schematic diagram of the lower surface of the novel gap measuring device of this application in another embodiment;

[0034] Figure 3 This is a side view of the power supply circuit in one embodiment of the novel gap measuring device of this application, where the upper surface of the circuit is at the same height as the outer casing and there is a gap between them.

[0035] Figure 4 This is a side view of the power circuit of the novel gap measuring device of this application in one embodiment, showing that the upper surface of the circuit is at the same height as the outer casing and is in close contact with the outer casing.

[0036] Figure 5 This is a side view of the power circuit of the novel gap measuring device of this application in one embodiment, where the upper surface is lower than the outer casing and is in close contact with the outer casing.

[0037] Figure 6 This is a side view diagram showing the upper surface of the power circuit of the novel gap measuring device of this application, which is lower than the height of the outer casing and has a gap between it and the outer casing, in one embodiment; and

[0038] Figure 7 This is an overall system block diagram of the novel gap measuring device of this application.

[0039] The following are the labeling elements in the figure:

[0040] 1. Circuit board;

[0041] 2. Electrode components; 21. Outer solder pad; 22. Inner solder pad;

[0042] 3. Processing module; 31. Controller; 32. Amplifier circuit; 321. Capacitor-to-digital converter; 322. Digital potentiometer; 323. High-speed operational amplifier;

[0043] 7. Outer shell;

[0044] 8. Power supply circuit; 81. Inner terminal; 82. Wire; 83. Battery; 84. Outer terminal; 85. Upper surface. Detailed Implementation

[0045] To make the objectives, technical solutions, and advantages of the embodiments of this application clearer, the technical solutions in the embodiments of this application will be clearly and completely described below. Obviously, the described embodiments are only some embodiments of this application, not all embodiments. Based on the embodiments in this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application. Unless otherwise defined, the technical or scientific terms used herein should have the ordinary meaning understood by those skilled in the art to which this application pertains. The terms "comprising" and similar expressions used herein mean that the element or object preceding the word covers the element or object listed following the word and its equivalents, but does not exclude other elements or objects.

[0046] As semiconductor component dimensions continue to shrink, advanced semiconductor integrated circuit etching equipment faces significant challenges in the wafer etching stage of wafer manufacturing. To ensure product consistency and maximum throughput, many critical process steps rely on precise measurement of the gap distance between the substrate or wafer support and the target conductor component, as well as the adjustment of the parallelism between the two planes. A common method for measuring gap and parallelism involves using motor drive pulses and lead screw pitch in the machine's servo system for position calibration and measurement. Specifically, the motor driver in the servo system receives a set pulse value and drives the motor to move until the top of the base connected to the motor is level with the bottom of the target conductor component; this point is recorded as zero. The motor then retracts, and the actual movement distance of the base, i.e., the gap distance between the base and the target conductor component, can be obtained by converting the number of drive pulses and the lead screw pitch. The tilt angle relative to the horizontal position is then measured using a level. However, limitations imposed by the motor drive pulses and lead screw pitch, and the inability to calibrate in a real vacuum environment, result in low measurement accuracy and large errors. As semiconductor component dimensions continue to shrink, even small errors can cause products to fail to meet process requirements.

[0047] This embodiment provides a novel gap measuring device, referring to... Figure 1 It is used to place on a support base inside a vacuum chamber to measure the gap between the support base and the target conductor component. In this embodiment, the target conductor component is an etching gas spray component inside the vacuum chamber.

[0048] Reference Figures 1 to 7The gap measuring device includes a housing 7, a circuit board 1, an electrode component 2, a processing module 3, and a power circuit 8. The circuit board 1 supports the electrode component 2 and the processing module 3, and the electrode component 2, processing module 3, and power circuit 8 are all electrically connected to the circuit board 1. The integration of the electrode component 2 and processing module 3 onto the circuit board 1 allows the gap measuring device to be used as a single unit, improving its ease of use. When the operator needs to use the gap measuring device for gap measurement, they simply place the device on the support base inside the vacuum chamber and activate it to measure the gap distance between the support base and the etching gas spray component inside the vacuum chamber. After measurement, the operator can adjust the height of the support base to ensure the gap distance between the support base and the etching gas spray component inside the vacuum chamber meets the standard. After adjustment, the gap measuring device can be moved for subsequent substrate or wafer processing.

