Display device, electronic device, and vehicle

Abstract

A display device, an electronic device, and a vehicle are provided. The display device includes a display panel, a window area disposed on a top surface of the display panel, and a reinforcing structure including a first portion covering a side surface of the display panel and a second portion disposed under a bottom surface of the display panel. The display device can have improved mechanical stability and can have improved life characteristics.

Description

[0001] This application claims priority to Korean Patent Application No. 10-2024-0103937, filed on August 5, 2024. Technical Field

[0002] The utility model relates to a display device, an electronic device, and a vehicle. Background Technology

[0003] Recently, with the development of automotive devices (such as automobiles), mobile devices (such as smartphones and tablets), and media devices (such as computers and TVs), various display devices have been developed for application to these devices.

[0004] In automotive devices, mobile devices, and / or media devices, images can be displayed in curved areas. In such cases, a display device can be provided as a curved display device.

[0005] However, cracks or interlayer gaps may occur in the curved area and / or outside the curved area of ​​the display device, which can cause impurities to penetrate from the outside or peel off between the layers included in the display device. Utility Model Content

[0006] The purpose of this invention is to provide a display device with improved mechanical stability and lifespan characteristics.

[0007] The purpose of this invention is to provide a method for manufacturing a display device with improved mechanical stability and lifespan characteristics.

[0008] The purpose of this invention is to provide an electronic device that includes a display device with shock resistance and stability.

[0009] The purpose of this invention is to provide a vehicle that includes a display device with impact resistance and stability.

[0010] In one embodiment, the display device includes: a display panel; a window region disposed on the top surface of the display panel; and a reinforcing structure including: a first portion covering a side surface of the display panel; and a second portion disposed below the bottom surface of the display panel.

[0011] In an embodiment, the window area may include: a window base, including a transmissive area and a border area; and a light-blocking pattern disposed below the border area.

[0012] In one embodiment, the first portion may cover at least a portion of the bottom surface of the light-shielding pattern.

[0013] In an embodiment, the display device may further include a light control area disposed between the display panel and the window area.

[0014] In one embodiment, the first portion may cover the side surface of the light control region.

[0015] In one embodiment, the light control region may include an anti-reflective layer.

[0016] In one embodiment, the display device may further include a first adhesive layer disposed between the display panel and the window area.

[0017] In one embodiment, the first portion may cover the side surface of the first adhesive layer.

[0018] In an embodiment, the display device may further include a second adhesive layer and a connecting structure arranged sequentially below the bottom surface of the second portion.

[0019] In one embodiment, the second adhesive layer may contact the underside of the bottom surface of the second portion, but may not contact the display panel.

[0020] In one embodiment, the display device may further include a cover panel disposed below the bottom surface of the display panel. The second portion may cover at least a portion of the bottom surface of the cover panel.

[0021] In one embodiment, the display device may further include a second adhesive layer and a connecting structure sequentially disposed below the bottom surface of the second portion. The second adhesive layer may be disposed directly below the bottom surface of the second portion and may not contact the cover panel.

[0022] In an embodiment, the reinforcing structure may include a resin comprising at least one selected from the group consisting of Si-based compounds and acrylic compounds.

[0023] In one embodiment, the display panel includes a substrate, a circuit layer on the substrate, and a light-emitting device electrically connected to the circuit layer.

[0024] In an embodiment, the light-emitting device includes a first electrode, a second electrode, and an intermediate layer containing an emitting layer disposed between the first electrode and the second electrode.

[0025] In one embodiment, the electronic device includes an electronic device frame and the aforementioned display device incorporated into the electronic device frame.

[0026] In an embodiment, the display device may further include a second adhesive layer and a connecting structure arranged sequentially below the bottom surface of the second portion, and the display device may be coupled to the electronic device frame via the connecting structure.

[0027] In this embodiment, the electronic device may be selected from flat panel displays, curved displays, computer monitors, medical monitors, televisions, billboards, indoor or outdoor lighting, signal lights, head-up displays, transparent displays, flexible displays, rollable displays, foldable displays, laser printers, telephones, mobile phones, tablet computers, phablets, personal information terminals (PDAs), wearable devices, laptop computers, digital cameras, camcorders, viewfinders, 3D displays, e-books, electronic dictionaries, electronic notebooks, electronic sensors, virtual reality or augmented reality displays, video walls, theater or stadium screens, or healthcare devices.

[0028] In one embodiment, the vehicle includes a vehicle frame and the aforementioned display device attached to the vehicle frame.

[0029] In one embodiment, the display device may further include a second adhesive layer and a connecting structure arranged sequentially below the bottom surface of the second portion, and the display device may be attached to the vehicle frame via the connecting structure.

[0030] In a method for manufacturing a display device, according to an embodiment, a window area is formed on a display panel. A reinforcing structure is formed, comprising a first portion covering a side surface of the display panel and a second portion disposed below a bottom surface of the display panel.

[0031] In one embodiment, a second adhesive layer and a connecting structure may be sequentially formed below the bottom surface of the second portion.

[0032] In one embodiment, a cover panel may also be formed beneath the bottom surface of the display panel. The second portion may at least partially cover the bottom surface of the cover panel.

[0033] According to the above embodiments, the display device may include a reinforcing structure comprising a first portion covering the side surface of the display panel and a second portion disposed below the bottom surface of the display panel. Therefore, impurities and moisture can be suppressed from penetrating into the side surface of the display panel, and warping between the display panel and adjacent layers (e.g., light control areas, adhesive layers, cover panels, etc.) can be prevented. Thus, the mechanical stability of the display device can be improved, and its lifespan characteristics can be enhanced. Attached Figure Description

[0034] Figure 1 This is a plan view showing a display device according to an embodiment.

[0035] Figure 2 This is a cross-sectional view showing a display device according to an embodiment.

[0036] Figure 3 This is a cross-sectional view showing a display device according to an embodiment.

[0037] Figure 4 This is a cross-sectional view showing a display device according to an embodiment.

[0038] Figure 5 This is a cross-sectional view showing a display panel according to an example embodiment.

[0039] Figure 6 This is a cross-sectional view showing the display panel according to an embodiment.

[0040] Figure 7 This is a cross-sectional view showing a light-emitting device according to an embodiment.

[0041] Figure 8 This is a cross-sectional view showing a light-emitting device according to an embodiment.

[0042] Figure 9 This is a schematic diagram illustrating a vehicle employing a display device according to an embodiment. Detailed Implementation

[0043] According to an embodiment, a display device is provided, including a display panel, a window area, and a reinforcing structure. Additionally, a vehicle including the display device is provided.

[0044] In the following description, embodiments of the utility model will be described in more detail with reference to the accompanying drawings. The same reference numerals may be used to indicate the same elements in the drawings, and repeated descriptions of the same elements may be omitted. The embodiments disclosed in the drawings are exemplary and are to be understood to include all modifications, equivalents, and substitutions within the spirit and scope of the utility model.

