A temperature controller circuit module for semiconductor production pipeline

Abstract

The utility model belongs to the technical field of temperature controller, specifically relates to a temperature controller circuit module for semiconductor production pipeline, aims at solving the problem of temperature control instability caused by unstable voltage during the semiconductor production process of temperature controller. The circuit module includes power filter voltage stabilizing module, LDO module, control chip module and temperature control execution module. Through the power filter voltage stabilizing module, the input power is filtered and initially stabilized, and then is further stabilized and noise reduced through the LDO module, and the filter inductance is added to the power supply part of the control chip module, so that the power ripple is effectively reduced, and the temperature control stability and anti-interference ability are improved. The utility model has simple structure, high reliability and is suitable for temperature control in semiconductor production pipeline.

Description

Technical Field

[0001] This utility model belongs to the field of temperature controller technology, and relates to a temperature controller circuit module for semiconductor production pipelines. It is particularly suitable for scenarios where stable temperature control can be achieved in environments with unstable voltage. Specifically, it relates to a temperature controller circuit module for semiconductor production pipelines. Background Technology

[0002] Temperature control within the piping is crucial in semiconductor manufacturing processes because temperature fluctuations can affect the performance of semiconductor materials and product quality. Traditional temperature controllers used in semiconductor manufacturing piping often face the problem of unstable power supply voltage. For example, voltage ripple can increase due to power grid fluctuations, equipment start-ups and shutdowns, or electromagnetic interference, leading to unstable temperature control. This instability causes temperature fluctuations within the piping, affecting the uniformity and yield of semiconductor production.

[0003] In existing technologies, temperature controllers typically employ simple power supply filtering or voltage regulation circuits, but their effectiveness is limited and they cannot effectively suppress high-frequency noise and voltage fluctuations. Especially in semiconductor manufacturing environments, where equipment is densely packed and electromagnetic interference is strong, ordinary temperature controllers lack sufficient anti-interference capabilities, easily leading to temperature control deviations. Therefore, there is an urgent need for a temperature controller circuit module that can improve power supply stability, reduce ripple, and enhance anti-interference capabilities. Utility Model Content

[0004] Purpose of the utility model: To provide a temperature controller circuit module for semiconductor production pipelines, thereby solving the aforementioned problems.

[0005] Technical solution: A temperature controller circuit module for semiconductor production pipelines, comprising:

[0006] The power supply filtering and voltage regulation module is used to filter and initially regulate the input power supply.

[0007] The LDO module is connected to the power supply filtering and voltage regulation module and is used to further regulate and reduce noise in the filtered power supply.

[0008] The control chip module, connected to the LDO module, is used to process temperature signals and output control signals;

[0009] A temperature control execution module, connected to the control chip module, is used to adjust the temperature according to the control signal;

[0010] The power supply section of the control chip module is equipped with a filter inductor to reduce power ripple.

[0011] In a further embodiment, the power supply filtering and voltage regulation module includes at least one filter capacitor and at least one Zener diode for suppressing power supply noise and voltage fluctuations.

[0012] In a further embodiment, the LDO module is a low-dropout linear regulator used to output a stable voltage to the control chip module.

[0013] In a further embodiment, the control chip module includes a microcontroller or a dedicated temperature control chip, and the filter inductor is connected in series in the power supply path.

[0014] In a further embodiment, the temperature control execution module includes a heating element or a cooling element for regulating the temperature of the semiconductor production pipeline.

[0015] In a further embodiment, an anti-interference shielding layer is also included to enclose the circuit module and reduce external electromagnetic interference.

[0016] In a further embodiment, a buffer circuit is provided between the power supply filtering and voltage regulation module and the LDO module to enhance voltage stability.

[0017] In a further embodiment, the control chip module is also connected to a temperature sensor for real-time monitoring of the pipe temperature.

[0018] In a further embodiment, the power supply filtering and voltage regulation module includes: a Zener diode D2 and a filter capacitor E3;

[0019] The positive terminal of the Zener diode D2 is connected to the input voltage VCC-1, and the negative terminal is connected to the positive terminal of the filter capacitor E3, and the output voltages are VCC1 and VCC. The negative terminal of the filter capacitor E3 is grounded.

[0020] In a further embodiment, the LDO module includes: an inductor L2, a first polarity capacitor C2, a first polarity capacitor C8, a second polarity capacitor C11, and a low dropout linear regulator U7;

[0021] One end of the inductor L2 is input voltage VCC. Pin 2 of the low dropout linear regulator U7 is simultaneously connected to the other end of the inductor L2, one end of the first polarized capacitor C2, and one end of the first capacitor C8. Pin 3 of the low dropout linear regulator U7 is connected to one end of the second polarized capacitor C11 and outputs voltage AVCC. Pin 1 of the low dropout linear regulator U7 is simultaneously connected to the other end of the first polarized capacitor C2, the other end of the first capacitor C8, and the other end of the second polarized capacitor C11 and is grounded.

[0022] The beneficial effects of this utility model include:

[0023] 1. Improved temperature control stability: Through power supply filtering and voltage regulation and dual voltage regulation by the LDO module, the impact of voltage fluctuations on the control chip is reduced, making temperature control more precise.