[0049] The electrode component 2 is electrically connected to the processing module 3 via the circuit board 1. The processing module 3 includes a controller 31, specifically, the electrode component 2 is electrically connected to the controller 31. Simultaneously, the power supply circuit 8 is electrically connected to both the electrode component 2 and the processing module 3. Specifically, the power supply circuit 8 is connected to the controller 31, thereby providing power to the controller 31. This allows the controller 31 to control the power supply circuit 8 to energize the electrode component 2, thus forming a capacitor between the electrode component 2 and the etching gas spray component within the vacuum chamber. The controller 31 obtains the capacitance value by applying an excitation voltage to the electrode component 2 and calculates the gap value between the support base and the target conductor component based on the capacitance value. The specific calculation formula under vacuum conditions is as follows: d is the gap distance between the carrier base and the target conductor component, is the relative permittivity between the carrier base and the target conductor component, S is the area between the carrier base and the target conductor component, is pi, k is the electrostatic constant, and C is the capacitance between the carrier base and the target conductor component. The target gap data is obtained by processing the gap value.

[0050] Furthermore, as those skilled in the art will recognize, in a preferred embodiment, the present invention also provides a transmission module (not shown in the figure) electrically connected to the controller 31. The transmission module transmits the target gap data to a host computer. The host computer is communicatively connected to the transmission module and compares the target gap data with pre-stored reference gap data, displaying the comparison result. The comparison result indicates the lifting height of the support base. The operator adjusts the support base according to the instructions of the host computer so that the distance between the support base and the spray component is the target gap data, thus ensuring that the gap distance between the support base and the etching gas spray component in the vacuum chamber meets the standard.

[0051] As semiconductor component dimensions continue to shrink, even minute gap deviations between the support base and the etching gas spraying components within the vacuum chamber can lead to substandard finished products, affecting product performance. In response, refer to... Figures 1 to 7 The processing module 3 includes an amplifier circuit 32, which is used to increase the range of the excitation voltage. For example, the amplifier circuit 32 includes a capacitor-to-digital converter 321, a digital potentiometer 322, and a high-speed operational amplifier 323. The capacitor-to-digital converter 321 is connected to the electrode component 2 and is used to convert the analog capacitance signal acquired from the electrode component 2 into a digital signal. The digital potentiometer 322 is connected to the capacitor-to-digital converter 321 and is used to adjust the resistance value of the amplifier circuit 32, thereby adjusting the magnitude and range of the excitation voltage. The high-speed operational amplifier 323 is connected to the digital potentiometer 322 and is used to drive and buffer the signal. The digital potentiometer 322 and the high-speed operational amplifier 323 act on the capacitor-to-digital converter 321, enabling the capacitor-to-digital converter 321 to convert to more precise capacitance values ​​and a wider range of capacitance values, thus increasing the measurement range of the processing module 3.

[0052] In a preferred embodiment, the circuit board 1 is housed within the housing 7, and the power supply circuit 8 is disposed on the surface of the housing 7, outside the electrode component 2. On one hand, since the power supply module 8 generates significant heat, its external design prevents heat conduction to the measurement area, thus preventing thermal deformation of the electrode component 2 and affecting the accuracy of the gap measurement. Furthermore, the limited internal space of the electrode component simplifies the internal wiring of the electrode component 2 and avoids the introduction of parasitic capacitance due to the intersection of high-voltage lines and measurement lines. On the other hand, the electromagnetic noise generated by the power supply circuit 8 may interfere with the high-precision gap measurement signal; its external placement reduces coupling interference to the electrode component 2 and improves the signal-to-noise ratio. As a vulnerable component, the external design facilitates quick replacement or repair, reducing downtime caused by power supply failures.

[0053] In another variation, the circuit board 1 is also disposed on the surface of the housing 7. The specific disposal method can be referred to the disposal method of the power supply circuit 8. Such a variation is within the protection scope of this utility model.

