A jig for adjusting the bending degree of a vertical probe

By combining a stepped positioning hole group with an equidistant mounting hole group, precise control of the vertical probe's curvature is achieved, solving the problems of accuracy and cumbersome operation in traditional methods, and improving the efficiency and reliability of semiconductor testing.

CN224594683UActive Publication Date: 2026-08-04SHENZHEN DOUGATE TECH CO LTD
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
SHENZHEN DOUGATE TECH CO LTD
Filing Date
2025-06-25
Publication Date
2026-08-04

AI Technical Summary

Technical Problem

In existing technologies, it is difficult to achieve micron-level precision control in adjusting the curvature of vertical probes. Furthermore, traditional methods are cumbersome to operate and cannot provide incremental step adjustment, which affects testing efficiency and fixture versatility.

Method used

It adopts an innovative combination of stepped positioning hole group and equidistant mounting hole group, and achieves micron-level linear precision control through sliding offset mechanism, eliminating human error, simplifying operation process and providing modular and detachable structure.

Benefits of technology

It achieves precision and repeatability of vertical probe bending, improves the adjustment efficiency and reliability of semiconductor testing, and solves the problem of microscale deformation controllability.

✦ Generated by Eureka AI based on patent content.

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Abstract

This utility model discloses a fixture for adjusting the curvature of a vertical probe, relating to the field of semiconductor testing technology. The fixture includes a lower support plate with an array of first insertion holes, a middle support assembly detachably mounted on the top of the lower support plate, the top surface of which has two sets of symmetrical mounting hole groups, each set containing several mounting holes equidistantly distributed along the X-axis, and an upper support plate slidably mounted on the top of the middle support assembly, having second insertion holes corresponding to the first insertion holes, and two sets of positioning hole groups that cooperate with the mounting hole groups. Each positioning hole group contains several positioning holes distributed in a stepped manner along the X-axis, with the center distance between adjacent positioning holes in the Y-axis direction being a fixed value of N micrometers, where N > 0. This fixture, through the innovative cooperation of the stepped positioning hole groups and the equidistant mounting hole groups, transforms complex deformation control into intuitive hole alignment operations, fundamentally solving the long-standing problem of microscale deformation controllability in the field of precision electronic testing.
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Description

Technical Field

[0001] This utility model relates to the field of semiconductor testing technology, and in particular to a fixture for adjusting the curvature of a vertical probe. Background Technology

[0002] Currently, in the fields of semiconductor testing and precision electronic inspection, the bending adjustment of vertical probes generally relies on manual stacking of shims or threaded fine-tuning mechanisms. These traditional methods have significant drawbacks: firstly, due to the uncontrollable nature of shim thickness tolerance and thread drive backlash, the actual bending amount often deviates from the preset value, making it difficult to achieve stable micron-level precision control; secondly, each probe replacement or bending adjustment requires disassembly and reassembly of the components, resulting in cumbersome procedures and poor repeatability. Furthermore, the fixed structure cannot provide stepped incremental adjustment capabilities, severely limiting testing efficiency and fixture versatility.

[0003] Based on the aforementioned industry pain points, there is an urgent need to develop a new type of adjustment fixture to fundamentally overcome existing limitations. This fixture needs to achieve technological leaps in two dimensions: firstly, it must have micron-level linear precision control capabilities to completely eliminate random errors caused by manual intervention; secondly, it needs to construct a rapid gradient switching mechanism to achieve progressive and precise adjustment of bending amount through structured displacement calibration. Utility Model Content

[0004] The main purpose of this invention is to provide a fixture for adjusting the curvature of a vertical probe, which aims to solve the problem of the inability to accurately control the pre-bending amount of a vertical probe.

[0005] To achieve the above objectives, this utility model proposes a fixture for adjusting the curvature of a vertical probe, the fixture comprising:

[0006] The lower support plate is provided with arrayed first insertion holes;

[0007] The middle support assembly is detachably mounted on the top of the lower support plate, and its top surface is provided with two sets of symmetrical mounting holes.

