heat dissipating device

Abstract

A heat dissipation device is provided for mounting on a circuit board having a heat generating element. The heat dissipation device includes a heat dissipation module and a plurality of second electrical contacts. The heat dissipation module is adapted to correspond to the heat generating element and is secured to the circuit board, wherein the heat dissipation module has a plurality of first electrical contacts. The second electrical contacts are disposed adjacent to the heat generating element and on the circuit board. The first electrical contacts directly contact the second electrical contacts when the heat dissipation device is mounted on the circuit board.

Description

Technical Field

[0001] This case involves a heat dissipation device. Background Technology

[0002] Currently, cooling systems are typically housed inside the computer case, electrically connecting multiple different components via various cables. For example, a water-cooled system includes a pump, a water cooling unit, and multiple fans, all connected via cables mounted on the motherboard. However, this setup requires careful verification of each cable's connection during assembly to avoid misconnections that could malfunction the cooling system and cause assembly difficulties. Furthermore, the numerous cables can create a cluttered visual appearance, which is unsightly when paired with transparent cases or lighting-equipped cooling systems. Utility Model Content

[0003] This invention provides a heat dissipation device that eliminates the need for multiple transmission lines to electrically connect multiple components.

[0004] The heat dissipation device of this invention is suitable for mounting on a circuit board, and the circuit board has a heat-generating element. The heat dissipation device includes a heat dissipation module and a plurality of second contacts. The heat dissipation module is adapted to correspond to the heat-generating element and is fixed on the circuit board, wherein the heat dissipation module has a plurality of first electrical contacts. These second electrical contacts are adjacent to the heat-generating element and are disposed on the circuit board. When the heat dissipation device is mounted on the circuit board, these first electrical contacts directly contact these second electrical contacts.

[0005] Based on the above, the heat dissipation device of this case, since these first electrical contacts and these second electrical contacts correspond to each other and are in direct contact, when the heat dissipation device is installed on the circuit board, the heat dissipation module can be directly electrically connected to the circuit board through the first electrical contacts and the second electrical contacts, and then different devices can be connected through the circuit board, without the need to use multiple transmission lines to connect different devices separately, which is quite convenient in assembly.

[0006] To make the above-mentioned features and advantages of this case more apparent and understandable, specific embodiments are provided below, along with detailed descriptions in conjunction with the accompanying drawings. Attached Figure Description

[0007] Figure 1A This is a schematic diagram of a heat dissipation device according to the present case;

[0008] Figure 1B yes Figure 1A Exploded view;

[0009] Figure 2 yes Figure 1A Exploded view of another embodiment;

[0010] Figure 3 This is a schematic diagram of a heat dissipation device according to another embodiment of this case;

[0011] Figure 4 This is a schematic diagram of a heat dissipation device according to another embodiment of this case;

[0012] Figure 5A This is a schematic diagram of a heat dissipation device according to another embodiment of this case;

[0013] Figure 5B yes Figure 5A Exploded view;

[0014] Figure 6 This is a schematic diagram of a heat dissipation device according to another embodiment of the present invention.

[0015] Explanation of reference numerals in the attached figures:

[0016] 10: Circuit board;

[0017] 10a: Surface;

[0018] 11: Heating element;

[0019] 12: Connecting device;

[0020] 13: Surrounding structure;

[0021] 13a: Heat sink;

[0022] 13b: Backing film;

[0023] 100: Heat dissipation device;

[0024] 110: Heat dissipation module;

[0025] 111: Ontology;

[0026] 112: Connector;

[0027] 113: First electrical contact;

[0028] 114: Locking hole;

[0029] 115: Connection port;

[0030] 120: Second electrical contact;

[0031] 130: Locking device. Detailed Implementation

[0032] Please refer to Figure 1A and Figure 1BThe heat dissipation device 100 of this invention is adapted to be mounted on a circuit board 10, and the circuit board 10 has a heating element 11. The heat dissipation device 100 includes a heat dissipation module 110 and a plurality of second electrical contacts 120. The heat dissipation module 110 is adapted to correspond to the heating element 11 and is fixed on the circuit board 10, wherein the heat dissipation module 110 has a plurality of first electrical contacts 113. These second electrical contacts 120 are adjacent to the heating element 11 and are disposed on the circuit board 10. When the heat dissipation device 100 is mounted on the circuit board 10, these first electrical contacts 113 directly contact these second electrical contacts 120, thereby electrically connecting the heat dissipation module 110 to the circuit board 10.

