Test instrument for integrated circuit reliability analysis
The design of the integrated circuit reliability analysis and testing instrument adopts a combination structure of conveyor rails, conveyor chains, springs and pressure plates to realize the automated loading, unloading and fixing of integrated circuits. This solves the problem of the inability to load, unload and clamp the circuits simultaneously in the existing technology, and improves the testing efficiency and safety.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- YEUNGYU ELECTRONICS CO LTD
- Filing Date
- 2025-07-01
- Publication Date
- 2026-08-04
AI Technical Summary
Existing integrated circuit reliability analysis and testing instruments cannot simultaneously load and unload materials during testing, and the clamping and fixing operation is cumbersome, affecting the effectiveness of use.
An integrated circuit reliability analysis and testing instrument was designed. It uses a conveyor track and conveyor chain to realize the automated loading and unloading of integrated circuits, and uses a combination structure of springs and pressure plates to realize the automatic fixation of integrated circuits. Combined with a linear drive module and drive motor, it realizes the automatic adjustment and contact of probes.
It enables synchronous loading and unloading and automatic fixing during the automated testing process of integrated circuits, improving testing efficiency, simplifying the operation process, and avoiding shaking and damage to integrated circuits during testing.
Smart Images

Figure CN224594776U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of testing instrument technology, and in particular to a testing instrument for integrated circuit reliability analysis. Background Technology
[0002] An integrated circuit reliability analysis and testing instrument is a specialized equipment system used to evaluate the ability of integrated circuits to resist failure within their expected lifespan.
[0003] Existing integrated circuit reliability analysis testers involve placing the integrated circuit under test into the test chamber before testing. However, this requires completing one test before removing the integrated circuit to place the next, preventing simultaneous loading and unloading during testing, resulting in poor performance. Furthermore, the test bench typically requires a clamping mechanism to hold and secure the integrated circuit, necessitating manual control or a separate power mechanism, which is cumbersome. Therefore, we propose a new integrated circuit reliability analysis tester. Utility Model Content
[0004] The purpose of this invention is to address the aforementioned shortcomings in the existing technology by proposing a test instrument for integrated circuit reliability analysis.
[0005] To achieve the above objectives, the present invention adopts the following technical solution: a tester for integrated circuit reliability analysis is designed, including a base, a shell with an opening on one side is installed on the top of the base, a movable plate is installed inside the shell, the top of the movable plate is connected to the shell through a telescopic mechanism, and a mounting base is connected to the bottom of the movable plate through a linear drive module. Several conductive sleeves are installed at the bottom of the mounting base, and a probe is installed inside each conductive sleeve, with the bottom of the probe extending to the outside of the conductive sleeve.
[0006] A pressure plate is provided below the probe. Several through holes are opened on the top of the pressure plate. Each probe is aligned with the corresponding through hole. L-shaped connecting plates are vertically installed on both sides of the top of the pressure plate. Guide rods are installed on both sides of the bottom of the mounting base. The bottom of each guide rod passes through the L-shaped connecting plate. A first spring is sleeved on the side of each guide rod. The bottom of each first spring abuts against the top of the L-shaped connecting plate, and the top of each first spring abuts against the bottom of the mounting base.
[0007] The top of the base is equipped with a conveyor rail, one end of which passes through the outer shell and extends into the interior of the outer shell. Inside the conveyor rail is a conveyor chain, the top of which extends out of the conveyor rail. Two trays are installed on the top of the conveyor chain, and each tray has a positioning groove on its top. An integrated circuit is placed inside the positioning groove. Two through slots are opened on the side of the outer shell. When one tray passes through the corresponding through slot and moves into the outer shell, the other tray passes through the through slot and moves out of the outer shell.
[0008] Both ends of the conveyor track are equipped with sprockets. The bottom of each sprocket is rotatably connected to the top of the base. Both ends of the conveyor track are provided with opening slots. One side of each sprocket passes through the corresponding opening slot and meshes with the conveyor chain. The bottom of one of the sprockets is connected to a drive motor, which is fixed to the top of the base.
