Vehicle-mounted imaging millimeter wave radar structure

Abstract

The utility model discloses a kind of vehicle-mounted imaging millimeter wave radar structures, comprising: multiple heat dissipation parts are equipped in integrated shell, integrated shell adopts high thermal conductivity coefficient material;The lower end surface of PCB board is close to all heat dissipation parts;PCB board is fixedly connected under radome;Integrated shell is connected in radome by screw, and PCB board is located in integrated shell and radome inside.The utility model passes through the setting of heat conduction protrusion so that PCB board can directly discharge heat from integrated shell, reduce volume, improve heat dissipation efficiency.

Description

Technical Field

[0001] This utility model relates to the technical field of millimeter-wave radar, specifically the technical field of vehicle-mounted imaging millimeter-wave radar structures. Background Technology

[0002] Current radar structures include a plastic housing, a metal heat dissipation shield, a PCB board, and an radome. The PCB board inside the radar houses the antennas used for transmitting and receiving signals. The electronic components on the PCB board generate heat and electromagnetic waves during operation. If the heat cannot be dissipated in time, the local temperature of the radar components can easily become too high, exceeding their normal operating temperature, thus affecting the overall performance of the radar. Furthermore, if the electromagnetic waves generated by the electronic components on the PCB board are not shielded, it will affect the antenna's transmission and reception performance.

[0003] In existing technologies, both the plastic casing and the radome are made of plastic, and their heat dissipation performance is poor when sealed. Therefore, the presence of a plastic casing is detrimental to the heat dissipation of radar products, affecting radar performance, and also makes mass production assembly more complicated, resulting in a larger overall radar size. Utility Model Content

[0004] This utility model addresses the technical problems mentioned in the background section by employing the following technical solution:

[0005] The structure of a vehicle-mounted imaging millimeter-wave radar includes:

[0006] An integrated housing with multiple heat dissipation sections inside, and the integrated housing is made of a material with high thermal conductivity;

[0007] A PCB board, the lower end face of which is in close contact with all the heat dissipation parts;

[0008] The antenna radome has the PCB board fixedly connected to its underside; the integrated housing is connected to the antenna radome by screws, and the PCB board is disposed inside the integrated housing and the antenna radome.

[0009] Optionally, the heat dissipation part is a thermally conductive protrusion, which is attached to the PCB board.

[0010] Optionally, a thermally conductive adhesive layer is provided between the thermally conductive protrusion and the PCB board.

[0011] Optionally, the high thermal conductivity material is a high thermal conductivity metal.

[0012] Optionally, the cross-sectional shape of any of the heat-conducting protrusions is the same as the orthographic projection shape of the corresponding component on the PCB board that requires heat dissipation.

[0013] Optionally, the integrated housing is provided with a groove for installing a sealing ring, and the sealing ring and the groove are interference fit.

[0014] Optionally, the integrated housing includes an outer shell and a shielding cover; the shielding cover is integrally formed inside the outer shell.

[0015] Optionally, the frame structure of the shielding cover contacts the bottom surface of the PCB board. Optionally, mounting grooves for fixing the frame structure are provided on the radome and the integrated housing.

[0016] Optionally, the frame structure and the integrated shell are connected by integral molding.

[0017] The beneficial effects of this utility model are:

[0018] This invention solves the drawbacks of existing plastic shells by using an integrated shell. Furthermore, because it is made of metal, it not only achieves encapsulation but also shields against electromagnetic waves generated by components on the PCB board. The invention also features thermally conductive protrusions with a thermally conductive adhesive layer, resulting in better heat dissipation compared to existing technologies. Additionally, a frame structure further enhances electromagnetic shielding. Finally, a sealing ring ensures effective sealing. Attached Figure Description

[0019] Figure 1 An exploded view of the vehicle-mounted imaging millimeter-wave radar structure of this utility model;

[0020] Figure 2 This is a schematic diagram of the PCB board of the vehicle-mounted imaging millimeter-wave radar structure of this utility model;

[0021] In the picture:

[0022] 1-Integrated housing, 11-Thermal conductive protrusion, 12-Thermal conductive adhesive layer, 13-Sealing ring, 14-Groove, 15-Frame structure, 2-Radiator cover, 3-PCB board, 4-Screw. Detailed Implementation

[0023] To enable those skilled in the art to better understand the present application, the technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present application, and not all embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative effort should fall within the scope of protection of the present application.

