Light engine, light module
By employing a silicon photonics chip packaging structure and mounting the photodiode (PD) on a ceramic substrate in the optical engine, the problems of large space, high power consumption, and PD warpage in the optical emission components are solved, achieving stability of the photocurrent and simplification of the process.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- ACCELIGHT TECHNOLOGIES (WUHAN) CO LTD
- Filing Date
- 2025-08-22
- Publication Date
- 2026-08-04
AI Technical Summary
Existing optical engines have large space requirements for their optical emitting components, high power consumption, and complex coupling processes. The photodiodes (PDs) of the optical receiving components are prone to warping under high and low temperature environments, which affects the stability of the photocurrent.
The packaging structure based on silicon photonics chips is adopted. The optical emitting component and the optical receiving component are respectively mounted on the optical component substrate through their respective substrates. The PD of the optical receiving component is mounted on the ceramic substrate. The structural layout is optimized and the process flow is simplified. The optical emitting component adopts wavelength division multiplexing function to reduce the number of components.
It simplifies the mounting and coupling process of optical components, ensures the stability of photocurrent under high and low temperature environments, reduces system noise, and improves the signal-to-noise ratio.
Smart Images
Figure CN224594887U_ABST
Abstract
Description
Technical Field
[0001] This utility model belongs to the field of optical communication, specifically relating to an optical engine and an optical module. Background Technology
[0002] With the rapid growth of data center interconnect applications, the demand for multi-channel parallel optical modules such as DR4, 2xDR4, and DR8 for short to medium transmission distances is increasing. The optical engine is the core of the optical module, and conventional optical engines currently suffer from the following problems: 1) The optical emitting components use EML (Electro-Absorption Modulated Laser) packaging, which occupies a large space, consumes a lot of power, and has complex coupling processes; 2) Optical components used in data centers often use non-hermetic packaging, which is more cost-effective. The PD (Photodetector, or photodiode) of the optical receiving components is mounted on the PCB board. The PCB board is prone to significant warping under high and low temperature environments, causing deformation of the PD and affecting the stability of the photocurrent. Utility Model Content
[0003] The purpose of this application is to provide an optical engine and an optical module including the above-mentioned optical engine. The optical engine can reduce the number of optical components used, optimize the structural layout of the optical components, thereby effectively simplifying the process flow of optical components such as patching and coupling, eliminating the influence of PD deformation caused by large warping of PCB board at high and low temperatures, and ensuring the stability of photocurrent under high and low temperature related environments.
[0004] The technical solution adopted in this utility model is: An optical engine includes a PCB board, an optical emitting component, and an optical receiving component; the PCB board has a slot with an optical component substrate, and the components of the optical emitting component and the optical receiving component are respectively mounted on the optical component substrate through their respective substrates. The optical emitting component adopts a silicon photonics chip-based packaging structure, and the PD in the optical receiving component is mounted on a ceramic substrate.
[0005] Preferably, the optical emitting component includes a COC component for generating signal light, a shaping device for shaping the signal light, a silicon photonic chip capable of coupling the signal light and performing wavelength division multiplexing, and a transmitting fiber array unit for coupling the signal light emitted from the silicon photonic chip, arranged sequentially along the optical path. The COC component, the shaping device, and the transmitting fiber array unit are disposed on the second transmitting substrate, the silicon photonic chip is disposed on the first transmitting substrate, and the first and second transmitting substrates are disposed on the optical component substrate.
[0006] Preferably, the number of channels in the COC component is less than or equal to the number of optical ports in the silicon photonics chip, and the wavelength of the COC component is matched with that of the optical ports in the silicon photonics chip.
[0007] Preferably, the shaping device includes a first-stage lens for collimation and a second-stage lens for focusing, arranged sequentially along the optical path.
[0008] Preferably, the light emitting assembly further includes an isolator for isolating reflected light; the isolator is disposed in the optical path in front of the first-stage lens, or in the optical path between the first-stage lens and the second-stage lens, or in the optical path behind the second-stage lens.
[0009] Preferably, the optical receiving component includes a receiving fiber array unit for input signal light, a receiving lens for beam shaping, a reflecting prism for bending the optical path, a photoelectric conversion device (PD), and a photoelectric amplification device (TIA) for amplifying the photocurrent into a voltage signal, arranged sequentially along the optical path. The receiving fiber array unit and the receiving lens are disposed on a first receiving substrate, the first receiving substrate and the PD are disposed on a second receiving substrate, and the TIA is disposed on a PCB board and bonded to the PD.