[0009] Preferably, a connecting ring is installed on the top of the probe. The connecting ring is made of insulating rubber material, and a second spring is fitted on the side of each conductive sleeve. The bottom of each second spring is fixed to the top of the connecting ring, and the top of each second spring is fixed to the bottom of the mounting base.
[0010] Preferably, the conductive sleeve is coaxially fitted with an insulating sleeve, which is a retractable corrugated sleeve. The bottom of the insulating sleeve is fixed to the top of the connecting ring, and the top of the insulating sleeve is fixed to the bottom of the mounting base. There is a gap between the outer surface of the insulating sleeve and the second spring.
[0011] Preferably, each guide rod is fitted with an anti-detachment block at its bottom end, and when the first spring extends, the bottom of the L-shaped connecting plate abuts against the top of the anti-detachment block.
[0012] Preferably, the top of the conveyor chain is equipped with two sealing covers, one of which is located inside the housing and the other is located outside the housing. When one of the trays moves below the probe, the two sealing covers cover the corresponding end of the through slot and are sealed to the through slot.
[0013] Preferably, a protective cover is provided on the side of the housing near the opening, one side of the protective cover is slidably connected to a wedge groove opened on the side of the housing via a wedge track, and the protective cover covers the opening of the housing and is sealed to the side wall of the opening of the housing.
[0014] Preferably, a control cabinet is installed on the side of the housing, and the controller inside the control cabinet is connected to the linear drive module, the conductive sleeve, the telescopic mechanism and the drive motor respectively through wires.
[0015] Preferably, several support legs are installed on the bottom edge of the base.
[0016] Preferably, guide plates are installed on both sides of the inner shell, and both ends of the movable plate are slidably connected to the corresponding guide plate side by sliding sleeves.
[0017] The design scheme proposed in this utility model has the following beneficial effects in application:
[0018] 1. The pressure plate can be pushed by the elastic force of the first spring, so that the pressure plate presses firmly on the surface of the integrated circuit, pressing and fixing the integrated circuit, preventing the integrated circuit from shaking during testing, and making it easy to fix.
[0019] 2. The drive motor can move the conveyor chain, which can synchronously move the two storage trays. When one storage tray is inside the housing, the other storage tray is outside the housing. When testing the integrated circuits on one storage tray, the operator can load and unload the other storage tray, improving the efficiency of use. Attached Figure Description
[0020] Figure 1 This is a schematic diagram of the structure of this utility model;
[0021] Figure 2 This is a schematic diagram of the conveyor chain and conveyor track structure of this utility model;
[0022] Figure 3 This is a schematic diagram of the movable plate structure of this utility model;
[0023] Figure 4 This is a schematic diagram of the probe and pressure plate structure of this utility model;
[0024] Figure 5 This is a side sectional view of the conductive sleeve and probe structure of this utility model;
[0025] Figure 6 This is a side sectional view of the structure of this utility model.
[0026] In the diagram: 1. Base; 2. Outer shell; 3. Protective cover; 4. Linear drive module; 5. Telescopic mechanism; 6. Mounting base; 7. Control cabinet; 8. Conveyor track; 9. Through slot; 10. Sealing cover; 11. Conveyor chain; 12. Sprocket; 13. Storage tray; 14. Positioning slot; 15. Opening slot; 16. Drive motor; 17. Guide plate; 18. Moving plate; 19. Support leg; 20. First spring; 21. Probe; 22. Through hole; 23. Pressure plate; 24. L-shaped connecting plate; 25. Guide rod; 26. Conductive sleeve; 27. Insulating sleeve; 28. Second spring; 29. Connecting ring; 30. Anti-detachment block. Detailed Implementation
[0027] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present utility model. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments.