[0024] It should be noted that if the terms "first," "second," etc., are used in the specification, claims, and accompanying drawings of this application, they are used to distinguish similar objects and are not necessarily used to describe a specific order or sequence. It should be understood that such data can be interchanged where appropriate for the embodiments of this application described herein. Furthermore, the terms "comprising" and "having," and any variations thereof, are intended to cover non-exclusive inclusion; for example, a process, method, system, product, or apparatus that comprises a series of steps or units is not necessarily limited to those steps or units explicitly listed, but may include other steps or units not explicitly listed or inherent to such processes, methods, products, or apparatus.

[0025] In this application, when terms such as "upper," "lower," "left," "right," "front," "rear," "top," "bottom," "inner," "outer," "middle," "vertical," "horizontal," "lateral," and "longitudinal" are used, they indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. These terms are mainly for better describing this application and its embodiments, and are not intended to limit the indicated device, element, or component to having a specific orientation, or to be constructed and operated in a specific orientation.

[0026] Furthermore, in addition to indicating location or positional relationship, some of the aforementioned terms may also have other meanings. For example, the term "above" may also be used in some cases to indicate a certain dependency or connection relationship. Those skilled in the art can understand the specific meaning of these terms in this application based on the specific circumstances.

[0027] Furthermore, in this application, the terms "installation," "setup," "equipped with," "connection," "linking," and "socketing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral structure; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium, or an internal connection between two devices, components, or parts. Those skilled in the art can understand the specific meaning of the above terms in this application according to the specific circumstances.

[0028] It should be noted that, unless otherwise specified, the embodiments and features described in this application can be combined with each other. This application will now be described in detail with reference to the accompanying drawings and embodiments.

[0029] like Figures 1-2 As shown, the structure of the vehicle-mounted imaging millimeter-wave radar includes:

[0030] The integrated housing 1 has multiple heat dissipation parts inside, and the integrated housing (1) is made of a material with high thermal conductivity.

[0031] PCB board (Printed Circuit Board) 3, the bottom surface of PCB board 3 is in close contact with all heat dissipation parts;

[0032] Antenna radome 2, with PCB board 3 fixedly connected to the bottom of antenna radome 2; integrated housing 1 is connected to antenna radome 2 by screws 4, and PCB board 3 is located inside integrated housing 1 and antenna radome 2.

[0033] In some embodiments, the integrated housing 1 is a metal with high thermal conductivity, such as copper, gold, aluminum, and aluminum alloys, which are conventional metals that can dissipate heat efficiently.

[0034] In some embodiments, the heat dissipation part is specifically a heat-conducting protrusion 11, which is disposed inside the integrated housing 1. After the PCB board 3 is installed, the heat-conducting protrusion 11 is attached to the PCB board 3. The heat-conducting protrusion 11 allows the PCB board 3 to directly dissipate heat from outside the integrated housing 1, reducing the volume and improving the heat dissipation efficiency.

[0035] In some embodiments, a thermally conductive adhesive layer 12 is provided between the thermally conductive protrusion 11 and the PCB board 3. The thermally conductive adhesive layer 12 not only secures the PCB board 3 but also dissipates heat in a targeted manner. This layer fills air gaps, specifically between the thermally conductive part (such as a heat sink) and the components. Since air is a poor conductor of heat, using thermally conductive adhesive significantly reduces thermal resistance and improves heat transfer efficiency. Furthermore, the thermally conductive adhesive not only has thermal conductivity but also adhesive strength. It firmly bonds components to the heat sink, preventing loosening or detachment due to vibration or other external forces, thus improving overall structural stability.

[0036] In some embodiments, three thermally conductive protrusions 11 are provided, the number of which is the same as the number of heat dissipation components required for the PCB board 3, and their positions correspond to each other. With three thermally conductive protrusions 11, and no two adjacent thermally conductive protrusions 11 in contact, the heat from the components on the PCB board 3 is not concentrated and dissipated, but rather dissipated through their respective thermally conductive protrusions 11, thereby achieving efficient and safe heat dissipation.

[0037] In some embodiments, the cross-sectional shape of any thermally conductive protrusion 11 is the same as the orthographic projection shape of the component to be cooled on the corresponding PCB board 3. Since the shapes and sizes of components differ, and the most efficient heat dissipation method is full coverage, it is the most economical and efficient heat dissipation method for the shape of the thermally conductive protrusion 11 to be the same as the shape of its corresponding component.

