High temperature test chamber

Abstract

This application discloses a high-temperature test chamber, relating to the field of testing technology. It includes a chamber body, a cover, a drive assembly, a sensing assembly, and a control assembly. The chamber body houses an electronic node. The cover has a through-hole with adjustable size for connecting the interior of the chamber to the external environment. The sensing assembly is located inside the chamber. The control assembly acquires the detected temperature of the sensing assembly and compares it with a preset temperature. When the difference between the detected temperature and the preset temperature exceeds a first preset value, the control assembly adjusts the size of the ventilation hole. Since the electronic node operates inside the chamber, the heat it generates raises the internal temperature. The waste heat from the electronic node's operation is directly used as the heat source for the high-temperature test chamber, significantly reducing energy consumption. By controlling the heat dissipation efficiency through changing the size of the ventilation hole, natural ventilation is achieved, reducing fan usage time and thus lowering noise levels during operation.

Description

Technical Field

[0001] This application relates to the field of testing technology, and in particular to a high-temperature testing chamber. Background Technology

[0002] With the rapid development of society and the economy, especially driven by artificial intelligence technology, the demand for IT equipment such as servers is constantly increasing. Among them, efficient heat dissipation management of core components of IT equipment, such as servers, is one of the key factors to ensure the stable operation of the equipment. In order to prevent IT equipment such as servers from crashing under high temperature environments, resulting in data loss and other problems, the research and development stage usually needs to be tested in various harsh environments.

[0003] A high-temperature chamber is a device used to simulate high-temperature environments. It is widely used to test the stability, heat dissipation performance, and long-term reliability of IT hardware such as servers, switches, and storage devices under extreme temperatures. Currently, traditional high-temperature test chambers mainly rely on electric heating tubes or heating wires for heating and use high-speed fans for internal circulation, resulting in high power consumption and noise. Utility Model Content

[0004] This application provides a high-temperature test chamber to reduce energy consumption and noise pollution during the testing process.

[0005] This application provides a high-temperature test chamber, including a chamber body, a cover, a drive assembly, a sensing assembly, and a control assembly;

[0006] The enclosure is used to house the electronic nodes;

[0007] The cover has a through-hole with adjustable size, located at the opening of the box, to connect the inside of the box with the outside environment;

[0008] The sensing components are located inside the enclosure and are used to detect the temperature inside the enclosure;

[0009] The control component is used to acquire the detected temperature of the sensing component and compare it with a preset temperature. When the difference between the detected temperature and the preset temperature is greater than a first preset value, the control drive component is used to adjust the size of the ventilation hole.

[0010] The high-temperature test chamber of this application eliminates the need for a traditional heating system. The heat generated by the operating electronic nodes within the chamber raises the internal temperature, directly utilizing the waste heat from the electronic nodes as the heat source, significantly reducing energy consumption. By controlling heat dissipation efficiency through adjustable ventilation holes, natural ventilation is achieved, reducing fan usage time and thus lowering operating noise. Furthermore, a cover with adjustable ventilation holes allows the control component to monitor the internal temperature in real-time via sensors, comparing it to a preset temperature. This enables dynamic adjustment of the ventilation hole opening based on actual temperature requirements, ensuring accurate temperature control and minimizing unnecessary energy consumption. When the difference between the detected and preset temperatures exceeds a set range, the control component quickly adjusts the ventilation hole size via a drive component, ensuring temperature stability in the testing environment. Providing more stable temperature control in high-temperature environments improves the heat dissipation performance and long-term reliability testing accuracy of the tested equipment. The adjustable ventilation hole design flexibly adapts to different testing needs, making it suitable for high-temperature performance testing of various IT hardware and offering a wider range of applications. Attached Figure Description

[0011] To more clearly illustrate the embodiments of this application, the accompanying drawings used in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0012] Figure 1 This is one of the structural schematic diagrams of a high-temperature test chamber provided in the embodiments of this application;

[0013] Figure 2 This is a second schematic diagram of the structure of a high-temperature test chamber provided in an embodiment of this application;

[0014] Figure 3 for Figure 1 One of the exploded structural diagrams of the high-temperature test chamber shown;

[0015] Figure 4 for Figure 1 The second part of the exploded structural diagram of the high-temperature test chamber is shown.

[0016] The above figures include the following reference numerals:

[0017] 100-High Temperature Test Chamber; 10-Chamber Body; 11-Placement Port; 12-Sliding Component; 20-Lid; 21-Ventilation Hole; 22-Frame; 23-Louvre; 30-Drive Component; 40-Sensing Component; 50-Control Component; 60-Heat Dissipation Component; 70-Alarm Component; 80-Power Supply Component; 81-Electrical Connector; 90-Door; 200-Electronic Node. Detailed Implementation

[0018] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. Based on the embodiments of this application, other embodiments obtained by those of ordinary skill in the art without creative effort are all within the protection scope of this application.