[0010] Preferably, the reflecting prism is disposed on the prism support, and the prism support is disposed on the first substrate of the receiving end.
[0011] Preferably, the upper surface of the TIA is close in height to or aligned with the upper surface of the PD.
[0012] Preferably, an electromagnetic shielding cover is provided above the optical emitting component and the optical receiving component, respectively, and the electromagnetic shielding cover provides electromagnetic shielding for the optical emitting component and the optical receiving component. At the same time, a dust cover is provided above the electromagnetic shielding cover of the optical emitting component and the optical receiving component, and the dust cover is provided with through holes.
[0013] An optical module includes a housing, within which the aforementioned optical engine is disposed.
[0014] The beneficial effects of this utility model are: In this optical engine, the optical emitting component adopts a packaging structure based on silicon photonics chips. Since silicon photonics chips have wavelength division multiplexing capabilities, the number of optical components can be reduced. Furthermore, the optical emitting component and the optical receiving component are mounted on the optical component substrate through their respective substrates, which optimizes the structural layout of the optical component and effectively simplifies the process flow of mounting and coupling of the optical component. In this optical engine, the photodiode is mounted on a ceramic substrate with high thermal stability, which eliminates the influence of the PD deformation caused by the large warping of the PCB board at high and low temperatures, and ensures the stability of the photocurrent under high and low temperature environments. Attached Figure Description
[0015] To more clearly illustrate the technical solutions of the embodiments of this application, the accompanying drawings used in the embodiments will be briefly introduced below. It should be understood that the following drawings only show some embodiments of this application and should not be regarded as a limitation of the scope. For those skilled in the art, other related drawings can be obtained based on these drawings without creative effort.
[0016] Figure 1 This is a schematic diagram of the light engine in an embodiment of the present invention.
[0017] Figure 2 This is a schematic diagram of the light engine from another angle in an embodiment of this utility model.
[0018] Figure 3 This is a schematic diagram of the installation of the light emitting component and the light receiving component on the PCB board in an embodiment of this utility model.
[0019] Figure 4 This is a schematic diagram of the installation of the light emitting component and the light receiving component on the PCB board in another embodiment of the present invention.
[0020] Figure 5 This is a schematic diagram of the optical module in an embodiment of the present invention.
[0021] In the picture: 10-Optical engine; 100-PCB board; 110-Connector; 120-Optical component substrate; 200-Optical emitting component; 210-COC component; 220-First-stage lens; 230-Isolator; 240-Second-stage lens; 250-Silicon photonic chip; 260-Transmitter fiber array unit; 270-Transmitter first substrate; 280-Transmitter second substrate; 290-Turning prism; 300-Optical receiving component; 310-Receiver fiber array unit; 320-Receiver lens; 330-Reflecting prism; 340-PD; 350-TIA; 360-Prism support; 370-Receiver first substrate; 380-Receiver second substrate.
[0022] 20 - Top cover; 30 - Base; 40 - Pull ring. Detailed Implementation
[0023] To make the objectives, technical solutions, and advantages of the embodiments of this application clearer, the technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. The components of the embodiments of this application described and shown in the accompanying drawings can generally be arranged and designed in various different configurations.
[0024] Therefore, the following detailed description of the embodiments of this application provided in the accompanying drawings is not intended to limit the scope of the claimed application, but merely to illustrate selected embodiments of the application. All other embodiments obtained by those skilled in the art based on the embodiments of this application without inventive effort are within the scope of protection of this application.
[0025] It should be noted that similar labels and letters in the following figures indicate similar items. Therefore, once an item is defined in one figure, it does not need to be further defined and explained in subsequent figures.
[0026] In the description of this application, it should be noted that the terms "inner" and "outer," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, or the orientation or positional relationship commonly used when the product is in use. They are used only for the convenience of describing this application and for simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this application. Furthermore, the terms "first," "second," etc., are used only to distinguish descriptions and should not be construed as indicating or implying relative importance.
[0027] The features and performance of this application will be further described in detail below with reference to the embodiments.
