Light emitting smart card and die module therefor

Abstract

The utility model relates to a kind of middle material modules, comprising: first protective film, middle material plate, second protective film are pasted together in turn. Middle material plate includes: substrate, radio frequency sensing unit and light emitting unit. Substrate is light-transmitting plate, and substrate is equipped with first avoid slot, second avoid slot and third avoid slot. Radio frequency sensing unit includes: IC chip and antenna. Light emitting unit includes: PCBA board, induction coil and light strip. Capacitor and diode connected with capacitor are provided on PCBA board. Light strip is equipped with multiple LED chips, which are uniformly and interval connected together, and each LED chip is arranged towards the side of light strip. First protective film and second protective film are both light-transmitting film. Meanwhile, a light-emitting smart card including the middle material module is also provided. By embedding electronic devices in avoid slot and using LED chips as light source devices to construct light strip, not only the thickness of the smart card can be further reduced, but also the uniformity of the luminance of the light-emitting area can be improved.

Description

Technical Field

[0001] This utility model relates to the field of smart card technology, and in particular to a material module and a light-emitting smart card. Background Technology

[0002] Contactless smart cards are widely used in daily life, such as bank cards, access cards, and card-type car keys. When a smart card enters the reader's range, the antenna inside the smart card detects the radio frequency signal, powering the IC chip and enabling information transmission. To allow users to intuitively know whether a smart card is within the reader's range, some smart cards are equipped with a light-emitting unit. When the smart card enters the reader's range, the induction coil of the light-emitting unit detects the radio frequency signal, powering the light source. The light source then illuminates a preset area on the smart card, allowing the user to determine whether the smart card is within the reader's range based on its illumination.

[0003] Traditional illuminated smart cards use one or more LED beads connected in series as their light source. The drawback of this traditional design is that the LED beads are relatively thick (including the bracket, LED chip, and lens), making it difficult to further reduce the thickness of the smart card. Furthermore, when multiple LED beads are connected in series, there are noticeable dark areas between adjacent LED beads, resulting in uneven brightness distribution of the luminous area produced by the light-emitting unit.

[0004] Therefore, there is a need to develop a new type of luminescent smart card that can further reduce the thickness of the smart card and improve the uniformity of brightness in the luminescent area. Utility Model Content

[0005] Based on this, the present invention provides a material module that uses recessed slots to embed electronic devices and LED chips as light source devices to construct a light strip, which can not only further reduce the thickness of the smart card, but also improve the uniformity of brightness in the light-emitting area.

[0006] A medium-load module, comprising:

[0007] The intermediate material board includes: a substrate, and a radio frequency sensing unit and a light-emitting unit respectively mounted on the substrate; the substrate has a light guide plate structure, and the substrate is provided with a first clearance groove, a second clearance groove, and a third clearance groove; the radio frequency sensing unit includes: an IC chip located in the first clearance groove and an antenna located on the surface of the substrate; the light-emitting unit includes: a PCBA board located in the second clearance groove, an induction coil connected to the PCBA board, and a light strip connected to the PCBA board; the PCBA board is provided with a capacitor and a diode connected to the capacitor; the induction coil is located on the surface of the substrate; the light strip is located in the third clearance groove; the light strip is provided with multiple LED chips connected in series at uniform intervals, and each LED chip is arranged facing one side of the light strip;

[0008] A first protective film affixed to one side of the material plate; the first protective film is a light-transmitting film; and

[0009] A second protective film is affixed to the side of the material plate opposite to the first protective film; the second protective film is a light-transmitting film.

[0010] The aforementioned intermediate material module incorporates recessed slots on the substrate to accommodate the relatively thick IC chips, PCBA boards, and LED strips, thus compressing the overall thickness of the intermediate material board through embedding. Simultaneously, the LED strip uses LED chips as the light source, and since LED chips have a bare structure, their thickness can be reduced compared to LED beads. Because LED chips are used as the light source, a greater number of LED chips can be placed per unit length compared to LED beads. However, LED chips lack lenses for focusing light, resulting in relatively dispersed light emission. Furthermore, each LED chip is positioned facing one side of the LED strip, with the substrate acting as a light guide to laterally guide the light propagation. Therefore, when multiple LED chips are evenly spaced and connected in series, the light from adjacent LED chips is dispersed and intersecting, resulting in a wide light coverage area, reducing the formation of dark areas, and thus improving the uniformity of brightness in the luminous area. Through this design, using recessed slots to embed electronic components and employing LED chips as the light source to construct the LED strip not only further reduces the thickness of the smart card but also improves the uniformity of brightness in the luminous area.