[0028] Reference Figures 1-6 An integrated circuit reliability analysis tester includes a base 1, characterized in that: a housing 2 with an opening on one side is installed on the top of the base 1, and a control cabinet 7 is installed on the side of the housing 2. The control cabinet 7 contains a controller, which is a control motherboard or a PLC logic controller.
[0029] like Figure 1 and Figure 2 As shown, a conveyor rail 8 is installed on the top of the base 1. One end of the conveyor rail 8 passes through the outer shell 2 and extends into the interior of the outer shell 2. A conveyor chain 11 is provided inside the conveyor rail 8, and the top of the conveyor chain 11 extends to the outside of the conveyor rail 8. Two trays 13 are installed on the top of the conveyor chain 11. Each tray 13 has a positioning groove 14 on its top. An integrated circuit is placed inside the positioning groove 14. Two through grooves 9 are opened on the side of the outer shell 2. When one tray 13 passes through the corresponding through groove 9 and moves into the outer shell 2, the other tray 13 passes through the through groove 9 and moves to the outside of the outer shell 2. In actual use, the tray 13 containing the integrated circuit can be moved into the outer shell 2 for testing by the conveyor chain 11, while the other tray 13 will be moved out of the outer shell 2. The operator can then place the integrated circuit to be tested into the positioning groove 14 on the tray 13, which allows for loading and unloading during testing and improves the efficiency of use.
[0030] like Figure 2 and Figure 6 As shown, both ends of the conveyor track 8 are equipped with sprockets 12. The bottom of each sprocket 12 is rotatably connected to the top of the base 1. Both ends of the conveyor track 8 are provided with opening slots 15. One side of each sprocket 12 passes through the corresponding opening slot 15 and meshes with the conveyor chain 11. The bottom of one of the sprockets 12 is connected to a drive motor 16. The drive motor 16 is fixed to the top of the base 1 and is connected to the controller through a wire. In actual use, the operator can drive the sprocket 12 to rotate through the drive motor 16. The sprocket 12 can drive the conveyor chain 11 to move along the conveyor track 8 and move the tray 13 containing the integrated circuit into the preset position inside the outer shell 2, ready for testing.
[0031] like Figure 1As shown, the interior of the outer casing 2 is provided with a movable plate 18. The top of the movable plate 18 is connected to the outer casing 2 through a telescopic mechanism 5. The telescopic mechanism 5 is an electric push rod, a cylinder or a hydraulic cylinder, and the telescopic mechanism 5 is connected to the controller through a wire. In actual use, the telescopic mechanism 5 can be extended and retracted through the controller, thereby adjusting the height of the movable plate 18.
[0032] It should be noted that, as Figure 3 and Figure 6 As shown, guide plates 17 are installed on both sides of the inner side of the outer casing 2. Both ends of the movable plate 18 are slidably connected to the sides of the corresponding guide plates 17 by sliding sleeves. In actual use, the guide plates 17 can guide and limit the movable plate 18, so that the movable plate 18 remains stable.
[0033] like Figure 3 and Figure 6 As shown, the bottom of the movable plate 18 is connected to the mounting base 6 via the linear drive module 4. Several conductive sleeves 26 are installed on the bottom of the mounting base 6. Each conductive sleeve 26 has a probe 21 inside. The bottom of the probe 21 extends to the outside of the conductive sleeve 26. The linear drive module 4 and the probe 21 are connected to the controller via wires. In actual use, the linear drive module 4 can drive the mounting base 6 to move, thereby allowing the position of the probe 21 to be adjusted horizontally.
