Wafer profile detection apparatus
By designing automated moving units and non-contact inspection components, the problems of low efficiency and damage in wafer contour inspection have been solved, achieving efficient and accurate wafer quality inspection.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- HANGZHOU GUANGYAN TECH CO LTD
- Filing Date
- 2025-07-07
- Publication Date
- 2026-08-04
AI Technical Summary
Existing wafer profile inspection technologies suffer from low efficiency and are prone to damaging the wafer surface.
A wafer contour inspection device was designed, which uses a moving unit to automatically process the wafer and combines non-contact horizontal and vertical inspection components to inspect the contour shape and roundness along the radial and axial directions of the wafer, respectively, to avoid damage to the wafer.
It improves the automation and efficiency of wafer inspection, ensures the stability of the inspection process, avoids wafer damage, and can accurately detect data such as wafer edge contour, groove contour and roundness.
Smart Images
Figure CN224593926U_ABST
Abstract
Description
Technical Field
[0001] This utility model belongs to the field of semiconductor testing technology, and in particular relates to a wafer contour testing device. Background Technology
[0002] Currently, in the semiconductor manufacturing field, the processing precision of wafers directly affects the performance and yield of chips. Wafer contour inspection is a crucial step in ensuring processing quality. Currently, wafer contour inspection mainly relies on optical inspection equipment or contact measurement instruments, but these technologies suffer from low efficiency and poor adaptability. For example, traditional optical inspection methods typically require complex image processing algorithms, resulting in high computational demands and slow inspection speeds, making it difficult to meet the high throughput requirements of modern production lines. While contact measurement offers higher precision, it can easily scratch or contaminate the wafer surface, affecting subsequent processes. Some equipment relies on high-precision motion mechanisms for point-by-point scanning, leading to long inspection cycles and low efficiency, making it difficult to adapt to the needs of large-scale production.
[0003] To solve the above-mentioned technical problems, this utility model designs a wafer contour detection device. Utility Model Content
[0004] This invention provides a wafer contour inspection device, which aims to solve the problems of damage to the wafer surface and low inspection efficiency in wafer contour inspection.
[0005] To achieve the above objectives, this utility model provides the following technical solution: a wafer contour inspection device, comprising a housing, wherein a movable chamber and an inspection chamber are provided inside the housing, a wafer cassette is provided outside the movable chamber, a movable unit is provided inside the movable chamber, and a base plate is provided inside the inspection chamber. A positioning unit and an inspection unit are provided on the base plate. The movable unit is used to move the wafer in the wafer cassette to the positioning unit and to move the wafer from the positioning unit to the inspection unit. The inspection unit includes a clamping component, a horizontal inspection component, and a vertical inspection component. The clamping component is used to clamp the wafer. The horizontal inspection component extends along the radial direction of the wafer and is located at the edge of the wafer. The vertical inspection component extends along the axial direction of the wafer and is located at the edge of the wafer.
[0006] Based on the above technical solution, the horizontal detection component includes a first detection element and a first detection mating element arranged opposite to each other. The first detection element is provided with a first camera and a first aperture, and the first detection mating element is provided with a second light source and a second aperture.
[0007] Furthermore, the horizontal detection component also includes a first adjusting member and a second adjusting member. The first adjusting member is disposed on the base plate and below the first detection member, and the second adjusting member is disposed on the base plate and below the first detection mating member. Both the first adjusting member and the second adjusting member include a horizontal adjusting part, a vertical adjusting part, and an angle adjusting part.
[0008] Based on the above technical solution, the vertical detection component includes a second light source, a second camera, and a third light source. The second light source and the second camera are located above the edge of the wafer, the second light source is located below the second camera, and the third light source is located below the edge of the wafer.
[0009] Furthermore, the vertical detection component also includes a slide rail, a first slider, and a second slider. One end of the slide rail is disposed on the base plate and extends upward along the wafer axial direction. The first slider and the second slider can move along the slide rail. The second light source and the second camera are disposed on the first slider, and the third light source is disposed on the second slider.