[0033] As described above, in this embodiment, the circuit board 10 has a surface 10a, and the second electrical contacts 120 are disposed on the surface 10a. The heat dissipation module 110 also includes a body 111 and a connector 112. The body 111 is adapted to correspond to the heat-generating element 11 and is fixed to the circuit board 10, and the first electrical contacts 113 are disposed on the connector 112, wherein the connector 112 is disposed on one side of the body 111 and fixed to the body 111. In addition, these first electrical contacts 113 may be, for example, multiple pogo pins. In other embodiments, these first electrical contacts 113 may also be multiple spring contacts or other types of contacts, as long as these first electrical contacts 113 can directly contact and be electrically connected to these second electrical contacts 120. This invention is not limited to this. On the other hand, the heat dissipation device 100 also includes a plurality of fasteners 130, and the heat dissipation module 110 also includes a plurality of locking holes 114, through which the fasteners 130 fix the heat dissipation module 110 to the circuit board 10.

[0034] Please continue to refer to this. Figure 1BThese second electrical contacts 120 are disposed on the circuit board 10 and correspond to the first electrical contacts 113, so that when the heat dissipation module 110 is fixed on the circuit board 10, the first electrical contacts 113 can directly contact the second electrical contacts 120. When there are two or more connectors 112 and they are disposed on multiple sides of the heat dissipation module 110, these second electrical contacts 120 are disposed on the surface 10a of the circuit board 10 and distributed at positions corresponding to the first electrical contacts 113. That is, these second electrical contacts 120 are disposed on the surface 10a of the circuit board 10 according to the positions of the first electrical contacts 113, so that when the heat dissipation module 110 is mounted on the circuit board 10, the first electrical contacts 113 can directly contact the second electrical contacts 120. In this embodiment, the first electrical contacts 113 are disposed on the connector 112. In other embodiments, the first electrical contacts 113 may also be directly disposed on the body 111 of the heat dissipation module 110. When the heat dissipation module 110 is mounted on the circuit board 10, the second electrical contacts 120 are disposed at the position where the heat dissipation module 110 contacts the circuit board 10, so that the first electrical contacts 113 directly contact the second electrical contacts 120. On the other hand, in this embodiment, the heating element 11 is, for example, a chip.

[0035] Please refer to Figure 2 In this embodiment, the connector 112 is detachably mounted on the body 111. Specifically, the connector 112 is located on one side of the body 111 and can be detached from it. When the heat dissipation module 110 is to be mounted on the circuit board 10, the connector 112 is first mounted on the body 111, and then the heat dissipation module 110 is fixed to the circuit board 10. Alternatively, the heat dissipation module 110 can be fixed to the circuit board 10 first, and then the connector 112 can be mounted in the corresponding position corresponding to the positions of the second electrical contacts 120, so that the first electrical contacts 113 on the connector 112 directly contact the second electrical contacts 120. In other words, in this embodiment, the position of the connector 112 on the body 111 can be adjusted according to the position of the second electrical contacts 120 on the circuit board 10, making the installation of the heat dissipation device 100 more convenient.

[0036] Please refer to Figure 3 Another embodiment shown therein is similar to Figure 1AThe embodiments are largely the same, except that the circuit board 10 further has at least one peripheral structure 13, wherein the second electrical contacts 120 are disposed on the at least one peripheral structure 13. Specifically, the peripheral structure 13 can be a heat sink 13a, and the second electrical contacts 120 are disposed on the heat sink 13a, wherein the first electrical contacts 113 are disposed on a connector 112, and the connector 112 is disposed on the same side of the heat dissipation module 110 relative to the second electrical contacts 120. When the heat dissipation module 110 is mounted on the circuit board 10, the first electrical contacts 113 are directly connected to the second electrical contacts 120, thereby electrically connecting the heat dissipation module 110 to the circuit board 10.

[0037] Please refer to Figure 4 Another embodiment shown therein is similar to Figure 3 The embodiments are largely the same, with the difference being that the peripheral structure 13 can be a clip 13b, wherein the clip 13b is disposed on the circuit board 10 and used to fix the heat dissipation module 110, and these second electrical contacts 120 are disposed on the clip 13b. In addition, in this embodiment, these first electrical contacts 113 are disposed on the connector 112 and correspond to these second electrical contacts 120. When the heat dissipation module 110 is mounted on the circuit board 10, these first electrical contacts 113 directly connect to these second electrical contacts 120, so that the heat dissipation module 110 is electrically connected to the circuit board 10. Alternatively, these second electrical contacts 120 can also be distributed on the surface 10a of the circuit board 10 and these peripheral structures 13, and these first electrical contacts 113 can correspond to these second electrical contacts 120 distributed on the body 111 or the connector 112, as long as these first electrical contacts 113 can directly connect to these second electrical contacts 120, this embodiment is not limited to this. On the other hand, in this embodiment, the peripheral structure 13 is a clip 13b. In other embodiments, the peripheral structure 13 may also be other devices disposed on the circuit board 10, as long as the first electrical contact 113 can be electrically connected to the second electrical contact 120 disposed on the device. This case is not limited to this.