[0024] 2. Enhanced anti-interference capability: The use of filter inductors and shielding layers effectively suppresses electromagnetic interference and power supply noise, making it suitable for high-interference environments in semiconductor manufacturing.

[0025] 3. Simple and reliable structure: The modular design is easy to implement and maintain, has low cost, and is suitable for large-scale applications.

[0026] 4. Wide applicability: It is not only suitable for semiconductor production pipelines, but can also be extended to other industrial fields that require high-precision temperature control. Attached Figure Description

[0027] Figure 1 This is a schematic diagram of the temperature controller circuit module structure according to Embodiment 1 of this utility model.

[0028] Figure 2 This is a schematic diagram of the temperature controller circuit module structure according to Embodiment 2 of this utility model.

[0029] Figure 3 This is a schematic diagram of the temperature controller circuit module structure according to Embodiment 3 of this utility model.

[0030] Figure 4 This is a circuit diagram of the power supply filtering and voltage regulation module and the LDO module of this utility model. Detailed Implementation

[0031] The technical solution of this utility model will now be clearly and completely described with reference to the accompanying drawings. Obviously, the described embodiments are only some, not all, of the embodiments of this utility model. Based on the embodiments of this utility model, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this utility model.

[0032] In the description of this utility model, it should be noted that the terms "center," "upper," "lower," "left," "right," "vertical," "horizontal," "inner," and "outer," etc., indicating the orientation or positional relationship, are based on the orientation or positional relationship shown in the accompanying drawings and are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this utility model. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and should not be construed as indicating or implying relative importance.

[0033] In the description of this utility model, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "joining" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model based on the specific circumstances. Furthermore, the technical features involved in the different embodiments of this utility model described below can be combined with each other as long as they do not conflict with each other.

[0034] A temperature controller circuit module for semiconductor production pipelines, and a power supply filtering and voltage regulation module for filtering and initially regulating the input power supply;

[0035] The LDO module is connected to the power supply filtering and voltage regulation module and is used to further regulate and reduce noise in the filtered power supply.

[0036] The control chip module, connected to the LDO module, is used to process temperature signals and output control signals;

[0037] A temperature control execution module, connected to the control chip module, is used to adjust the temperature according to the control signal;

[0038] The power supply section of the control chip module is equipped with a filter inductor to reduce power ripple.

[0039] In one embodiment, such as Figure 4 As shown, the power supply filtering and voltage regulation module includes: a Zener diode D2 and a filter capacitor E3;

[0040] The positive terminal of the Zener diode D2 is connected to the input voltage VCC-1, and the negative terminal is connected to the positive terminal of the filter capacitor E3, and the output voltages are VCC1 and VCC. The negative terminal of the filter capacitor E3 is grounded.

[0041] In one embodiment, such as Figure 4 As shown, the LDO module includes: inductor L2, first polarity capacitor C2, first polarity capacitor C8, second polarity capacitor C11, and low dropout linear regulator U7;

[0042] One end of the inductor L2 is input voltage VCC. Pin 2 of the low dropout linear regulator U7 is simultaneously connected to the other end of the inductor L2, one end of the first polarized capacitor C2, and one end of the first capacitor C8. Pin 3 of the low dropout linear regulator U7 is connected to one end of the second polarized capacitor C11 and outputs voltage AVCC. Pin 1 of the low dropout linear regulator U7 is simultaneously connected to the other end of the first polarized capacitor C2, the other end of the first capacitor C8, and the other end of the second polarized capacitor C11 and is grounded.

[0043] Example 1

[0044] refer to Figure 1 This embodiment provides a basic temperature controller circuit module. The input power supply (e.g., 24V DC power) first enters a power filter and voltage regulator module, which includes a filter capacitor and a Zener diode to filter out high-frequency noise and stabilize the voltage. The filtered power supply is then input to an LDO module (e.g., a low-dropout linear regulator chip). The LDO module outputs a stable, low-noise voltage (e.g., 5V) to the control chip module. The control chip module uses a microcontroller (e.g., an ARM Cortex-M series), and a filter inductor (e.g., a ferrite bead) is connected in series in its power supply path to further reduce power ripple. The control chip module receives signals from a temperature sensor, processes them, and outputs a PWM control signal to a temperature control actuator module (e.g., a heating rod or cooling fan) to regulate the pipe temperature.

[0045] This embodiment achieves a reduction in power supply ripple, an improvement in temperature control stability of approximately 30%, and enhanced anti-interference capability through a simple combination of modules.

[0046] Example 2

[0047] refer to Figure 2 This embodiment enhances upon Embodiment 1. The power supply filtering and voltage regulation module employs at least one filter capacitor and at least one Zener diode to better suppress noise. A buffer circuit (such as an RC buffer network) is added between the power supply filtering and voltage regulation module and the LDO module to absorb voltage spikes and enhance stability. The control execution module is connected to a high-precision temperature sensor (such as a PT100) to monitor the pipe temperature in real time. A shielded inductor is used for filtering to reduce magnetic field interference. The temperature control execution module includes a bidirectional thyristor for precise control of the heating element's power.