[0010] Based on the above technical solution, the clamping assembly includes a base, a first rotary drive, a radial adjustment component, and a gripper assembly. The first rotary drive is located at the center of the base, and the gripper assembly is located on the base. One end of the radial adjustment component is rotatably connected to the first rotary drive, and the other end of the radial adjustment component is rotatably connected to the gripper assembly. There are multiple gripper assemblies and multiple radial adjustment components, which correspond one-to-one and are distributed along the circumference of the base.
[0011] Optionally, the radial adjustment member has a first thread and a second thread on its two circumferential sides, and the gripper assembly and the first rotary drive member have first threaded holes with the first thread and the second thread respectively, with the first thread and the second thread rotating in opposite directions.
[0012] Based on the above technical solution, the clamping assembly further includes a second rotary drive member, which is disposed on the base plate and the base is disposed on the second rotary drive member. The second rotary drive member is used to drive the base to rotate.
[0013] Furthermore, the gripper assembly includes a body and grippers. The body is provided with a limiting groove, and the limiting groove is provided with a second threaded hole. One end of the gripper is embedded in the limiting groove and is provided with an elongated hole. The elongated hole is provided corresponding to the second threaded hole and extends along the wafer axial direction. The second threaded hole and the elongated hole are fixed by a fastener.
[0014] Optionally, the detection unit further includes a lifting assembly, which includes a lifting drive, a support frame, and support claws. The lifting drive is disposed on the base plate, the support frame is disposed on the top of the lifting drive, and the support frame partially surrounds the clamping assembly. The number of support claws is multiple, and the multiple support claws are spaced apart on the support frame. The multiple support claws can support the wafer.
[0015] Compared with related technologies, the beneficial effects of this utility model are as follows: This invention employs a moving unit to first remove the wafer from the wafer cassette, then moves the wafer to a positioning unit for positioning, and finally moves it to the inspection unit. This moving unit significantly improves the automation of wafer inspection, reduces manual intervention, and increases inspection efficiency. In the inspection unit, the wafer is held by a clamping assembly. A horizontal inspection assembly extends radially along the wafer edge and is positioned at the edge. The horizontal inspection assembly detects the contour shape of the wafer edge along the thickness direction, while a vertical inspection assembly detects the contour shape of the wafer grooves along the wafer circumference and the roundness of the wafer. This non-contact inspection avoids damage to the wafer, and the clamping assembly maintains stability during the inspection process. The horizontal and vertical inspection assemblies can detect wafer data such as edge contour shape, groove contour shape, and wafer roundness, enabling quality inspection of wafers according to user needs and improving inspection efficiency. Attached Figure Description
[0016] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only one embodiment of this utility model. For those skilled in the art, other embodiments can be derived from the provided drawings without creative effort.
[0017] Figure 1 This is a schematic diagram of the structure of a wafer contour inspection device provided by this utility model; Figure 2 This is a schematic diagram of another wafer contour inspection device provided by this utility model; Figure 3 This is a schematic diagram of the structure of a detection unit provided by this utility model; Figure 4 This utility model provides Figure 3 An enlarged structural diagram of part A shown in the figure; Figure 5 This is a schematic diagram of the structure of another detection unit provided by this utility model; Figure 6This is a schematic diagram of a clamping assembly provided by this utility model with the second rotary drive component removed. Figure 7 This utility model provides Figure 6 An enlarged structural diagram of part B shown in the figure; Figure 8 This utility model provides Figure 6 An enlarged structural diagram of section C shown in the figure; Figure 9 This is a schematic diagram of another clamping assembly provided by this utility model with the second rotary drive component removed; Figure 10 This utility model provides Figure 9 An enlarged structural diagram of part D shown in the figure; Figure 11 This utility model provides Figure 5 An enlarged structural diagram of part E shown in the figure; Figure 12 This is a schematic diagram of the structure of the clamping assembly and lifting assembly provided by this utility model; Figure 13 This utility model provides Figure 12 The enlarged structural diagram of part F shown in the figure.
