An 800g sr8 lpo optical engine
By introducing a second gold wire as a reference ground between the optical chip and the electrical chip, the high-frequency attenuation problem of the traditional 800G SR8 LPO optical engine was solved, and the high-frequency performance was improved.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- 武汉钧恒科技有限公司
- Filing Date
- 2025-08-07
- Publication Date
- 2026-08-04
AI Technical Summary
Traditional 800G SR8 LPO optical engines suffer from severe attenuation of high-frequency S-parameters due to the lack of DSP chips and the high quality requirements of high-speed RF signals.
A second gold wire, serving as a reference ground, is introduced between the optical chip and the electrical chip to shorten the distance between the first gold wire and the reference ground. Multiple second gold wires are used, and their shape and height are optimized to reduce high-frequency attenuation.
By introducing a second gold wire, the high-frequency attenuation is significantly reduced, and the high-frequency performance is improved by 0.45dB to 1dB.
Smart Images
Figure CN224594884U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of optical engine technology, specifically to an 800G SR8 LPO optical engine. Background Technology
[0002] The structure of a traditional 800G SR8 LPO optical engine is as follows: Figure 1 , Figure 2 As shown, it includes: a PCB board, on which optical and electrical chips are mounted on the GND pads. The GND pads are gold-plated copper. The optical and electrical chips are bonded together by multiple high-speed RF gold wires. The optical chip is a PD chip and / or a VCSEL chip, and the electrical chip is a TIA chip and / or a Driver chip. The height of both the optical and electrical chips is 150μm. Because the 800G SR8 LPO optical engine lacks a DSP chip and has very high requirements for high-speed RF signal quality, and because the distance between the high-speed RF gold wires and the PCB reference ground is greater than 150μm, the high-frequency S-parameters of the 800G SR8 LPO optical engine experience significant attenuation. Figure 3 As shown: the horizontal axis represents bandwidth, and the vertical axis represents high-frequency attenuation. Utility Model Content
[0003] The technical problem to be solved by this utility model is to provide an 800G SR8 LPO optical engine to overcome the shortcomings of the prior art.
[0004] The technical solution of this utility model to solve the above-mentioned technical problems is as follows: An 800G SR8 LPO optical engine includes: a PCB board, on which optical chips and electrical chips are disposed on the GND pads of the PCB board, the optical chips and electrical chips are bonded by multiple first gold wires, and at least one second gold wire is disposed below the first gold wires and bonded to the GND pads on the PCB board as a reference ground.
[0005] The beneficial effects of this invention are: by introducing a second gold wire as a reference ground, the distance between the first gold wire and the reference ground can be shortened, thereby reducing the high-frequency attenuation and improving high-frequency performance.
[0006] Based on the above technical solution, the present invention can be further improved as follows.
[0007] Furthermore, the number of second gold wires between the optical chip and the electrical chip is four.
[0008] Furthermore, the arc height of the second gold wire is lower than the height of the electrical chip.
[0009] Furthermore, the height of both the optical chip and the electrical chip is 150μm, and the height of the second gold wire is 120μm.
[0010] The further beneficial effects of adopting the above are as follows: the distance between the first gold wire and the reference ground is shortened by 120μm, which greatly reduces the high-frequency attenuation and can improve the high-frequency performance by approximately 0.45dB to 1dB.
[0011] Furthermore, the second gold wire has a flat-top shape.
[0012] The further beneficial effect of adopting the above is that when the second gold wire is approximately flat-topped, the effect of reducing high-frequency attenuation is the best.
[0013] Furthermore, the optical chip is a PD chip, and the electrical chip is a TIA chip.
[0014] Furthermore, the optical chip is a VCSEL chip, and the electrical chip is a Driver chip.
[0015] Furthermore, a ceramic heating block is provided on the PCB near the Vcsel chip to heat the Vcsel chip to room temperature.
[0016] The further beneficial effect of adopting the above is that when the 800G SR8 LPO optical engine is at low temperature, the ceramic heating block heats the Vcsel chip to room temperature, thereby ensuring low-temperature performance.
[0017] Furthermore, the ceramic heating block and the driver chip are located on opposite sides of the Vcsel chip.
[0018] Furthermore, the first gold wire is a high-speed RF gold wire. Attached Figure Description
[0019] Figure 1 This is a partial structural diagram of an 800G SR8 LPO optical engine in the prior art; Figure 2 This is a partial structural side view of an 800G SR8 LPO optical engine in the prior art; Figure 3 The high-frequency S-parameter diagram of the 800G SR8 LPO optical engine in the prior art; Figure 4 This is a structural diagram of the 800G SR8 LPO optical engine in this utility model; Figure 5 This is a partial structural side view of the 800G SR8 LPO optical engine in this utility model; Figure 6 This is a partial structural diagram of the 800G SR8 LPO optical engine in this utility model; Figure 7 This is a high-frequency S-parameter diagram of the 800G SR8 LPO optical engine in this utility model.
[0020] The attached diagram lists the components represented by each number as follows: 1. PCB board, 110. GND pad, 2. Optical chip, 3. Electrical chip, 4. First gold wire, 5. Second gold wire, 6. Ceramic heating block. Detailed Implementation
[0021] The principles and features of this utility model are described below with reference to the accompanying drawings. The examples given are only for explaining this utility model and are not intended to limit the scope of this utility model.