[0008] Each set of mounting holes contains several mounting holes that are equidistantly distributed along a straight line along the X-axis.

[0009] The upper support plate is slidably disposed on the top of the middle support assembly, and is provided with a second insertion hole corresponding to the first insertion hole, as well as two sets of positioning holes that cooperate with the mounting hole group;

[0010] Each group of positioning holes comprises several positioning holes arranged in a stepped manner along the X-axis, and the center distance between adjacent positioning holes along the Y-axis is a fixed value N micrometers, where N > 0;

[0011] When the first mounting hole aligns with the first positioning hole, the upper support plate generates an initial offset of N micrometers; when the kth mounting hole aligns with the kth positioning hole, the upper support plate generates a cumulative offset of k×N micrometers, which is used to precisely control the bending amount of the vertical probe (k=1, 2, 3…).

[0012] Preferably, the middle support assembly includes two middle support blocks, which are symmetrically distributed and disposed on both sides of the first insertion hole; the channel between the two middle support blocks is a limiting channel to accommodate the bending of the vertical probe; and the two sets of mounting holes are respectively located on the two middle support blocks.

[0013] Preferably, each set of mounting holes includes five mounting holes; each set of positioning holes includes five positioning holes, and N is 20 micrometers.

[0014] Preferably, the lower support plate is detachably connected to the middle support assembly via a connector.

[0015] Preferably, the connector includes a plurality of fastening screws.

[0016] Preferably, the upper support plate is detachably connected to the middle support assembly via a connector.

[0017] Preferably, the connector includes a plurality of pins.

[0018] Preferably, the upper support plate is provided with two observation ports, which are connected to the limiting channel, and the two observation ports are respectively located on both sides of the second insertion hole.

[0019] Preferably, the observation port is covered with a transparent protective plate.

[0020] Preferably, at least one of the lower support plate, the middle support assembly, and the upper support plate has a non-magnetic material layer embedded in its interior or on its surface.

[0021] The beneficial effects of this utility model are as follows: The fixture, through the innovative combination of stepped positioning hole group and equidistant mounting hole group, achieves micron-level linear offset control of the upper support plate while completely eliminating the cumulative error of traditional manual shim stacking. This makes the adjustment of the vertical probe bending amount both accurate and repeatable. Secondly, its modular and detachable structure not only simplifies the switching operation of different bending gradients and avoids positioning inaccuracies caused by repeated disassembly and assembly, but also transforms complex deformation control into intuitive hole alignment operation through the sliding offset mechanism. This significantly improves the adjustment efficiency and reliability of probe arrays in semiconductor testing scenarios, fundamentally solving the long-standing problem of microscale deformation controllability in the field of precision electronic testing. Attached Figure Description

[0022] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on the structures shown in these drawings without creative effort.

[0023] Figure 1 This is a three-dimensional structural diagram of the fixture in this utility model;

[0024] Figure 2 This is an exploded view of the fixture in this utility model;

[0025] Figure 3 This is an exploded view of the fixture in this utility model from another angle;

[0026] Figure 4 This is a top view of the upper support plate in this utility model without translation;

[0027] Figure 5 This is a top view of the upper support plate in this utility model after translation.

[0028] Label Explanation:

[0029] 1. Lower support plate; 11. First insertion hole; 12. Connection hole;

[0030] 2. Middle support component; 21. Middle support block; 211. Mounting hole; 22. Limiting channel;

[0031] 3. Upper support plate; 31. Second insertion hole; 32. Positioning hole; 321. First positioning hole; 322. Second positioning hole; 323. Third positioning hole; 324. Fourth positioning hole; 325. Fifth positioning hole; 33. Observation port; 34. Pin.

[0032] The realization of the purpose, functional features and advantages of this utility model will be further explained in conjunction with the embodiments and with reference to the accompanying drawings. Detailed Implementation

[0033] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0034] It should be noted that if the embodiments of this utility model involve directional indicators (such as up, down, left, right, front, back, etc.), the directional indicators are only used to explain the relative positional relationship and movement of the components in a certain specific posture (as shown in the figure). If the specific posture changes, the directional indicators will also change accordingly.