[0028] Example 1 This embodiment discloses a light engine 10, such as Figure 1 and Figure 2 As shown, it includes a PCB board 100, a light emitting component 200, and a light receiving component 300; wherein: as Figure 1 and Figure 2 As shown, an optical component substrate 120 is provided on a slot in the PCB board 100. The optical emitting component 200 and the optical receiving component 300 are respectively mounted on the optical component substrate 120 via their respective substrates, as shown. Figure 3 and Figure 4 As shown, the optical emitting component 200 adopts a packaging structure based on the silicon photonic chip 250, and the PD340 in the optical receiving component 300 is mounted on a ceramic substrate. In this optical engine: the optical emitting component 200 adopts a packaging structure based on the silicon photonic chip 250. Since the silicon photonic chip 250 has wavelength division multiplexing capabilities, the number of optical components can be reduced. Furthermore, the optical emitting component 200 and the optical receiving component 300 are respectively mounted on the optical component substrate 120 through their respective substrates, optimizing the structural layout of the optical component and effectively simplifying the process flow such as mounting and coupling of the optical component; the PD340 is mounted on a ceramic substrate with high thermal stability, eliminating the influence of deformation of the PD340 caused by the large warping of the PCB board 100 at high and low temperatures, and ensuring the stability of the photocurrent under high and low temperature environments.
[0029] Regarding the structure and installation of the optical emitting component 200: like Figure 3 As shown, in this embodiment, preferably, the optical emitting component 200 includes a COC component 210 for generating signal light, a shaping device for shaping the signal light, a silicon photonic chip 250 for coupling the signal light and performing wavelength division multiplexing, and a transmitting fiber array unit 260 for coupling the signal light emitted from the silicon photonic chip 250, arranged sequentially along the optical path. The COC component 210, the shaping device, and the transmitting fiber array unit 260 are disposed on the transmitting second substrate 280, the silicon photonic chip 250 is disposed on the transmitting first substrate 270, and the transmitting first substrate 270 and the transmitting second substrate 250 are disposed on the optical component substrate 120.
[0030] During operation, the COC component 210 generates signal light. After being shaped by a shaping device, the signal light is coupled into the input waveguide of the silicon photonic chip 250. After wavelength division multiplexing, the signal light is emitted from the output waveguide of the silicon photonic chip 250 and then directly coupled to the transmitting end fiber array unit 260.
[0031] The silicon photonic chip 250 and the COC component 210 are respectively disposed on the first substrate 270 and the second substrate 280 of the transmitter, which physically separates the heat-sensitive silicon photonic chip 250 from the heat-generating COC component 210, preventing the heat of the COC component 210 from being directly conducted to the silicon photonic chip 250, and avoiding performance drift of the silicon photonic chip 250 due to temperature fluctuations.
[0032] In this embodiment, preferably, the COC component 210 includes a laser chip, a pad, and a thermistor.
[0033] In this embodiment, preferably, the number of channels of the COC component 210 is less than or equal to the number of optical ports of the silicon photonic chip 250, the wavelength of the optical ports of the COC component 210 is matched with that of the silicon photonic chip 250, and the COC component 210 can be selected as single-channel or multi-channel.
[0034] like Figure 3 As shown, in this embodiment, preferably, the shaping device includes a first-stage lens 220 for collimation and a second-stage lens 240 for focusing, arranged sequentially along the optical path. During operation, the signal light is accurately incident on the silicon photonic chip 250 after collimation and focusing. Furthermore, the light emitting assembly can also be equipped with an isolator 230 for isolating reflected light. The isolator 230 can be located in the optical path in front of the first-stage lens 220, or in the optical path between the first-stage lens 220 and the second-stage lens 240, or in the optical path behind the second-stage lens 240, preferably in the optical path between the first-stage lens 220 and the second-stage lens 240.
[0035] In this embodiment, preferably, a refractive index matching liquid is provided at the coupling end face of the transmitting fiber array unit 260 and the silicon photonic chip 250, which can improve mode field matching and increase coupling efficiency.
[0036] Regarding the structure and installation of the optical receiver assembly 300: like Figure 3 As shown, in this embodiment, preferably, the optical receiving component 300 includes a receiving fiber array unit 310 for input signal light, a receiving lens 320 for beam shaping, a reflecting prism 330 for bending the optical path, a PD 340 for photoelectric conversion, and a TIA 350 (Transimpedance Amplifier) for amplifying photocurrent into a voltage signal, arranged sequentially along the optical path. The receiving fiber array unit 310 and the receiving lens 320 are disposed on the receiving first substrate 370, and the receiving first substrate 370 and the PD 340 are disposed on the receiving second substrate 380. Both the receiving second substrate 380 and the receiving first substrate 370 are ceramic substrates. The TIA 350 is disposed on the PCB board 100 and bonded to the PD 340.