[0045] The terms “on,” “above,” or “between” as used here refer to direct placement / direct connection / direct combination, and also to the situation where another element is placed between two different elements.

[0046] The terms “upper,” “lower,” “first,” “second,” etc., are used in a relative sense to distinguish different elements or positions, and do not refer to absolute positions or absolute order.

[0047] The term "thickness direction" used here can refer to the direction along which the layers of the display device are stacked.

[0048] Figure 1 This is a plan view showing a display device according to an embodiment. Figure 2 This is a cross-sectional view showing a display device according to an embodiment. For example, Figure 2 It is along Figure 1 A cross-sectional view taken along line I-I' in the thickness direction.

[0049] In the embodiments and referenced Figure 1 and Figure 2The display device may include a display panel 100 and a window area 200 disposed on the top surface of the display panel 100.

[0050] In an embodiment, the display panel 100 may include a light-emitting device for displaying an image of the display device and a circuit layer for applying signals to the light-emitting device. For example, the display panel 100 may be configured as an image display area of ​​the display device. Referring later... Figure 5 and Figure 6 Describe the detailed structure of the display panel 100.

[0051] In an embodiment, the window area 200 may be configured as a surface that is directly viewed by the user of the display device.

[0052] In an embodiment, the window area 200 may include a window base 210 and a light-shielding pattern 220. The window base 210 includes a transmissive area TA and a border area BZA, and the light-shielding pattern 220 is disposed below the border area BZA.

[0053] In an embodiment, the transmissive region TA can be used as an area for displaying images and superimposed on the light-emitting device of the display panel 100 in the thickness direction.

[0054] In this embodiment, the border area BZA can be set as a non-display area of ​​the display device, or it can be set as an area displaying a predetermined color. For example, the border area BZA may not overlap with the light-emitting device of the display panel 100 in the thickness direction, so that the image from the display panel 100 may be invisible in the border area BZA.

[0055] In an embodiment, the border region BZA can be disposed along the periphery of the transmission region TA. Although Figure 1 The diagram illustrates a structure in which the border region BZA surrounds the transmission region TA, but the invention is not limited thereto. For example, in another embodiment, the border region BZA may only contact a portion of the side edge of the transmission region TA.

[0056] In embodiments, the window substrate 210 may include a polymeric material (such as polyimide, polysiloxane, epoxy resin, acrylic resin, or polyester), or may include a glass substrate or a metal substrate.

[0057] In addition, the window substrate 210 can be used as an image display surface that can be directly recognized by the user.

[0058] Furthermore, the thickness of the window base 210 can be in the range of approximately 0.3 mm to approximately 1.5 mm. Within this range, the display panel 100 can be adequately protected, and the thickness of the display device can be reduced. For example, the thickness of the window base 210 used in mobile electronic devices can be in the range of approximately 0.3 mm to approximately 0.7 mm, and the thickness of the window base 210 used in vehicles can be in the range of approximately 1.0 mm to approximately 1.5 mm.

[0059] In this embodiment, the light-shielding pattern 220 may be disposed below the border area BZA. For example, the light-shielding pattern 220 may be disposed at the edge of the window area 200, and the image of the display panel 100 may not be displayed in the border area BZA due to the light-shielding pattern 220. Therefore, a metallic or opaque structure that is visually identifiable from the outside of the display device may be provided below the light-shielding pattern 220 or the border area BZA to enhance the sharpness and aesthetics of the displayed image.

[0060] In an embodiment, the light-blocking pattern 220 may include pigments or dyes. For example, the light-blocking pattern 220 may be formed by printing ink of a predetermined color onto the window substrate 210.

[0061] In an embodiment, the light-shielding pattern 220 may be patterned with a predetermined design or color.

[0062] In an embodiment, the light-shielding pattern 220 can be used as a black matrix.

[0063] For example, the thickness of the light-shielding pattern 220 can be less than the thickness of the window substrate 210, wherein the thickness of the light-shielding pattern 220 can be in the range of about 5 μm to about 500 μm.

[0064] In an embodiment, the area of ​​the window region 200 in a plan view may be larger than the area of ​​the display panel 100 in a plan view. For example, in a plan view, the side surface of the display panel 100 may be closer to the center of the display device than the side surface of the window region 200.

[0065] In an embodiment, the display device may include a reinforcing structure 300, which includes a first portion 310 covering the side surface of the display panel 100 and a second portion 320 disposed below the bottom surface of the display panel 100. Therefore, impurities and moisture can be suppressed from penetrating into the side surface of the display panel 100, and peeling of the display panel 100 from other layers (e.g., the light control region, the first adhesive layer AD1, the cover panel, etc.) can be prevented. Thus, the mechanical stability of the display device can be improved, and its lifespan characteristics can be enhanced.

[0066] In an embodiment, the first portion 310 and the second portion 320 may be formed as a substantially integral component using the same material. For example, the first portion 310 may extend to cover a side surface of the display panel 100, and the second portion 320 may be directly connected to one end of the first portion 310 to extend below the bottom surface of the display panel 100.

[0067] In one embodiment, the first portion 310 may cover at least a portion of the light-shielding pattern 220. Therefore, the bottom surface of the window region 200, the side surfaces of the display panel 100, and the bottom surface of the display panel 100 can be protected by the reinforcing structure 300 from penetration by external impurities, and the bonding strength between the components of the display device can be increased, thereby improving reliability.

[0068] In an embodiment, the reinforcing structure 300 may include a resin comprising Si-based compounds, acrylic compounds, etc. The resin may include ultraviolet (UV) curable resins, thermosetting resins, UV and thermo-curable mixed resins, etc. The resin may include electrostatic discharge (ESD) resins, epoxy resins (e.g., TUFFY resin), gap-filling resins, etc. The compounds / resins may be used alone or in combination of two or more of them.

[0069] In this embodiment, the resin can be injected into the side portion of the display device in liquid or mold form to form the reinforcing structure 300. Therefore, external exposure of the display panel and adjacent components (e.g., the light control area, the first adhesive layer AD1, the cover panel, etc.) can be further suppressed.

[0070] In this embodiment, the first adhesive layer AD1 may be disposed between the display panel 100 and the window area 200. Therefore, the structural stability of the stacked structure of the display device can be improved.

[0071] In this embodiment, the first adhesive layer AD1 may include optically transparent adhesive (OCA), optically transparent resin (OCR), etc. For example, an adhesive film such as an OCA film or an OCR film may be used as the first adhesive layer AD1.

[0072] In an embodiment, the first portion 310 of the reinforcing structure 300 may cover the side surface of the first adhesive layer AD1. For example, the first portion 310 may commonly cover both the side surface of the first adhesive layer AD1 and the side surface of the display panel 100. Therefore, warping between the first adhesive layer AD1 and the display panel 100 can be suppressed.