[0054] The relationship between the upper surface 85 of the power supply circuit 8 and the upper surface of the electrode component 2 is as follows: the upper surface 85 and the upper surface of the electrode component 2 are on the same horizontal plane, or the upper surface 85 is higher than the upper surface of the electrode component 2, as shown in the figure. The electrode component 2 includes multiple outer pads 21 and multiple inner pads 22. Both the outer pads 21 and the inner pads 22 are connected to the circuit board 1 and are electrically connected to the capacitor-to-digital converter 321. The outer pads 21 are arranged in a ring shape, and the outer pads 21 and the inner pads 22 are spaced apart. One outer pad 21 and one inner pad 22 form an electrode pair. Using a set of electrode pairs, the gap distance between a position on the support base and the etching gas spray component in the vacuum chamber can be measured. By reasonably setting the position and size of multiple sets of electrode pairs, the gap between support bases of different sizes and etching gas spray components in the vacuum chamber can be measured. In actual production, since the power supply circuit 8 often uses customized outsourced components to facilitate mass production and reduce production costs, the upper surface 85 of the power supply circuit 8 may be higher than or at the same level as the upper surface 85 of the electrode component 2. This application does not impose any restrictions on this.

[0055] In this embodiment, the power circuit 8 can be fixed to the housing 7 in any one or more of the following ways: welding; screw fixing; bonding; or embedded in a groove provided on the housing 7, the size of which is adapted to the size of the power circuit 8. For example, the power circuit 8 can be directly welded to a designated position on the housing 7 by solder joints to ensure mechanical strength and electrical connection reliability, suitable for high vibration environments; or the power circuit 8 can be fastened to the housing 7 by screws through threaded holes, facilitating later maintenance or replacement, while providing stable mechanical support; or the power circuit 8 can be bonded to the surface of the housing 7 using high-temperature resistant and anti-aging structural adhesive, suitable for lightweight design or situations where mechanical stress concentration is avoided; the housing 7 has a groove matching the size of the power circuit 8, the power circuit 8 is embedded therein, and fixed by clips or auxiliary fasteners, such as pressure plates, to ensure accurate positioning and reduce the impact of external impacts. This application does not limit the method of fixing the power circuit 8 to the housing.

[0056] In this embodiment, the outer casing 7 includes a first step 71 and a second step 72. The first step 71 is disposed on the second step 72, and the first step 71 may be higher than the second step 72; or the second step 72 may be higher than the first step 71, forming a stepped installation space; or the upper surfaces 85 of the first step 71 and the second step 72 may be on the same horizontal plane. The electrode component 2 is fixed on the first step 71, and a portion of the power circuit 8 is disposed on the second step 72, or the entire power circuit 8 is disposed on the second step 72. When the first step 71 is higher than the second step 72 or the second step 72 is higher than the first step 71, a stepped installation position will appear between the power circuit 8 and the electrode component 2. When the upper surfaces 85 of the first step 71 and the second step 72 are on the same horizontal plane, the electrode component 2 and the power circuit 8 will maintain the same installation reference plane. In this embodiment, the inner end 81 of the power circuit 8 is disposed against the outer edge of the first step 71. The inner end 81 of the power circuit 8 is tightly attached to the outer edge of the first step 71 and is fixed by welding, screws, or clips to ensure mechanical stability. In another embodiment, a gap may be provided between the inner end 81 of the power circuit 8 and the outer edge of the first step 71, and the power circuit 8 is electrically connected to the processing module 3 disposed in the housing 7 by a wire 82 attached to the second step 72.

[0057] Furthermore, those skilled in the art will understand that in the embodiment where the power circuit 8 is disposed on the outer surface of the housing 7 and the electrode component 2 is disposed within the housing 7, the battery 83 of the power circuit 8 can extend into the housing 7 via the aforementioned wire 82 and connect to and supply power to the electrode component 2. For example, it can extend into the housing 7 and connect to a circuit board, while the electrode component 2 is also connected to a circuit board disposed within the housing 7. In another variation, the inner end of the battery 83 is first connected to a conversion interface, and the other end of the conversion interface is connected to the electrode component 2 or the circuit board. These variations are all within the protection scope of this utility model. Those skilled in the art will understand that when using a conversion interface, the battery 83 can be a battery with a uniform shape, such as a cubic battery, i.e., the inner end of the battery 83 is a right angle, while the side of the conversion interface facing the electrode component 2 can be of various shapes, such as an arc, thereby making the conversion interface more easily adaptable to the outer edge shape of the first step, and making the manufacturing process more varied, flexible, easy to implement, and low-cost. The adaptation of the conversion interface to the shape of the first step also makes the housing 7 more airtight. In another embodiment, a sealing device or the like can be provided at the contact position between the housing 7 and the conversion interface or battery 83 to further increase the sealing performance of the housing 7.