[0037] During operation, the signal light is input to the receiving fiber array unit 310. After being shaped by the receiving lens 320, the signal light is deflected by the reflecting prism 330 (usually turning 90°) and enters the PD340. The PD340 converts the signal light into a stable photocurrent (μA level), and the TIA350 amplifies the photocurrent into a voltage signal (mV level).
[0038] Both the first substrate 370 and the second substrate 380 of the receiving end are made of ceramic substrates with high thermal stability, which eliminates the influence of deformation of each device in the optical receiving component 300 caused by the large warping of the PCB board 100 at high and low temperatures, and can ensure the stability of the optical receiving component 300 under high and low temperature related environments. The TIA350 and PD340 are mounted separately (TIA350 is mounted on PCB 100, and PD340 is mounted on the second substrate 380 of the receiver). The TIA350 generates significant heat during operation, and the PD340 is extremely sensitive to temperature. Its performance (such as responsivity, dark current, noise, and gain) will drift with temperature changes. Physically separating the TIA350 and PD340 can prevent the heat generated by the TIA350 from being directly conducted to the PD340, ensuring the stability of the detection sensitivity. In addition, the TIA350 generates noise during operation. Physically separating the TIA350 and PD340 can minimize noise by coupling it to the high-sensitivity PD340 through a shared substrate or power plane, thereby reducing the overall system noise floor. Furthermore, the TIA350 is an ultra-high gain amplifier and is extremely susceptible to noise interference. The PD340 itself also generates a small leakage current (dark current). Physically separating the TIA350 and PD340 can prevent the leakage current from interfering with the TIA350. By setting up a reflective prism 330 to deflect the optical path, the signal light can be guided to the horizontally placed PD340, which facilitates the arrangement of the receiving fiber array unit 310, the receiving lens 320 and the PD340, and saves space.
[0039] like Figure 3 As shown, in this embodiment, preferably, the reflecting prism 330 is disposed on the prism support 360, and the prism support 360 is disposed on the receiving end first substrate 370. In order to adapt to the height of the reflecting prism 330 so that it can couple the signal light shaped by the receiving end lens 320 to the PD340, the height of the prism support 360 can be set as needed.
[0040] like Figure 3 As shown, in this embodiment, preferably, the upper surface of TIA350 and the upper surface of PD340 are close in height or aligned, ensuring that the arc height of the gold wire connecting the two is not too large, which facilitates the gold wire bonding of TIA350 and PD340.
[0041] In addition, in this embodiment, preferably, electromagnetic shielding covers can be provided above the light emitting component 200 and the light receiving component 300 respectively. The electromagnetic shielding covers provide electromagnetic shielding for the light emitting component 200 and the light receiving component 300 respectively. Furthermore, a dust cover can be provided above the entire light emitting component 200 and the light receiving component 300. The dust cover covers the electromagnetic shielding covers of the light emitting component 200 and the light receiving component 300. The dust cover has through holes. This double-layer cover design isolates the electromagnetic radiation interference between the light emitting component 200 and the light receiving component 300, prevents dirt from contaminating the optical path, ensures a high signal-to-noise ratio, and avoids damage to the light emitting component 200 and the light receiving component 300 in subsequent processes. In addition, the through holes on the dust cover can promptly discharge the gas generated by heating during subsequent baking tests.
[0042] In addition, in this embodiment, preferably: Figure 1 and Figure 2 As shown, both the transmitting fiber array unit 260 and the receiving fiber array unit 310 are connected to external devices via connector 110.
[0043] In addition, in this embodiment, preferably: the COC component 210, the shaping device, and the transmitting fiber array unit 260 are bonded and fixed on the transmitting second substrate 280; the silicon photonic chip 250 is bonded and fixed on the transmitting first substrate 270; the transmitting second substrate 280 and the transmitting first substrate 270 are bonded and fixed on the optical component substrate 120; the receiving fiber array unit 310 and the receiving lens 320 are bonded and fixed on the receiving first substrate 370; the reflecting prism 330 is bonded and fixed on the prism support 360; the PD 350, the receiving first substrate 370, and the prism support 360 are bonded and fixed on the receiving second substrate 380; the TIA 360 is bonded and fixed on the PCB board 100; the receiving second substrate 380 is bonded and fixed on the optical component substrate 120; and the optical component substrate 120 is bonded and fixed on the slot of the PCB board 100.