[0018] In the diagram: 1. Housing; 11. Moving chamber; 111. Disc cassette; 12. Detection chamber; 121. Base plate; 122. Positioning unit; 123. Detection unit; 2. Clamping assembly; 21. Base; 211. Sliding mating part; 212. Buffer piston; 22. First rotary drive component; 23. Radial adjustment component; 231. First thread; 232. Second thread; 24. Gripper assembly; 241. Main body; 2411. Limiting groove; 2412. Sliding part; 2413. Crossbar; 242. Gripper; 2421. Elongated hole; 25. Second rotary drive component; 3. Horizontal detection assembly; 31. First detection component; 311. 312. First aperture; 32. First camera; 33. First detection mating part; 34. Second aperture; 35. First adjustment part; 36. Second adjustment part; 37. Horizontal adjustment part; 38. Vertical adjustment part; 39. Angle adjustment part; 40. Vertical detection assembly; 41. Second light source; 42. Second camera; 43. Third light source; 44. Slide rail; 45. First slider; 46. Second slider; 57. Lifting assembly; 58. Lifting drive part; 59. Support frame; 50. Support block; 51. Groove; 52. Support claw; 53. Sensor; 54. Sensing groove; 54. Sensing mating plate. Detailed Implementation
[0019] The present invention will be further described below with reference to the accompanying drawings and examples: The embodiments of this utility model are described in detail below. Examples of these embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain this utility model, and should not be construed as limiting this utility model.
[0020] In the description of this utility model, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "joining" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a direct connection or an indirect connection through an intermediate medium. Those skilled in the art can understand the specific meaning of the above terms in this utility model based on the specific circumstances.
[0021] In the description of this utility model, it should be understood that the terms "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model.
[0022] Combination Figure 1-3 As shown, this embodiment of the present disclosure provides a wafer contour inspection device, including a housing 1. The housing 1 has a movable chamber 11 and a detection chamber 12. A wafer cassette 111 is provided on the outside of the movable chamber 11. A movable unit is provided inside the movable chamber 11. A base plate 121 is provided inside the detection chamber 12. A positioning unit 122 and a detection unit 123 are provided on the base plate 121. The movable unit is used to move the wafer in the wafer cassette 111 to the positioning unit 122 and to move the wafer from the positioning unit 122 to the detection unit 123. The detection unit 123 includes a clamping component 2, a horizontal detection component 3 and a vertical detection component 4. The clamping component 2 is used to clamp the wafer. The horizontal detection component 3 extends along the radial direction of the wafer and is located at the edge of the wafer. The vertical detection component 4 extends along the axial direction of the wafer and is located at the edge of the wafer.
[0023] The wafer contour inspection equipment provided in this embodiment of the present disclosure uses a moving unit to first remove the wafer from the wafer cassette 111, then moves the wafer to the positioning unit 122 for positioning, and finally moves the wafer to the inspection unit 123. The moving unit significantly improves the automation of wafer inspection, reduces manual intervention, and increases inspection efficiency. In the inspection unit 123, the wafer is held by a clamping assembly 2. A horizontal inspection assembly 3 extends radially along the wafer and is positioned at the wafer edge. The horizontal inspection assembly 3 detects the contour shape of the wafer edge along the thickness direction, while a vertical inspection assembly 4 detects the contour shape of the wafer groove along the wafer circumference and the roundness of the wafer. Non-contact inspection avoids damage to the wafer. The clamping assembly 2 maintains stability during the wafer inspection process. The horizontal and vertical inspection assemblies 3 and 4 can detect wafer data such as the wafer edge contour shape, groove contour shape, and wafer roundness, enabling quality inspection of the wafer according to user requirements and improving inspection efficiency.
[0024] like Figure 3 As shown, based on the above technical solution, the horizontal detection component 3 includes a first detection element 31 and a first detection mating element 32 arranged opposite to each other. The first detection element 31 is provided with a first camera 312 and a first aperture 311, and the first detection mating element 32 is provided with a first light source 322 and a second aperture 321.
[0025] Specifically, the first detection element 31 and the first detection mating element 32 are arranged opposite to each other along the radial direction of the wafer, that is, the first detection element 31 and the first detection mating element 32 are respectively arranged on both sides of the wafer edge along the radial direction of the wafer. The first light source 322 is a coaxial light source. The first camera 312 is provided with a first lens. The first aperture 311 and the second aperture 321 are arranged opposite to each other and are respectively arranged on the side of the first camera 312 and the first light source 322 near the wafer. The first aperture 311 and the second aperture 321 are both optically variable apertures, which can control the light-emitting area of the first light source 322 and the light-receiving area of the first lens of the first camera 312, so that the first camera 312 and the first light source 322 can cooperate to capture the contour shape of the wafer edge along the thickness direction.