[0058] For example Figure 2In the embodiment shown, the battery 83 is in close contact with the first step 71. It can directly contact the first step 71 or contact the first step 71 through the above-mentioned conversion interface (not shown). These variations are all within the protection scope of this utility model.

[0059] In this embodiment, the relationship between the upper surface 85 of the power supply circuit 8 and the upper surface 85 of the first step 71 can be that the upper surface 85 is lower than the upper surface 85 of the first step 71; or the upper surface 85 and the upper surface 85 of the first step 71 are on the same horizontal plane; or the upper surface 85 is higher than the upper surface 85 of the first step 71.

[0060] In this embodiment, the power supply circuit 8 includes multiple batteries 83. Some of the batteries 83 are distributed on the second step 72, and the other part is disposed on the first step 71, or all of the batteries 83 are disposed on the second step 72.

[0061] In this embodiment, multiple batteries 83 are arranged symmetrically on the outer casing 7. This arrangement can ensure balanced power load, avoid measurement errors caused by uneven power supply on one side, and improve power supply stability.

[0062] Furthermore, referring to the above Figure 1 , Figure 2 The embodiments shown are as understood by those skilled in the art. Figure 1 , Figure 2 The embodiment, in its formal sense, shows only one battery 83. However, in specific embodiments, there can be multiple batteries 83, and their positions can vary. For example, they can be arranged adjacently in a region, with a 2cm interval between each battery 83, or they can be distributed, such as the aforementioned centrally symmetrical arrangement around the product center. In a preferred embodiment, the number of batteries 83 can be determined based on the number of electrode pairs formed by the outer solder pads 21 and the inner solder pads 22. For example, preferably, one or two batteries 83 provide power to one electrode pair. Such embodiments are all within the protection scope of this utility model.

[0063] Furthermore, those skilled in the art will understand that, in combination with Figures 1 to 6 In the illustrated embodiment, when multiple batteries 83 are used, the battery arrangement can be as follows: Figures 3 to 6 Any of the methods described above, and in a single product, multiple batteries 83 can be arbitrarily selected from 3 to... Figure 6 Any of the variations thereof are within the scope of protection of this utility model.

[0064] In this embodiment, at least one of the multiple batteries 83 is a rechargeable battery. For example, one of the batteries may be a rechargeable battery, while the others may be disposable or backup batteries to support different working scenarios. Rechargeable batteries can replenish power when the device is idle, improving energy efficiency and reducing the maintenance costs of frequent battery replacements.

[0065] In this embodiment, at least one of the batteries 83 has a charging interface on its external end 84. The charging interface on at least one external end 84 facilitates fast charging or connection to an external power adapter.

[0066] The beneficial effects of this application are:

[0067] This application incorporates a processing module 3, which energizes the electrode component 2 to drive it to form a capacitor with the etching gas spray component within the vacuum chamber. The processing module 3 measures the capacitance value of the electrode component 2 to obtain the gap value between the support base and the spray component, and processes this gap value to obtain the target gap data. The processing module 3 includes an amplifier circuit 32, which comprises a capacitance-to-digital converter 321, a digital potentiometer 322, and a high-speed operational amplifier 323. The digital potentiometer 322 and the high-speed operational amplifier 323 act on the capacitance-to-digital converter 321, enabling it to convert to more precise capacitance values ​​and a wider range of capacitance values, thus increasing the measurement range of the processing module 3. Since the gap distance between the support base and the spray component varies in different vacuum chambers, increasing the measurement range of the processing module 3 makes the gap measuring device suitable for different machine tools, improving its applicability.

[0068] This application places the battery outside the casing, offering the following advantages: When the battery is low on power, it can be replaced to continue operation; when the battery ages, it can be replaced without disassembling the casing; the external design facilitates quick replacement or maintenance, reducing downtime due to power failures. The absence of an internal battery simplifies product transportation. The power module generates significant heat; the external design prevents heat conduction to the measurement area, which could cause thermal deformation of the wafer or electrodes, affecting the accuracy of gap measurements. With limited internal space in the electrode structure, an external power supply simplifies internal wiring and avoids the introduction of parasitic capacitance from crossing high-voltage lines and measurement lines.