[0038] Please refer to Figure 5A and Figure 5B Another embodiment shown therein is similar to Figure 1AThe embodiments are largely the same, with the difference being that the heat dissipation device 100 further includes a connection port 115, which is fixed to one side of the body 111, and the connector 112 is detachably disposed within the connection port 115. Additionally, in this embodiment, the second electrical contacts 120 are disposed within the connecting device 12 to protect them. The connecting device 12 is positioned corresponding to the first electrical contacts 113 and is disposed on the surface 10a of the circuit board 10. Specifically, in this embodiment, when the heat dissipation module 110 is to be installed on the circuit board 10, the connector 112 is first disposed within the connection port 115, allowing the first electrical contacts 113 on the connector 112 to directly connect to the second electrical contacts 120 on the circuit board 10. In this embodiment, because the connector 112 is detachable, the user can select the corresponding connector 112 based on the second electrical contacts 120 on different circuit boards 10, making installation more convenient.

[0039] Please refer to Figure 6 Another embodiment shown therein is similar to Figure 5A The embodiments are largely the same, with the difference being that the connecting device 12 is disposed on the heat sink 13a, and the connector 112 is disposed on the heat dissipation module 110 and on one side corresponding to the connecting device 12. Alternatively, in other embodiments, the connector 112 may be directly disposed on the body 111, or the first electrical contacts 113 may be directly disposed on the body 111, corresponding to the connecting device 12 so that the first electrical contacts 113 can directly contact the second electrical contacts 120; this is not a limitation of the present invention. In this embodiment, the connecting device 12 is disposed on the heat sink 13a; in other embodiments, the connecting device 12 may also be disposed on other devices, as long as it allows the first electrical contacts 113 to directly connect to the second electrical contacts 120; this is not a limitation of the present invention.

[0040] In summary, the heat dissipation device of this case, since these first electrical contacts and these second electrical contacts correspond to each other and are in direct contact, when the heat dissipation device is installed on the circuit board, the heat dissipation module can be directly electrically connected to the circuit board through the first electrical contacts and the second electrical contacts, and then different devices can be connected through the circuit board, without the need to use multiple transmission lines to connect different devices separately, which is quite convenient in assembly.

[0041] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of this utility model, and are not intended to limit it. Although the utility model has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some or all of the technical features therein. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of this utility model.

Claims

1. A heat dissipation device, characterized in that, Suitable for mounting on a circuit board having a heat-generating element, the heat dissipation device includes: A heat dissipation module, adapted to correspond to the heat-generating element and fixed on the circuit board, and having multiple first electrical contacts; and Multiple second electrical contacts are located adjacent to the heating element and disposed on the circuit board; When the heat dissipation device is installed on the circuit board, the plurality of first electrical contacts directly contact the plurality of second electrical contacts.

2. The heat dissipation device according to claim 1, characterized in that, The heat dissipation module also includes: The main body, adapted to correspond to the heating element and fixed on the circuit board; and A connector is disposed on one side of the body, and the plurality of first electrical contacts are disposed on the connector.

3. The heat dissipation device according to claim 2, characterized in that, The connector is fixed to the body.

4. The heat dissipation device according to claim 2, characterized in that, The connector is detachably mounted on the body.

5. The heat dissipation device according to claim 1, characterized in that, The heat dissipation module also includes: The main body is adapted to correspond to the heating element and fixed to the circuit board; A connector, fixed to one side of the main body; and A connector is detachably connected to the connection port, and the plurality of first electrical contacts are disposed on the connector.

6. The heat dissipation device according to claim 1, characterized in that, The circuit board also has at least one peripheral structure, and the plurality of second electrical contacts are disposed on the at least one peripheral structure.

7. The heat dissipation device according to claim 6, characterized in that, The plurality of second electrical contacts are distributed on the circuit board and the at least one peripheral structure.

8. The heat dissipation device according to claim 1, characterized in that, The plurality of first electrical contacts are disposed on the same side of the heat dissipation module.

9. The heat dissipation device according to claim 8, characterized in that, The plurality of second electrical contacts correspond to the plurality of first electrical contacts and are disposed on the same side of the circuit board.

10. The heat dissipation device according to claim 1, characterized in that, The plurality of first electrical contacts are distributed on the heat dissipation module.

11. The heat dissipation device according to claim 10, characterized in that, The plurality of second electrical contacts correspond to the plurality of first electrical contacts and are distributed on the circuit board.

12. The heat dissipation device according to claim 1, characterized in that, It also has multiple locking fasteners, wherein the multiple locking fasteners are adapted to fix the heat dissipation module to the circuit board through multiple locking holes of the heat dissipation module.

13. The heat dissipation device according to claim 1, characterized in that, At least some of the plurality of second electrical contacts are disposed within at least one connecting device.

14. The heat dissipation device according to claim 13, characterized in that, The circuit board also has at least one peripheral structure, and the connecting device is disposed on the at least one peripheral structure.

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