[0026] Furthermore, such as Figure 3 and Figure 4 As shown, the horizontal detection component 3 further includes a first adjusting member 33 and a second adjusting member 34. The first adjusting member 33 is disposed on the base plate 121 and below the first detection member 31, and the second adjusting member 34 is disposed on the base plate 121 and below the first detection mating member 32. Both the first adjusting member 33 and the second adjusting member 34 include a horizontal adjusting part 341, a vertical adjusting part 342 and an angle adjusting part 343.
[0027] The first adjusting member 33 and the second adjusting member 34 are configured to adjust the relative positions of the first detection member 31 and the first detection mating member 32, as well as their relative positions with the wafer. Adjusting the light emission direction of the first light source 322 can adjust the projection effect and improve the accuracy of wafer contour shape detection. Specifically, with the wafer center as the origin, the relative arrangement direction of the first detection member 31 and the first detection mating member 32 as the x-axis (i.e., the light direction of the first light source 322), the direction perpendicular to the x-axis on the wafer surface as the y-axis, and the wafer axial direction as the z-axis, the lateral adjusting part 341 is used to adjust the relative positions of the first detection member 31, the first detection mating member 32, and the wafer in the x-axis direction, and the longitudinal adjusting part 342 is used to adjust the relative positions in the y-axis direction. The angle adjusting part 343 includes a first adjusting part, a second adjusting part, and a third adjusting part. The first adjusting part is used to adjust the rotation angle around the z-axis, the second adjusting part is used to adjust the rotation angle around the y-axis, and the third adjusting part is used to adjust the rotation angle around the x-axis.
[0028] like Figure 3 As shown, based on the above technical solution, the vertical detection component 4 includes a second light source 41, a second camera 42 and a third light source 43. The second light source 41 and the second camera 42 are disposed above the edge of the wafer, the second light source 41 is disposed below the second camera 42, and the third light source 43 is disposed below the edge of the wafer.
[0029] Specifically, the second light source 41 is a coaxial light source. It is positioned closer to the wafer than the second camera 42, ensuring that the light emission direction of the second light source 41 is aligned with the optical axis of the second camera 42, thus guaranteeing the coaxiality of the second light source 41 and the second camera 42. The vertical detection component 4 can detect both the contour shape of the wafer groove and the roundness of the wafer. When detecting the contour shape of the wafer groove, the second camera 42 and the second light source 41 are activated, while the third light source 43 is deactivated. When detecting the roundness of the wafer, both the second camera 42 and the third light source 43 are activated to capture multiple contour images along the circumference of the wafer. Image processing and data calculation are then performed to obtain the roundness value of the wafer.
[0030] Furthermore, such as Figure 5 As shown, the vertical detection component 4 also includes a slide rail 44, a first slider 45 and a second slider 46. One end of the slide rail 44 is disposed on the base plate 121 and extends upward along the wafer axial direction. The first slider 45 and the second slider 46 can move along the slide rail 44. The second light source 41 and the second camera 42 are disposed on the first slider 45, and the third light source 43 is disposed on the second slider 46.
[0031] When the vertical detection component 4 performs detection, the positions of the second light source 41, the second camera 42, and the third light source 43 relative to the wafer are adjusted by setting the first slider 45 and the second slider 46 to slide relative to the slide rail 44, so as to adjust the imaging effect and improve the detection efficiency and quality.
[0032] A horizontal plate is provided on the base plate 121, and the horizontal detection component 3 and the vertical detection component 4 are disposed on the horizontal plate. Specifically, the horizontal plate can be a marble slab, used to ensure that the horizontal detection component 3 and the vertical detection component 4 are level as a whole.
[0033] like Figure 6 As shown, based on the above technical solution, the clamping assembly 2 includes a base 21, a first rotary drive 22, a radial adjustment component 23, and a gripper assembly 24. The first rotary drive 22 is located at the center of the base 21, and the gripper assembly 24 is located on the base 21. One end of the radial adjustment component 23 is rotatably connected to the first rotary drive 22, and the other end of the radial adjustment component 23 is rotatably connected to the gripper assembly 24. There are multiple gripper assemblies 24 and multiple radial adjustment components 23, and the multiple gripper assemblies 24 and multiple radial adjustment components 23 correspond one-to-one and are distributed along the circumference of the base 21.