[0069] While the embodiments of this application have been described in detail above, it will be apparent to those skilled in the art that various modifications and variations can be made to these embodiments. However, it should be understood that such modifications and variations fall within the scope and spirit of this application. Furthermore, the application described herein may have other embodiments and can be implemented or carried out in various ways.

[0070] It should also be noted that the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the process, method, article, or apparatus that includes said element.

Claims

1. A novel gap measuring device for measuring a gap between a carrier base and a target conductor component, characterized by, The support base for placement within a vacuum cavity includes at least: Outer shell (7), Circuit board (1), electrode components (2), processing module (3), power supply circuit (8); The electrode component (2) and the processing module (3) are both electrically connected to the circuit board (1). The electrode component (2) is electrically connected to the processing module (3) through the circuit board (1). The electrode component (2) and the target conductor component form a capacitor. The processing module (3) includes a controller (31) and an amplifier circuit (32). The amplifier circuit (32) is electrically connected to the controller (31). The amplifier circuit (32) is used to increase the range of the excitation voltage. The controller is used to apply an excitation voltage to the electrode component (2) and obtain the capacitance value, and then convert it to obtain the target gap data. The target gap data is used to indicate the gap between the bearing base and the target conductor component. At least the power supply circuit (8) is disposed on the surface of the housing (7), and the power supply circuit (8) is electrically connected to and supplies power to the electrode component (2) and the processing module (3) respectively.

2. The novel gap measuring device according to claim 1, characterized in that, The power supply circuit (8) is located on the outside of the electrode component (2).

3. A novel gap measuring device according to claim 1 or 2, characterized in that, The height relationship of the upper surface (85) of the power supply circuit (8) is as follows: - The upper surface (85) is on the same horizontal plane as the upper surface of the electrode component (2); - The upper surface (85) is lower than the upper surface of the electrode component (2); or - The upper surface (85) is higher than the upper surface of the electrode component (2).

4. The novel gap measuring device of claim 3, wherein, The power supply circuit (8) is fixed to the housing (7) in any one or more of the following ways: - Welding; - Secured with screws; - Adhesion; - Inserted into the housing (7) by plugging and unplugging; or - Embedded in a groove provided on the housing (7), the size of the groove being adapted to the size of the power supply circuit (8).

5. The novel gap measuring device according to claim 1 or 2 or 4, characterized by, The housing (7) includes at least a first step (71) and a second step (72), the first step (71) is disposed on the second step (72), the electrode component (2) is fixed on the first step (71), and at least a part of the power supply circuit (8) is disposed on the second step (72).

6. The novel gap measuring device of claim 5, wherein, The height relationship between the first step (71) and the second step (72) is as follows: - The first step (71) is higher than the second step (72); - The upper surfaces of the first step (71) and the second step (72) are on the same horizontal plane; or - The second step (72) is higher than the first step (71).

7. The novel gap measuring device of claim 6, wherein, The inner end (81) of the power supply circuit (8) is set to fit against the outer edge of the first step (71).

8. The novel gap measuring device of claim 7, wherein, The inner end (81) is one of the following: - The shape of the inner end (81) is adapted to the edge shape of the first step (71); - The inner end (81) is connected to an adapter interface, the shape of which facing the first step (71) is adapted to the edge shape of the first step (71).

9. The novel gap measuring device of claim 6, wherein, There is a gap between the inner end (81) of the power circuit (8) and the outer edge of the first step (71). The power circuit (8) is electrically connected to the processing module (3) located in the housing (7) by a wire (82) attached to the second step.

10. The novel gap measuring device according to any one of claims 6 to 9, characterized in that, The height relationship of the upper surface (85) of the power supply circuit (8) is as follows: - The upper surface (85) is lower than the upper surface of the first step (71); - The upper surface (85) is on the same horizontal plane as the upper surface of the first step (71); or - The upper surface (85) is higher than the upper surface of the first step (71).

11. The novel gap measuring device of claim 10, wherein, The power supply circuit (8) includes multiple batteries (83), at least a portion of which are disposed on the second step (72).

12. The novel gap measuring device according to claim 11, characterized in that, The multiple batteries (83) are arranged in a centrally symmetrical manner.

13. The novel gap measuring device according to claim 11 or 12, characterized in that, At least one of the multiple batteries (83) is a rechargeable battery.

14. The novel gap measuring device according to claim 13, characterized in that, A charging interface is provided at the outer end (84) of at least one of the multiple batteries (83).

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