[0019] It should be noted that the terms "center," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," "axial," "radial," and "circumferential," etc., indicating orientation or positional relationships based on the orientation or positional relationships shown in the accompanying drawings, are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application. The terms "installed," "connected," and "linked" should be interpreted broadly, for example, they can be fixed connections, detachable connections, or integral connections; they can be mechanical connections or electrical connections; they can be direct connections or indirect connections through an intermediate medium; they can be internal connections between two elements. The terms "parallel," "perpendicular," and "equal" include the described situation and situations similar to the described situation, the range of which is within an acceptable deviation range, wherein the acceptable deviation range is determined by those skilled in the art taking into account the measurement under discussion and the error associated with the measurement of a particular quantity (i.e., the limitations of the measurement system). For example, "parallel" includes absolute parallelism and approximate parallelism, where an acceptable deviation range for approximate parallelism can be, for example, within 5°; "perpendicular" includes absolute perpendicularity and approximate perpendicularity, where an acceptable deviation range for approximate perpendicularity can also be, for example, within 5°. "Equal" includes absolute equality and approximate equality, where an acceptable deviation range for approximate equality can be, for example, a difference between the two equal items being less than or equal to 5% of either one. Those skilled in the art will understand the specific meaning of the above terms in this application based on the specific circumstances.

[0020] To enable those skilled in the art to better understand the present application, the present application will be further described in detail below with reference to the accompanying drawings and specific embodiments.

[0021] The embodiments of this application provide a high-temperature test chamber 100. The structure and working principle of the high-temperature test chamber 100 are described in detail below.

[0022] like Figure 1 As shown in the embodiment of this application, the high-temperature test chamber 100 is used to perform high-temperature testing on the electronic node 200.

[0023] In some possible implementations, electronic node 200 includes, but is not limited to, IT hardware such as server nodes, storage devices, and switches.

[0024] like Figure 4 As shown, in some possible implementations, the high-temperature test chamber 100 includes a chamber body 10, a cover 20, a drive assembly 30, a sensing assembly 40, and a control assembly 50. The chamber body 10 houses the electronic node 200. The cover 20, drive assembly 30, sensing assembly 40, and control assembly 50 are respectively disposed within the chamber body 10. The cover 20 is used for ventilation and heat dissipation of the chamber body 10. The cover 20 has a through-hole vent 21 of adjustable size. The cover 20 is located at the opening of the chamber body 10. The vent 21 connects the interior of the chamber body 10 with the external environment to facilitate heat exchange. The drive assembly 30 is connected to the cover 20. The drive assembly 30 adjusts the size of the vent 21 to regulate ventilation performance. The sensing assembly 40 is located inside the chamber body 10 and is used to detect the internal temperature of the chamber body 10. The control assembly 50 is controllably connected to the sensing assembly 40 and the drive assembly 30.

[0025] The control component 50 is used to acquire the detected temperature of the sensing component 40 and compare it with the preset temperature. When the difference between the detected temperature and the preset temperature is greater than a first preset value, the control drive component 30 is used to adjust the size of the ventilation hole 21.

[0026] In some possible implementations, sensing component 40 is a temperature sensor.

[0027] In some possible implementations, the control component 50 uses an MCU (Micro Controller Unit) as the core control unit to receive temperature data from the temperature sensing component and compare it with the set temperature range. The control component 50 uses a touch panel to display the real-time temperature and the set temperature.

[0028] In some possible implementations, the first preset value is 1℃. When the temperature inside the high-temperature test chamber 100 is stable within ±1℃ of the preset temperature, the current size of the ventilation hole 21 is maintained; when the temperature inside the high-temperature test chamber 100 is higher than the preset temperature by more than 1℃, the size of the ventilation hole 21 is increased by the drive component 30; when the temperature inside the high-temperature test chamber 100 is lower than the preset temperature by more than 1℃, the size of the ventilation hole 21 is decreased by the drive component 30, thereby realizing dynamic adjustment of the temperature inside the chamber 10.

[0029] The size of the ventilation hole 21 on the cover 20 is adjusted, that is, the opening ratio of the cover 20 is adjusted.

[0030] Since the electronic node 200 operates inside the chamber 10, the heat it generates raises the temperature inside the chamber. This eliminates the need for a traditional heating system, directly utilizing the waste heat from the electronic node 200 as the heat source for the high-temperature test chamber 100, significantly reducing energy consumption. Furthermore, by controlling the heat dissipation efficiency through changes in the size of the ventilation holes 21, natural ventilation is achieved, reducing fan usage time and thus lowering the noise level during equipment operation.

[0031] Furthermore, a cover 20 is provided on the enclosure 10, and the cover 20 features adjustable ventilation holes 21. The control component 50 monitors the temperature inside the enclosure 10 in real time via the sensing component 40 and compares it with a preset temperature. It can dynamically adjust the opening of the ventilation holes 21 according to the actual temperature requirements inside the enclosure 10, ensuring accurate temperature regulation and reducing unnecessary energy consumption. When the difference between the detected temperature and the preset temperature exceeds the set range, the control component 50 can quickly adjust the size of the ventilation holes 21 via the drive component 30, thereby ensuring the temperature stability of the test environment. By providing more stable temperature control conditions in high-temperature environments, the heat dissipation performance and long-term reliability testing accuracy of the tested equipment are improved. The adjustable ventilation hole 21 design can flexibly adapt to different testing needs, making it suitable for high-temperature performance testing of various IT hardware and providing a wider range of application scenarios.

[0032] In some possible implementations, the chamber 10 is made of a high-strength, well-insulated double-layer vacuum insulation panel, which can effectively reduce heat exchange between the inside and outside of the chamber 10, thereby reducing the impact of the external ambient temperature on the interior of the high-temperature test chamber 100.