[0073] In this embodiment, the second adhesive layer AD2 and the connecting structure CS may be sequentially disposed below the bottom surface of the second portion 320. For example, the connecting structure CS and the reinforcing structure 300 may be connected to each other via the second adhesive layer AD2.

[0074] In an embodiment, the second adhesive layer AD2 may include a material type substantially the same as that of the first adhesive layer AD1.

[0075] In an embodiment, the connection structure CS can serve as an intermediate structure for connecting a display device and an object to which the display device is applied. Structures and materials widely known in the relevant art can be used, enabling the intermediate structure to connect to or incorporate the object. For example, in an embodiment, the connection structure CS may include a composite structure in which multiple sub-connection units are combined.

[0076] In an embodiment, the connection structure CS may include a bracket connected to the frame of a vehicle or media device, wherein the shape and structure of the bracket may be appropriately adjusted according to the vehicle or media device to which it is applied.

[0077] In this embodiment, the second adhesive layer AD2 may contact the bottom surface of the second portion 320 but may not contact the display panel 100. Therefore, damage to the display panel 100 caused by detachment of the adhesive members due to external impact or bending of the display device can be reduced.

[0078] Figure 3 This is a cross-sectional view showing a display device according to an embodiment. For example, Figure 3 It is along Figure 1 A cross-sectional view taken along line I-I' in the thickness direction.

[0079] In the embodiments and referenced Figure 3 The display device may also include a light control area 400 disposed between the display panel 100 and the window area 200.

[0080] In an embodiment, the light control region 400 may include a multi-layer structure containing a polarization layer, an anti-reflection layer, etc.

[0081] In one embodiment, the light control region 400 may include an anti-reflective layer that can improve image sharpness by controlling the light reflected from the display panel 100 by an external light source. Furthermore, it can prevent the image from the display device from being reflected onto the windshield of the vehicle to which the display device is applied, thereby achieving driving stability.

[0082] In this embodiment, the thickness of the light control region 400 can be in the range of approximately 330 μm to approximately 520 μm. Within this range, reflected light can be sufficiently controlled, and the thickness of the display device can be reduced. For example, the thickness of the anti-reflective layer can be in the range of approximately 230 μm to approximately 270 μm, and the thickness of the polarizing layer can be in the range of approximately 90 μm to approximately 250 μm.

[0083] In one embodiment, the first adhesive layer AD1 may be placed between the light control region 400 and the window region 200.

[0084] In one embodiment, the display panel 100 and the light control area 400 can be stacked using an adhesive member (not shown). In this case, the first portion 310 of the reinforcing structure 300 can also cover the side surface of the adhesive member.

[0085] In an embodiment, the first portion 310 of the reinforcing structure 300 may cover the side surface of the light control region 400. For example, the first portion 310 may together cover the side surface of the display panel 100, the side surface of the light control region 400, and the side surface of the first adhesive layer AD1 to further suppress interlayer warping and the penetration of external impurities.

[0086] Figure 4 This is a cross-sectional view showing a display device according to an embodiment. For example, Figure 4 It can be along Figure 1 A cross-sectional view taken along line I-I' in the thickness direction.

[0087] In the embodiments and referenced Figure 4 The display device may also include a cover panel 500 disposed below the bottom surface of the display panel 100.

[0088] In this embodiment, the cover panel 500 may include materials with properties such as impact resistance, electromagnetic wave shielding, heat dissipation, and barrier properties. The cover panel 500 can protect the display panel 100 from external impacts and can improve the image visibility of the display panel 100.

[0089] In one embodiment, the cover panel 500 may have a single-layer structure.

[0090] In this embodiment, the cover panel 500 may have a multi-layer structure. For example, the cover panel 500 may include a stacked structure comprising a heat dissipation layer, foam, and / or a black sheet.

[0091] In an embodiment, the heat dissipation layer of the cover panel 500 may contain metals such as Cu and Al to dissipate heat generated from the display panel 100 to the outside.

[0092] Furthermore, in this embodiment, plastic foam can be used as a support structure for the cover panel 500.

[0093] In this embodiment, the black sheet can prevent images emitted from the display panel 100 from being refracted or reflected below the display panel 100, thereby further improving the image clarity of the display device.

[0094] In this embodiment, the total thickness of the cover panel 500 can be in the range of approximately 300 μm to approximately 550 μm. Within this range, excessive increase in the thickness of the display device can be suppressed while adequately protecting the display panel 100.

[0095] In one embodiment, the second portion 320 of the reinforcing structure 300 may cover at least a portion of the bottom surface of the cover panel 500. Therefore, the mechanical stability of the stacked structure including the display panel 100, the reinforcing structure 300, and the window region 200 can be further improved.

[0096] In one embodiment, the second portion 320 may extend along the bottom surface of the cover panel 500.

[0097] In an embodiment, the first portion 310 of the reinforcing structure 300 may cover the bottom surface of the light-shielding pattern 220, the side surface of the first adhesive layer AD1, the side surface of the light control region 400, the side surface of the display panel 100, and the side surface of the cover panel 500, and the second portion 320 may be integrally connected to the first portion 310 to cover at least a portion of the bottom surface of the cover panel 500. Therefore, warping between the display panel 100, the light control region 400, the cover panel 500, and the first adhesive layer AD1 can be prevented, and the penetration of external impurities / moisture can be suppressed.

[0098] In this embodiment, the second adhesive layer AD2 may contact the bottom surface of the second portion 320 but may not contact the cover panel 500. Therefore, damage to the cover panel 500 and / or the display panel 100 due to detachment of the adhesive members caused by external impact or bending of the display device can be suppressed.

[0099] In one embodiment, the reinforcing structure 300 may be formed along the edge portion of the display device, and the second adhesive layer AD2 may only contact a portion of the bottom surface of the second portion 320 of the reinforcing structure 300. For example, a plurality of second adhesive layers AD2 may be formed spaced apart from each other along the edge of the display device. Therefore, the flexibility and stability of the display device can be improved.

[0100] In this embodiment, the second adhesive layer AD2 can contact substantially the entire bottom surface of the second portion 320 of the reinforcing structure 300. Therefore, the adhesive stability between the display panel 100 or cover panel 500 and the connecting structure CS can be further improved.

[0101] In the embodiments and as Figure 4 As shown, the flexible printed circuit (FPC) can be attached to the underside of the bottom surface of the cover panel 500. For example, the flexible printed circuit board can be configured as a main circuit board (main FPC: MFPC) electrically connected to the driver integrated circuit (IC) chip of the display device.

[0102] In this embodiment, the display device may be curved. For example, the display device described above may be configured as a curved display device.

[0103] In an embodiment, the stacked structure of the window region 200, the first adhesive layer AD1, the light control region 400, the display panel 100, and / or the cover panel 500 can be bent at a predetermined curvature.