[0035] Furthermore, if the embodiments of this utility model involve descriptions such as "first" or "second," these descriptions are for descriptive purposes only and should not be construed as indicating or implying their relative importance or implicitly specifying the number of technical features indicated. Therefore, features defined with "first" or "second" may explicitly or implicitly include at least one of those features. Additionally, if the word "and / or" appears throughout the text, it means including three parallel solutions; for example, "A and / or B" includes solution A, solution B, or a solution that simultaneously satisfies A and B. Furthermore, the technical solutions of the various embodiments can be combined with each other, but this must be based on the ability of those skilled in the art to implement them. When the combination of technical solutions is contradictory or impossible to implement, it should be considered that such a combination of technical solutions does not exist and is not within the scope of protection claimed by this utility model.

[0036] This utility model proposes a fixture for adjusting the curvature of a vertical probe. Please refer to [reference needed]. Figures 1-5The fixture includes a lower support plate 1, a middle support assembly 2, and an upper support plate 3. The lower support plate 1 has arrayed first insertion holes 11. The middle support assembly 2 is detachably mounted on the top of the lower support plate 1. The top surface of the middle support assembly 2 has two sets of symmetrical mounting holes 211. Each set of mounting holes 211 includes several mounting holes 211 equidistantly distributed along the X-axis. The upper support plate 3 is slidably mounted on the top of the middle support assembly 2. It has second insertion holes 31 corresponding to the first insertion holes 11, and two sets of positioning holes 32 that cooperate with the mounting holes 211. Each set of positioning holes 32 includes several positioning holes 32 distributed in a stepped manner along the X-axis. The center distance between adjacent positioning holes 32 in the Y-axis direction is a fixed value N micrometers, where N > 0. When the first mounting hole 211 is aligned and connected with the first positioning hole 32, the upper support plate 3 generates an initial offset of N micrometers. When the kth mounting hole 211 is aligned and connected with the first positioning hole 32, the upper support plate 3 generates an initial offset of N micrometers. When hole 211 is aligned and connected with the kth positioning hole 32, the upper support plate 3 generates a cumulative offset of k×N micrometers to precisely control the bending amount of the vertical probe (k=1, 2, 3…). This setting utilizes the innovative combination of the stepped positioning hole 32 group and the equidistant mounting hole 211 group to achieve micrometer-level linear offset control of the upper support plate 3 while completely eliminating the cumulative error of traditional manual shim stacking. This makes the adjustment of the bending amount of the vertical probe both accurate and repeatable. Secondly, its modular and detachable structure not only simplifies the switching operation of different bending gradients and avoids positioning inaccuracies caused by repeated disassembly and assembly, but also transforms complex deformation control into intuitive hole alignment operation through the sliding offset mechanism. This significantly improves the adjustment efficiency and reliability of probe arrays in semiconductor testing scenarios and fundamentally solves the long-standing problem of microscale deformation controllability in the field of precision electronic testing.

[0037] It should be noted that, please refer to Figure 4 The X-axis and Y-axis directions are represented by arrows.

[0038] In this embodiment, the middle support component 2 includes two middle support blocks 21, please refer to... Figure 2 The two middle support blocks 21 are symmetrically distributed and set on both sides of the first insertion hole 11. The channel between the two middle support blocks 21 is a limiting channel 22 to accommodate the bending of the vertical probe. The two sets of mounting holes 211 are respectively located on the two middle support blocks 21. This arrangement uses the double-block symmetrical structure to form the limiting channel 22 to ensure that the vertical probe has space to accommodate its bending deformation. Its distributed load-bearing design evenly decomposes the probe pressure to the two support blocks, significantly reducing the local pressure and providing a sustainable mechanical stability basis for the 3-micrometer cumulative offset of the upper support plate.