[0034] like Figure 2 and Figure 4 As shown, a pressure plate 23 is provided below the probe 21. Several through holes 22 are opened on the top of the pressure plate 23. Each probe 21 is aligned with a corresponding through hole 22. L-shaped connecting plates 24 are vertically installed on both sides of the top of the pressure plate 23. Guide rods 25 are installed on both sides of the bottom of the mounting base 6. The bottom of each guide rod 25 penetrates through the L-shaped connecting plate 24. A first spring 20 is fitted on the side of each guide rod 25. The bottom of each first spring 20 abuts against the top of the L-shaped connecting plate 24. The top of the spring 20 rests against the bottom of the mounting base 6. In actual use, the extension and retraction of the moving plate 18 will cause the pressure plate 23 to move down. First, the bottom of the pressure plate 23 contacts the top of the integrated circuit. Then, the mounting base 6 will continue to move down and cause the conductive sleeve 26 to move down. The first spring 20 is compressed, so that the pressure plate 23 presses the integrated circuit tightly and fixes it. At the same time, the bottom of the probe 21 passes through the through hole 22 and contacts the contact on the integrated circuit to complete the circuit connection, so that the integrated circuit can be tested.
[0035] It should be noted that the pressure plate 23 is made of a cushioning rubber material, or other flexible material with cushioning properties, so that the pressure plate 23 will not damage the integrated circuit when it is pressed and fixed.
[0036] like Figure 4 and Figure 5 As shown, a connecting ring 29 is installed on the top of the probe 21. The connecting ring 29 is made of insulating rubber material, and a second spring 28 is fitted on the side of each conductive sleeve 26. The bottom of each second spring 28 is fixed to the top of the connecting ring 29, and the top of each second spring 28 is fixed to the bottom of the mounting base 6. In actual use, when the probe 21 contacts the integrated circuit, the integrated circuit will generate a reaction force on the probe 21. At this time, the second spring 28 will contract under the reaction force, which can buffer and eliminate the reaction force, and avoid damage when the integrated circuit or the probe 21 contacts.
[0037] It should be noted that when the second spring 28 is extended to its longest length, the top of the probe 21 is located inside the conductive sleeve 26, so that the probe 21 will not come out of the conductive sleeve 26.
[0038] like Figure 4 and Figure 5 As shown, an insulating sleeve 27 is coaxially fitted around the conductive sleeve 26. The insulating sleeve 27 is a retractable corrugated sleeve. The bottom of the insulating sleeve 27 is fixed to the top of the connecting ring 29, and the top of the insulating sleeve 27 is fixed to the bottom of the mounting base 6. There is a gap between the outer surface of the insulating sleeve 27 and the second spring 28. The insulating sleeve 27 can separate the second spring 28 from the conductive sleeve 26, so that the second spring 28 will not come into contact with the conductive sleeve 26 during use, thus preventing a short circuit.
[0039] It should be noted that, as Figure 1 and Figure 2 As shown, two sealing covers 10 are installed on the top of the conveyor chain 11. One sealing cover 10 is located inside the housing 2, and the other sealing cover 10 is located outside the housing 2. When one of the trays 13 moves below the probe 21, the two sealing covers 10 cover the corresponding end of the through groove 9 and seal the through groove 9. In actual use, the through groove 9 can be sealed by the sealing cover 10. In this way, a closed environment will be formed inside the housing 2 during detection, which improves the detection effect.