[0011] In one embodiment, both the antenna and the induction coil are embedded in the surface of the substrate by ultrasonic welding. When the surface material of the substrate melts during ultrasonic welding, the antenna and induction coil can be embedded into the surface of the substrate, thereby compressing the overall thickness of the substrate.

[0012] In one embodiment, the light strip includes an outer light-emitting strip and an inner light-emitting strip respectively connected to the PCBA board; the LED chips of the outer light-emitting strip are all arranged facing the outer side of the substrate; the LED chips of the inner light-emitting strip are all arranged facing the inner side of the substrate; the outer light-emitting strip is located outside the inner light-emitting strip. The outer light-emitting strip can form a light-emitting area that diffuses outwards, used to illuminate the outer perimeter of the smart card. The inner light-emitting strip can form a light-emitting area that diffuses inwards, used to illuminate a designated area on the smart card.

[0013] In one embodiment, the light strip includes an outer light-emitting strip connected to the PCBA board; the LED chips of the outer light-emitting strip are all disposed facing the outer side of the substrate. The outer light-emitting strip can form a light-emitting area that diffuses outward, used to illuminate the outer periphery of the smart card.

[0014] In one embodiment, the light strip includes an inner light-emitting strip connected to the PCBA board; the LED chips of the inner light-emitting strip are all disposed facing the inner side of the substrate. The inner light-emitting strip can form an inwardly diffused light-emitting area for illuminating a designated area on the smart card.

[0015] In one embodiment, the substrate is a transparent PVC sheet. Transparent PVC sheets are insulating, have good light-guiding properties, are resistant to bending, are inexpensive, and are highly malleable.

[0016] In one embodiment, both the first and second protective films are transparent PVC films. Transparent PVC films are insulating, have good light-guiding properties, are resistant to bending, are inexpensive, and are highly malleable.

[0017] In addition, this utility model also provides a light-emitting smart card.

[0018] A light-emitting smart card includes a material processing module as described in any of the above embodiments; the light-emitting smart card further includes: a first interface and a second interface disposed parallel to the first interface; the material processing module is located between the first interface and the second interface; both the first interface and the second interface are provided with a light-shielding area.

[0019] In the aforementioned luminescent smart card, the middle plate is used to realize radio frequency sensing and light emission functions, while the first and second interfaces are used to form a light-shielding area to further control the range of the light-emitting area. Through the above design, by using recessed slots to embed electronic devices and using LED chips as light source devices to construct the light strip, not only can the thickness of the smart card be further reduced, but the uniformity of brightness in the light-emitting area can also be improved. Attached Figure Description

[0020] Figure 1 This is a schematic diagram of the material feeding module according to one embodiment of the present invention;

[0021] Figure 2 for Figure 1 The exploded view of the intermediate material module is shown;

[0022] Figure 3 for Figure 2 The diagram shown is a schematic of the core layer in the intermediate material module;

[0023] Figure 4 for Figure 3 The diagram shows the decomposition of the core layer.

[0024] Figure 5 for Figure 4 A magnified view of a portion of the LED strip in the core layer shown;

[0025] Figure 6 for Figure 1 The diagram shows the light-emitting effect of the intermediate material module;

[0026] Figure 7 This is a schematic diagram of the material feeding module according to another embodiment of the present invention;

[0027] Figure 8 for Figure 7 The diagram shows the light-emitting effect of the intermediate material module;

[0028] Figure 9 This is a schematic diagram of the material feeding module according to another embodiment of the present invention;

[0029] Figure 10 for Figure 9 The diagram shows the light-emitting effect of the intermediate material module;

[0030] Figure 11 This is a schematic diagram of a light-emitting smart card according to an embodiment of the present invention;

[0031] Figure 12 for Figure 11 An exploded view of the illuminated smart card shown.

[0032] Figure 13 for Figure 11 The image shows the illumination effect of the illuminated smart card.