[0039] In other embodiments, the central support component 2 may also be an annular support block with a limiting channel 22 in the middle.

[0040] In this embodiment, please refer to Figure 4and Figure 5 Each set of mounting holes 211 includes five mounting holes 211, and each set of positioning holes 32 includes five positioning holes 32, with N being 20 micrometers. Specifically, after the vertical probe is inserted into the second insertion hole 31 and the limiting channel 22 in sequence until it is inserted into the second insertion hole 31, the operator needs to perform a pre-bending operation on the vertical probe to meet the needs of some probe cards that require bending probes for testing. It should be noted that before the upper support plate 3 is translated, the positioning holes 32 on the upper support plate 3 are partially connected to the mounting holes 211 corresponding to the middle support component 2. In other words, on the vertical projection plane, the projection planes of the two channels partially overlap. At this time, the center distance between the center of the positioning hole 32 closest to the second insertion hole 31 and the center of the corresponding mounting hole 211 in the Y-axis direction is 20 micrometers.

[0041] For ease of description, the positioning hole 32 closest to the second insertion hole 31 is named the first positioning hole 321, and the adjacent ones are named the second positioning hole 322, the third positioning hole 323, the fourth positioning hole 324, and the fifth positioning hole 325, respectively. Therefore, when the upper support plate 3 is moved along the Y-axis so that the first positioning hole 321 is fully aligned and connected with the corresponding mounting hole 211, the operator can know the offset distance of the upper support plate 3 and thus determine the bending amount of the vertical probe. At this time, if the positioning hole 32 and the mounting hole 211 are connected by fasteners to fix the position of the upper support plate 3 on the middle support assembly 2, the position of the probe is stabilized. By observing the bending deformation of the probe, the user can test the corresponding probe card. If the bending amount of the probe does not meet the test requirements of the corresponding probe card, the operator only needs to remove the fastener and continue to move the upper support plate 3 until the second positioning hole 322 is fully aligned and connected with the corresponding mounting hole 211. The operator only needs to add 20 micrometers to determine the bending amount of the vertical probe at this time. Obviously, by continuing to repeat the above operation, the operator can accurately monitor the bending amount of the vertical probe by superimposing calculations without using other auxiliary tools to measure the offset of the upper support plate 3, thus reducing the error offset caused by other auxiliary tools.

[0042] In other embodiments, each group of mounting holes 211 may also include six mounting holes 211, and each group of positioning holes 32 may also include six positioning holes 32, and N is 30 micrometers. The specific number of mounting holes 211 and positioning holes 32, and the value of N in micrometers, can be determined according to the testing requirements of different probe cards.

[0043] In essence, please refer to Figure 3The lower support plate 1 is provided with a number of connecting holes 12, which correspond one-to-one with the mounting holes 211 on the middle support component 2, and the connecting holes 12 and the mounting holes 211 are aligned and connected. This setting is mainly to cooperate with the fastener insertion to connect and fix the lower support plate 1, the middle support component 2 and the upper support plate 3 into a whole, enhance the stability of the probe bending state, and avoid the lower support plate 1 from being affected by the unstable connection between the lower support plate 1 and the middle support component 2, thereby changing the position of the first insertion hole 11 and causing the probe bending deformation to produce errors.

[0044] Specifically, the upper support plate 3 is detachably connected to the middle support assembly 2 via a connector. In this embodiment, the connector includes several pins 34. The middle support assembly 2 is provided with first pin holes around its perimeter, and the upper support plate 3 is provided with second pin holes corresponding to the first pin holes. When the upper support plate 3 is placed on the top surface of the middle support assembly 2, so that the second pin holes are fully connected to the corresponding first pin holes, the upper support plate 3 is fixed to the middle support assembly 2 by inserting the pins 34. At this time, the second insertion hole 31 corresponds one-to-one with the first insertion hole 11, and the probe is stably inserted into the second insertion hole 31 and the first insertion hole 11. After the vertical probe is inserted, the operator removes the pins 34, and the operator can then perform the aforementioned operation of translating the upper support plate 3 to change the bending amount of the probe.

