A power amplifier module test fixture

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By designing a test fixture that includes a metal shielding cover, a PCB circuit board, and a metal heat sink frame, the problems of complex connections, low efficiency, low accuracy, and unsatisfactory heat dissipation in power amplifier module testing are solved. This achieves efficient and accurate automated testing and heat dissipation, meeting the needs of modern large-scale production.

CN224594708UActive Publication Date: 2026-08-04DONGGUAN SOUTH INTELLIGENT COMMUNICATION CO LTD

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Patent Information

Authority / Receiving Office: CN · China
Patent Type: Utility models(China)
Current Assignee / Owner: DONGGUAN SOUTH INTELLIGENT COMMUNICATION CO LTD
Filing Date: 2025-09-12
Publication Date: 2026-08-04

AI Technical Summary

Technical Problem

Existing power amplifier module testing processes suffer from problems such as complex test connections, low efficiency, difficulty in guaranteeing accuracy, inadequate heat dissipation, and external signal interference, failing to meet the demands of modern large-scale production and high-precision testing.

Method used

A test fixture including a metal shielding cover, a PCB circuit board, and a metal heat sink frame was designed. The power amplifier module is fixed by various connection methods to achieve automated testing, and the metal heat sink frame is used for heat dissipation and shielding against external signal interference.

Benefits of technology

It improves testing efficiency and accuracy, reduces testing costs, ensures the stability and reliability of the testing process, and enables rapid testing of various performance indicators.

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Abstract

The utility model discloses a kind of power amplifier module test tool, including metal shielding cover, PCB circuit board and metal heat dissipation frame, metal shielding cover is equipped with multiple connector through holes;PCB circuit board is installed in the downside of PCB circuit board, and the contact contact point for connecting power amplifier module is equipped on PCB circuit board, the contact pad for connecting external power supply device and control device and the radio frequency coaxial connector for connecting external test equipment are arranged, radio frequency coaxial connector is inserted connector through hole upwards, and the contact pad of PCB circuit board is exposed to outside metal shielding cover;Metal heat dissipation frame is arranged in the downside of PCB circuit board, and the product fixing groove for fixing power amplifier module is equipped on metal heat dissipation frame.The utility model is efficient, accurate, convenient in use and test process, can realize the rapid test of multiple performance indexes of power amplifier module, improve test efficiency and accuracy, can shield external signal interference, can do heat dissipation treatment to power amplifier module.

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Description

Technical Field

[0001] This utility model relates to the technical field of communication device testing equipment, and in particular to a power amplifier module testing fixture. Background Technology

[0002] With the continuous development of electronic technology, power amplifiers are widely used in fields such as communications. However, existing power amplifier module testing processes suffer from numerous problems, such as complex test connections, low testing efficiency, and difficulty in guaranteeing test accuracy. Traditional testing methods often require frequent manual cable plugging and unplugging, which is not only cumbersome but also prone to errors due to unstable connections, failing to meet the demands of modern large-scale production and high-precision testing. Furthermore, existing testing fixtures do not provide ideal heat dissipation for power amplifier modules during testing, potentially leading to significant temperature-dependent test results and reduced accuracy. Utility Model Content

[0003] The technical problem to be solved by this utility model is to provide a high-efficiency, accurate and convenient power amplifier module testing fixture that addresses the shortcomings of the prior art. This fixture can quickly test various performance indicators of the power amplifier module, improve testing efficiency and accuracy, shield external signal interference, provide heat dissipation for the power amplifier module, reduce testing costs, and ensure the stability and reliability of the testing process.

[0004] To solve the above-mentioned technical problems, the technical solution of this utility model is: a power amplifier module testing fixture, comprising: A metal shielding cover, wherein the metal shielding cover is provided with multiple connector through holes; The PCB circuit board is mounted on the lower side of the PCB circuit board. The PCB circuit board is provided with contact points for connecting power amplifier modules, contact pads for connecting external power devices and control devices, and RF coaxial connectors for connecting external test equipment. There are multiple RF coaxial connectors. The RF coaxial connectors are inserted into corresponding connector through holes. The contact pads of the PCB circuit board are exposed outside the metal shielding cover. A metal heat sink frame is provided on the underside of a PCB circuit board. The metal shielding cover, the PCB circuit board, and the metal heat sink frame can be assembled and connected to each other or disassembled from each other. The metal heat sink frame is provided with a product fixing groove for fixing the power amplifier module.