[0104] Curved display devices can be applied to media devices such as TVs, smartphones, or tablets, or to the windshields or dashboards of vehicles.

[0105] According to an embodiment, the reinforcing structure 300 can reduce or suppress cracks, interlayer delamination, and / or the penetration of external impurities caused by bending of the stacked structure. Therefore, mechanical stability can be improved even when the display device is configured to bend for various objects.

[0106] In an embodiment, the area of ​​the border region BZA can decrease as the area of ​​the transmissive region TA, which serves as the image display area, increases. In this case, the connecting structure CS may not have enough space to cover the side surfaces of the display panel 100 and adjacent layers, therefore the window region 200 and the connecting structure CS can be as follows: Figures 2 to 4 The spacing shown is different.

[0107] According to an embodiment, the side surface can be covered by the aforementioned reinforcing structure 300, thereby improving the structural stability of the display device while reducing the bezel area BZA.

[0108] In embodiments, the above-described display device can be combined with or included in various types of electronic devices using the connection structure CS. For example, such as Figure 4 As shown, the display device can be attached to the electronic device frame FR via the connection structure CS.

[0109] Electronic devices may include flat panel displays, flexible displays, computer monitors, medical monitors, televisions, billboards, indoor or outdoor lighting, signal lights, head-up displays, transparent displays, flexible displays, rollable displays, foldable displays, laser printers, telephones, mobile phones, tablet computers, phablets, personal information terminals (PDAs), wearable devices, laptop computers, digital cameras, camcorders, viewfinders, 3D displays, e-books, electronic dictionaries, electronic notebooks, electronic sensors, virtual reality or augmented reality displays, video walls, theater or stadium screens, healthcare devices, vehicles, etc.

[0110] In this embodiment, the window region 200 may be formed on the display panel 100, and a reinforcing structure 300 may be formed covering the side surface of the display panel 100 and extending below the bottom surface of the display panel 100. The reinforcing structure 300 may be formed by coating the aforementioned resin in a molded manner.

[0111] In one embodiment, a light control region 400 may be further formed between the display panel 100 and the window region 200. The light control region 400 and the window region 200 may be stacked via a first adhesive layer AD1.

[0112] In one embodiment, the cover panel 500 may be further formed below the bottom surface of the display panel 100.

[0113] In one embodiment, the second portion 320 may cover at least a portion of the bottom surface of the cover panel 500.

[0114] Furthermore, the bottom surface of the second part 320 and the connecting structure CS can be bonded together by the second adhesive layer AD2.

[0115] Figure 5 This is a cross-sectional view showing the display panel according to an embodiment.

[0116] In the embodiments and referenced Figure 5 The display panel 100 may include a circuit layer CL disposed on a substrate 102 and light-emitting devices ED1, ED2 and ED3 disposed on the circuit layer CL.

[0117] The substrate 102 can be used as a support substrate or backplate substrate for the display panel 100. A glass substrate or a plastic substrate can be used as the substrate 102.

[0118] In an embodiment, the substrate 102 may include a polymeric material that is both transparent and flexible. In this case, the substrate 102 can be used in a transparent flexible display device. For example, the substrate 102 may include a polymeric material such as polyimide, polysiloxane, epoxy resin, acrylic resin, or polyester. In an embodiment, the substrate 102 may include polyimide.

[0119] In an embodiment, the circuit layer CL may include transistors TR1, TR2 and TR3, and may include wiring layers and insulating layers forming a thin-film transistor array (TFT-array).

[0120] In an embodiment, the circuit layer CL may further include a buffer layer 104 formed on the top surface of the substrate 102. Moisture permeating through the substrate 102 can be blocked by the buffer layer 104, and the diffusion of impurities between the substrate 102 and the structures formed on the substrate 102 can also be blocked.

[0121] In embodiments, buffer layer 104 may include, for example, silicon oxide, silicon nitride, or silicon oxynitride. These may be used alone or in combination of two or more of them. In some embodiments, buffer layer 104 may have a stacked structure including silicon oxide layers and silicon nitride layers.

[0122] In this embodiment, transistors TR1, TR2, and TR3 may be disposed on buffer layer 104. The first transistor TR1, the second transistor TR2, and the third transistor TR3 may be electrically connected to the first light-emitting device ED1, the second light-emitting device ED2, and the third light-emitting device ED3, respectively.

[0123] In an embodiment, each of transistors TR1, TR2 and TR3 may include an active layer 101, a gate insulating layer 103, a gate electrode 105, and connection electrodes 107 and 109.

[0124] In this embodiment, the active layer 101 may be disposed on the buffer layer 104 and may be arranged repeatedly / regularly for each pixel. The active layer 101 may include a silicon compound such as polysilicon. A p-type dopant or an n-type dopant may be doped in a portion of the active layer 101 and may include a source region, a drain region, and a channel region.

[0125] Additionally, the active layer 101 may include an oxide semiconductor such as indium gallium zinc oxide (IGZO), zinc tin oxide (ZTO), or ITZO.

[0126] In an embodiment, a gate insulating layer 103 may be formed on the active layer 101, and a gate electrode 105 may be stacked on the gate insulating layer 103. For example... Figure 5 As shown, the gate insulating layer 103 can be formed in a pattern shape that partially covers each active layer 101. In another embodiment, the gate insulating layer 103 can extend continuously across multiple pixels or light-emitting regions and can be commonly included in transistors TR1, TR2, and TR3.

[0127] The gate electrode 105 can be stacked with the channel region of the active layer 101 in the thickness direction.

[0128] In this embodiment, an insulating intermediate layer 106 covering the gate insulating layer 103 and the gate electrode 105 may be formed on the active layer 101. Connection electrodes 107 and 109 that may contact or be electrically connected to the active layer 101 may be disposed on the insulating intermediate layer 106.

[0129] In this embodiment, the connecting electrodes 107 and 109 can penetrate the insulating intermediate layer 106 and can be connected to the active layer 101. When the gate insulating layer 103 is formed continuously in multiple light-emitting regions, the connecting electrodes 107 and 109 can also penetrate the gate insulating layer 103.

[0130] The connecting electrodes 107 and 109 may include a source electrode 107 connected to or in contact with the source region of the active layer 101 and a drain electrode 109 connected to or in contact with the drain region of the active layer 101.

[0131] In an embodiment, the gate insulating layer 103 and the insulating intermediate layer 106 may include silicon oxide, silicon nitride, or silicon oxynitride, and may have a stacked structure including a silicon oxide layer and a silicon nitride layer.

[0132] In the embodiments, the gate electrode 105 and the connecting electrodes 107 and 109 may include metals such as Ag, Mg, Al, W, Cu, Ni, Cr, Mo, Ti, Pt, Ta, Nd, Sc, alloys thereof, or nitrides thereof.

[0133] In an embodiment, a via insulating layer 108 may be formed on an insulating intermediate layer 106 to cover the connection electrodes 107 and 109.