[0038] In some embodiments, a groove 14 for mounting a sealing ring 13 is provided on the integral housing 1, and the sealing ring 13 is installed in the groove 14. The cross-sectional shape of the sealing ring 13 is the same as the cross-sectional shape of the groove 14, and the sealing ring 13 is an interference fit after installation. Since the housing is an integral design, a sealing ring 13 is required for sealing. In addition, to reduce the volume, the groove 14 is also provided, achieving a better sealing effect with a smaller volume. The sealing ring 13 is usually made of elastic materials such as rubber, silicone, and polytetrafluoroethylene (PTFE). The sealing ring 13 usually has good electrical insulation properties and can prevent current leakage or short circuit.

[0039] Furthermore, the sealing ring 13 forms an airtight and watertight barrier, preventing damage to internal electronic components from the external environment. Additionally, the sealing ring 13 can absorb mechanical vibrations and shocks, reducing damage to sensitive electronic components.

[0040] In some embodiments, the number of screws 4 is at least four, and the four screws 4 are respectively installed and fixed at the four corners of the integrated housing 1. Through holes are provided at corresponding positions on the integrated housing 1, and threaded holes are provided at corresponding positions on the radome 2 for fastening the screws 4. By providing screws 4 at the four corners, this application ensures the stability of the installation of the integrated housing 1 and the radome 2.

[0041] In some embodiments, the integrated housing 1 includes an outer shell 111 and a shielding shell 112; the shielding shell is integrally formed inside the outer shell 111. The shielding shell 112 is in direct contact with the outer shell 111, and the integrated housing 1 is made of a high thermal conductivity material. Therefore, heat is naturally dissipated to the outside air directly through the shielding shell 112 and the outer shell 111, greatly improving the heat dissipation effect.

[0042] In some embodiments, a frame structure 15 is provided within the integrated housing 1, wherein the upper surface of the frame structure 15 contacts the C1 surface of the PCB board 3, forming an electromagnetic shielding effect. To achieve better electromagnetic shielding, the upper surface of the frame structure 15 contacts the C1 surface of the PCB board 3, such as... Figure 2 As shown, the C1 side of PCB board 3 is located at the bottom edge of PCB board 3.

[0043] In some embodiments, mounting slots for mounting the frame structure 15 are provided on the radome 2 and the integrated housing 1.

[0044] In some embodiments, the frame structure 15 and the integral housing 1 are connected by integral molding.

[0045] The foregoing has shown and described the basic principles, main features, and advantages of this utility model. Those skilled in the art should understand that this utility model is not limited to the above embodiments, and various changes and modifications can be made without departing from the spirit and scope of this utility model. All such changes and modifications fall within the scope of the claimed utility model. The scope of protection of this utility model is defined by the appended claims and their equivalents.

Claims

1. A vehicular imaging millimeter wave radar structure, characterized by, include: An integrated housing with multiple heat dissipation sections inside, and the integrated housing is made of a material with high thermal conductivity; A PCB board, the lower end face of which is in close contact with all the heat dissipation parts; The antenna radome has the PCB board fixedly connected to its underside; the integrated housing is connected to the antenna radome by screws, and the PCB board is disposed inside the integrated housing and the antenna radome.

2. The vehicular imaging millimeter wave radar structure of claim 1, wherein, The heat dissipation part is a thermally conductive protrusion, which is attached to the PCB board.

3. The vehicular imaging millimeter wave radar structure of claim 2, wherein, A thermally conductive adhesive layer is provided between the thermally conductive protrusion and the PCB board.

4. The vehicular imaging millimeter wave radar structure of claim 3, wherein, The material with high thermal conductivity is a high thermal conductivity metal.

5. The vehicular imaging millimeter wave radar structure of claim 2, wherein, The cross-sectional shape of any of the heat-conducting protrusions is the same as the orthographic projection shape of the corresponding component on the PCB board that requires heat dissipation.

6. The vehicular imaging millimeter wave radar structure of claim 5, wherein, The integrated housing has a groove for installing a sealing ring, and the sealing ring and the groove are interference fit.

7. The vehicular imaging millimeter wave radar structure of claim 5, wherein, The integrated housing includes an outer shell and a shielding cover; the shielding cover is integrally formed inside the outer shell.

8. The vehicular imaging millimeter wave radar structure of claim 7, wherein, The frame structure of the shielding cover is in contact with the bottom surface of the PCB board.

9. The vehicular imaging millimeter wave radar structure of claim 8, wherein, The radome and the integrated housing are provided with mounting grooves for fixing the frame structure.

10. The vehicular imaging millimeter wave radar structure of claim 9, wherein, The frame structure and the integrated shell are connected by being integrally formed.

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