[0005] Preferably, the lower end of the metal heat sink frame is provided with multiple heat sinks, and the bottom of the product fixing slot matches the shape of the heat dissipation surface of the power amplifier module, so that the product fixing slot can closely contact the heat dissipation surface of the power amplifier module.

[0006] Preferably, the product fixing groove is provided with a product positioning guide pin for guiding and positioning the power amplifier module, and the area outside the product fixing groove on the metal heat sink frame is provided with a shielding cover positioning guide pin and a shielding cover positioning screw hole. The metal shielding cover is provided with a positioning pin hole for assembly with the shielding cover positioning guide pin and a screw mounting hole corresponding to the shielding cover positioning screw hole.

[0007] Preferably, a conductive adhesive strip is provided on the lower side of the metal shielding cover, and the conductive adhesive strip is located at the position where the metal shielding cover contacts the PCB circuit board, and the metal shielding cover and the PCB circuit board are bonded together by the conductive adhesive strip.

[0008] Preferably, the lower side of the metal shielding cover is provided with a long groove and a short groove, the positions of which correspond to the positions of the contact points on the PCB circuit board. A rubber strip is provided in the long groove, and a rubber block is provided in the short groove. The rubber strip and the rubber block are respectively interference-fitted with the positions of the contact points on the PCB circuit board to press the contact points of the power amplifier module and the PCB board tightly. The power amplifier module is provided with a contact connector for connecting to the contact points on the PCB board, and a connector fixing groove is provided on the metal heat sink frame for fixing the contact connector.

[0009] There are two types of metal shielding covers: closed shielding covers and open shielding covers. Open shielding covers have multiple hollowed-out cavities inside, and the positions of the cavities correspond to the positions of the power amplifier modules.

[0010] Preferably, the metal heat sink frame has two product fixing slots arranged side by side, the PCB circuit board has cutouts corresponding to the product fixing slots, the PCB circuit board has two sets of contact points and six RF coaxial connectors, wherein one set of contact points and three RF coaxial connectors correspond to one power amplifier module, and the other set of contact points and three RF coaxial connectors correspond to another power amplifier module, and the metal shielding cover has six connector through holes.

[0011] Preferably, the metal heat sink frame is an aluminum alloy heat sink frame, and the metal shielding cover is an aluminum alloy shielding cover.

[0012] The beneficial effects of this utility model are as follows: During testing, the power amplifier module is fixed within the product mounting slot of the metal heat sink frame. Then, the metal shielding cover and its lower PCB circuit board are placed on top of and fixed to the metal heat sink frame, allowing for testing of the power amplifier module. During testing, the contact points on the PCB circuit board can connect to the power amplifier module, and the contact pads on the PCB circuit board can connect to external power supply devices and control devices. External power supply devices include, but are not limited to, power inputs for driving the power amplifier and the final stage power amplifier, including positive, negative, and bias voltages. External control devices include the input and output of control signals, supporting connection to external devices for automated testing. The RF coaxial connector on the PCB circuit board can connect to external testing equipment to test the power amplifier module. Simultaneously, the metal heat sink frame provides heat dissipation for the power amplifier module, and the metal shielding cover and the metal heat sink frame together shield external signals, preventing external signal interference during testing. Therefore, this utility model is efficient, accurate, and convenient, enabling rapid testing of various performance indicators of power amplifier modules, improving testing efficiency and accuracy, shielding external signal interference, providing heat dissipation for power amplifier modules, reducing testing costs, and ensuring the stability and reliability of the testing process. Attached Figure Description

[0013] Figure 1 This is an overall structural diagram of the present invention.

[0014] Figure 2 This is a diagram of the dispersed structure of this utility model.

[0015] Figure 3 This is a structural diagram of the shielding cover of this utility model.

[0016] Figure 4 This is a structural diagram of the PCB board of this utility model.