[0134] The via insulating layer 108 can accommodate a via structure that electrically connects the first electrode 110 to the drain electrode 109. The via insulating layer 108 can serve as a planarization layer for the circuit layer CL. In some embodiments, the via insulating layer 108 may include organic materials such as polyimide, epoxy resin, acrylic resin, polyester, etc.

[0135] In this embodiment, light-emitting devices ED1, ED2, and ED3 may be disposed on the via insulating layer 108. (See below for further details.) Figures 7 to 8 Describe the detailed components of a light-emitting device (ED).

[0136] In an embodiment, the light-emitting devices ED1, ED2 and ED3 may include a first electrode 110, a hole transport region 120, an emission layer 130, an electron transport region 140 and a second electrode 150, which are sequentially stacked from the via insulating layer 108.

[0137] The first electrode 110 can be electrically connected via a via structure to transistors TR1, TR2, and TR3 included in circuit layer CL, or to connecting electrodes 107 and 109. For example... Figure 5 As shown, the first electrode 110 may contact or be connected to the drain electrode 109 to serve as a pixel electrode patterned for each light-emitting area or pixel area.

[0138] In this embodiment, the pixel defining layer 170 may be formed on the via insulating layer 108 to define the light-emitting region or pixel region. The blue light-emitting region, the red light-emitting region, and the green light-emitting region may be separated and defined by the pixel defining layer 170, and the light-emitting devices ED1, ED2, and ED3 may correspond to the blue light-emitting device, the red light-emitting device, and the green light-emitting device, respectively.

[0139] In addition, the pixel-defining layer 170 can partially cover the first electrode 110 of each light-emitting area.

[0140] In the embodiments and as Figure 5 As shown, hole transport region 120 and electron transport region 140 can be formed continuously and commonly on pixel defining layer 170 and multiple first electrodes 110. Emitting layer 130 can be formed in the form of islands separated for each light-emitting region or pixel region, and can be defined by pixel defining layer 170.

[0141] In some embodiments, the emitting layer 130 may also be formed continuously and in common to multiple light-emitting regions or pixel regions. In some embodiments, the hole transport region 120, the emitting layer 130, and the electron transport region 140 may be completely separate and selectively formed for each light-emitting region or pixel region.

[0142] In an embodiment, the second electrode 150 can be used as a common electrode that is continuously formed over multiple light-emitting areas or pixel areas.

[0143] In an embodiment, the encapsulation layer 180 may be disposed on the pixel defining layer 170 and the light-emitting devices ED1, ED2, and ED3 to protect the light-emitting devices ED1, ED2, and ED3 from moisture or oxygen. The encapsulation layer 180 may be formed as a thin-film encapsulation (TFE) having a single-layer structure or a multi-layer structure.

[0144] Encapsulation layer 180 may include an inorganic layer, an organic layer, or a combination of organic and inorganic layers, wherein the inorganic layer includes silicon nitride (SiN). x ), silicon dioxide (SiO) x Indium tin oxide, indium zinc oxide, or any combination thereof, and the organic layer includes polyethylene terephthalate, polyethylene naphthalate, polycarbonate, polyimide, polyethylene sulfonate, polyoxymethylene, polyarylate, hexamethyldisiloxane, acrylic resin (e.g., polymethyl methacrylate, polyacrylic acid, etc.), epoxy resin (e.g., aliphatic glycidyl ether (AGE)), or any combination thereof.

[0145] In an embodiment, the display panel 100 may further include a functional layer 190 disposed on the encapsulation layer 180, wherein the functional layer 190 may include a sensor layer (such as a touch sensor layer) or an optical layer (such as a polarization layer, a color conversion layer, or a color filter layer).

[0146] Figure 6 This is a cross-sectional view showing the display panel according to an embodiment.

[0147] Figure 6 A display panel 100 having a QD-OLED structure according to an embodiment is shown. Reference numerals are omitted. Figure 5 A detailed description of components and structures that are substantially the same or similar.

[0148] In the embodiments and referenced Figure 6The pixel limiting layer 170 and the light-emitting device ED can be set as shown in the reference. Figure 5 The circuit layer CL is described. In some embodiments, light of the same wavelength region can be emitted from each pixel. In one embodiment, blue light can be emitted from each light-emitting device ED.

[0149] In some embodiments, a light-emitting device (ED) with a series structure can be disposed in each light-emitting region. In this case, an intermediate layer included in the ED can be formed continuously and in common throughout multiple light-emitting regions. (See below for further details.) Figure 8 Describe a light-emitting device with a series structure.

[0150] In this embodiment, the color control layer CCL, which includes color control portions CCP1, CCP2 and CCP3, can be disposed on the encapsulation layer 180.

[0151] Color control sections CCP1, CCP2, and CCP3 may include light converters such as quantum dots or fluorescent materials. The wavelength of light introduced into each of the color control sections CCP1, CCP2, and CCP3 can be converted and emitted by the light converters.

[0152] Color control components CCP1, CCP2, and CCP3 can be separated from or spaced apart from each other by a dam BM, wherein the dam BM can be substantially superimposed on the pixel definition layer 170, and color control components CCP1, CCP2, and CCP3 can be substantially superimposed on the emission layer 130.

[0153] In an embodiment, the color control layer CCL may include a first color control portion CCP1, a second color control portion CCP2, and a third color control portion CCP3. The first color control portion CCP1 includes a first quantum dot for converting first color light provided by the light-emitting device ED into second color light. The second color control portion CCP2 includes a second quantum dot for converting first color light into third color light. The third color control portion CCP3 is used to transmit first color light.

[0154] In this embodiment, the first color light, the second color light, and the third color light can be blue light, red light, and green light, respectively. The first quantum dot and the second quantum dot can be red quantum dot and green quantum dot, respectively.

[0155] In embodiments, color control portions CCP1, CCP2, and CCP3 may further include scattering materials such as inorganic particles. The third color control portion CCP3 may not include quantum dots but may include scattering materials, such as TiO2, ZnO, Al2O3, SiO2, hollow silica, etc. These may be used individually or in combination of two or more.

[0156] In this embodiment, the color control portions CCP1, CCP2, and CCP3 may further include an adhesive resin for dispersing the quantum dots and scattering materials. The adhesive resin may include acrylic resin, urethane resin, silicone resin, epoxy resin, etc.

[0157] In this embodiment, the color filter layer CFL, including filters CF1 and CF2, and the light-blocking portion CP can be disposed on the color control layer CCL.

[0158] In an embodiment, the color filter layer CFL may include a first filter CF1 that can transmit a second color of light, a second filter CF2 that can transmit a third color of light, and a third filter that can transmit a first color of light. For example, the first filter CF1 may be a red filter, the second filter CF2 may be a green filter, and the third filter may be a blue filter.