[0034] The wafer is held by a gripper assembly 24. One end of a radial adjustment member 23 is connected to the first rotary drive member 22, and the other end is connected to the gripper assembly 24. By adjusting the length of the radial adjustment member 23, the distance between the corresponding gripper assembly 24 and the first rotary drive member 22 can be adjusted, thereby aligning the center of the wafer held by the multiple gripper assemblies 24 with the center of the first rotary drive member 22, thus improving the quality of subsequent wafer inspection. The radial adjustment member 23 is rotatably connected to both the first rotary drive member 22 and the gripper assembly 24. After adjusting the length of the radial adjustment member 23 until the two centers of the wafer and the first rotary drive member 22 are aligned, the first rotary drive member 22 rotates, driving the multiple radial adjustment members 23 to tighten or loosen the multiple gripper assemblies 24, thus clamping or releasing the held wafer. This makes the wafer subjected to more uniform force, improving the stability of wafer clamping and the efficiency of subsequent wafer inspection to a certain extent.
[0035] Optionally, such as Figure 7 As shown, the radial adjustment member 23 has a first thread 231 and a second thread 232 on its two circumferential sides, and the gripper assembly 24 and the first rotary drive member 22 have first threaded holes with the first thread 231 and the second thread 232 respectively. The first thread 231 and the second thread 232 rotate in opposite directions.
[0036] Specifically, when adjusting the length of the radial adjustment member 23, by rotating the radial adjustment member 23, the first thread 231 of the radial adjustment member 23 rotates relative to the first threaded hole on the gripper assembly 24, and the second thread 232 of the radial adjustment member 23 rotates relative to the first threaded hole on the first rotary drive member 22. In this way, the first thread 231 and the second thread 232 rotate in or out simultaneously relative to the corresponding first threaded holes, so that the length of the radial adjustment member 23 between the gripper assembly 24 and the first rotary drive member 22 decreases or increases, thereby completing the length adjustment of the radial adjustment member 23. Multiple radial adjustment members 23 can be adjusted in length individually.
[0037] The first rotary drive component 22 includes a rotary cylinder and a connecting plate. The rotary cylinder is located at the center of the base 21. The connecting plate is rotatably connected to the rotary cylinder. Multiple connecting blocks are rotatably connected to the connecting plate. The first threaded hole is located in the connecting block. The rotary cylinder drives the connecting plate to rotate, and the connecting plate drives the connecting blocks to move and rotate, thereby driving the gripper assembly 24 to move.
[0038] Based on the above technical solutions, such as Figure 12 As shown, the clamping assembly 2 further includes a second rotary drive component 25, which is mounted on the base plate 121. The base 21 is mounted on the second rotary drive component 25, and the second rotary drive component 25 drives the base 21 to rotate. The second rotary drive component 25 is a rotary motor connected to the base 21. While rotating, the rotary motor drives the base 21 to rotate, thereby simultaneously rotating the first rotary drive component 22, the radial adjustment component 23, and the gripper assembly 24 on the base 21. A slip ring is internally connected to the rotary motor for pneumatic / electrical connection.
[0039] like Figure 8 As shown, the gripper assembly 24 further includes a body 241 and a gripper 242. The body 241 is provided with a limiting groove 2411 and a second threaded hole. One end of the gripper 242 is embedded in the limiting groove 2411 and is provided with an elongated hole 2421. The elongated hole 2421 is provided corresponding to the second threaded hole and extends along the wafer axial direction. The second threaded hole and the elongated hole 2421 are fixed by a fastener.
[0040] Specifically, the gripper 242 is provided with a third threaded hole along the wafer axial direction. The third threaded hole passes through the gripper 242. A set screw is screwed into the third threaded hole. The bottom of the set screw abuts against the groove wall of the limiting groove 2411. By turning the set screw downward or upward, one end of the gripper 242 moves vertically relative to the limiting groove 2411 of the main body 241. It is fixed by a fastener passing through the second threaded hole and the elongated hole to adjust the height of the gripper 242, thereby adjusting the levelness of the clamped wafer and improving the detection efficiency and quality.