[0033] In some possible implementations, the enclosure 10 is roughly rectangular, which makes it easy to place in spaces such as computer rooms for use.

[0034] like Figure 2As shown, in some possible implementations, the high-temperature test chamber 100 also includes a heat dissipation assembly 60. The heat dissipation assembly 60 is disposed within the chamber 10. The heat dissipation assembly 60 is used to regulate the temperature of the electronic node 200, such as by blowing air into or out of the chamber 10, thereby accelerating airflow and lowering the temperature inside the chamber 10. A control assembly 50 is connected to the heat dissipation assembly 60. The control assembly 50 is also used to activate the heat dissipation assembly 60 when the detected temperature exceeds a preset temperature by a value greater than a second preset value, thereby improving the heat dissipation efficiency within the chamber 10.

[0035] The second preset value is greater than the first preset value.

[0036] In some possible implementations, the second preset value is 5°C. When the temperature inside the high-temperature test chamber 100 is more than 5°C higher than the preset temperature, the drive component 30 increases the size of the ventilation hole 21. By controlling the heat dissipation component 60 to start, the increased ventilation hole 21 forces the airflow inside the chamber 10 to accelerate, thereby achieving heat dissipation from the chamber 10.

[0037] When the temperature inside the chamber 10 exceeds a certain threshold (second preset value), activating the heat dissipation component 60 can rapidly enhance heat dissipation capacity, preventing the temperature from rising further and thus ensuring the temperature stability of the test environment. By setting two different preset values ​​(first preset value and second preset value), the system can adopt different heat dissipation strategies according to different degrees of temperature change. The first preset value is used to adjust the ventilation vent 21, while the second preset value is used to activate the heat dissipation component 60, achieving more flexible temperature control. The second preset value ensures that the heat dissipation component 60 is activated only when necessary, avoiding unnecessary energy consumption. By prioritizing natural ventilation (adjusting the ventilation vent 21) for temperature regulation, and only activating the heat dissipation component 60 when the temperature exceeds the second preset value, this strategy effectively reduces overall energy consumption. By combining natural ventilation and forced ventilation (heat dissipation component 60), the system can achieve more precise temperature control, ensuring the stability of the test environment and thus improving the accuracy of test results.

[0038] Because the heat dissipation component 60 only activates when the temperature exceeds a second preset value, the equipment can maintain a low noise level most of the time, improving the comfort of the testing environment. In extreme cases (such as a sharp rise in temperature), the timely activation of the heat dissipation component 60 can prevent the equipment from overheating, thereby improving the reliability and safety of the testing equipment.

[0039] In some possible implementations, the heat dissipation component 60 is located on one side of the length direction of the housing 10, and a cover 20 can also be provided on the side of the housing 10 facing the heat dissipation component 60, so that the airflow of the heat dissipation component 60 can be adjusted by the opening ratio of the cover 20.

[0040] In some possible implementations, the heat dissipation component 60 includes multiple fans arranged in a matrix to improve the uniformity and efficiency of heat dissipation.

[0041] In some possible implementations, the high-temperature test chamber 100 also includes an alarm component 70. The alarm component 70 is located in the chamber 10 and is used to issue a warning. A control component 50 is connected to the alarm component 70. The control component 50 is also used to control the drive component 30 to fully open the ventilation hole 21, control the heat dissipation component 60 to rotate at full power, and control the alarm component 70 to issue a warning when the detected temperature exceeds a preset temperature value greater than a third preset value.

[0042] The third preset value is greater than the second preset value.

[0043] In some possible implementations, the third preset value is 10℃. When the temperature inside the high-temperature test chamber 100 exceeds the preset temperature by more than 10℃, it indicates that the temperature inside the chamber 10 may be out of control. At this time, the control drive component 30 fully opens the ventilation hole 21 and controls the heat dissipation component 60 to rotate at full power to achieve maximum power heat dissipation. At the same time, the alarm component 70 issues a warning to the operator. Before the operator can handle the high-temperature test chamber 100, the maximum power heat dissipation is maintained to reduce the probability of accidents.

[0044] The introduction of alarm component 70 enables the system to issue timely warnings when the temperature reaches dangerous levels, alerting operators to take necessary measures and helping to prevent equipment damage or loss of test data. Alarms from alarm component 70 prompt operators to react quickly, check the system status, and take necessary remedial measures, ensuring the continuity and safety of the testing process.

[0045] When the temperature exceeds the third preset value, the system enters an emergency state, providing the highest level of safety. In an emergency, fully opening the ventilation holes 21 and operating the heat dissipation components 60 at full power maximizes heat dissipation efficiency, rapidly reducing the temperature inside the enclosure 10 and protecting the test equipment. Through timely alarms and maximized heat dissipation measures, the system effectively prevents equipment damage due to overheating, extending the equipment's lifespan. The alarm component 70 not only protects the equipment but also enhances operator safety, preventing potential hazards caused by equipment overheating.

[0046] By setting three different preset values ​​(first preset value, second preset value, and third preset value), the system can take graded response measures as the temperature gradually increases. This multi-level temperature control and alarm mechanism improves the overall reliability of the system, enabling it to operate stably under various extreme conditions.

[0047] In some possible implementations, the alarm component 70 includes a warning light and a warning horn, such as an industrial-grade audible and visual alarm with an adjustable threshold. The alarm component 70 is positioned above the enclosure 10 to facilitate operator identification and confirmation of the corresponding high-temperature test chamber 100.