[0159] Filters CF1 and CF2 may include a photosensitive adhesive resin and a colorant material including pigments and / or dyes. The first filter CF1 may include a red pigment or dye, and the second filter CF2 may include a green pigment or dye.

[0160] In some embodiments, the light-shielding portion CP may be disposed between the filters. In some embodiments, the light-shielding portion CP may include a first light-shielding portion CP1 and a second light-shielding portion CP2 containing colorant materials of different colors.

[0161] In an embodiment, the first light-shielding portion CP1 may include a blue colorant material, and the second light-shielding portion CP2 may include a red colorant material. In an embodiment, in the blue emitting region, a portion of the first light-shielding portion CP1 exposed between the second light-shielding portion CP2 can be used as a blue filter, and an additional filter (third filter) can be omitted.

[0162] In this embodiment, the first barrier layer 192 may be disposed between the color control layer CCL and the light-emitting device ED (or the encapsulation layer 180). The second barrier layer 194 may be disposed between the color control layer CCL and the color filter layer CFL.

[0163] Barrier layers 192 and 194 may include at least one inorganic layer. For example, barrier layers 192 and 194 may include silicon nitride, aluminum nitride, zirconium nitride, titanium nitride, hafnium nitride, tantalum nitride, silicon oxide, aluminum oxide, titanium oxide, tin oxide, cerium oxide, silicon oxynitride, etc.

[0164] In addition, barrier layers 192 and 194 may have a multilayer structure that also includes an organic layer.

[0165] The following text provides a detailed description of the light-emitting device ED of the display panel 100.

[0166] Figure 7 and Figure 8 This is a cross-sectional view showing a light-emitting device according to an embodiment.

[0167] In the embodiments and referenced Figure 7 The light-emitting device (ED) may include a first electrode 110, a second electrode 150, and an intermediate layer (ITL) disposed between the first electrode 110 and the second electrode 150. The intermediate layer (ITL) may include an emitting layer 130, a hole transport region 120, and an electron transport region 140.

[0168] In one embodiment, the hole transport region 120, the emitter layer 130, the electron transport region 140, and the second electrode 150 can be sequentially stacked from the top surface of the first electrode 110.

[0169] In one embodiment, the hole transport region 120 may include a hole injection layer and a hole transport layer. The electron transport region 140 may include an electron injection layer and an electron transport layer. For example, the hole injection layer, hole transport layer, emitter layer, electron transport layer, electron injection layer, and second electrode 150 may be sequentially stacked from the top surface of the first electrode 110.

[0170] In some embodiments, the first electrode 110 can be an anode or a cathode. In some embodiments, the first electrode 110 can be used as an anode and can also be used as a pixel electrode. In this case, the first electrode 110 can include a conductive material with a high work function that can facilitate hole injection.

[0171] In an embodiment, the first electrode 110 may be configured as a transmission electrode and may include a transparent conductive oxide such as indium tin oxide (ITO), indium zinc oxide (IZO), zinc oxide (ZnO), indium tin zinc oxide (ITZO), etc.

[0172] In an embodiment, the first electrode 110 may be configured as a transmissive / reflective electrode or a reflective electrode, wherein the first electrode 110 may include a metal selected from Ag, Mg, Cu, Al, Pt, Pd, Au, Ni, Nd, Ir, Cr, Li, Ca, Mo, Ti, W, In, Sn, and Zn, or an alloy or compound (such as LiF) including at least one of them. For example, the first electrode 110 may include a mixture of Li, Ca, LiF, Al, Ag, and Mg, and a material having a multilayer structure such as LiF / Ca (a stacked structure of LiF and Ca) or LiF / Al (a stacked structure of LiF and Al).

[0173] In the embodiments, the first electrode 110 may have a single-layer structure or a multi-layer structure. For example, the first electrode 110 may have a three-layer structure of ITO / Ag / ITO.

[0174] In an embodiment, the thickness of the first electrode 110 may be in the range of about 700 Å to about 10000 Å or about 1000 Å to about 3000 Å.

[0175] In some embodiments, the second electrode 150 can be used as a cathode or an anode. In some embodiments, the second electrode 150 can be used as an electron injection electrode or a cathode. The second electrode 150 may include a metal, alloy, conductive compound, etc., having a low work function.

[0176] For example, the second electrode 150 may include lithium (Li), silver (Ag), magnesium (Mg), aluminum (Al), aluminum-lithium (Al-Li), calcium (Ca), magnesium-indium (Mg-In), magnesium-silver (Mg-Ag), ytterbium (Yb), silver-ytterbium (Ag-Yb), ITO, IZO, etc. These can be used alone or in combination of two or more of them.

[0177] In the embodiments, the second electrode 150 may be configured as a transmission electrode, a transmission-reflection electrode, or a reflection electrode, and the second electrode 150 may have a single-layer structure or a multi-layer structure.

[0178] In an embodiment, the emitter layer 130 may include a host material. For example, the emitter layer 130 may include host materials widely known in the relevant art (such as anthracene derivatives, pyrene derivatives, fluoranthene derivatives, phenanthrene derivatives, dihydrobenzanthene derivatives, benzo[9,10]phenanthrene derivatives, etc.).

[0179] In an embodiment, the emitting layer 130 may include a fluorescent host material and / or a phosphorescent host material.

[0180] The emitter layer 130 may include, for example, BCPDS (bis(4-(9H-carbazole-9-yl)phenyl)diphenylsilane), POPCPA ((4-(1-(4-(diphenylamino)phenyl)cyclohexyl)phenyl)diphenylphosphine oxide), DPEPO (bis[2-(diphenylphosphino)phenyl]oxide ether), mCBP (3,3'-bis(9H-carbazole-9-yl)-1,1'-biphenyl), CBP (4,4'-bis(N-carbazole-9-yl)benzene), mCP (1,3-bis(carbazole-9-yl)benzene), PPF (2,8-bis(diphenylphospho)dibenzo[b,d]furan), TCTA (4,4',4''-tris(carbazole-9-yl)triphenylamine), TPBi The main materials include (1,3,5-tris(1-phenyl-1H-benzis[d]imidazol-2-yl)benzene), Alq3 (tris(8-hydroxyquinoline)aluminum), AND (9,10-di(naphthyl-2-yl)anthracene), TBADN (2-tert-butyl-9,10-di(naphthyl-2-yl)anthracene), DSA (stilbeneyl arylene), CDBP (4,4'-bis(9-carbazolyl)-2,2'-dimethyl-biphenyl), MADN (2-methyl-9,10-bis(naphthyl-2-yl)anthracene), CP1 (methazine triphosphazene), UGH2 (1,4-bis(triphenylsilyl)benzene), DPSiO3 (hexaphenylcyclotrisiloxane), and DPSiO4 (octaphenylcyclotetrasiloxane). These can be used alone or in combination of two or more of them.

[0181] In addition, the emitter layer 130 may also include dopants that interact with the host material.