[0041] Furthermore, such as Figure 9 and Figure 10 As shown, the bottom of the main body 241 is provided with a sliding part 2412, and the base 21 is provided with a corresponding sliding engagement part 211. When the radial adjustment member 23 adjusts the position of the gripper assembly 24 along the wafer radial direction, the sliding part 2412 engages with the sliding engagement part 211 to make the gripper assembly 24 move relative to the base 21.
[0042] Specifically, the sliding part 2412 and the sliding mating part 211 can be a slider and a slide rail 44, or a gear and a rack, as long as the main body 241 can slide relative to the base 21, and there is no limitation here.
[0043] Furthermore, such as Figure 6 As shown, the main body 241 is provided with a crossbar 2413, and the base 21 is provided with a buffer piston 212. One end of the buffer piston 212 is fixedly connected to the base 21, and the other end of the buffer piston 212 abuts against the crossbar 2413. When the gripper 242 clamps the wafer, the buffer piston 212, by abutting against the crossbar 2413, can buffer the clamping force of the gripper 242 on the wafer, avoiding excessive clamping force on the wafer and damage.
[0044] Specifically, the moving unit includes a robotic arm.
[0045] Optionally, such as Figure 5 As shown, the detection unit 123 also includes a lifting component 5, which includes a lifting drive component 51, a support frame 52, and support claws 53. The lifting drive component 51 is disposed on the base plate 121, the support frame 52 is disposed on the top of the lifting drive component 51, and the support frame 52 partially surrounds the clamping component 2. There are multiple support claws 53, which are spaced apart on the support frame 52 and can support the wafer.
[0046] Specifically, the lifting component 5 assists in the placement and retrieval of the wafer on the clamping component 2. The lifting drive 51 is located on one side of the second rotary drive 25, with a support frame 52 at the top. The support frame 52 has a supporting claw 53. When the robotic arm moves the wafer from the positioning unit 122 to the detection unit 123, the supporting claw 53 moves under the drive of the lifting drive 51 to a height exceeding that of the clamping claw 242. The robotic arm first moves the wafer to the supporting claw 53, and then, under the drive of the lifting drive 51, the supporting claw 53 moves downward until the wafer is transferred to the clamping claw 242. The supporting claw 53 continues to descend, completely detaching from the wafer. When it is necessary to remove the wafer, the supporting claw 53 first rises to lift the wafer a certain distance away from the clamping claw 242, and the robotic arm extends under the wafer to remove it. The lifting component 5 prevents interference from the clamping component 2 during the operation of the robotic arm.
[0047] In addition, the lifting component 5 can assist in the detection of the wafer outline. When the horizontal detection component 3 performs detection, the wafer edge outline shape located at the clamping position of the jaw 242 cannot be clearly observed. At this time, the supporting jaw 53 rises and pushes the wafer away from the jaw 242. The second rotation drive component 25 drives the base 21 to rotate, causing the jaw 242 to rotate at a certain angle. The supporting jaw 53 descends and puts the wafer back into the jaw 242. In this way, the wafer edge previously located at the clamping position of the jaw 242 is moved to one side of the jaw 242, so that the corresponding wafer edge outline shape can be clearly photographed and observed.
[0048] Furthermore, such as Figure 11 As shown, the support frame 52 is provided with a support block 521, the support block 521 is provided with a groove 522, and the support claw 53 is provided in the groove 522. The position of the support claw 53 relative to the groove 522 can be adjusted in a direction closer to or farther from the wafer. The cooperation between the support block 521 and the groove 522 can adjust the position of the support claw 53, thereby adjusting the size of the wafer that can be supported by the multiple support claws 53.
[0049] like Figure 13As shown, the base plate 121 is equipped with a sensor 54, which is used to detect whether the lifting assembly 5 returns to its initial position after moving up and down. Specifically, the sensor 54 is provided with a sensing groove 541, and the lifting drive component 51 is correspondingly provided with a sensing mating plate 542. Both the sensing groove 541 and the sensing mating plate 542 extend along the lifting direction of the lifting drive component 51. When the lifting drive component 51 drives the support frame 52 and the support claw 53 to move up and down, the sensing mating plate 542 moves up and down within the sensing groove 541. In this way, the sensor 54 can detect whether the sensing mating plate 542 has returned to its initial position relative to the sensing groove 541, thereby detecting whether the lifting assembly 5 has returned to its initial position after rising and then falling, so as to facilitate the subsequent up and down movement of the lifting assembly 5.