[0048] In some possible implementations, the alarm component 70 can also issue an alarm independently. By setting preset parameters, when an abnormality is detected in the high-temperature test chamber 100, an alarm can be issued directly.

[0049] In some possible implementations, the control component 50 is also used to adjust the rotational power of the heat dissipation component 60 when the detected temperature exceeds a preset temperature by a value greater than a second preset value and less than a third preset value.

[0050] In some possible implementations, the control component 50 is also used to maintain the size of the ventilation hole 21 when the difference between the detected temperature and the preset temperature is less than a first preset value.

[0051] In some possible implementations, the control component 50 is also used to control the drive component 30 to completely close the ventilation hole 21 when the detected temperature is lower than a preset temperature value greater than a second preset value.

[0052] By employing different control measures within varying temperature ranges, the system can more precisely regulate the internal temperature, ensuring the stability of the testing environment. The system can dynamically adjust the power of the heat dissipation component 60 and the size of the ventilation holes 21 based on temperature changes, providing more flexible temperature management. This dynamic adaptability helps address diverse testing needs and environmental variations. By reducing unnecessary operation of the heat dissipation component 60 and adjustment of the ventilation holes 21, power consumption is reduced, mechanical wear is minimized, and the equipment's lifespan is extended.

[0053] When the temperature difference is less than the first preset value, the size of the ventilation hole 21 is maintained to avoid unnecessary adjustments, thereby saving energy. When the temperature difference is between the second and third preset values, the rotation power of the heat dissipation component 60 is adjusted to achieve appropriate temperature control, further optimizing energy consumption. When the detected temperature is greater than the second preset value but lower than the preset temperature, the drive component 30 is controlled to completely close the ventilation hole 21, increasing the temperature inside the chamber 10 and preventing the temperature inside the chamber 10 from becoming too low, thus protecting the normal operation of the tested equipment.

[0054] Precise temperature control helps improve the accuracy of test results and ensures that test equipment operates under optimal conditions. This automated temperature management reduces the need for manual intervention, improves the user-friendliness of the system, and allows operators to focus on the testing itself.

[0055] In some possible implementations, the cover 20 includes a first sub-cover disposed on a first surface of the housing 10 and a second sub-cover disposed on a second surface of the housing 10. The first surface and the second surface can be two opposite surfaces of the housing 10 or two adjacent surfaces of the housing 10. By providing ventilation holes 21 on the two different surfaces, air inside the housing 10 is encouraged to convect with the outside, thereby increasing the airflow velocity between them.

[0056] In some possible implementations, the high-temperature test chamber 100 also includes a power supply assembly 80. The power supply assembly 80 is used to power the electronic node 200, the drive assembly 30, the sensing assembly 40, and the control assembly 50.

[0057] By integrating the power supply component 80 within the test chamber, reliance on external power sources is reduced, making the entire system more compact and easier to manage, and simplifying the installation and wiring process. The built-in power supply component 80 provides a stable power supply, reducing test interruptions caused by external power fluctuations or interruptions, and improving the reliability and continuity of the testing process. For scenarios requiring testing in different locations, the built-in power supply component 80 makes the high-temperature test chamber 100 easier to move and deploy, providing greater portability and flexibility. The integrated power supply component 80 can be designed to meet specific safety standards, providing overcurrent, overvoltage, and short-circuit protection, enhancing the overall system safety.

[0058] The power supply unit 80 can simultaneously power multiple components, ensuring the normal operation of system components during testing and preventing equipment failure due to insufficient power. Centralized power supply management allows the system to more effectively monitor and optimize energy consumption, reducing unnecessary power waste. Operators no longer need to configure individual power supplies for components, simplifying the operation process, reducing the possibility of errors, and improving work efficiency.

[0059] In some possible implementations, the power supply assembly 80 uses a PSU (Power Supply, DC power supply) to power the entire high-temperature test chamber 100 through multiple high-power power supplies.

[0060] In some possible implementations, the high-temperature test chamber 100 also includes an electrical connector 81. The electrical connector 81 is located inside the chamber 10 and is electrically connected to the power supply assembly 80. The electrical connector 81 is used for the insertion of the electronic node 200.

[0061] The electrical connector 81 allows the electronic node 200 to be directly plugged into the high-temperature test chamber 100 without the need for additional cables or external power connections, simplifying the installation and disassembly process. Through the electrical connector 81, users can quickly replace or add different electronic nodes 200 for testing, enhancing the flexibility and adaptability of the high-temperature test chamber 100 to suit various testing scenarios. The built-in electrical connector 81 reduces the use of external cables, lowers wiring complexity and clutter, and improves the cleanliness and safety of the testing environment.

[0062] By combining the power supply assembly 80 and the electrical connector 81, the system can centrally manage the power supply, ensuring a stable power supply to connected devices and improving the overall system reliability. The built-in electrical connector 81 allows for more efficient use of the internal space of the enclosure 10, avoiding the need for external power supplies to occupy additional space. By simplifying power connections, operators can perform equipment setup and test preparation more quickly, improving work efficiency and testing speed.

[0063] The electrical connector 81 can be designed to meet safety standards, providing overload protection and protection against electric shock to ensure the safety of equipment and operators.

[0064] In some possible implementations, the electrical connector 81 is a plug-in connector, which facilitates the connection of different electronic nodes 200 as needed inside the housing 10.