[0182] In an embodiment, the emitting layer 130 may include fluorescent dopants and / or phosphorescent dopants.

[0183] In some embodiments, the emitting layer 130 may include, for example, styrene derivatives (e.g., 1,4-bis[2-(3-ethylcarbazolyl)vinyl]benzene (BCzVB), 4-(di-p-tolylamino)-4'-[(di-p-tolylamino)styrene]stilbene (DPAVB), N-(4-((E)-2-(6-((E)-4-(diphenylamino)styrene)naphth-2-yl)vinyl)phenyl)-N-phenylaniline (NBDAVBi)), 4,4'-bis[2-(4-(N,N-diphenylamino)phenyl)vinyl]biphenyl (DPAVBi), perylene and its derivatives (e.g., 2,5,8,11-tetra-tert-butylperylene (TBP)), pyrene and its derivatives (e.g., 1,1'-dipyrene, 1,4-dipyrenebenzene, 1,4-bis(N,N-diphenylamino)pyrene) as fluorescent dopant materials).

[0184] In embodiments, the emitting layer 130 may include metal complexes containing iridium (Ir), platinum (Pt), osmium (Os), gold (Au), titanium (Ti), zirconium (Zr), hafnium (Hf), europium (Eu), terbium (Tb), or thulium (Tm) as phosphorescent dopants. For example, FIrpic (bis(4,6-difluorophenylpyridine-N,C2)pyridinecarboxylate iridium(III)), FIr6 (bis(2,4-difluorophenylpyridine)-tetra(1-pyrazolyl)boronate iridium(III)), PtOEP (octaethylporphyrin platinum), etc., can be used as phosphorescent dopants.

[0185] In one embodiment, the emitter layer 130 may include a boron-containing dopant.

[0186] The aforementioned dopant materials can be used alone or in combination of two or more of them.

[0187] In embodiments, the emitting layer 130 may include two or more host materials. For example, the emitting layer 130 may include a hole transport host and an electron transport host. In this case, the emitting layer 130 may include a hole transport host, an electron transport host, a photosensitizer, and a dopant. In some embodiments, the hole transport host and the electron transport host may form an excimer complex, and energy transfer may occur from the excimer complex to the photosensitizer and from the photosensitizer to the dopant, thereby inducing light emission.

[0188] In an embodiment, the emitter layer 130 may include quantum dots, wherein the quantum dots may include II-VI compounds, III-VI compounds, I-III-VI compounds, III-V compounds, III-II-V compounds, IV-VI compounds, group IV elements, group IV compounds, or combinations thereof.

[0189] In an embodiment, the hole transport region 120 may include m-MTDATA (4,4',4"-[tris(3-methylphenyl)phenylamino]triphenylamine), TDATA (4,4',4"-tris(N,N-diphenylamino)triphenylamine), 2-TNATA (4,4',4"-tris[N-(2-naphthyl)-N-phenylamino]triphenylamine), NPB (N,N'-di(naphthyl-1-yl)-N,N'-diphenyl-benzidine), TPD (N,N'-bis(3-methylphenyl)-N,N'-diphenyl-[1,1'-diamine), spiro-TPD, spiro-NPB, DNTPD (N 1 N 1' -([1,1'-biphenyl]-4,4'-diyl)bis(N) 1 -Phenyl-N 4 N 4The following compounds are listed: di-m-tolylphenyl-1,4-diamine, TAPC (4,4'-cyclohexylbis[N,N-bis(4-methylphenyl)aniline]), HMTPD (4,4'-bis[N,N'-(3-tolyl)amino]-3,3'-dimethylbiphenyl), TCTA (4,4',4"-tris(N-carbazolyl)triphenylamine), PANI / DBSA (polyaniline / dodecylbenzenesulfonic acid), PEDOT / PSS (poly(3,4-ethylenedioxythiophene) / poly(4-styrenesulfonate)), PANI / CSA (polyaniline / camphorsulfonic acid), phthalocyanine compounds, carbazole compounds (N-phenylcarbazole, polyvinylcarbazole, etc.), fluorene compounds, etc. These can be used alone or in combination of two or more.

[0190] In an embodiment, the hole transport region 120 may further include a charge-generating material. A dopant material, such as a p-doped material, can be used as the charge-generating material, and thus the conductivity of the hole transport region 120 can be improved.

[0191] Examples of dopant materials include metal halide compounds (such as LiF, NaCl, CsF, RbCl, RbI, CuI, KI, etc.), quinone derivatives (such as TCNQ (tetracyanoquinone dimethylane), F4-TCNQ (2,3,5,6-tetrafluoro-7,7,8,8-tetracyanoquinone dimethylane), etc.), cyano-containing compounds (such as HAT-CN (dipyrazino[2,3-f:2',3'-h]quinoxaline-2,3,6,7,10,11-hexacarboxynitrile), NDP9 (4-[[2,3-bis[cyano-(4-cyano-2,3,5,6-tetrafluorophenyl)methylene]cyclopropylene]-cyanomethyl]-2,3,5,6-tetrafluorophenylbenzylnitrile), W oxides, Mo oxides, etc. These can be used alone or in combination of two or more.

[0192] Electron transport region 140 may include anthracene compounds, Alq3 (tris(8-hydroxyquinoline)aluminum), 1,3,5-tris[(3-pyridyl)-phenyl-3-yl]benzene, 2,4,6-tris(3'-(pyridyl-3-yl)biphenyl-3-yl)-1,3,5-triazine, 2-(4-(N-phenylbenzimidazol-1-yl)phenyl)-9,10-dinaphthylanthracene, TPBi (1,3,5-tris(1-phenyl) -1H-benzo[d]imidazol-2-yl)benzene), BCP (2,9-dimethyl-4,7-diphenyl-1,10-phenanthroline), Bphen (4,7-diphenyl-1,10-phenanthroline), TAZ (3-(4-biphenyl)-4-phenyl-5-tert-butylphenyl-1,2,4-triazole), NTAZ (4-(naphthyl-1-yl)-3,5-diphenyl-4H-1,2,4-triazole), tBu-PBD (2-(4-biphenyl)-5-(4-tert-butylphenyl)-1,3,4-oxadiazole), BAlq (bis(2-methyl-8-hydroxyquinoline-N1,O8)-(1,1'-biphenyl-4-hydroxy)aluminum), Bebq2 (bis(benzoquinoline-10-hydroxy)beryllium), AND (9,10-bis(naphthyl-2-yl)anthracene), BmPyPhB (1,3-bis[3,5-bis(pyridin-3-yl)phenyl]benzene), etc. These can be used alone or in combination of two or more of them.

[0193] In an embodiment, the electron transport region 140 may include alkali metals, alkaline earth metals, rare earth metals, alkali metal-containing compounds, alkaline earth metal-containing compounds, rare earth metal-containing compounds, alkali metal complexes, alkaline earth metal complexes, rare earth metal complexes, or combinations thereof. In an embodiment, the above materials may be included in the electron injection layer.