[0033] The meanings of the labels in the attached diagram are as follows:

[0034] 1000-Illuminated Smart Card;

[0035] 100-Medium Material Module;

[0036] 10-Medium material plate, 11-Substrate, 111-First clearance groove, 112-Second clearance groove, 113-Third clearance groove, 12-RF sensing unit, 121-IC chip, 122-Antenna, 13-Light-emitting unit, 131-PCBA board, 132-Induction coil, 133-Light strip, 133A-Outer light-emitting strip, 133B-Inner light-emitting strip, 1331-LED chip;

[0037] 20 - First protective film;

[0038] 30 - Second protective film;

[0039] 200 - First interface, 201 - Shading area, 202 - Transmitting area;

[0040] 300 - Second interface. Detailed Implementation

[0041] To make the above-mentioned objects, features, and advantages of this utility model more apparent and understandable, the specific embodiments of this utility model will be described in detail below with reference to the accompanying drawings. Many specific details are set forth in the following description to provide a full understanding of this utility model. However, this utility model can be implemented in many other ways different from those described herein, and those skilled in the art can make similar modifications without departing from the spirit of this utility model. Therefore, this utility model is not limited to the specific embodiments disclosed below.

[0042] In the description of this utility model, it should be understood that the terms "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc., indicating the orientation or positional relationship are based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing this utility model and simplifying the description, and are not intended to indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this utility model.

[0043] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one of that feature. In the description of this utility model, "a plurality of" means at least two, such as two, three, etc., unless otherwise explicitly specified.

[0044] In this utility model, unless otherwise explicitly specified and limited, the terms "installation," "connection," "joining," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components, unless otherwise explicitly limited. Those skilled in the art can understand the specific meaning of the above terms in this utility model according to the specific circumstances.

[0045] In this utility model, unless otherwise explicitly specified and limited, "above" or "below" the second feature can mean that the first feature is in direct contact with the second feature, or that the first feature is in indirect contact with the second feature through an intermediate medium. Furthermore, "above," "on top of," and "over" the second feature can mean that the first feature is directly above or diagonally above the second feature, or simply that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature can mean that the first feature is directly below or diagonally below the second feature, or simply that the first feature is at a lower horizontal level than the second feature.

[0046] It should be noted that when an element is referred to as being "fixed to" or "set on" another element, it can be directly on the other element or there may be an intervening element. When an element is considered to be "connected to" another element, it can be directly connected to the other element or there may be an intervening element. The terms "vertical," "horizontal," "upper," "lower," "left," "right," and similar expressions used herein are for illustrative purposes only and do not represent the only possible implementation.

[0047] like Figures 1 to 6 As shown, it is a material feeding module 100 of one embodiment of the present utility model.

[0048] like Figure 1 and Figure 2 As shown, the material module 100 includes: a material plate 10, a first protective film 20 attached to one side of the material plate 10, and a second protective film 30 attached to the side of the material plate 10 opposite to the first protective film 20.

[0049] like Figure 3 As shown, the intermediate material plate 10 includes: a substrate 11, and a radio frequency sensing unit 12 and a light-emitting unit 13 respectively mounted on the substrate 11. The substrate 11 has a light guide plate structure, and the substrate 11 is provided with a first clearance groove 111, a second clearance groove 112, and a third clearance groove 113.

[0050] In this embodiment, the substrate 11 is a transparent PVC sheet. For example, in this embodiment, the substrate 11 is a 0.3mm thick transparent PVC sheet. Transparent PVC sheets are electrically insulating, have good light guiding properties, are resistant to bending, are inexpensive, and have high plasticity.

[0051] like Figure 4As shown, the radio frequency sensing unit 12 includes an IC chip 121 located in the first recess 111 and an antenna 122 located on the surface of the substrate 11. When the antenna 122 enters the sensing range of the card reader, the antenna 122 generates an electrical signal to drive the IC chip 121 to work and serves as a signal transmission medium between the IC chip 121 and the card reader.

[0052] like Figure 4 As shown, the light-emitting unit 13 includes: a PCBA board 131 located in the second recess 112, an induction coil 132 connected to the PCBA board 131, and an LED strip 133 connected to the PCBA board 131. The PCBA board 131 has a capacitor and a diode connected to the capacitor. The induction coil 132 is located on the surface of the substrate 11. The LED strip 133 is located in the third recess 113. When the induction coil 132 enters the sensing range of the card reader, the induction coil 132 generates an electrical signal to charge the capacitor on the PCBA board 131, and the diode restricts the flow direction of the electrical signal. The charged capacitor then powers the LED strip 133.

[0053] like Figure 5 As shown, the light strip 133 has multiple LED chips 1331 connected in series at even intervals, and each LED chip 1331 is positioned facing one side of the light strip 133. It should be noted that the LED chip 1331 is a bare structure, that is, an unencapsulated LED without a bracket and lens.