[0065] like Figure 3 As shown, in some possible implementations, the high-temperature test chamber 100 also includes a door 90. The chamber 10 is provided with a placement opening 11 for inserting the electronic node 200, and the door 90 covers the placement opening 11 and is provided with a cover 20.

[0066] The door 90 allows for easy insertion and removal of the electronic node 200 through the placement port 11, simplifying test preparation and equipment changeover processes and improving operational efficiency. The door 90 effectively covers the placement port 11, providing a good seal and preventing external environmental influences on the internal temperature of the enclosure 10, thereby improving test accuracy and reliability. The door 90 is designed to prevent accidental opening during testing, protecting operator safety and preventing equipment damage from drops or external interference. The door 90 also allows operators easy access to the interior of the enclosure 10 for equipment installation, commissioning, and maintenance, improving the user experience.

[0067] A cover 20 is provided on the door 90, allowing airflow within the chamber 10 to be controlled by adjusting the size of the ventilation holes 21, providing flexible temperature and heat dissipation management. By integrating the cover 20 into the door 90, the design is more compact, saving overall space in the chamber 10 and improving the space utilization of the equipment. Through the flexible design of the door 90 and cover 20, the high-temperature test chamber 100 can accommodate electronic nodes 200 of different sizes and types, as well as other IT equipment, meeting diverse testing needs.

[0068] In some possible implementations, the door 90 is located on one side of the length of the housing 10 and is opposite to the heat dissipation assembly 60, forming a longer heat dissipation duct.

[0069] In some possible implementations, the door 90 can be directly set as the cover 20, thereby improving the temperature regulation performance of the high temperature test chamber 100 and simplifying the structure of the high temperature test chamber 100.

[0070] In some possible implementations, the housing 10 is provided with a sliding component 12, which is used for the electronic node 200 to be slidably inserted into the housing 10.

[0071] The sliding assembly 12 provides a smooth movement path, reducing the probability of physical damage to the electronic node 200 and other equipment during loading and unloading. The sliding assembly 12 allows the electronic node 200 to easily slide into and out of the housing 10, simplifying the installation and disassembly process and reducing operator workload. The sliding assembly 12 makes loading and unloading the electronic node 200 faster, significantly improving the efficiency of test preparation and equipment changeover. The use of the sliding assembly 12 reduces the physical demands on operators, enhancing the user experience, especially in situations requiring frequent equipment changes or adjustments.

[0072] The sliding assembly 12 can be designed to accommodate electronic nodes 200 and other IT equipment of different sizes and weights, providing broader compatibility and adaptability. The sliding assembly 12 can be designed with a locking mechanism to ensure the electronic node 200 remains stable during testing, preventing damage or test interruption due to accidental movement. The sliding assembly 12 helps to better organize the internal space of the enclosure 10, resulting in a neater arrangement of equipment and improved space utilization.

[0073] In some possible implementations, the sliding component 12 consists of multiple sets of rollers arranged sequentially along the opening direction of the placement port 11, so that the electronic node 200 can be placed at the opening of the placement port 11 and pushed to be installed into the housing 10.

[0074] The multiple sets of rollers allow the electronic node 200 to easily slide into the housing 10. Operators simply place the electronic node 200 at the opening of the placement port 11 and gently push it into the housing 10, reducing the difficulty and time required for installation. The roller design reduces the physical exertion required for operators when loading and unloading the electronic node 200, lowering the probability of injury from handling heavy objects and improving work safety. The rollers provide a smooth movement path, reducing the probability of physical damage to the electronic node 200 and other equipment during loading and unloading, protecting the integrity of the equipment. Multiple sets of rollers provide even support, ensuring the electronic node 200 remains stable during sliding, reducing the possibility of tilting or wobbling. The roller design can accommodate electronic nodes 200 and other IT equipment of different sizes and weights, providing broader compatibility and adaptability.

[0075] The rollers make loading and unloading equipment much faster, significantly improving the efficiency of test preparation and equipment changeover. The rollers also make equipment operation easier and more intuitive, enhancing the user experience, especially when frequent equipment changes or adjustments are required.

[0076] In some possible implementations, the high temperature test chamber 100 includes multiple covers 20, a drive assembly 30, and a sensor assembly 40. The multiple covers 20 are respectively located on the chamber 10. The drive assembly 30 corresponds to each cover 20, and the sensor assembly 40 corresponds to each cover 20 and is adjacent to the corresponding cover 20.

[0077] Multiple sensing components 40 monitor the temperature inside the enclosure 10 in real time and feed it back to the control component 50 for dynamic adjustment to ensure temperature uniformity.

[0078] Each cover 20 has an independent drive assembly 30 and a sensing assembly 40, enabling precise temperature control in different areas within the chamber 10. This design allows for independent adjustment based on the temperature requirements of each area, ensuring temperature uniformity and stability throughout the testing environment. By independently adjusting the temperature of different areas, the system can more effectively manage energy consumption, avoiding unnecessary energy waste and contributing to optimized overall energy efficiency. Since the sensing assemblies 40 are located adjacent to their corresponding covers 20, the system can quickly respond to temperature changes and promptly adjust the opening of the ventilation vents 21 to ensure that the temperature of the corresponding area remains consistent with the preset temperature, thus maintaining temperature stability. Through precise temperature control, the test chamber can provide more stable environmental conditions, improving the accuracy and reliability of test results. The design of multiple covers 20 provides greater flexibility, adapting to different testing needs and equipment configurations. Users can adjust the ventilation and temperature settings of each area according to specific testing conditions.