[0040] Specifically, in use, the operator places the integrated circuit in the corresponding positioning slot 14, and then controls the drive motor 16 to work through the controller. The drive motor 16 drives the sprocket 12 to rotate, and the sprocket 12 drives the conveyor chain 11 to move along the conveyor track 8. The conveyor chain 11 moves the tray 13 containing the integrated circuit to a preset position inside the outer shell 2. At the same time, another tray 13 moves out of the outer shell 2 and to a preset position. Then, the operator controls the linear drive module 4 to work through the controller. The linear drive module 4 can drive the conductive sleeve 26 and the probe 21 to move, so that the probe 21 is aligned with the contact of the integrated circuit. After the position is adjusted, the telescopic mechanism 5 is controlled through the controller to work. The telescopic mechanism 5 drives the moving plate 18 to move down, and the moving plate 18 drives the mounting base 6 to move down. The mounting base 6 will simultaneously drive the probe 21 and the pressure plate 23 to move. The bottom of the pressure plate 23 first contacts the top of the integrated circuit. At this time, the mounting base 6 continues to move down, the first spring 20 is compressed, and elastic force is applied to the pressure plate 23, so that the pressure plate 23 firmly fixes the integrated circuit. At the same time, the probe 21 will follow the mounting base 6 to continue to move down. The probe 21 continues to move downwards, allowing its bottom end to pass through the through hole 22 and contact the integrated circuit contacts, enabling testing of the integrated circuit. Simultaneously, the operator can place the integrated circuit to be tested into the corresponding positioning slot 14. After the integrated circuit under test has completed its test, the operator can control the telescopic mechanism 5 to retract, separating the probe 21 and the pressure plate 23 from the integrated circuit. Then, the controller controls the drive motor 16 to reverse, moving the tested integrated circuit out of the housing 2. Simultaneously, untested integrated circuits follow the conveyor chain 11 into the housing 2. Next, the controller controls the linear drive module 4 to move the mounting base 6 horizontally, moving the probe 21 to a preset position above the integrated circuit. Then, the telescopic mechanism 5 extends, pushing the moving plate 18 downwards, causing the pressure plate 23 to press the integrated circuit firmly. The probe 21 then contacts the integrated circuit contacts for testing. Simultaneously, the operator can remove the tested integrated circuit from the positioning slot 14 and place a new integrated circuit to be tested into the positioning slot 14, awaiting testing. This allows for simultaneous loading and unloading during testing, improving efficiency.
[0041] Furthermore, such as Figure 4 As shown, each guide rod 25 is equipped with an anti-detachment block 30 at its bottom. When the first spring 20 extends, the bottom of the L-shaped connecting plate 24 abuts against the top of the anti-detachment block 30. The anti-detachment block 30 can prevent the L-shaped connecting plate 24 from separating from the guide rod 25, thus improving the performance.
[0042] Furthermore, such as Figure 1As shown, a protective cover 3 is provided on the side of the outer shell 2 near the opening. One side of the protective cover 3 is slidably connected to the wedge groove opened on the side of the outer shell 2 through a wedge track. The protective cover 3 covers the opening of the outer shell 2 and is sealed to the side wall of the opening of the outer shell 2. The protective cover 3 can block and seal the opening of the outer shell 2 to avoid the external environment from interfering with the test results.
[0043] Furthermore, several support legs 19 are installed on the bottom edge of the base 1 to support the base 1 and keep the base 1 stable.
[0044] The above description is only a preferred embodiment of the present utility model, but the protection scope of the present utility model is not limited thereto. Any equivalent substitutions or changes made by those skilled in the art within the technical scope disclosed in the present utility model, based on the technical solution and the inventive concept of the present utility model, should be included within the protection scope of the present utility model.