[0017] Figure 5 This is a structural diagram of the heat dissipation frame of this utility model.

[0018] Figure 6 This is a diagram showing the dispersed structure of the open-type shielding cover used in this utility model. Detailed Implementation

[0019] The structural and working principles of this utility model will be further described in detail below with reference to the accompanying drawings.

[0020] like Figures 1-5As shown, this utility model is a power amplifier module testing fixture, including a metal shielding cover 10, a PCB circuit board 20, and a metal heat sink 30. The metal shielding cover 10 has multiple connector through holes 103. The PCB circuit board 20 is mounted on the lower side of the PCB circuit board 20. The PCB circuit board 20 has contact points 201 for connecting a power amplifier module (not shown in the figure), contact pads 202 for connecting external power supply devices and control devices (not shown in the figure), and RF coaxial connectors 21 for connecting external test equipment (not shown in the figure). There are multiple RF coaxial connectors 21, and the RF coaxial connectors 21 are inserted into the corresponding connector through holes 103. The contact pads 202 of the PCB circuit board 20 are exposed outside the metal shielding cover 10. The metal heat sink 30 is disposed on the lower side of the PCB circuit board 20. The metal shielding cover 10, the PCB circuit board 20, and the metal heat sink 30 can be assembled and connected to each other or disassembled. The metal heat sink 30 has a product fixing groove 302 for fixing the power amplifier module.

[0021] In testing, the power amplifier module is first fixed within the product mounting slot 302 of the metal heat sink 30. Then, the metal shielding cover 10 and its lower PCB circuit board 20 are placed on top of and fixed to the metal heat sink 30. During testing, the contact points 201 of the PCB circuit board 20 can connect to the power amplifier module, and the contact pads 202 of the PCB circuit board 20 can connect to external power supply devices and control devices. External power supply devices include, but are not limited to, power inputs for driving the power amplifier and the final stage power amplifier, including positive, negative, and bias voltages. External control devices include the input and output of control signals, supporting connection to external devices for automated testing. The RF coaxial connector 21 of the PCB circuit board 20 can connect to external testing equipment to test the power amplifier module. Simultaneously, the metal heat sink 30 provides heat dissipation for the power amplifier module, and the metal shielding cover 10 and the metal heat sink 30 together shield external signals, preventing external signal interference during testing. Therefore, this utility model is efficient, accurate, and convenient, enabling rapid testing of various performance indicators of power amplifier modules, improving testing efficiency and accuracy, shielding external signal interference, providing heat dissipation for power amplifier modules, reducing testing costs, and ensuring the stability and reliability of the testing process.

[0022] like Figure 1 and Figure 2As shown, the lower end of the metal heat sink frame 30 is provided with multiple heat sinks 301. The bottom of the product mounting slot 302 matches the shape of the heat dissipation surface (not shown) of the power amplifier module, allowing the product mounting slot 302 to closely contact the heat dissipation surface of the power amplifier module. During testing, the heat dissipated by the power amplifier module is directed to the product mounting slot 302 and then quickly dissipated by the metal heat sink frame 30 and its heat sinks 301, resulting in good heat dissipation.

[0023] like Figures 1-2 As shown, the product fixing groove 302 is provided with a product positioning guide pin 31 for guiding and positioning the power amplifier module. The area above the metal heat sink frame 30, outside the product fixing groove 302, is provided with a shielding cover positioning guide pin 32 and a shielding cover positioning screw hole 33. The metal shielding cover 10 is provided with a positioning pin hole 101 for assembly with the shielding cover positioning guide pin 32 and a screw mounting hole 102 corresponding to the shielding cover positioning screw hole 33. Furthermore, the PCB circuit board 20 is provided with holes corresponding to the shielding cover positioning guide pin 32 and the shielding cover positioning screw hole 33. The metal shielding cover 10 and its lower PCB circuit board 20 are placed on top of the metal heat sink frame 30, the shielding cover positioning guide pin 32 passes upward through the positioning pin hole 101, and a screw passes through the screw mounting hole 102 and is screwed into the shielding cover positioning screw hole 33 for locking. It should be noted that the connection method between the metal shielding cover 10 and the metal heat sink frame 30 is not limited to the positioning guide pin connection and screw connection. It can also adopt the clip connection or hinge connection. Therefore, the clip connection or hinge connection may also realize the alternative solution of this utility model.