[0079] In some possible implementations, multiple sensing components 40 are evenly arranged in the housing 10. The high-temperature test chamber 100 includes multiple heat dissipation components 60, which are correspondingly arranged with the sensing components 40.

[0080] Multiple sensing components 40 monitor the temperature distribution inside the enclosure 10 in real time and transmit the collected temperature data to the control component 50, which then controls the corresponding heat dissipation component 60 for adjustment.

[0081] By using evenly distributed sensing components 40 to monitor and control components 50 in real time, along with corresponding heat dissipation components 60, forced convection cooling can be achieved in different areas. Combined with multiple covers 20 and drive components 30, precise control of heat dissipation at different locations within the chamber 10 can be achieved, ensuring temperature uniformity and stability throughout the testing environment. By adjusting forced ventilation only in the required areas, the system reduces unnecessary operation of the heat dissipation components 60, thereby lowering noise levels and improving the comfort of the testing environment. This multi-zone control design allows the high-temperature test chamber 100 to support more complex testing scenarios, such as simultaneously testing multiple devices or conducting comparative tests under different conditions.

[0082] In some possible implementations, the cover 20 includes a frame 22 and a plurality of louvers 23. The frame 22 is mounted on the housing 10. The louvers 23 are rotatably mounted on the frame 22. Ventilation holes 21 are formed between the louvers 23. The drive assembly 30 is drivenly connected to the louvers 23 to drive the louvers 23 to rotate, thereby adjusting the size of the ventilation holes 21.

[0083] The louver 23 design allows for precise adjustment of the size of the ventilation opening 21 by rotation, enabling fine control of airflow within the chamber 10. This design can meet the adjustment of ventilation requirements. By adjusting the angle of the louver 23, the opening of the ventilation opening 21 can be quickly changed, flexibly adjusting the temperature within the chamber 10 and ensuring the stability and consistency of the testing environment. Precise ventilation control helps optimize energy consumption, avoid unnecessary energy waste, and thus improve the overall energy efficiency of the high-temperature test chamber 100.

[0084] When the louvers 23 are fully closed, they provide excellent sealing, preventing outside air from entering the housing 10 and thus maintaining the stability of the internal environment. Through a transmission connection with the drive assembly 30, the adjustment of the louvers 23 can be automated, reducing manual intervention and improving operational efficiency.

[0085] The louvered 23 structure is generally highly durable, capable of withstanding frequent adjustment operations, reducing maintenance requirements and improving system reliability.

[0086] Compared to traditional fans, the adjustable louvers 23 allow for natural ventilation without increasing noise, thereby reducing noise levels in the testing environment and improving comfort.

[0087] In some possible implementations, the drive component 30 is a stepper motor. The drive component 30 is connected to the louver 23 through a gear transmission mechanism. After receiving the command from the control component 50, the motor drives the louver 23 to rotate, precisely adjusting the size of the ventilation hole.

[0088] However, it is not limited to this. In other possible implementations, the drive component 30 can also be connected to the louver 23 via a transmission belt, a lead screw structure, etc. In this case, the drive component 30 can be a servo motor or a cylinder, etc.

[0089] In some possible implementations, the louver 23 is made of lightweight, high-temperature resistant aluminum alloy.

[0090] In some possible implementations, the cover 20 is provided on both sides and the top surface of the box 10 along its length.

[0091] During testing, the electronic node 200 generates heat while operating within the enclosure 10. The sensing component 40 monitors the temperature inside the enclosure 10 in real time and transmits this information to the control component 50. The control component 50 compares the detected temperature with a preset temperature range. If the temperature exceeds the preset range by less than 5°C, the drive component 30 is first controlled to increase the ventilation opening 21 for natural ventilation to dissipate heat until the temperature inside the enclosure 10 stabilizes within ±1°C of the preset temperature range. If the temperature continues to rise and exceeds the temperature range by more than 5°C, even though the ventilation opening 21 is already at its maximum, but the temperature exceeds the range by less than 10°C, the heat dissipation component 60 is activated and operates at 50% power to force-accelerate airflow for heat dissipation within the enclosure 10. Once the temperature drops to within 5°C of the preset temperature range, the heat dissipation component 60 is turned off, and temperature control is restored to adjusting only the ventilation opening 21 until the temperature inside the enclosure 10 stabilizes within ±1°C of the preset temperature range, maintaining the size of the ventilation opening 21 to maintain the current heat dissipation level. If the temperature continues to rise above the preset temperature range of 10°C, the heat dissipation component 60 will be controlled to operate at full power, and the alarm component 70 will issue an alarm until the operator comes to handle the situation.

[0092] Through continuous monitoring by the sensing component 40, the control component 50 continuously adjusts the drive component 30 and the heat dissipation component 60 to form a closed-loop control, ensuring that the temperature inside the enclosure 10 remains stable within the preset temperature range of ±1℃.