[0054] It should be noted that, in this solution, since the induction coil 132 and the antenna 122 are usually made of enameled wire, and the wire diameter of the enameled wire is small, the induction coil 132 and the antenna 122 can be directly placed on the surface of the substrate 11 and then covered and fixed by the first protective film 20 and the second protective film 30.

[0055] Considering that although the enameled wire has a small diameter, placing it directly on the surface of the substrate 11 would still be detrimental to compressing the overall thickness of the intermediate material plate 10, in this embodiment, both the antenna 122 and the induction coil 132 can be embedded in the surface of the substrate 11 by ultrasonic welding. When the surface material of the substrate 11 melts during ultrasonic welding, the antenna 122 and the induction coil 132 can be embedded into the surface of the substrate 11, achieving the purpose of compressing the overall thickness of the intermediate material plate 10.

[0056] In this embodiment, both the first protective film 20 and the second protective film 30 are light-transmitting films. In this embodiment, both the first protective film 20 and the second protective film 30 are transparent PVC films. Transparent PVC films are insulating, have good light-guiding properties, are resistant to bending, are inexpensive, and have high plasticity.

[0057] Brief description of working principle:

[0058] like Figure 3 and Figure 4 As shown, recessed grooves are provided on the substrate 11 to accommodate the relatively thick IC chip 121, PCBA board 131, and LED strip 133, thereby compressing the overall thickness of the intermediate material board 10 through an embedded method. Meanwhile, as... Figure 5 As shown, the light strip 133 uses LED chips 1331 as the light source. Since LED chips 1331 have a bare structure, they eliminate the need for brackets and lenses compared to LED beads, thus reducing thickness. Furthermore, because LED chips 1331 eliminate the need for brackets and lenses compared to LED beads, more LED chips 1331 can be placed per unit length (i.e., they can be distributed more densely). While the light emitted by LED chips 1331 is relatively dispersed due to the lack of lens focusing, their dense arrangement can improve the uniformity of light in the luminous area and reduce the formation of dark areas. Moreover, each LED chip 1331 is positioned facing one side of the light strip 133, with the substrate 11 acting as a light guide to guide the light laterally. Therefore, when multiple LED chips 1331 are evenly spaced and connected in series, the light from adjacent LED chips 1331 is dispersed and intersecting, resulting in a wide light coverage area, reducing the formation of dark areas, and thus improving the uniformity of brightness in the luminous area.

[0059] Furthermore, the specific design of the light strip 133 varies depending on the requirements of setting different light-emitting areas.

[0060] For example, such as Figure 3 , Figure 4 ,as well as Figure 5 As shown, in this embodiment, the light strip 133 may include an outer light-emitting strip 133A and an inner light-emitting strip 133B respectively connected to the PCBA board 131. The LED chips 1331 of the outer light-emitting strip 133A are all disposed facing the outer side of the substrate 11. The LED chips 1331 of the inner light-emitting strip 133B are all disposed facing the inner side of the substrate 11. The outer light-emitting strip 133A surrounds the outer periphery of the inner light-emitting strip 133B. The outer light-emitting strip 133A can form a light-emitting area that diffuses outwards, used to illuminate the outer periphery of the smart card (see...). Figure 6 The shadowed area L1 at the center of the smart card. The inner light-emitting band 133B can form an inwardly diffused light-emitting area to illuminate a designated area on the smart card (see...). Figure 6 The shadow area L2 on the outer periphery of the smart card, for example, is used to illuminate the logo area or pattern area on the smart card.

[0061] For example, such as Figure 7 and Figure 8As shown, in this embodiment, the light strip 133 may include an outer light-emitting strip 133A connected to the PCBA board 131. The LED chips 1331 of the outer light-emitting strip 133A are all disposed facing the outer side of the substrate 11. The outer light-emitting strip 133A can form a light-emitting area that diffuses outwards, used to illuminate the outer periphery of the smart card (see...). Figure 8 The shaded area L1 in the image.

[0062] For example, such as Figure 9 and Figure 10 As shown, in this embodiment, the light strip 133 may include an inner light-emitting strip 133B connected to the PCBA board 131. The LED chips 1331 of the inner light-emitting strip 133B are all disposed facing the inner side of the substrate 11. The inner light-emitting strip 133B can form an inwardly diffused light-emitting area for illuminating a designated area on the smart card (see...). Figure 10 The shaded area L2 in the image.

[0063] The aforementioned material module 100 utilizes recessed slots to embed electronic devices and employs LED chips 1331 as light source devices to construct a light strip 133, which not only further reduces the thickness of the smart card but also improves the uniformity of brightness in the light-emitting area.