[0044] Example 2 This embodiment discloses another type of light engine 10, such as Figure 4 As shown, the difference between it and Embodiment 1 is that: a deflection prism 290 is provided in front of the light-incident waveguide of the silicon photonic chip 250, and the refraction angle of the deflection prism 290 matches the incident angle of the signal light. In this way, the angle of the light-incident waveguide of the silicon photonic chip 250 can be adjusted according to the structural design, which facilitates the structural arrangement.
[0045] Example 3 This embodiment discloses an optical module, such as Figure 5As shown, the device includes a housing, which comprises a base 30, a top cover 20, and a pull ring 40 assembled together. The pull ring 40 is installed at the connection between the base 30 and the top cover 20. Operating the pull ring 40 can lock / unlock the optical module and the switch. The housing contains the optical engine 10 described in the above embodiment.
[0046] The embodiments described above are some, but not all, of the embodiments of this application. The detailed description of the embodiments of this application is not intended to limit the scope of the claimed application, but merely to illustrate selected embodiments. All other embodiments obtained by those skilled in the art based on the embodiments of this application without inventive effort are within the scope of protection of this application.
Claims
1. A light engine, comprising a PCB board, a light emitting component, and a light receiving component; characterized in that: The PCB board has a slot with an optical component substrate. The components of the optical emitting component and the optical receiving component are mounted on the optical component substrate through their respective substrates. The optical emitting component adopts a silicon photonic chip-based packaging structure, and the PD in the optical receiving component is mounted on a ceramic substrate.
2. The light engine as described in claim 1, characterized in that: The optical emitting component includes a COC component for generating signal light, a shaping device for shaping the signal light, a silicon photonic chip for coupling the signal light and performing wavelength division multiplexing, and a transmitting fiber array unit for coupling the signal light emitted from the silicon photonic chip, arranged sequentially along the optical path. The COC component, the shaping device, and the transmitting fiber array unit are disposed on the second transmitting substrate, the silicon photonic chip is disposed on the first transmitting substrate, and the first and second transmitting substrates are disposed on the optical component substrate.
3. The light engine as described in claim 2, characterized in that: The number of channels in a COC component is less than or equal to the number of optical ports in a silicon photonic chip, and the wavelengths of the COC component and the optical ports of the silicon photonic chip are matched.
4. The light engine as described in claim 2, characterized in that: The shaping device includes a first-stage lens for collimation and a second-stage lens for focusing, arranged sequentially along the optical path.
5. The light engine as described in claim 4, characterized in that: The light emitting assembly also includes an isolator for isolating reflected light; the isolator is located in the optical path in front of the first-stage lens, or in the optical path between the first-stage lens and the second-stage lens, or in the optical path behind the second-stage lens.
6. The light engine as described in claim 1, characterized in that: The optical receiving component includes a receiving fiber array unit for input signal light, a receiving lens for beam shaping, a reflecting prism for deflecting the optical path, a photoelectric conversion device (PD) for photoelectric conversion, and a photoelectric amplification device (TIA) for amplifying photocurrent into a voltage signal, arranged sequentially along the optical path. The receiving fiber array unit and the receiving lens are disposed on a first receiving substrate, the first receiving substrate and the PD are disposed on a second receiving substrate, and the TIA is disposed on a PCB board and bonded to the PD.
7. The light engine as described in claim 6, characterized in that: The reflecting prism is mounted on the prism support, and the prism support is mounted on the first substrate of the receiving end.
8. The light engine as described in claim 6, characterized in that: The upper surface of TIA is close to or aligned with the upper surface of PD.
9. The light engine as described in any one of claims 1 to 8, characterized in that: Electromagnetic shielding covers are provided above the optical emitting component and the optical receiving component, respectively. The electromagnetic shielding covers provide electromagnetic shielding for the optical emitting component and the optical receiving component. Dustproof covers are also provided above the electromagnetic shielding covers of the optical emitting component and the optical receiving component, and the dustproof covers are provided with through holes.
10. An optical module, comprising a housing, characterized in that: The housing contains a light engine as described in any one of claims 1 to 9.