[0093] The high-temperature test chamber 100 provided in this embodiment includes a chamber body 10, a cover 20, a drive assembly 30, a sensing assembly 40, and a control assembly 50. The chamber body 10 houses the electronic node 200. The cover 20 is disposed within the chamber body 10. The cover 20 has an adjustable ventilation hole 21. The ventilation hole 21 communicates with the interior of the chamber body 10. The drive assembly 30 is connected to the cover 20 to adjust the size of the ventilation hole 21. The sensing assembly 40 is disposed within the chamber body 10 and is used to detect the temperature inside the chamber body 10. The control assembly 50 is controllably connected to the sensing assembly 40 and the drive assembly 30. The control assembly 50 acquires the detected temperature from the sensing assembly 40 and compares it with a preset temperature. When the difference between the detected temperature and the preset temperature exceeds a first preset value, the control assembly 50 adjusts the size of the ventilation hole 21.

[0094] Since the electronic node 200 operates within the chamber 10, the heat it generates raises the internal temperature. This eliminates the need for a traditional heating system, directly utilizing the waste heat from the electronic node 200 as the heat source for the high-temperature test chamber 100, significantly reducing energy consumption. By controlling the size of the ventilation holes 21 to improve heat dissipation efficiency, natural ventilation is achieved, reducing fan usage time and thus lowering noise levels. Furthermore, a cover 20 with adjustable ventilation holes 21 is installed on the chamber 10. The control component 50 monitors the temperature inside the chamber 10 in real time via the sensing component 40 and compares it with a preset temperature. It can dynamically adjust the opening of the ventilation holes 21 according to the actual temperature requirements inside the chamber 10, ensuring accurate temperature control and reducing unnecessary energy consumption. When the difference between the detected temperature and the preset temperature exceeds the set range, the control component 50 can quickly adjust the size of the ventilation holes 21 via the drive component 30, ensuring temperature stability in the test environment. By providing more stable temperature control conditions in high-temperature environments, the heat dissipation performance and long-term reliability testing accuracy of the tested equipment are improved. The adjustable ventilation hole design allows for flexible adaptation to different testing needs, making it suitable for high-temperature performance testing of various IT hardware and providing a wider range of application scenarios.

[0095] An embodiment of this application provides a temperature control testing method applied to a high-temperature test chamber 100, comprising:

[0096] Set the preset temperature;

[0097] The detected temperature of the sensing component 40 is obtained and compared with the preset temperature;

[0098] When the difference between the detected temperature and the preset temperature is greater than the first preset value, the control drive component 30 adjusts the size of the ventilation hole 21.

[0099] This method provides an automated and reliable temperature management system, enhancing the user experience and making the operation of the high-temperature test chamber more convenient and efficient. By setting a preset temperature and acquiring the detected temperature of the sensing component 40 in real time, the system can accurately monitor and manage the temperature inside the chamber 10, ensuring the stability of the testing environment. When the difference between the detected temperature and the preset temperature exceeds a first preset value, the system automatically controls the drive component 30 to adjust the size of the ventilation vent 21. This dynamic response capability allows the system to quickly adapt to temperature changes and maintain ideal testing conditions. By adjusting the size of the ventilation vent 21 only when necessary, the system can effectively manage energy consumption, avoid unnecessary energy waste, and improve overall energy efficiency. Automated temperature control reduces the need for manual intervention, improves operational efficiency, and allows operators to focus on other important tasks. Precise temperature control helps improve the accuracy and reliability of test results, ensuring that the test equipment operates under optimal conditions.

[0100] In some possible implementations, the temperature control test method also includes: when the detected temperature is higher than the preset temperature, if the detected temperature exceeds the preset temperature by a value greater than a second preset value, controlling the heat dissipation component 60 to start, where the second preset value is greater than the first preset value.

[0101] This method reduces the need for manual intervention, providing an automated temperature management system that makes operation more convenient and efficient. When the detected temperature exceeds a second preset value, activating the heat dissipation component 60 rapidly increases airflow, accelerates heat dissipation, and helps the temperature inside the chamber 10 quickly return to the preset range. By setting different preset values ​​(first and second preset values), the system can take more proactive measures (such as activating the heat dissipation component 60) when there are large temperature differences, providing a multi-level temperature control strategy to ensure the stability of the testing environment. The rapid activation of the heat dissipation component 60 provides timely cooling when the temperature rises sharply, enhancing the system's response speed to temperature changes and preventing excessively high temperatures from affecting test results or damaging equipment. The heat dissipation component 60 only activates when the temperature difference exceeds the second preset value, avoiding unnecessary energy consumption. This strategic use of the heat dissipation component 60 helps optimize overall energy efficiency. Activating the heat dissipation component 60 only when needed reduces noise problems caused by continuous operation and improves the comfort of the testing environment.

[0102] In some possible implementations, the temperature control test method also includes: when the detected temperature exceeds the preset temperature, if the detected temperature exceeds the preset temperature by a value greater than a third preset value, controlling the drive component 30 to fully open the ventilation hole 21, controlling the heat dissipation component 60 to rotate at full power, and controlling the alarm component 70 to issue a warning, the third preset value being greater than the second preset value.

[0103] This multi-layered temperature control and alarm mechanism improves the reliability of the testing process, ensuring that test results are not affected by extreme temperature conditions. The system automatically executes a series of emergency response measures, reducing reliance on manual intervention and improving operational efficiency and safety.