[0064] like Figures 11 to 13 As shown, it is a light-emitting smart card 1000 according to an embodiment of the present utility model.

[0065] like Figure 11 and Figure 12 As shown, in this embodiment, the luminescent smart card 1000 includes: a material processing module 100, a first interface 200, and a second interface 300 disposed parallel to the first interface 200. The material processing module 100 is located between the first interface 200 and the second interface 300. Both the first interface 200 and the second interface 300 are provided with a light-shielding area 201. For example, in this embodiment, using... Figure 12 Taking the displayed posture as an example, the outer ring area of ​​the upper surface of the first interface 200 is the light-blocking area 201, while the central area of ​​the upper surface of the first interface 200 is the light-transmitting area 202. Simultaneously, the entire lower surface of the second interface 300 is the light-blocking area 201. For example... Figure 13 As shown, when the luminous smart card 1000 is triggered, the central area and the outer perimeter are illuminated (see...). Figure 13 (Shaded areas L3 and L4 in the image).

[0066] In this embodiment, both the first interface 200 and the second interface 300 are PVC films, and a light-shielding coating is provided on the surface to form a light-shielding area 201.

[0067] In the aforementioned luminous smart card 1000, the middle plate 10 is used to realize radio frequency sensing and light emission functions, while the first interface 200 and the second interface 300 are used to form a light-shielding area 201 to further control the range of the light-emitting area. Through the above design, by using the recessed slot to embed electronic devices and using LED chips 1331 as light source devices to construct the light strip 133, not only can the thickness of the smart card be further reduced, but the uniformity of brightness in the light-emitting area can also be improved.

[0068] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0069] The above embodiments only illustrate preferred implementations of this utility model, and their descriptions are relatively specific and detailed, but they should not be construed as limiting the scope of the utility model patent. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this utility model, and these all fall within the protection scope of this utility model. Therefore, the protection scope of this utility model patent should be determined by the appended claims.

Claims

1. A medium-load module, characterized in that, include: Medium material plate; The intermediate material plate includes: a substrate, and a radio frequency sensing unit and a light-emitting unit respectively mounted on the substrate; the substrate has a light guide plate structure, and the substrate is provided with a first clearance groove, a second clearance groove, and a third clearance groove; the radio frequency sensing unit includes: an IC chip located in the first clearance groove and an antenna located on the surface of the substrate; the light-emitting unit includes: a PCBA board located in the second clearance groove, an induction coil connected to the PCBA board, and a light strip connected to the PCBA board; the PCBA board is provided with a capacitor and a diode connected to the capacitor; the induction coil is located on the surface of the substrate; the light strip is located in the third clearance groove; the light strip is provided with a plurality of LED chips connected in series at uniform intervals, and each of the LED chips is arranged facing one side of the light strip; A first protective film affixed to one side of the material plate; the first protective film is a light-transmitting film; and A second protective film is affixed to the side of the material plate opposite to the first protective film; the second protective film is a light-transmitting film.

2. The intermediate material module according to claim 1, characterized in that, Both the antenna and the induction coil are embedded in the surface of the substrate by ultrasonic welding.

3. The intermediate material module according to claim 1, characterized in that, The light strip includes an outer light-emitting strip and an inner light-emitting strip that are respectively connected to the PCBA board; the LED chips of the outer light-emitting strip are all arranged facing the outside of the substrate; the LED chips of the inner light-emitting strip are all arranged facing the inside of the substrate; and the outer light-emitting strip is located outside the inner light-emitting strip.

4. The intermediate material module according to claim 1, characterized in that, The light strip includes an outer light-emitting strip connected to the PCBA board; the LED chips of the outer light-emitting strip are all arranged facing the outside of the substrate.

5. The intermediate material module according to claim 1, characterized in that, The light strip includes an inner light-emitting strip connected to the PCBA board; the LED chips of the inner light-emitting strip are all arranged facing the inside of the substrate.

6. The intermediate material module according to claim 1, characterized in that, The substrate is a transparent PVC board.

7. The intermediate material module according to claim 1, characterized in that, Both the first protective film and the second protective film are transparent PVC films.

8. A light-emitting smart card, characterized in that, The system includes the material module as described in any one of claims 1 to 7; the luminescent smart card further includes: a first interface and a second interface disposed parallel to the first interface; the material module is located between the first interface and the second interface; both the first interface and the second interface are provided with a light-shielding area.

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