[0045] In this embodiment, please refer to Figure 2 The upper support plate 3 is provided with two observation ports 33, which are connected to the limiting channel 22. The two observation ports 33 are located on both sides of the second insertion hole 31. The observation ports 33 are mainly provided to facilitate the operator to observe the degree of bending of the probe in real time. Furthermore, the observation ports 33 are covered with a transparent protective plate (not shown) to prevent contaminants from entering the limiting channel 22 and contaminating the probe, or to protect the probe from external structures entering the limiting channel 22 and damaging the probe.

[0046] In this embodiment, the lower support plate 1 is detachably connected to the middle support assembly 2 via a connector. The connector includes several fastening screws. This arrangement is mainly to fix the lower support plate 1 to the middle support assembly 2, thereby fixing the position of the first insertion hole 11, which facilitates subsequent probe insertion.

[0047] Furthermore, at least one of the lower support plate 1, the middle support assembly 2, and the upper support plate 3 has a non-magnetic material layer embedded in its interior or on its surface. This arrangement fundamentally blocks the transmission path of the external magnetic field to the probe area, solving the problems of probe signal distortion and eddy current heating caused by the fixture's own magnetic induction in high-precision testing, and ensuring that the micron-level bending adjustment can still be stably achieved in complex electromagnetic environments.

[0048] The above description is only an optional embodiment of the present utility model and does not limit the patent scope of the present utility model. All equivalent structural transformations made under the inventive concept of the present utility model using the contents of the present utility model specification and drawings, or direct / indirect applications in other related technical fields, are included within the patent protection scope of the present utility model.

Claims

1. A jig for adjusting the bend of a vertical probe, characterized by, The fixtures include: The lower support plate is provided with arrayed first insertion holes; The middle support assembly is detachably mounted on the top of the lower support plate, and its top surface is provided with two sets of symmetrical mounting holes. Each set of mounting holes contains several mounting holes that are equidistantly distributed along a straight line along the X-axis. The upper support plate is slidably disposed on the top of the middle support assembly, and is provided with a second insertion hole corresponding to the first insertion hole, as well as two sets of positioning holes that cooperate with the mounting hole group; Each group of positioning holes comprises several positioning holes arranged in a stepped manner along the X-axis, and the center distance between adjacent positioning holes along the Y-axis is a fixed value N micrometers, where N > 0; When the first mounting hole aligns with the first positioning hole, the upper support plate generates an initial offset of N micrometers; when the kth mounting hole aligns with the kth positioning hole, the upper support plate generates a cumulative offset of k×N micrometers, which is used to precisely control the bending amount of the vertical probe (k=1, 2, 3…).

2. The fixture according to claim 1, characterized in that, The middle support assembly includes two middle support blocks, which are symmetrically distributed and disposed on both sides of the first insertion hole; the channel between the two middle support blocks is a limiting channel to accommodate the bending of the vertical probe; the two sets of mounting holes are respectively located on the two middle support blocks.

3. The jig of claim 2, wherein Each set of mounting holes includes five mounting holes; each set of positioning holes includes five positioning holes, and N is 20 micrometers.

4. The jig of claim 1, wherein The lower support plate is detachably connected to the middle support assembly via a connector.

5. The jig of claim 4, wherein The connector includes several fastening screws.

6. The tool of claim 1, wherein The upper support plate is detachably connected to the middle support assembly via a connector.

7. The tool of claim 6, wherein The connector includes a number of pins.

8. The tool of claim 2, wherein, The upper support plate is provided with two observation ports, which are connected to the limiting channel. The two observation ports are located on both sides of the second insertion hole.

9. The tool of claim 8, wherein, The observation port is covered with a transparent protective plate.

10. The tool of any one of claims 1-9, wherein, At least one of the lower support plate, the middle support assembly, and the upper support plate has a non-magnetic material layer embedded in its interior or on its surface.