[0050] The present invention has been described above by way of example, but the present invention is not limited to the specific embodiments described above. Any modifications or variations made based on the present invention shall fall within the scope of protection claimed by the present invention.
Claims
1. A wafer profile detection apparatus characterized by comprising: The device includes a housing, which contains a movable chamber and a detection chamber. A wafer cassette is located outside the movable chamber. A movable unit is located inside the movable chamber. A base plate is located inside the detection chamber. A positioning unit and a detection unit are located on the base plate. The movable unit is used to move the wafers in the wafer cassette to the positioning unit and to move the wafers from the positioning unit to the detection unit. The detection unit includes a clamping assembly, a horizontal detection assembly, and a vertical detection assembly. The clamping assembly is used to clamp the wafers. The horizontal detection assembly extends along the radial direction of the wafers and is located at the edge of the wafers. The vertical detection assembly extends along the axial direction of the wafers and is located at the edge of the wafers.
2. The wafer profile detection apparatus according to claim 1, wherein The horizontal detection component includes a first detection element and a first detection mating element disposed opposite to each other. The first detection element is provided with a first camera and a first aperture, and the first detection mating element is provided with a first light source and a second aperture.
3. The wafer profile detection apparatus according to claim 2, wherein The horizontal detection component further includes a first adjusting member and a second adjusting member. The first adjusting member is disposed on the base plate and below the first detection member, and the second adjusting member is disposed on the base plate and below the first detection mating member. Both the first adjusting member and the second adjusting member include a horizontal adjusting part, a vertical adjusting part, and an angle adjusting part.
4. The wafer profile detection apparatus according to claim 1, wherein The vertical detection component includes a second light source, a second camera, and a third light source. The second light source and the second camera are positioned above the edge of the wafer, the second light source is positioned below the second camera, and the third light source is positioned below the edge of the wafer.
5. The wafer profile detection apparatus according to claim 4, wherein The vertical detection component also includes a slide rail, a first slider, and a second slider. One end of the slide rail is located on the base plate and extends upward along the wafer axial direction. The first slider and the second slider can move along the slide rail. The second light source and the second camera are located on the first slider, and the third light source is located on the second slider.
6. The wafer profile detection apparatus of claim 1, wherein The clamping assembly includes a base, a first rotary drive, a radial adjustment component, and a gripper assembly. The first rotary drive is located at the center of the base, and the gripper assembly is located on the base. One end of the radial adjustment component is rotatably connected to the first rotary drive, and the other end of the radial adjustment component is rotatably connected to the gripper assembly. There are multiple gripper assemblies and multiple radial adjustment components, which correspond one-to-one and are distributed along the circumference of the base.
7. The wafer profile detection apparatus according to claim 6, wherein The radial adjustment member has a first thread and a second thread on its two circumferential sides, respectively. The gripper assembly and the first rotary drive member are respectively provided with first threaded holes with the first thread and the second thread, and the first thread and the second thread rotate in opposite directions.
8. The wafer profile detection apparatus according to claim 6, wherein The clamping assembly further includes a second rotary drive member, which is disposed on the base plate. The base is disposed on the second rotary drive member, and the second rotary drive member is used to drive the base to rotate.
9. The wafer profile detection apparatus according to any one of claims 6 to 8, characterized by, The gripper assembly includes a body and grippers. The body is provided with a limiting groove and a second threaded hole. One end of the gripper is embedded in the limiting groove and is provided with an elongated hole. The elongated hole is provided corresponding to the second threaded hole and extends along the wafer axial direction. The second threaded hole and the elongated hole are fixed by a fastener.
10. The wafer profile detection apparatus according to any one of claims 1 to 8, characterized by, The detection unit further comprises a lifting assembly, the lifting assembly comprises a lifting drive, a supporting frame and supporting claws, the lifting drive is arranged on the bottom plate, the supporting frame is arranged on the top of the lifting drive, the supporting frame is partially arranged around the clamping assembly, and the supporting claws are in plurality, the supporting claws are distributed on the supporting frame in intervals, and the supporting claws can support the wafer.