[0194] Alkali metals may include Li, Na, K, Rb, Cs, or any combination thereof. Alkali earth metals may include Mg, Ca, Sr, Ba, or any combination thereof. Rare earth metals may include Sc, Y, Ce, Tb, Yb, Gd, or any combination thereof.

[0195] In the embodiments, the alkali metal-containing compounds, alkaline earth metal-containing compounds, and rare earth metal-containing compounds may respectively include oxides, halides (e.g., fluorides, chlorides, bromides, iodides, etc.), tellurides, or combinations thereof.

[0196] In the embodiments, alkali metal complexes, alkaline earth metal complexes, and rare earth metal complexes may include metal ions of alkali metals, alkaline earth metals, or rare earth metals and ligands bonded to the metal ions. Ligands may include, for example, hydroxyquinoline, hydroxyisoquinoline, hydroxybenzoquinoline, hydroxyacridine, hydroxyphenanthridine, hydroxyphenyloxazole, hydroxyphenylthiazole, hydroxyphenyloxadiazole, hydroxyphenylthiadiazole, hydroxyphenylpyridine, hydroxyphenylbenzimidazole, hydroxyphenylbenzothiazole, bipyridine, phenanthrene, cyclopentadiene, or combinations thereof.

[0197] In the embodiments and referenced Figure 8 The light-emitting device (ED) may include multiple light-emitting structures ES1, ES2, and ES3. Each of the light-emitting structures ES1, ES2, and ES3 may include, as shown in the reference... Figure 7 The stacked structure of hole transport region 120, emitter layer 130, and electron transport region 140 is described. In some embodiments, Figure 8 The light-emitting device (ED) can be a light-emitting device with a series structure.

[0198] In this embodiment, charge generation layers CGL1 and CGL2 may be disposed between adjacent light-emitting structures ES1, ES2, and ES3. Charge generation layers CGL1 and CGL2 may include p-type charge generation layers and / or n-type charge generation layers. Charge generation layers CGL1 and CGL2 may include a first charge generation layer CGL1 disposed between the first light-emitting structure ES1 and the second light-emitting structure ES2, and a second charge generation layer CGL2 disposed between the second light-emitting structure ES2 and the third light-emitting structure ES3.

[0199] In an embodiment, the first light-emitting structure ES1, the first charge-generating layer CGL1, the second light-emitting structure ES2, the second charge-generating layer CGL2, the third light-emitting structure ES3, and the second electrode 150 can be sequentially stacked from the top surface of the first electrode 110.

[0200] In some embodiments, the light-emitting device (ED) can be applied to an organic light-emitting diode (OLED) display device or a quantum dot (QD)-OLED display device.

[0201] Figure 9 This is a schematic diagram illustrating a vehicle employing a display device according to an embodiment.

[0202] In the embodiments and referenced Figure 9 The vehicle 600 may include a vehicle frame 605 and the aforementioned display device attached to the vehicle frame 605.

[0203] The vehicle frame 605 may refer to the material and / or shape of the vehicle body that constitutes the vehicle 600.

[0204] For example, the display device can be attached to the vehicle frame 605 using a connection structure CS. For example, the connection structure CS can be configured as an intermediate structure connecting the display device and the vehicle 600.

[0205] In the embodiments and as Figure 9 As shown, at least one of the display devices DP1, DP2, DP3, DP4 and DP5 can be applied to vehicle 600.

[0206] In some embodiments, a first display device DP1 may be disposed in a cluster area 610, wherein driving information such as driving distance and speed, as well as various warning lights, may be displayed in the cluster area 610.

[0207] The second display device DP2 can be installed on the front windshield (FW) of the vehicle 600. For example, the second display device DP2 can be installed in the form of a head-up display (HUD).

[0208] The third display device DP3 can be installed on the central instrument panel area 620 of the vehicle 600, where buttons or switches for controlling the operation of the image / music player, air conditioning, heater, etc., can be displayed, and vehicle information can also be displayed.

[0209] The fourth display device DP4 can be applied to the side mirrors 630 of the vehicle 600, wherein the side mirrors 630 can be mounted on both sides of the exterior of the vehicle 600, and wherein the fourth display device DP4 can be applied to at least one of the side mirrors 630.

[0210] The fifth display device DP5 may be mounted on the passenger seat instrument panel 640, wherein information / images that are the same as or different from those displayed on the cluster area 610 and / or the central instrument panel area 620 can be displayed from the passenger seat instrument panel 640.

[0211] Those skilled in the art will understand that the utility model can be implemented in other specific embodiments besides those described herein without altering its technical spirit or essential features. Therefore, it will be understood that the exemplary embodiments described above are illustrative in all respects and not restrictive. The disclosed embodiments of the utility model are used only in a general and descriptive sense and not for limiting purposes. Each component specifically shown in the embodiments of the utility model can be implemented by variations, and such variations and differences related to the utility model should be interpreted as being included within the scope of the utility model. Furthermore, embodiments or parts thereof can be combined, in whole or in part, without departing from the scope of the utility model.

Claims

1. A display device, characterized by comprising: The display device includes: Display panel; A window area is disposed on the top surface of the display panel; and The reinforcing structure includes: a first portion covering the side surface of the display panel; and a second portion disposed below the bottom surface of the display panel.

2. The display device according to claim 1, wherein The window area includes: The window base, including the transmissive area and the border area; and A light-blocking pattern is arranged below the border area.

3. The display device according to claim 2, wherein The first portion covers at least a portion of the bottom surface of the light-shielding pattern.

4. The display device according to claim 1, wherein The display device further includes a light control area disposed between the display panel and the window area.

5. The display device according to claim 4, wherein The light control region includes an anti-reflective layer.

6. The display device according to claim 1, wherein The display device further includes a first adhesive layer disposed between the display panel and the window area.

7. The display device according to claim 1, wherein The display device further includes a cover panel disposed below the bottom surface of the display panel. The second part covers at least a portion of the bottom surface of the cover panel.

8. The display device according to claim 7, wherein The display device further includes a second adhesive layer and a connecting structure sequentially arranged below the bottom surface of the second part. The second adhesive layer is disposed directly below the bottom surface of the second part and does not contact the cover panel.

9. An electronic device, comprising: The electronic device includes: Electronic device frame; and The display device is integrated into the electronic device frame. The display device includes: Display panel; A window area is disposed on the top surface of the display panel; and The reinforcing structure includes: a first portion covering the side surface of the display panel; and a second portion disposed below the bottom surface of the display panel.

10. A vehicle characterized by comprising: The vehicles include: Vehicle frame; and The display device is integrated into the vehicle frame. The display device includes: Display panel; A window area is disposed on the top surface of the display panel; and The reinforcing structure includes: a first portion covering the side surface of the display panel; and a second portion disposed below the bottom surface of the display panel.

Images