[0024] like Figure 3 As shown, a conductive adhesive strip 11 is provided on the lower side of the metal shielding cover 10. The conductive adhesive strip 11 is located at the position where the metal shielding cover 10 contacts the PCB circuit board 20. The metal shielding cover 10 and the PCB circuit board 20 are bonded together by the conductive adhesive strip 11.

[0025] like Figure 3 As shown, the lower side of the metal shielding cover 10 is provided with a long groove 104 and a short groove 105. The positions of the long groove 104 and the short groove 105 correspond to the positions of the contact points 201 of the PCB circuit board 20. A rubber strip 12 is provided inside the long groove 104, and a rubber block 13 is provided inside the short groove 105. The rubber strip 12 and the rubber block 13 are respectively press-fitted to the positions of the contact points 201 of the PCB circuit board 20 to press the contact points 201 of the power amplifier module and the PCB board. Figure 2 , 5 As shown, the power amplifier module is provided with a contact connector (not shown in the figure) for connecting the contact contact 201 of the PCB board, and the metal heat sink frame 30 is provided with a connector fixing groove 34 for fixing the contact connector.

[0026] There are two types of metal shielding covers. See one type for details. Figures 1-3 The metal shielding cover is a closed type, used in the mass production stage of power amplifier modules. Another type of metal shielding cover is an open type (see [reference number]). Figure 6 The open shielding cover 40 has multiple hollowed-out cavities 401 inside, and the positions of the cavities 401 correspond to the positions of the power amplifier module. Since the power amplifier module needs to be continuously tested and debugged during the research and development stage, the open shielding cover 40 is adopted to reduce the disassembly and assembly process. This facilitates debugging during the research and development stage and eliminates the need for repeated disassembly and assembly.

[0027] As a preferred embodiment of this utility model, such as Figures 1-5 As shown, the metal heat sink 30 has two product fixing slots 302 arranged side by side. The PCB circuit board 20 has cutouts at the positions corresponding to the product fixing slots 302. The PCB circuit board 20 has two sets of contact points 201 and six radio frequency coaxial connectors 21. One set of contact points 201 and three radio frequency coaxial connectors 21 correspond to one power amplifier module, and the other set of contact points 201 and three radio frequency coaxial connectors 21 correspond to another power amplifier module. The metal shielding cover 10 has six connector through holes 103.

[0028] In a preferred embodiment of this utility model, the metal heat sink 30 is an aluminum alloy heat sink, machined from aluminum alloy with high thermal conductivity, and the positioning guide pin 31 and the shielding cover positioning guide pin 32 are assembled together. The positioning guide pin 31 and the shielding cover positioning guide pin 32 are stainless steel guide pins. The metal shielding cover 10 is an aluminum alloy shielding cover, machined from aluminum alloy, and conductive adhesive strips 11 are applied using an adhesive dispensing process. Then, rubber pressure strips 12 and rubber pressure blocks 13 are assembled.

[0029] The assembly steps of the test fixture of this utility model are as follows: (1) Install the rubber strip 12 and the rubber block 13 into the long groove 104 and the short groove 105 of the metal shielding cover 10 respectively; (2) Install the positioning guide pin 31 and the shielding cover positioning guide pin 32 into the positioning hole of the metal heat sink frame 30 respectively; (3) Place the PCB circuit board on the metal heat sink frame 30 through the shielding cover positioning guide pin 32, connect the contact pad 202 to the external conversion circuit and the voltage regulator circuit to provide a stable working power supply for the power amplifier, and connect the signal input module and the signal output module to the corresponding circuit lines respectively; (4) Cover the metal shielding cover 10 and fix it with screws, but not limited to, a quick clamp or pneumatic method can also be used to press it.