Claims
1. A test instrument for reliability analysis of integrated circuits, comprising a base (1), characterized in that: The top of the base (1) is fitted with a housing (2) with an opening on one side. Inside the housing (2) is a movable plate (18). The top of the movable plate (18) is connected to the housing (2) via a telescopic mechanism (5). The bottom of the movable plate (18) is connected to a mounting base (6) via a linear drive module (4). The bottom of the mounting base (6) is fitted with several conductive sleeves (26). Inside each conductive sleeve (26) is a probe (21). The bottom of the probe (21) extends to the outside of the conductive sleeve (26). A pressure plate (23) is provided below the probe (21). Several through holes (22) are opened on the top of the pressure plate (23). Each probe (21) is aligned with the corresponding through hole (22). L-shaped connecting plates (24) are vertically installed on both sides of the top of the pressure plate (23). Guide rods (25) are installed on both sides of the bottom of the mounting base (6). The bottom of each guide rod (25) passes through the L-shaped connecting plate (24). A first spring (20) is sleeved on the side of each guide rod (25). The bottom of each first spring (20) abuts against the top of the L-shaped connecting plate (24), and the top of each first spring (20) abuts against the bottom of the mounting base (6). A conveying track (8) is installed on the top of the base (1). One end of the conveying track (8) passes through the outer shell (2) and extends into the interior of the outer shell (2). A conveying chain (11) is provided inside the conveying track (8). The top of the conveying chain (11) extends to the outside of the conveying track (8). Two storage trays (13) are installed on the top of the conveying chain (11). Each storage tray (13) has a positioning groove (14) on its top. An integrated circuit is placed inside the positioning groove (14). Two through grooves (9) are opened on the side of the outer shell (2). When one of the storage trays (13) passes through the corresponding through groove (9) and moves into the outer shell (2), the other storage tray (13) passes through the through groove (9) and moves to the outside of the outer shell (2). Both ends of the conveying track (8) are provided with sprockets (12). The bottom of each sprocket (12) is rotatably connected to the top of the base (1). Both ends of the conveying track (8) are provided with opening slots (15). One side of each sprocket (12) passes through the corresponding opening slot (15) and meshes with the conveying chain (11). The bottom of one of the sprockets (12) is connected to a drive motor (16), which is fixed to the top of the base (1).
2. The integrated circuit reliability analysis tester according to claim 1, characterized in that: A connecting ring (29) is installed on the top of the probe (21). The connecting ring (29) is made of insulating rubber material, and a second spring (28) is fitted on the side of each conductive sleeve (26). The bottom of each second spring (28) is fixed to the top of the connecting ring (29), and the top of each second spring (28) is fixed to the bottom of the mounting base (6).
3. The integrated circuit reliability analysis tester according to claim 2, characterized in that: The conductive sleeve (26) is coaxially fitted with an insulating sleeve (27). The insulating sleeve (27) is a retractable corrugated sleeve. The bottom of the insulating sleeve (27) is fixed to the top of the connecting ring (29), and the top of the insulating sleeve (27) is fixed to the bottom of the mounting base (6). There is a gap between the outer surface of the insulating sleeve (27) and the second spring (28).
4. The integrated circuit reliability analysis tester according to claim 1, characterized in that: Each guide rod (25) has an anti-detachment block (30) installed at its bottom end. When the first spring (20) extends, the bottom of the L-shaped connecting plate (24) abuts against the top of the anti-detachment block (30).
5. The integrated circuit reliability analysis tester according to claim 1, characterized in that: Two sealing covers (10) are installed on the top of the conveyor chain (11), one of which is located inside the housing (2) and the other is located outside the housing (2). When one of the trays (13) moves below the probe (21), the two sealing covers (10) cover the end of the corresponding through groove (9) and are sealed to the through groove (9).
6. The integrated circuit reliability analysis tester according to claim 1, characterized in that: The outer casing (2) is provided with a protective cover (3) on the side near the opening. One side of the protective cover (3) is slidably connected to the wedge groove opened on the side of the outer casing (2) through a wedge track, and the protective cover (3) covers the opening of the outer casing (2) and is sealed to the side wall of the opening of the outer casing (2).
7. The integrated circuit reliability analysis tester according to claim 1, characterized in that: A control cabinet (7) is installed on the side of the outer casing (2). The controller inside the control cabinet (7) is connected to the linear drive module (4), the conductive sleeve (26), the telescopic mechanism (5) and the drive motor (16) respectively through wires.
8. The integrated circuit reliability analysis tester according to claim 1, characterized in that: Several support legs (19) are installed on the bottom edge of the base (1).
9. The integrated circuit reliability analysis tester according to claim 1, characterized in that: Guide plates (17) are installed on both sides of the inner side of the outer shell (2). Both ends of the movable plate (18) are slidably connected to the guide plates (17) by sliding sleeves on the sides of the corresponding guide plates (17).