[0022] Example 1 like Figure 4 , Figure 5 , Figure 6 , Figure 7 As shown, an 800G SR8 LPO optical engine includes: a PCB board 1, on which an optical chip 2 and an electrical chip 3 are disposed. The GND pad 110 of the PCB board 1 is gold-plated copper, which is consistent with the prior art. The optical chip 2 and the electrical chip 3 are bonded together by multiple first gold wires 4 to achieve electrical connection, which is also consistent with the prior art. At least one second gold wire 5 is arranged below the first gold wires 4 and bonded to the GND pad 110 on the PCB board 1. The second gold wire 5 serves as a reference ground. The bonding of the second gold wire 5 can be understood as the two ends of the second gold wire 5 being connected to the GND pad 110 respectively. In the prior art, the first gold wire 4 uses the GND pad 110 of the PCB board as the reference ground. However, in this invention, by introducing the second gold wire 5 as the reference ground, the distance between the first gold wire 4 and the reference ground can be shortened, thereby reducing the high-frequency attenuation and improving the high-frequency performance.
[0023] Example 2 like Figure 5 , Figure 6 As shown, this embodiment is a further improvement on embodiment 1, as detailed below: The number of second gold wires 5 between the optical chip 2 and the electrical chip 3 is preferably four. Of course, this is just an example. In actual application, other numbers can be selected, such as three, five, six, etc.
[0024] Furthermore, the arc height of the second gold wire 5 is lower than the height of the electrical chip 3, so even if the electrical chip 3 comes into contact with the second gold wire 5 during mounting, it will not short-circuit with the electrical pads on the upper surface of the electrical chip 3.
[0025] Furthermore, the height of the optical chip 2 is 150μm, and the height of the electrical chip 3 is 150μm, meaning that the heights of the optical chip 2 and the electrical chip 3 are consistent with existing technologies. The height of the second gold wire 5 is 120μm, meaning that the second gold wire 5 is 30μm shorter than the optical chip 2. This shortens the distance between the first gold wire 4 and the reference ground by 120μm, resulting in a significant reduction in high-frequency attenuation, which can improve high-frequency performance by approximately 0.45dB to 1dB.
[0026] Furthermore, the second gold wire 5 is preferably flat-topped, and when the second gold wire 5 is approximately flat-topped, the effect on reducing high-frequency attenuation is the best.
[0027] Example 3 like Figure 4 As shown, this embodiment is a further improvement on embodiment 1 or 2, as detailed below: Optical chip 2 is a PD chip, and electrical chip 3 is a TIA chip.
[0028] Alternatively, optical chip 2 can be a VCSEL chip, and electrical chip 3 can be a Driver chip.
[0029] Of course, the 800G SR8 LPO optical engine can contain a PD chip, a TIA chip, a VCSEL chip, and a Driver chip.
[0030] On the PCB board 1, a ceramic heating block 6 is provided near the Vcsel chip. When the 800G SR8 LPO optical engine is at a low temperature, the ceramic heating block 6 heats the Vcsel chip to room temperature, thereby ensuring low-temperature performance. The ceramic heating block 6 and the Driver chip are preferably located on opposite sides of the Vcsel chip.
[0031] Example 4 like Figure 5 As shown, this embodiment is a further improvement on any one of embodiments 1 to 3, as detailed below: The first gold wire 4 is preferably a high-speed RF gold wire, which is consistent with the existing technology.
[0032] Although embodiments of the present invention have been shown and described above, it is understood that the above embodiments are exemplary and should not be construed as limiting the present invention. Those skilled in the art can make changes, modifications, substitutions and variations to the above embodiments within the scope of the present invention.
Claims
1. An 800G SR8 LPO optical engine, characterized in that, include: A PCB board (1) has an optical chip (2) and an electrical chip (3) on its GND pad (110). The optical chip (2) and the electrical chip (3) are bonded together by multiple first gold wires (4). At least one second gold wire (5) is arranged between the optical chip (2) and the electrical chip (3) below the first gold wire (4) and bonded to the GND pad (110) on the PCB board (1) as a reference ground.
2. The 800G SR8 LPO optical engine of claim 1, wherein, The number of the second gold wires (5) between the optical chip (2) and the electrical chip (3) is four.
3. The 800G SR8 LPO optical engine of claim 2, wherein, The arc height of the second gold wire (5) is lower than the height of the electrical chip (3).
4. The 800G SR8 LPO optical engine of claim 3, wherein, The height of the optical chip (2) and the electrical chip (3) is 150 μm, and the height of the second gold wire (5) is 120 μm.
5. The 800G SR8 LPO optical engine of any of claims 1-4, wherein, The second gold wire (5) has a flat-top shape.
6. The 800G SR8 LPO optical engine of claim 1, wherein, The optical chip (2) is a PD chip, and the electrical chip (3) is a TIA chip.
7. The 800G SR8 LPO optical engine of claim 1, wherein, The optical chip (2) is a Vcsel chip, and the electrical chip (3) is a Driver chip.
8. The 800G SR8 LPO optical engine of claim 7, wherein, The PCB board (1) has a ceramic heating block (6) near the Vcsel chip to heat the Vcsel chip to room temperature.
9. The 800G SR8 LPO optical engine of claim 8, wherein, The ceramic heating block (6) and the Driver chip are located on opposite sides of the Vcsel chip.
10. The 800G SR8 LPO optical engine of claim 1, wherein, The first gold wire (4) is a high-speed RF gold wire.