[0104] When the detected temperature exceeds the preset temperature by a value greater than the third preset value, the system takes a series of emergency measures, including fully opening the ventilation vents 21, operating the heat dissipation components 60 at full power, and issuing a warning. These multiple measures ensure maximum safety under extreme temperature conditions. By fully opening the ventilation vents 21 and operating the heat dissipation components 60 at full power, the system can rapidly increase airflow and heat dissipation capacity, quickly reducing the temperature inside the enclosure 10 and preventing overheating. The activation of the alarm component 70 provides a clear warning to the operator, indicating a potential temperature problem, enabling them to take further measures to protect the equipment and data. By taking emergency measures when the temperature reaches a dangerous level, the system effectively prevents equipment damage due to overheating and extends the equipment's lifespan. The real-time alarm function provided by the alarm component 70 gives users greater peace of mind, knowing that the system can respond and take measures promptly when abnormal temperatures occur.

[0105] Among some possible implementations, temperature control testing methods also include:

[0106] When the detected temperature exceeds the preset temperature, if the detected temperature exceeds the preset temperature by a value greater than the second preset value but less than the third preset value, the rotation power of the heat dissipation component 60 is adjusted.

[0107] In some possible implementations, the temperature control test method also includes maintaining the size of the ventilation hole 21 when the difference between the detected temperature and the preset temperature is less than a first preset value.

[0108] In some possible implementations, the temperature control test method also includes: when the detected temperature is lower than the preset temperature, if the preset temperature exceeds the detected temperature by a value greater than a second preset value, the control drive component 30 completely closes the ventilation hole 21.

[0109] By employing different measures within varying temperature ranges, the system can precisely manage the temperature inside the chamber. This approach ensures more stable and accurate temperature control, adapting to diverse testing needs. This multi-layered temperature control strategy provides appropriate protection under different temperature conditions, extending the equipment's lifespan. Automated temperature regulation and control reduce the need for manual intervention, improving operational efficiency and allowing operators to focus on other critical tasks. By adjusting the operation of the ventilation vents 21 and heat dissipation components 60 only when necessary, the system effectively manages energy consumption, avoiding unnecessary energy waste and improving overall energy efficiency.

[0110] When the detected temperature exceeds a preset value by more than a second preset value but less than a third preset value, the system can flexibly adjust its heat dissipation capacity by adjusting the rotation power of the heat dissipation component 60. This dynamic adjustment helps optimize energy consumption while maintaining the temperature within a safe range.

[0111] When the difference between the detected temperature and the preset temperature is less than the first preset value, the size of the ventilation hole 21 remains unchanged, which helps to maintain the current temperature stability and avoid unnecessary adjustment interference.

[0112] When the detected temperature is lower than the preset temperature by more than the second preset value, completely closing the ventilation hole 21 can prevent the temperature inside the enclosure 10 from getting too low and protect the equipment from the effects of low temperature.

[0113] The high-temperature testing chamber provided in this application has been described in detail above. Specific examples have been used to illustrate the principles and implementation methods of this application. The descriptions of the above embodiments are only intended to help understand the method and core ideas of this application. It should be noted that those skilled in the art can make various improvements and modifications to this application without departing from its principles, and these improvements and modifications also fall within the protection scope of the claims of this application.

Claims

1. A high temperature test chamber characterized by, Includes housing, cover, drive assembly, sensing assembly and control assembly; The enclosure is used to house electronic nodes; The cover has a through-hole with adjustable size, located at the opening of the box, for connecting the inside of the box with the external environment; The sensing component is located inside the enclosure and is used to detect the temperature inside the enclosure; The control component is used to acquire the detected temperature of the sensing component and compare it with a preset temperature. When the difference between the detected temperature and the preset temperature is greater than a first preset value, the control component is used to adjust the size of the ventilation hole.

2. The high-temperature test chamber according to claim 1, characterized in that, It also includes a heat dissipation component for regulating the temperature of the electronic node.

3. The high-temperature test chamber according to claim 2, characterized in that, It also includes an alarm component for issuing warnings.

4. The high-temperature test chamber according to any one of claims 1-3, characterized in that, The cover includes a first sub-cover disposed on the first surface of the housing and a second sub-cover disposed on the second surface.

5. The high-temperature test chamber according to any one of claims 1-3, characterized in that, It also includes a power supply component for supplying power to the electronic node, the drive component, the sensing component and the control component.

6. The high-temperature test chamber according to claim 5, characterized in that, It also includes an electrical connector, which is disposed inside the housing and electrically connected to the power supply assembly, and is used for electronic node insertion.

7. The high-temperature test chamber according to any one of claims 1-3, characterized in that, It also includes a door, the box having a placement opening for inserting the electronic node, the door covering the placement opening, and the door having a cover.

8. The high-temperature test chamber according to any one of claims 1-3, characterized in that, The high-temperature test chamber includes multiple covers, a driving component, and a sensing component. The multiple covers are respectively disposed in the chamber. The driving component corresponds to each cover, and the sensing component corresponds to each cover and is adjacent to the corresponding cover.

9. The high-temperature test chamber according to any one of claims 1-3, characterized in that, The housing is equipped with a sliding component, which is used to slide the electronic node into the housing.

10. The high-temperature test chamber according to any one of claims 1-3, characterized in that, The cover includes a frame and multiple louvers. The frame is mounted on the box, and the louvers are rotatably mounted on the frame. The ventilation holes are formed between the louvers. The drive assembly is connected to the louvers to drive the louvers to rotate and adjust the size of the ventilation holes.

Images