[0030] The use and testing process of this utility model test fixture: (1) Open the metal shielding cover 10 and install the power amplifier module into the heat sink frame 30 along the positioning guide pin 31; (2) Cover the metal shielding cover 10 and fix it with screws, insert the test connection line of the external test equipment and connect the RF coaxial connector 21; (3) Turn on the external power supply to provide working power through the power module power amplifier, set the relevant parameters to be tested through the signal input module and signal output module, and then perform the test and save the relevant data; (4) Turn off the power and take out the power amplifier module.

[0031] The above description is merely a preferred embodiment of this utility model. Any minor modifications, equivalent changes, and alterations made to the above embodiments based on the technical solution of this utility model shall fall within the scope of the technical solution of this utility model.

Claims

1. A power amplifier module test fixture, comprising: include: A metal shielding cover, wherein the metal shielding cover is provided with multiple connector through holes; The PCB circuit board is mounted on the lower side of the PCB circuit board. The PCB circuit board is provided with contact points for connecting power amplifier modules, contact pads for connecting external power devices and control devices, and RF coaxial connectors for connecting external test equipment. There are multiple RF coaxial connectors. The RF coaxial connectors are inserted into corresponding connector through holes. The contact pads of the PCB circuit board are exposed outside the metal shielding cover. A metal heat sink frame is provided on the underside of a PCB circuit board. The metal shielding cover, the PCB circuit board, and the metal heat sink frame can be assembled and connected to each other or disassembled from each other. The metal heat sink frame is provided with a product fixing groove for fixing the power amplifier module.

2. The power amplifier module test fixture of claim 1, wherein: The lower end of the metal heat sink frame is provided with multiple heat sinks, and the bottom of the product fixing slot matches the shape of the heat dissipation surface of the power amplifier module, so that the product fixing slot can be in close contact with the heat dissipation surface of the power amplifier module.

3. The power amplifier module test fixture of claim 1, wherein: The product fixing groove is provided with a product positioning guide pin for guiding and positioning the power amplifier module. The area outside the product fixing groove on the metal heat sink frame is provided with a shielding cover positioning guide pin and a shielding cover positioning screw hole. The metal shielding cover is provided with a positioning pin hole for assembly with the shielding cover positioning guide pin and a screw mounting hole corresponding to the shielding cover positioning screw hole.

4. The power amplifier module test fixture of claim 1, wherein: The metal shielding cover has a conductive adhesive strip on its lower side. The conductive adhesive strip is located at the position where the metal shielding cover contacts the PCB circuit board, and the metal shielding cover and the PCB circuit board are bonded together by the conductive adhesive strip.

5. The power amplifier module test fixture according to claim 1, characterized in that: The metal shielding cover has a long groove and a short groove on its lower side. The positions of the long groove and the short groove correspond to the positions of the contact points of the PCB circuit board. A rubber strip is provided in the long groove and a rubber block is provided in the short groove. The rubber strip and the rubber block are respectively interference-fitted with the positions of the contact points of the PCB circuit board to press the contact points of the power amplifier module and the PCB board tightly.

6. The power amplifier module test fixture of claim 5, wherein: The power amplifier module is provided with a contact connector for connecting the contact points of the PCB board, and the metal heat sink frame is provided with a connector fixing groove for fixing the contact connector.

7. The power amplifier module test fixture of claim 1, wherein: The metal shielding cover is a closed shielding cover.

8. The power amplifier module test fixture of claim 1, wherein: The metal shielding cover is an open shielding cover, with multiple hollowed-out cavities inside, the positions of which correspond to the positions of the power amplifier modules.

9. The power amplifier module test fixture of any of claims 1-8, wherein: The metal heat sink frame has two product mounting slots arranged side by side. The PCB circuit board has cutouts at the positions corresponding to the product mounting slots. The PCB circuit board has two sets of contact points and six RF coaxial connectors. One set of contact points and three RF coaxial connectors correspond to one power amplifier module, and the other set of contact points and three RF coaxial connectors correspond to another power amplifier module. The metal shielding cover has six connector through holes.

10. The power amplifier module test fixture of any of claims 1-8, wherein: The metal heat sink frame is an aluminum alloy heat sink frame, and the metal shielding cover is an aluminum alloy shielding cover.