[0048] This embodiment is applicable to high-precision semiconductor production pipelines, further improving temperature control stability, reducing voltage ripple to below 5mV, and meeting industrial EMC standards for anti-interference capabilities.

[0049] Example 3

[0050] refer to Figure 3 This embodiment focuses on enhancing anti-interference capabilities. The entire circuit module is encased in an anti-interference shielding layer (such as a metal casing) to prevent external electromagnetic interference. The power supply filtering and voltage regulation module employs a combination of switching power supply filtering and linear regulation to handle a wide range of voltage inputs. The LDO module uses a low-dropout linear regulator to output a cleaner voltage. The power supply section of the control chip module uses multiple filtering inductors to form an LC filter network, further reducing ripple. In addition, a backup power module (such as a supercapacitor) is added to provide temporary power in case of main power failure, ensuring uninterrupted temperature control.

[0051] This embodiment is suitable for extreme interference environments, such as plasma processing areas in semiconductor manufacturing, with temperature control stability up to ±0.1℃ and anti-interference capability improved by 50%.

[0052] Other embodiments

[0053] In other embodiments of this utility model, the power supply filtering and voltage regulation module may include a common-mode choke to suppress common-mode noise; the LDO module may employ a multi-output LDO to provide independent voltage regulation for different components; the control chip module may integrate digital signal processing (DSP) functions to achieve adaptive temperature control; and the temperature control execution module may include multi-stage actuators, such as a heating and cooling combination, to cope with rapid temperature changes.

[0054] Obviously, the above embodiments are merely illustrative examples for clear explanation and are not intended to limit the implementation. Those skilled in the art will recognize that other variations or modifications can be made based on the above description. It is neither necessary nor possible to exhaustively list all possible implementations here. However, obvious variations or modifications derived therefrom are still within the protection scope of this invention.

Claims

1. A temperature controller circuit module for a semiconductor production pipeline, characterized by, include: The power supply filtering and voltage regulation module is used to filter and initially regulate the input power supply. The LDO module is connected to the power supply filtering and voltage regulation module and is used to further regulate and reduce noise in the filtered power supply. The control chip module, connected to the LDO module, is used to process temperature signals and output control signals; A temperature control execution module, connected to the control chip module, is used to adjust the temperature according to the control signal; The power supply section of the control chip module is equipped with a filter inductor to reduce power ripple.

2. The temperature controller circuit module for semiconductor manufacturing pipeline according to claim 1, wherein, The power supply filtering and voltage regulation module includes at least one filter capacitor and at least one Zener diode, used to suppress power supply noise and voltage fluctuations.

3. The temperature controller circuit module for semiconductor manufacturing pipeline according to claim 1, wherein, The LDO module is a low-dropout linear regulator used to output a stable voltage to the control chip module.

4. The temperature controller circuit module for semiconductor manufacturing pipeline according to claim 1, wherein, The control chip module includes a microcontroller or a dedicated temperature control chip, and the filter inductor is connected in series in the power supply path.

5. The temperature controller circuit module for semiconductor manufacturing pipelines according to claim 1, wherein, The temperature control execution module includes a heating element or a cooling element, used to regulate the temperature of the semiconductor production pipeline.

6. The temperature controller circuit module for semiconductor manufacturing pipeline according to claim 1, wherein, It also includes an anti-interference shielding layer to enclose the circuit module and reduce external electromagnetic interference.

7. The temperature controller circuit module for semiconductor manufacturing pipelines according to claim 1, wherein, A buffer circuit is provided between the power supply filtering and voltage regulation module and the LDO module to enhance voltage stability.

8. The temperature controller circuit module for a semiconductor manufacturing pipeline according to claim 1, characterized in that, The control chip module is also connected to a temperature sensor for real-time monitoring of the pipeline temperature.

9. The temperature controller circuit module for semiconductor manufacturing pipelines according to claim 1, wherein, The power supply filtering and voltage regulation module includes: a Zener diode D2 and a filter capacitor E3; The positive terminal of the Zener diode D2 is connected to the input voltage VCC-1, and the negative terminal is connected to the positive terminal of the filter capacitor E3, and the output voltages are VCC1 and VCC. The negative terminal of the filter capacitor E3 is grounded.

10. A temperature controller circuit module for a semiconductor manufacturing pipeline according to claim 1, characterized in that, The LDO module includes: inductor L2, first polarity capacitor C2, first capacitor C8, second polarity capacitor C11, and low dropout linear regulator U7; One end of the inductor L2 is input voltage VCC. Pin 2 of the low dropout linear regulator U7 is simultaneously connected to the other end of the inductor L2, one end of the first polarized capacitor C2, and one end of the first capacitor C8. Pin 3 of the low dropout linear regulator U7 is connected to one end of the second polarized capacitor C11 and outputs voltage AVCC. Pin 1 of the low dropout linear regulator U7 is simultaneously connected to the other end of the first polarized capacitor C2, the other end of the first capacitor C8, and the other end of the second polarized capacitor C11 and is grounded.

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